FAIRCHILD FDD4685_08

FDD4685_F085
®
P-Channel PowerTrench MOSFET
-40V, -32A, 35mΩ
Features
Applications
„ Typ rDS(on) = 23mΩ at VGS = -10V, ID = -8.4A
„ Inverter
„ Typ rDS(on) = 30mΩ at VGS = -4.5V, ID = -7A
„ Power Supplies
„ Typ Qg(TOT) = 19nC at VGS = -5V
„ High performance trench technology for extremely low
rDS(on)
„ RoHS Compliant
„ Qualified to AEC Q101
©2010 Fairchild Semiconductor Corporation
FDD4685_F085 Rev. C
1
www.fairchildsemi.com
FDD4685_F085 P-Channel PowerTrench® MOSFET
December 2010
Symbol
VDSS
Drain to Source Voltage
VGS
ID
Parameter
Ratings
-40
Units
V
Gate to Source Voltage
±20
V
Drain Current Continuous (TC<90oC, VGS = 10V)
-32
Pulsed
EAS
PD
A
See Figure 4
Single Pulse Avalanche Energe
(Note 1)
121
mJ
Power Dissipation
83
W
Dreate above 25oC
0.56
W/oC
-55 to +175
oC
TJ, TSTG Operating and Storage Temperature
Thermal Characteristics
RθJC
RθJA
Maximum Thermal Resistance Junction to Case
2
Maximum Thermal Resistance Junction to Ambient TO-252, 1in copper pad area
1.8
o
C/W
40
o
C/W
Package Marking and Ordering Information
Device Marking
FDD4685
Device
FDD4685_F085
Package
TO252
Reel Size
13”
Tape Width
12mm
Quantity
2500 units
Electrical Characteristics TJ = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
-40
-
-
V
-
mV/°C
Off Characteristics
BVDSS
Drain to Source Breakdown Voltage
Breakdown Voltage Temperature
Coefficient
ID = -250μA, VGS = 0V
ΔBVDSS
ΔTJ
ID = -250μA, referenced to 25°C
-
-33
IDSS
Zero Gate Voltage Drain Current
VDS = -32V,
-
-
-1
μA
IGSS
Gate to Source Leakage Current
VGS = ±20V
-
-
±100
nA
On Characteristics
VGS(th)
Gate to Source Threshold Voltage
VGS = VDS, ID = -250μA
-1
-1.6
-3
V
ΔVGS(th)
ΔTJ
Gate to Source Threshold Voltage
Temperature Coefficient
ID = –250μA, referenced to 25°C
-
4.9
-
mV/°C
rDS(on)
gFS
Drain to Source On Resistance
Forward Transconductance
ID = -8.4A, VGS= -10V
-
23
27
ID = -7A, VGS= -4.5V
-
30
35
ID = -8.4A, VGS= -10V,
TJ = 150oC
-
38
45
ID = –8.4A, VDS = –5V,
-
23
-
VDS = -20V, VGS = 0V,
f = 1MHz
-
1790
2380
pF
-
260
345
pF
pF
mΩ
S
Dynamic Characteristics
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
RG
Gate Resistance
Qg(TOT)
Total Gate Charge
Qgs
Gate to Source Gate Charge
Qgd
Gate to Drain “Miller“ Charge
FDD4685_F085 Rev. C
f = 1MHz
VDD = -20V, VGS = -5V
ID = -8.4A
2
-
140
205
-
4
-
Ω
-
19
27
nC
-
5.6
-
nC
-
6.1
-
nC
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FDD4685_F085 P-Channel PowerTrench® MOSFET
MOSFET Maximum Ratings TC = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
-
8
16
ns
-
15
27
ns
-
34
55
ns
-
14
26
ns
Switching Characteristics
td(on)
Turn-On Delay Time
tr
Rise Time
td(off)
Turn-Off Delay Time
tf
Fall Time
VDD = -20V, ID = -8.4A
VGS = -10V, RGEN = 6Ω
Drain-Source Diode Characteristics
VSD
Source to Drain Diode Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
ISD = -8.4A, VGS=0V
ISD = -8.4A, dISD/dt = 100A/μs
-
-0.85
-1.2
V
-
30
45
ns
-
31
47
nC
Notes:
1: Starting TJ= 25°C, L = 3mH, IAS= 9A, VGS= 10V, VDD= 40V during the inductor charging time and 0V during the time in avalanche.
