STMICROELECTRONICS DVIULC6-4SC6

DVIULC6-4SC6
Ultra low capacitance ESD protection
Main applications
■
DVI ports up to 1.65 Gb/s
■
HDMI ports up to 1.65 Gb/s
■
IEEE 1394a and IEEE 1394b ports up to
1.6 Gb/s
■
USB2.0 ports up to 480 Mb/s (high speed),
backwards compatible with USB1.1 low and full
speed
■
Ethernet port: 10/100/1000 Mb/s
■
SIM card protection
■
Video line protection
SOT23-6L
(JEDEC MO178AB)
Complies with these standards:
■
Description
The DVIULC6-4SC6 is a monolithic, application
specific discrete device dedicated to ESD
protection of high speed interfaces, such as DVI,
HDMI, IEEE 1394a and IEEE 1394b, USB2.0,
Ethernet links and video lines.
Its ultra low line capacitance secures a high level
of signal integrity without compromising in
protecting sensitive chips against the most
stringent characterized ESD strikes.
Features
■
4 line ESD protection
■
Protects VBUS when applicable
■
Ultra low capacitance: 0.6 pF at F = 825 MHz
■
Fast response time
■
SOT23-6L package
■
RoHS compliant
Order code
Part Number
Marking
DVIULC6-4SC6
DL46
IEC61000-4-2 level 4
– 15 kV (air discharge)
– 8 kV (contact discharge)
Benefits
■
ESD standards compliance guaranteed at
device level, hence greater immunity at system
level
■
ESD protection of VBUS when applicable.
Allows ESD current flowing to Ground when
ESD event occurs on data line
■
Optimized rise and fall times for maximum data
integrity
■
Consistent D+ / D- signal balance:
– Best capacitance matching tolerance I/O to
GND = 0.015 pF for ultra low inter pair skew
– Best capacitance matching tolerance I/O to
I/O = 0.007 pF for ultra low intra pair skew
– Matching high bit rate DVI, HDMI, and
IEEE 1394 requirements
■
Low PCB space consuming, 9mm² maximum
foot print
■
Low leakage current for longer operation of
battery powered devices
■
Higher reliability offered by monolithic
integration
Rev 1
1/12
August 2005
www.st.com
12
DVIULC6-4SC6
Figure 1.
Table 1.
Functional Diagram
I/O1
1
1
6
I/O4
GND
2
5
VBUS
I/O2
3
4
I/O3
Absolute Ratings
Symbol
Parameter
VPP
Peak pulse voltage
Tstg
Storage temperature range
Value
At device level:
IEC61000-4-2 air discharge
IEC61000-4-2 contact discharge
MIL STD883C-Method 3015-6
Unit
±15
±15
±25
kV
-55 to +150
°C
Tj
Maximum junction temperature
125
°C
TL
Lead solder temperature (10 seconds duration)
260
°C
Table 2.
Electrical Characteristics (Tamb = 25°C)
Value
Symbol
Parameter
Test Conditions
Unit
Min.
VRM = 5 V
IRM
Leakage current
VBR
Breakdown voltage between VBUS and GND IR = 1 mA
VCL
0.5
6
µA
V
IPP = 1 A, tp = 8/20 µs
Any I/O pin to GND
12
V
IPP = 5 A, tp = 8/20 µs
Any I/O pin to GND
17
V
VR = 0 V, F= 1 MHz
0.85
VR = 0 V, F= 825 MHz
0.6
∆Ci/o-GND Capacitance variation between I/O and GND
Capacitance between I/O
∆Ci/o-i/o Capacitance variation between I/O
2/12
Max
Clamping voltage
Ci/o-GND Capacitance between I/O and GND
Ci/o-i/o
Typ.
1
pF
0.015
VR = 0 V, F= 1 MHz
0.42
VR = 0 V, F= 825 MHz
0.3
0.007
0.5
pF
DVIULC6-4SC6
Figure 2.
Line Capacitance versus line
voltage (typical values)
Figure 3.
C(pF)
C(pF)
1.0
1.0
F=825MHz
Vosc=500m VRMS
VBU S O PEN
Tj=25 °C
0.9
0.8
Vosc=30mVRMS
Tj =25°C
VI-O/GND = 0V
VBUS OPEN
0.9
0.8
0.7
0.7
0.6
0.6
0.5
CI/O - GND
0.5
0.4
0.4
0.3
0.3
0.2
CI/O - GND
0.2
0.1
CI/O - CI/O
0.1
Data line voltage (v)
0
F(MHz)
0
0.0
Figure 4.
