SANYO VEC2812

VEC2812
Ordering number : ENA0392
SANYO Semiconductors
DATA SHEET
VEC2812
MOSFET : N-Channel Silicon MOSFET
SBD : Schottky Barrier Diode
General-Purpose Switching Device
Applications
Features
•
•
•
•
DC / DC converter.
Composite type with an N-channel sillicon MOSFET and a schottky barrier diode contained in one package
facilitating high-density mounting.
[MOSFET]
• Low ON-resistance.
• 1.8V drive.
[SBD]
• Short reverse recovery time.
• Low forward voltage.
Specifications
Absolute Maximum Ratings at Ta=25°C
Parameter
Symbol
Conditions
Ratings
Unit
[MOSFET]
Drain-to-Source Voltage
VDSS
VGSS
ID
Gate-to-Source Voltage
Drain Current (DC)
Drain Current (Pulse)
Allowable Power Dissipation
IDP
PD
20
PW≤10µs, duty cycle≤1%
Mounted on a ceramic board (900mm2✕0.8mm) 1unit
V
±10
V
1.5
A
6
A
0.8
W
Channel Temperature
Tch
150
°C
Storage Temperature
Tstg
--55 to +125
°C
[SBD]
Repetitive Peak Reverse Voltage
Nonrepetitive Peak Reverse Surge Voltage
Average Output Current
Surge Forward Current
VRRM
VRSM
IO
IFSM
50Hz sine wave, 1 cycle
30
V
35
V
1
A
10
A
Junction Temperature
Tj
--55 to +125
°C
Storage Temperature
Tstg
--55 to +125
°C
Marking : BZ
Any and all SANYO Semiconductor products described or contained herein do not have specifications
that can handle applications that require extremely high levels of reliability, such as life-support systems,
aircraft's control systems, or other applications whose failure can be reasonably expected to result in
serious physical and/or material damage. Consult with your SANYO Semiconductor representative
nearest you before usingany SANYO Semiconductor products described or contained herein in such
applications.
SANYO Semiconductor assumes no responsibility for equipment failures that result from using products
at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition
ranges, or other parameters) listed in products specifications of any and all SANYO Semiconductor
products described or contained herein.
TOKYO OFFICE Tokyo Bldg., 1-10, 1 Chome, Ueno, Taito-ku, TOKYO, 110-8534 JAPAN
N0806PE SY IM TC-00000280 No. A0392-1/6
VEC2812
Electrical Characteristics at Ta=25°C
Parameter
Symbol
Ratings
Conditions
min
typ
Unit
max
[MOSFET]
Drain-to-Source Breakdown Voltage
V(BR)DSS
ID=1mA, VGS=0V
VDS=20V, VGS=0V
20
Zero-Gate Voltage Drain Current
IDSS
Gate-to-Source Leakage Current
IGSS
VGS(off)
VGSS=±8V, VDS=0V
VDS=10V, ID=1mA
0.4
yfs
RDS(on)1
VDS=10V, ID=1A
1.7
Cutoff Voltage
Forward Transfer Admittance
Static Drain-to-Source On-State Resistance
RDS(on)2
RDS(on)3
V
1
µA
±10
µA
1.3
V
2.8
S
ID=1A, VGS=4V
ID=0.5A, VGS=2.5V
160
210
mΩ
220
290
mΩ
310
435
mΩ
Input Capacitance
Ciss
ID=0.1A, VGS=1.8V
VDS=10V, f=1MHz
Output Capacitance
Coss
Reverse Transfer Capacitance
100
pF
VDS=10V, f=1MHz
22
pF
Crss
VDS=10V, f=1MHz
15
pF
Turn-ON Delay Time
td(on)
See specified Test Circuit.
5.5
ns
Rise Time
tr
td(off)
See specified Test Circuit.
18
ns
See specified Test Circuit.
17
ns
Turn-OFF Delay Time
Fall Time
tf
Qg
Total Gate Charge
8
ns
VDS=10V, VGS=10V, ID=1.5A
See specified Test Circuit.
4.5
nC
nC
Gate-to-Source Charge
Qgs
Qgd
VDS=10V, VGS=10V, ID=1.5A
VDS=10V, VGS=10V, ID=1.5A
0.4
Gate-to-Drain “Miller” Charge
Diode Forward Voltage
VSD
IS=1.5A, VGS=0V
0.9
1.2
V
VR
VF 1
IR=500µA
IF=500mA
0.35
0.39
V
VF 2
0.45
V
360
µA
Interterminal Capacitance
IF=1A
VR=15V
VR=10V, f=1MHz
0.4
IR
C
Reverse Recovery Time
trr
IF=IR=100mA, See specified Test Circuit.