This product has been designed to meet the extreme test conditions and environment demanded by the automotive industry. For
a copy of the requirements, see AEC Q101 at: http://www.aecouncil.com/
All Fairchild Semiconductor products are manufactured, assembled and tested under ISO9000 and QS9000 quality systems
certification.
FDD4685_F085 Rev. C
3
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FDD4685_F085 P-Channel PowerTrench® MOSFET
Electrical Characteristics TJ = 25oC unless otherwise noted
-ID, DRAIN CURRENT (A)
POWER DISSIPATION MULTIPLIER
50
1.2
1.0
0.8
0.6
0.4
0.2
CURRENT LIMITED
BY PACKAGE
40
30
VGS = -10V
20
VGS = -4.5V
10
o
RθJC = 1.8 C/W
0.0
0
0
25
50
75
100
125
150
TC, CASE TEMPERATURE(oC)
175
25
50
75
100
125
150
175
o
TC, CASE TEMPERATURE ( C)
Figure 2. Maximum Continuous Drain Current vs
Case Temperature
Figure 1. Normalized Power Dissipation vs Case
Temperature
2
DUTY CYCLE - DESCENDING ORDER
NORMALIZED THERMAL
IMPEDANCE, ZθJC
1
D = 0.50
0.20
0.10
0.05
0.02
0.01
0.1
PDM
t1
0.01
SINGLE PULSE
t2
NOTES:
DUTY FACTOR: D = t1/t2
PEAK TJ = PDM x ZθJA x RθJA + TA
0.001
-5
10
-4
10
-3
-2
-1
0
10
10
10
t, RECTANGULAR PULSE DURATION(s)
1
10
10
Figure 3. Normalized Maximum Transient Thermal Impedance
10000
VGS = 10V
TC = 25oC
-IDM, PEAK CURRENT (A)
FOR TEMPERATURES
ABOVE 25oC DERATE PEAK
CURRENT AS FOLLOWS:
175 - TC
I = I25
150
100
SINGLE PULSE
10
-5
10
-4
10
-3
-2
-1
10
10
10
t, RECTANGULAR PULSE DURATION(s)
0
10
1
10
Figure 4. Peak Current Capability
FDD4685_F085 Rev. C
4
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FDD4685_F085 P-Channel PowerTrench® MOSFET
Typical Characteristics
200
-IAS, AVALANCHE CURRENT (A)
-ID, DRAIN CURRENT (A)
1000
100
100us
10
SINGLE PULSE
TJ = MAX RATED
TC = 25oC
1ms
1
10ms
DC
OPERATION IN THIS
AREA MAY BE
LIMITED BY rDS(on)
0.1
1
STARTING TJ = 25oC
10
STARTING TJ = 150oC
1
10
-VDS, DRAIN TO SOURCE VOLTAGE (V)
If R = 0
tAV = (L)(IAS)/(1.3*RATED BVDSS - VDD)
If R ≠ 0
tAV = (L/R)ln[(IAS*R)/(1.3*RATED BVDSS - VDD) +1]
100
90
1
0.1
1
10
100
tAV, TIME IN AVALANCHE (ms)
NOTE: Refer to Fairchild Application Notes AN7514 and AN7515
Figure 5. Forward Bias Safe Operating Area
100
PULSE DURATION = 80μs
DUTY CYCLE = 0.5% MAX
80
VDD = -5V
-ID, DRAIN CURRENT (A)
-ID, DRAIN CURRENT (A)
100
Figure 6. Unclamped Inductive Switching
Capability
TJ = -55oC
60
TJ = 25oC
40
TJ = 175oC
20
0
0
1
2
3
4
5
-VGS, GATE TO SOURCE VOLTAGE (V)
Figure 7. Transfer Characteristics
ID = -8.4A
PULSE DURATION = 80μs
DUTY CYCLE = 0.5% MAX
100
80
60
TJ = 175oC
40
20
TJ = 25oC
2
4
6
8
10
-VGS, GATE TO SOURCE VOLTAGE (V)
Figure 9. Drain to Source On-Resistance
Variation vs Gate to Source Voltage
FDD4685_F085 Rev. C
VGS = -10V
60
VGS = -6V
VGS = -4.5V
40
VGS = -4V
20
VGS = -3V
0
1
2
3
-VDS, DRAIN TO SOURCE VOLTAGE (V)
4
Figure 8. Saturation Characteristics
NORMALIZED
DRAIN TO SOURCE ON-RESISTANCE
rDS(on), DRAIN TO SOURCE
ON-RESISTANCE (mΩ)
120
80
0
6
PULSE DURATION = 80μs
DUTY CYCLE = 0.5% MAX
1.8
1.6
PULSE DURATION = 80μs
DUTY CYCLE = 0.5% MAX
1.4
1.2
1.0
0.8
0.6
-80
ID = -8.4A
VGS = -10V
-40
0
40
80
120
160
TJ, JUNCTION TEMPERATURE(oC)
200
Figure 10. Normalized Drain to Source On
Resistance vs Junction Temperature
5
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FDD4685_F085 P-Channel PowerTrench® MOSFET