Line capacitance versus frequency
(typical values)
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
1
Relative variation of leakage current Figure 5.
versus junction temperature (typical
values)
10
1000
10000
Frequency response
Attenuation
S21(dB)
IRM[Tj] / IRM[Tj=25°C]
100
0
5
4
-2
3
-4
2
-6
Tj(°C)
1
25
50
75
100
F(Hz)
125
-8
100.0k
1.0M
10.0M
100.0M
1.0G
3/12
DVIULC6-4SC6
1 Surge protection
Technical information
1
Surge protection
The DVIULC6-4SC6 is particularly optimized to perform ESD surge protection based on the rail
to rail topology.
The clamping voltage VCL can be calculated as follow:
VCL+ = VBUS + VF
VCL- = - VF
for positive surges
for negative surges
with: VF = VT + Rd.Ip
(VF forward drop voltage) / (VT forward drop threshold voltage)
We assume that the value of the dynamic resistance of the clamping diode is typically:
Rd = 1.4 Ω and VT = 1.2 V.
For an IEC61000-4-2 surge Level 4 (Contact Discharge: Vg=8 kV, Rg=330 Ω), VBUS = +5 V, and
if in first approximation, we assume that: Ip = Vg / Rg = 24 A.
So, we find:
VCL+ = +39 V
VCL- = -34 V
Note:
4/12
The calculations do not take into account phenomena due to parasitic inductances.
DVIULC6-4SC6
2
2 Surge protection application example
Surge protection application example
If we consider that the connections from the pin VBUS to VCC and from GND to PCB GND are
done by two tracks of 10mm long and 0.5 mm large; we assume that the parasitic inductances
Lw of these tracks are about 6nH. So when an IEC61000-4-2 surge occurs, due to the rise time
of this spike (tr=1 ns), the voltage VCL has an extra value equal to Lw.dI/dt.
The dI/dt is calculated as: dI/dt = Ip/tr = 24 A/ns
The over voltage due to the parasitic inductances is: Lw.dI/dt = 6 x 24 = 144 V
By taking into account the effect of these parasitic inductances due to unsuitable layout, the
clamping voltage will be:
VCL+ = +39 + 144 = 183 V
VCL- = -34 - 144 = -178 V
We can reduce as much as possible these phenomena with simple layout optimization.
It’s the reason why some recommendations have to be followed (see Section 3: How to ensure
a good ESD protection).
Figure 6.
ESD behavior: parasitic phenomena due to unsuitable layout
VCL+
183V
Lw
VBUS
ESD
SURGE
+VCC
VF
Lw di
dt
Lw
di
dt
POSITIVE
SURGE
VCC+VF
t
I/O
tr=1ns
di
VCL+ = VBUS+VF+Lw dt surge >0
di
surge <0
VCL- = -VF-Lw
dt
VI/O
Lw di
dt
tr=1ns
t
-VF
-Lw
di
dt
NEGATIVE
SURGE
GND
-178V
VCL-
5/12
DVIULC6-4SC6
3 How to ensure a good ESD protection
3
How to ensure a good ESD protection
While the DVIULC6-4SC6 provides a high immunity to ESD surge, an efficient protection
depends on the layout of the board. In the same way, with the rail to rail topology, the track from
the VBUS pin to the power supply +VCC and from the VBUS pin to GND must be as short as
possible to avoid over voltages due to parasitic phenomena (see Figure 6).
It’s often harder to connect the power supply near to the DVIULC6-4SC6 unlike the ground
thanks to the ground plane that allows a short connection.
To ensure the same efficiency for positive surges when the connections can’t be short enough,
we recommend to put close to the DVIULC6-4SC6, between VBUS and ground, a capacitance
of 100nF to prevent from these kinds of overfatigue disturbances (see Figure 7).
The add of this capacitance will allow a better protection by providing during surge a constant
voltage.
The Figure 8, Figure 9, and Figure 10 show the improvement of the ESD protection according
to the recommendations described above.
ESD behavior: optimized layout and Figure 8.
add of a capacitance of 100nF
ESD
SURGE
VCL+
Lw
ESD
SURGE
REF2=+VCC
t
I/O
surge <0
Vcc (+5V)
t
VCL+ = VCC+VF surge >0
VCL- = -VF
TEST BOARD
POSITIVE
SURGE
C=100nF
VI/O
ESD behavior: measurements
conditions (with coupling
capacitance)
DVIULC6-4SC6
Figure 7.
NEGATIVE
SURGE
REF1=GND
VCL-
C=100nF
6/12
DVIULC6-4SC6
Figure 9.
4 Crosstalk behavior
Remaining voltage after the
Figure 10. Remaining voltage after the
DVIULC6-4SC6 during positive ESD
DVIULC6-4SC6 during negative ESD
surge
surge
IMPORTANT:
A main precaution to take is to put the protection device closer to the disturbance source
(generally the connector).