0.4
nC
[SBD]
Reverse Voltage
Forward Voltage
Reverse Current
Package Dimensions
30
V
27
pF
10
ns
Electrical Connection
0.3
8
7
8
7
6
5
1
2
3
4
0.15
6 5
2.3
2
3
4
1 : Anode
2 : No Contact
3 : Source
4 : Gate
5 : Drain
6 : Drain
7 : Cathode
8 : Cathode
0.65
2.9
0.75
1
0.07
0.25
2.8
0.25
unit : mm (typ)
7012-004
Top view
1 : Anode
2 : No Contact
3 : Source
4 : Gate
5 : Drain
6 : Drain
7 : Cathode
8 : Cathode
SANYO : VEC8
No. A0392-2/6
VEC2812
Switching Time Test Circuit
trr Test Circuit
[MOSFET]
[SBD]
VDD=10V
Duty≤10%
100mA
ID=1A
RL=10Ω
VOUT
D
50Ω
100Ω
10Ω
100mA
VIN
10µs
PW=10µs
D.C.≤1%
10mA
VIN
4V
0V
--5V
G
trr
VEC2812
50Ω
S
1.2
1.0
0.6
VGS=1.0V
-25
°C 25°C
0.8
0.4
0.4
1.0
1.2
0.2
0
75
°C
1.4
5°C
V
1.5
°C
Ta=
1.6
Drain Current, ID -- A
4.0V
--25
°C
V
2.5
3.0V
1.8
V
6.0V
[MOSFET]
VDS=10V
10.0
V
Drain Current, ID -- A
0.8
ID -- VGS
2.0
8
1.
1.6
1.2
[MOSFET]
25
ID -- VDS
2.0
Ta=
7
P.G
0
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
Drain-to-Source Voltage, VDS -- V
0.9
0
1.0
0.4
0.6
0.8
1.4
1.6
Gate-to-Source Voltage, VGS -- V
RDS(on) -- VGS
400
0.2
IT02901
1.8
2.0
IT02902
RDS(on) -- Ta
400
Static Drain-to-Source
On-State Resistance, RDS(on) -- mΩ
Static Drain-to-Source
On-State Resistance, RDS(on) -- mΩ
Ta=25°C
350
300
1.0A
250
ID=0.5A
200
150
100
50
0
0
2
4
6
8
Gate-to-Source Voltage, VGS -- V
10
IT02985
350
300
V
,
0.5A
I D=
250
=2.5
VGS
=4.0V
, VGS
200
.0A
I D=1
150
100
50
0
--60
--40
--20
0
20
40
60
80
100
Ambient Temperature, Ta -- °C
120
140
160
IT11826
No. A0392-3/6
C
25°
1.0
7
5
C
5°
=
Ta
3
2
--2
°C
75
0.1
7
5
3
2
2 3
5 7 0.01
2 3
5 7 0.1
2 3
5 7 1.0
2 3
Drain Current, ID -- A
0.1
7
5
1000
0.4
0.5
0.6
td(off)
2
tf
10
7
td(on)
5
3
0.9
1.0
1.1
1.2
f=1MHz
3
2
Ciss
100
7
5
3
Coss
2
2
Crss
10
2
3
5
7
2
1.0
3
Drain Current, ID -- A
5
0
[MOSFET]
10
7
5
VDS=10V
ID=1.5A
Drain Current, ID -- A
3
2
0
1
2
3
4
5
Total Gate Charge, Qg -- nC
IT07692
PD -- Ta
1.0
14
16
18
20
≤10µs
IDP=6A
10
ID=1.5A
m
s
1.0
7
5
D
C
op
er
3
2
0.1
7
5
3
2
1
12
s
4
10
s
5
8
0m
6
6
10
7
4
Drain-to-Source Voltage, VDS -- V
IT02908
ASO
[MOSFET]
1m
3
2
8
0
2
IT02907
VGS -- Qg
10
9
0.8
5
3
1.0
0.1
0.7
7
Ciss, Coss, Crss -- pF
5
0.3
IT02906
Diode Forward Voltage, VSD -- V
Ciss, Coss, Crss -- VDS [MOSFET]
[MOSFET]
tr
Switching Time, SW Time -- ns
3
2
0.01
0.2
5
VDD=10V
VGS=4V
7
Gate-to-Source Voltage, VGS -- V
1.0
7
5
IT02905
SW Time -- ID
100
Allowable Power Dissipation, PD -- W
3
2
3
2
0.01
0.001
[MOSFET]
VGS=0V
°C
C
--25
°C
3
2
IS -- VSD
10
7
5
VDS=10V
25°
[MOSFET]
Ta=
75
yfs -- ID
10
7
5
Source Current, IS -- A
Forward Transfer Admittance, yfs -- S
VEC2812
at
io
n
Operation in this
area is limited by RDS(on).
