BULD741 High voltage fast-switching NPN power transistor Features ■ High voltage capability ■ Low spread of dynamic parameters ■ Minimum lot-to-lot spread for reliable operation ■ Very high switching speed 3 Description 1 The device is manufactured using high voltage Multi-Epitaxial Planar technology for high switching speeds and high voltage capability. Thanks to an increased intermediate layer, it has an intrinsic ruggedness which enables the transistor to withstand an high collector current level during breakdown condition, without using the transil protection usually necessary in typical converters for lamp ballast. Figure 1. 1 DPAK IPAK TO-252 TO-251 2 3 Internal schematic diagram Applications ■ Electronic ballast for fluorescent lighting ■ Switch mode power supplies. Table 1. Device summary Order codes Marking Package Packaging BULD741T4 BULD741 DPAK Tape & reel BULD741-1 BULD741 IPAK Tube July 2007 Rev 2 1/11 www.st.com 11 Electrical ratings 1 BULD741 Electrical ratings Table 2. Absolute maximum rating Symbol Parameter Value Unit VCES Collector-emitter voltage (V BE = 0) 1050 V VCEO Collector-emitter voltage (IB = 0) 400 V VEBO Emitter-base voltage (IC = 0, IB = 2A, tP < 10ms) V(BR)EBO V 2.5 A 5 A 1.5 A IC ICM IB Collector peak current (tP < 5ms) Base current IBM Base peak current (tP < 5ms) 3 A Ptot Total dissipation at T c = 25°C 30 W Tstg Storage temperature -65 to 150 °C 150 °C Value Unit 4.16 °C/W TJ Table 3. Symbol Rthj-case 2/11 Collector current Max. operating junction temperature Thermal data Parameter Thermal resistance junction-case __max BULD741 2 Electrical characteristics Electrical characteristics (Tcase = 25°C unless otherwise specified) Table 4. Symbol Electrical characteristics Parameter Test conditions Min. Typ. Max. Unit ICES Collector cut-off current (VBE =0V) VCE =1050V 0.2 10 µA ICEO Collector cut-off current (IB =0) VCE =400V 10 250 µA V(BR)EBO Emitter-base breakdown voltage (IC = 0) IE =1mA 15 19 24 V 400 450 Collector-emitter VCEO(sus) (1) sustaining voltage (IB = 0) VCE(sat) (1) Collector-emitter saturation voltage VBE(sat) (1) Base-emitter saturation voltage hFE ts tf Ear DC current gain IC =10mA V IC =0.7A IB =0.14A IC =2A IB =0.6A 0.15 0.5 0.5 1.5 V V IC =2A IB =0.6A 1.1 1.5 V IC =0.1A VCE =5V 48 70 100 IC =0.45A VCE =3V 25 35 50 VCC =125V IC =1A Resistive load Storage time Fall time IB1 = -IB2 =0.2A tp = 300µs 2.5 3.5 µs VBE(off) =-5V 350 500 ns Repetitive avalanche energy L =2mH VBE(off) =-5V C =1.8nF 5 mJ Note (1) Pulsed duration = 300µs, duty cycle ≤1.5% 3/11 Electrical characteristics 2.1 4/11 BULD741 Electrical characteristics (curves) Figure 2. Safe operating area Figure 3. Derating curve Figure 4. Output characteristics Figure 5. Reverse biased safe operating area Figure 6. DC current gain Figure 7. DC current gain BULD741 Electrical characteristics Figure 8. Base-emitter saturation voltage Figure 9. Collector-emitter saturation voltage Figure 10. Resistive load switching on times Figure 11. Resistive load switching on times Figure 12. Resistive load switching off times Figure 13. Resistive load switching off times 5/11 Electrical characteristics 2.2 Test circuits Figure 14. Resistive load switching test circuit 1) Fast electronic switch 2) Non-inductive resistor Figure 15. Energy rating test circuit 6/11 BULD741 BULD741 3 Package mechanical data Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com 7/11 Package mechanical data BULD741 TO-252 (DPAK) MECHANICAL DATA mm DIM. MIN. TYP. inch MAX. MIN. TYP. MAX. A 2.20 2.40 0.087 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009 B 0.64 0.90 0.025 0.035 B2 5.20 5.40 0.204 0.213 C 0.45 0.60 0.018 0.024 C2 0.48 0.60 0.019 0.024 D 6.00 6.20 0.236 0.244 E 6.40 6.60 0.252 0.260 G 4.40 4.60 0.173 0.181 H 9.35 10.10 0.368 L2 0.8 0.398 0.031 L4 0.60 1.00 0.024 0.039 V2 0o 8o 0o 0o P032P_B 8/11 BULD741 Package mechanical data TO-251 (IPAK) MECHANICAL DATA DIM. mm MIN. TYP. inch MAX. MIN. TYP. MAX. A 2.20 2.40 0.087 0.094 A1 0.90 1.10 0.035 0.043 A3 0.70 1.30 0.028 0.051 B 0.64 0.90 0.025 0.035 B2 5.20 5.40 0.204 0.213 B3 0.85 B5 0.033 0.30 B6 0.012 0.95 0.037 C 0.45 0.60 0.018 0.024 C2 0.48 0.60 0.019 0.024 D 6.00 6.20 0.237 0.244 E 6.40 6.60 0.252 0.260 G 4.40 4.60 0.173 0.181 H 15.90 16.30 0.626 0.642 L 9.00 9.40 0.354 0.370 L1 0.80 1.20 0.031 0.047 L2 0.80 V1 10o 1.00 0.031 0.039 10o P032N_E 9/11 Revision history 4 BULD741 Revision history Table 5. 10/11 Revision history Date Revision Changes 20-Dec-2006 1 Initial release. 09-Jul-2007 2 Updated package names in page 1, added figure 4, updated figure 12 and 13. BULD741 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. 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