EMIF02-SPK01F2 ® 2 LINE EMI FILTER AND ESD PROTECTION IPAD™ MAIN PRODUCT CHARACTERISTICS: Where EMI filtering in ESD sensitive equipment is required : ■ Mobile phones and communication systems ■ Computers, printers and MCU Boards DESCRIPTION The EMIF02-SPK01 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interferences. The EMIF02 Flip-Chip packaging means the package size is equal to the die size. This filter includes an ESD protection circuitry which prevents damage to the application when subjected to ESD surges up 15 kV. Flip-Chip (5 Bumps) Table 1: Order Code Part Number EMIF02-SPK01F2 BENEFITS ■ EMI symmetrical (I/O) low-pass filter ■ High efficiency in EMI filtering ■ Very low PCB space consuming: 1.07 mm x 1.47 mm ■ Very thin package: 0.65 mm ■ High efficiency in ESD suppression ■ High reliability offered by monolithic integration ■ High reducing of parasitic elements through integration & wafer level packaging Marking FX Figure 1: Pin Configuration (bump side) 3 2 1 I2 COMPLIES WITH THE FOLLOWING STANDARDS: IEC 61000-4-2 Level 4 on input pins 15 kV (air discharge) 8 kV (contact discharge) Level 1 on output pins 2 kV (air discharge) 2 kV (contact discharge) MIL STD 883E -Method 3015-6 Class 3 I1 B GND O2 A O1 C Figure 2: Basic Cell Configuration Low-pass Filter Input Output Ri/o = 10 Ω Cline = 200 pF GND GND GND TM: IPAD is a trademark of STMicroelectronics. October 2005 REV 1 1/7 EMIF02-SPK01F2 Table 2: Absolute Ratings (limiting values) Symbol Parameter and test conditions Value Unit 125 °C - 40 to + 85 °C - 55 to 50 °C Maximum junction temperature Tj Top Operating temperature range Tstg Storage temperature range Table 3: Electrical Characteristics (Tamb = 25 °C) Symbol Parameter I VBR Breakdown voltage IRM Leakage current @ VRM VRM Stand-off voltage VCL Clamping voltage Rd Dynamic impedance IPP Peak pulse current RI/O Series resistance between Input & Output Cline Input capacitance per line Symbol IPP VCL VBR VRM IR IRM IRM IR V VRM VBR VCL IPP Test conditions Min. Typ. 6 8 Max. VBR IR = 1 mA IRM VRM = 3 V per line RI/O Tolerance ± 20 % 10 Ω Cline VR = 0 V 200 pF V 500 Figure 3: S21 (dB) attenuation measurements and Aplac simulation 0.00 nA Figure 4: Analog crosstalk measurements 0.00 dB dB --5.00 --10.00 --10.00 --20.00 --15.00 --20.00 --30.00 --25.00 --40.00 --30.00 --50.00 -35.00 -40.00 100.0k 2/7 Unit 1.0M 10.0M f/Hz 100.0M 1.0G --60.00 100.0k 1.0M 10.0M f/Hz 100.0M 1.0G EMIF02-SPK01F2 Figure 5: ESD response to IEC61000-4-2 (+ 15kV air discharge) on one input V(in) and one output V(out) Figure 6: ESD response to IEC61000-4-2 (15kV air discharge) on one input V(in) and one output V(out) Figure 7: Line capacitance versus applied voltage C(pF) 250 F=1MHz Vosc=30mVRMS Tj=25°C 200 150 100 50 VR(V) 0 0 1 2 3 4 5 3/7 EMIF02-SPK01F2 Figure 8: Aplac model IN1 Rspk Rbump Lbump Lspk Lbump Rbump GND OUT1 Lsub model = D1 model = D2 Rsub Rbump GND model = D3 Lbump model = D1 model = D2 Lgnd Cgnd IN2 OUT2 Rbump Lbump Rspk Lspk Ground return EMIF02-SPK01F1 model Figure 9: Aplac parameters Model D1 Model D3 Model D2 aplacvar Ls 1nH CJO=Cdiode1 CJO=Cdiode3 CJO=Cdiode2 aplacvar Rs 150m BV=7 BV=7 BV=7 aplacvar Rspk 10 IBV=1u IBV=1u IBV=1u aplacvar Lspk 10p IKF=1000 IKF=1000 IKF=1000 aplacvar Cdiode1 234pF IS=10f IS=10f IS=10f aplacvar Cdiode2 3.5ppF ISR=100p ISR=100p ISR=100p aplacvar Cdiode3 1nF N=1 N=1 N=1 aplacvar Lbump 50pH M=0.3333 M=0.3333 M=0.3333 aplacvar Rbump 10m RS=0.7 RS=0.12 RS=0.3 aplacvar Rsub 0.5m VJ=0.6 VJ=0.6 VJ=0.6 aplacvar Lsub 10pH TT=50n TT=50n TT=50n aplacvar Rgnd 1m aplacvar Lgnd 50pH aplacvar Cgnd 0.15pF 4/7 Rgnd Lbump Rbump EMIF02-SPK01F2 Figure 10: Order code EMIF yy - xxx zz Fx EMI Filter Number of lines Information x = resistance value (Ohms) z = capacitance value / 10(pF) or 3 letters = application 2 digits = version Package F = Flip-Chip x = 1: 500µm, Bump = 315µm = 2: Leadfree Pitch = 500µm, Bump = 315µm Figure 11: FLIP-CHIP Package Mechanical Data 500µm ± 10 315µm ± 50 650µm ± 50 50 0µ m ± 15 1.47mm ± 50µm 250µm ± 10 1.07mm ± 50µm Figure 12: Foot print recommendations Copper pad Diameter : 250µm recommended , 300µm max Solder stencil opening : 330µm Solder mask opening recommendation : 340µm min for 315µm copper pad diameter Figure 13: Marking Dot, ST logo xx = marking z = manufacturing location yww = datecode (y = year ww = week) E x x z y ww 5/7 EMIF02-SPK01F2 Figure 14: FLIP-CHIP Tape and Reel Specification Dot identifying Pin A1 location Ø 1.5 ± 0.1 1.75 ± 0.1 ST E ST E ST E xxz yww xxz yww xxz yww 0.73 ± 0.05 3.5 ± 0.1 8 ± 0.3 4 ± 0.1 4 ± 0.1 User direction of unreeling All dimensions in mm In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Table 4: Ordering Information Ordering code Marking Package Weight Base qty Delivery mode EMIF02-SPK01F2 FX Flip-Chip 2.1 mg 5000 Tape & reel (7”) Note: More packing informations are available in the application notes AN1235: ''Flip-Chip: Package description and recommandations for use'' AN1751: "EMI Filters: Recommendations and measurements" Table 5: Revision History 6/7 Date Revision 14-Oct-2004 1 Description of Changes First issue EMIF02-SPK01F2 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. 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