Ta=25°C
Single pulse
Mounted on a ceramic board (900mm2✕0.8mm) 1unit
0.01
0.01
2 3
5 7 0.1
2 3
5 7 1.0
2 3
5 7 10
Drain-to-Source Voltage, VDS -- V
2 3
5
IT09925
[MOSFET]
M
0.8
ou
nt
0.6
ed
on
ac
er
am
ic
bo
ar
0.4
d(
90
0m
m2
✕0
.8m
0.2
m
)1
un
it
0
0
20
40
60
80
100
120
Ambient Temperature, Ta -- °C
140
160
IT09926
No. A0392-4/6
VEC2812
IF -- VF
25
5°C
10
°C
Ta
=-25
°C
0°
0.1
7
5
3
2
0.01
7
5
3
2
0.001
0.3
0.4
Average Forward Power Dissipation, PF(AV) -- W
0.6
0.5
(1)
75°C
50°C
25°C
100
7
5
3
2
--25°C
10
7
5
3
2
1.0
0
[SBD]
Rectangular
wave
θ
360°
Sine wave
0.1
30
40
IT07945
Tc -- IO
[SBD]
(1)Rectangular wave θ=60°
(2)Rectangular wave θ=120°
(3)Rectangular wave θ=180°
(4)Sine wave θ=180°
140
120
0.4
0.2
20
10
Reverse Voltage, VR -- V
(2) (4) (3)
0.3
100°C
IT07944
PF(AV) -- IO
(1)Rectangular wave θ=60°
(2)Rectangular wave θ=120°
(3)Rectangular wave θ=180°
(4)Sine wave θ=180°
[SBD]
°C
Ta=125
1000
7
5
3
2
0.5
Forward Voltage, VF -- V
Case Temperature, Tc -- °C
0.2
0.1
0
IR -- VR
3
2
Reverse Current, IR -- µA
C
75
°C
50
°C
1.0
7
5
3
2
[SBD]
10000
7
5
3
2
12
Forward Current, IF -- A
10
7
5
3
2
100
80
60
40
(1)
(2) (4) (3)
20
180°
360°
1.0
0
0
0.2
0.4
0.6
0.8
Average Output Current, IO -- A
IT08214
C -- VR
3
0
1.2
0
0.2
0.4
0.6
0.8
Average Output Current, IO -- A
1.0
1.2
IT08216
[SBD]
f=1MHz
Interterminal Capacitance, C -- pF
2
100
7
5
3
2
10
0.1
2
3
5 7 1.0
2
3
5 7 10
Reverse Voltage, VR -- V
2
3
5 7 100
IT07948
No. A0392-5/6
VEC2812
Note on usage : Since the VEC2812 is a MOSFET product, please avoid using this device in the vicinity
of highly charged objects.
Specifications of any and all SANYO Semiconductor products described or contained herein stipulate
the performance, characteristics, and functions of the described products in the independent state,
and are not guarantees of the performance, characteristics, and functions of the described products
as mounted in the customer's products or equipment. To verify symptoms and states that cannot be
evaluated in an independent device, the customer should always evaluate and test devices mounted
in the customer's products or equipment.
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and all semiconductor products fail with some probability. It is possible that these probabilistic failures
could give rise to accidents or events that could endanger human lives, that could give rise to smoke or
fire, or that could cause damage to other property. When designing equipment, adopt safety measures
so that these kinds of accidents or events cannot occur. Such measures include but are not limited to
protective circuits and error prevention circuits for safe design, redundant design, and structural design.
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for the SANYO Semiconductor product that you intend to use.
Information (including circuit diagrams and circuit parameters) herein is for example only; it is not
guaranteed for volume production. SANYO Semiconductor believes information herein is accurate
and reliable, but no guarantees are made or implied regarding its use or any infringements of
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This catalog provides information as of November, 2006. Specifications and information herein are subject
to change without notice.
PS No. A0392-6/6