Note:
The measurements have been done with the DVIULC6-4SC6 in open circuit.
4
Crosstalk behavior
4.1
Crosstalk phenomena
Figure 11. Crosstalk phenomena
RG1
Line 1
VG1
RL1
RG2
VG2
RL2
DRIVERS
α 1 VG1 + β12VG2
Line 2
α 2VG2 + β21VG1
RECEIVERS
The crosstalk phenomena are due to the coupling between 2 lines. The coupling factor (β12 or
β21) increases when the gap across lines decreases, particularly in silicon dice. In the example
above the expected signal on load RL2 is α2VG2, in fact the real voltage at this point has got an
extra value β21VG1. This part of the VG1 signal represents the effect of the crosstalk
phenomenon of the line 1 on the line 2. This phenomenon has to be taken into account when
7/12
DVIULC6-4SC6
4 Crosstalk behavior
the drivers impose fast digital data or high frequency analog signals in the disturbing line. The
perturbed line will be more affected if it works with low voltage signal or high load impedance
(few kΩ).
Figure 12. Analog crosstalk measurements
TRACKING GENERATOR
SPECTRUM ANALYSER
TEST BOARD
DVIULC6
50
50 ΩW
Vcc
Vin
Vg
V
g
50 ΩW
Vout
C=100nF
Figure 12 gives the measurement circuit for the analog application. In usual frequency range of
analog signals (up to 240 MHz) the effect on disturbed line is less than -45 dB (see Figure 13).
Figure 13. Analog crosstalk results
Crosstalk
APLAC 7.91 User: ST Microelectronics May 20 2005
0.00
- 30.00
- 60.00
- 90.00
- 120.00
100.0k
1.0M
10.0M
100.0M
1.0G
f/Hz
As the DVIULC6-4SC6 is designed to protect high speed data lines, it must ensure a good
transmission of operating signals. The frequency response (figure 5) gives attenuation
information and shows that the DVIULC6-4SC6 is well suitable for data line transmission up to
1.65 Gb/s.
8/12
DVIULC6-4SC6
Application examples
Figure 14. DVI/HDMI Digital single link application using DVIULC6-4SC6
Display (LCD monitor, flat panel,display, projector)
HOST (PC, graphics cards, set-top box, DVD player)
DE
Tx0-
RX0-
Tx0+
RX0+
TMDS
Transmitter
Pixel
Data
Graphics
Controller
Clock
Vsync
DVI connector
1
1
6
1
1
6
2
5
2
5
3
4
3
4
Tx1Tx1+
Tx2Tx2+
Hsync
TMDS
Receiver
1
1
6
2
5
3
4
1
1
DE
Pixel
Data
Rx1Rx1+
Rx2RX2+
Clock
Display
Controller
Vsync
6
Hsync
TMDS Links
2
5
3
4
TC-
RC-
TC+
RC+
Figure 15. T1/E1/Ethernet protection
Tx
SMP75-8
+VCC
4
5
2
1
1
6
100nF
3
5
5 Application examples
DATA
TRANSCEIVER
Rx
SMP75-8
9/12
DVIULC6-4SC6
6 PCB layout considerations
6
PCB layout considerations
Figure 16. DVIULC6-4SC6 PCB layout
considerations ( VCC connection is
application dependent)
Figure 17. Foot Print Dimensions (in
millimeters)
0.60
D+1
DVI
1
1.20
D-1
Connector
VCC
C = 100nF
GND
D+2
Side
0.95
D-2
3.50
1.10
2.30
DVIULC6-4SC6
Figure 18. SOT23-6L Package Mechanical Data
DIMENSIONS
REF.
E
Min.
e
b
D
e
A2
c
A1
θ
L
H
Millimeters
Typ.
Max.
Inches
Min.
Typ.
Max.
A
0.90
A1
0
A2
0.90
1.30 0.035
0.051
b
0.35
0.50 0.014
0.02
c
0.09
0.20 0.004
0.008
D
2.80
3.05 0.110
0.120
E
1.50
1.75 0.059
0.069
e
1.45 0.035
0.057
0.10
0.004
0
0.95
0.037
H
2.60
3.00 0.102
0.118
L
0.10
0.60 0.004
0.024
θ
0°
10°
0°
10°
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect . The category of
second level interconnect is marked on the package and on the inner box label, in compliance
with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also
marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are
available at: www.st.com.
10/12
DVIULC6-4SC6
7
8
7 Ordering information
Ordering information
Ordering code
Marking
Package
Weight
Base qty
Delivery mode
DVIULC6-4SC6
DL46
SOT23-6L
16.7 mg
3000
Tape & reel
Revision history
Date
Revision
24-Aug-2005
1
Description of Changes
First Issue
11/12
DVIULC6-4SC6
8 Revision history
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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