Typical Characteristics
1.3
1.15
NORMALIZED GATE
THRESHOLD VOLTAGE
1.2
NORMALIZED DRAIN TO SOURCE
BREAKDOWN VOLTAGE
VGS = VDS
ID = -250μA
1.1
1.0
0.9
0.8
0.7
0.6
0.5
0.4
-80
-40
0
40
80
120
160
TJ, JUNCTION TEMPERATURE(oC)
200
Figure 11. Normalized Gate Threshold Voltage vs
Junction Temperature
-VGS, GATE TO SOURCE VOLTAGE(V)
CAPACITANCE (pF)
Ciss
1000
Coss
Crss
f = 1MHz
VGS = 0V
10
0.1
1
10
-VDS, DRAIN TO SOURCE VOLTAGE (V)
100
Figure 13. Capacitance vs Drain to Source
Voltage
FDD4685_F085 Rev. C
1.10
1.05
1.00
0.95
0.90
-80
-40
0
40
80
120
160
TJ, JUNCTION TEMPERATURE (oC)
200
Figure 12. Normalized Drain to Source
Breakdown Voltage vs Junction Temperature
10000
100
ID = -250uA
10
VDD = -10V
8
VDD = -20V
6
VDD = -30V
4
2
0
0
10
20
30
Qg, GATE CHARGE(nC)
40
Figure 14. Gate Charge vs Gate to Source Voltage
6
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FDD4685_F085 P-Channel PowerTrench® MOSFET
Typical Characteristics
*Trademarks of System General Corporation, used under license by Fairchild Semiconductor.
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FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
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PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
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THEREIN, WHICH COVERS THESE PRODUCTS.
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FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE
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As used here in:
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intended for surgical implant into the body or (b) support or sustain life,
and (c) whose failure to perform when properly used in accordance with
instructions for use provided in the labeling, can be reasonably
expected to result in a significant injury of the user.
2.
A critical component in any component of a life support, device, or
system whose failure to perform can be reasonably expected to cause
the failure of the life support device or system, or to affect its safety or
effectiveness.
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Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Formative / In Design
Datasheet contains the design specifications for product development. Specifications
may change in any manner without notice.
Preliminary
First Production
Datasheet contains preliminary data; supplementary data will be published at a later
date. Fairchild Semiconductor reserves the right to make changes at any time without
notice to improve design.
No Identification Needed
Full Production
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to
make changes at any time without notice to improve the design.
Obsolete
Not In Production
Datasheet contains specifications on a product that is discontinued by Fairchild
Semiconductor. The datasheet is for reference information only.
Rev. I51
FDD4685_F085 Rev. C
7
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FDD4685_F085 P-Channel PowerTrench® MOSFET
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The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not
intended to be an exhaustive list of all such trademarks.
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