STMICROELECTRONICS EMIF02

EMIF02-USB05C2
IPAD™
2 line EMF filter including ESD protection
Main application
When EMI filtering is ESD sensitive equipment is
required:
■
Mobile phones and communication systems
■
Computers, printers and MCU boards
Description
The EMIF02-USB05C2 is a highly integrated
array designed to suppress EMI / RFI noise for
USB port filtering. The EMIF02-USB05C2 FlipChip packaging means the package size is equal
to the die size.
Coated Flip-Chip
(8 Bumps)
Pin configuration (bump side)
Additionally, this low-pass filter includes an ESD
protection circuitry to prevent damage to the
application when subjected to ESD surges up
to 15 kV.
This device is designed to be fully compatible with
USB standards.
2
1
IO4
VCC
A
O2
I2
B
O1
I1
C
IO3
GND
D
Benefits
Functional diagram
■
2 x EMI low-pass filter + 2 line ESD protection
■
1.5 kΩ pull-up included
IO4
■
High efficiency in EMI filtering
IO3
■
Lead free coated package
■
Very low PCB space consumption:
1.92 mm x 0.92 mm
■
Very thin package: 0.69 mm
■
High reliability offered by monolithic integration
■
High reduction of parasitic elements through
integration and wafer level packaging
■
VCC
R3
R1
Input 2
Output2
GND
R2
Input 1
Output 1
Order code
USB full speed (12 Mbps), OTG compliant
Complies with following standards:
Part Number
Marking
EMIF02-USB05C2
GV
IEC 61000-4-2
level 4
15 kV (air discharge)
8 kV (contact discharge)
MIL STD 883G - Method 3015-7 Class 3
November 2006
TM: IPAD is a trademark of STMicroelectronics
Rev 2
1/7
www.st.com
7
Characteristics
1
EMIF02-USB05C2
Characteristics
Table 1.
Absolute ratings (limiting values)
Symbol
Parameter and test conditions
Maximum junction temperature
Tj
Unit
125
°C
Top
Operating temperature range
- 40 to + 85
°C
Tstg
Storage temperature range
- 55 to + 150
°C
Table 2.
Electrical characteristics (Tamb = 25° C)
Symbol
Parameter
VBR
Breakdown voltage
IRM
Leakage current @ VRM
VRM
Stand-off voltage
Cline
Input capacitance per line
Symbol
Test conditions
VBR
IR = 1 mA
IRM
VRM = 5 V per line
I
VBR
VRM
IR
IRM
IRM
IR
Tolerance
Min.
VRM VBR
Typ.
6
V
Max.
Unit
9
V
1
µA
R1, R2
I = 10 mA
± 5%
33
Ω
R3
I = 1 mA
± 5%
1.5
kΩ
@0V
30
pF
Serial resistance matching
1
%
Cline
Matching
2/7
Value
EMIF02-USB05C2
Figure 1.
0.00
Characteristics
S21 (dB) attenuation measurement Figure 2.
dB
0.00
Analog crosstalk measurements
dB
--10.00
--20.00
--10.00
--30.00
--40.00
--50.00
--20.00
--60.00
-70.00
--30.00
-80.00
-90.00
F (Hz)
--40.00
100.0k
Figure 3.
1.0M
10.0M
100.0M
--100.00
100.0k
1.0G
ESD response to IEC 61000-4-2
Figure 4.
(+15 kV air discharge) on one input
(Vin) and on one output (Vout)
F (Hz)
1.0M
10.0M
100.0M
1.0G
ESD response to IEC 61000-4-2
(-15 kV air discharge) on one input
(Vin) and on one output (Vout)
V(in)
5 V/d
V(in)
5 V/d
V(out)
5 V/d
V(out)
5 V/d
100 ns/d
100 ns/d
Figure 5.
Junction capacitance versus
reverse voltage applied
CLINE (pF)
35
Vosc = 30 mV
Vosc=30mV
F=1MHz
F = 1 MHz
Tamb
Ta=25=°C25° C
30
25
20
15
10
5
VLINE (V)
0
0
1
2
3
4
5
3/7
Ordering information scheme
Figure 6.
EMIF02-USB05C2
Aplac model device structure
Lbump Rbump
A1
D2
bulk
A2
R3
B1
Rbump Lbump
MODEL = D2
R1
Lbump Rbump
B2
Rbump
Rbump
Lbump
Lbump
D1
MODEL = D1
MODEL = D1
bulk
C1
bulk
MODEL = D1
bulk
R2
Rbump Lbump
Lbump Rbump
MODEL = D1
C2
bulk
MODEL = D1
Lgn d
Rgn d
Aplac model parameters
Diode D1
BV=7
IBV=1m
CJO=Cz_d1
M=0.3333
RS=Rs_d1
VJ=0.6
TT=100n
Diode D2
BV=7
IBV=1m
CJO=Cz_d2
M=0.3333
RS=Rs_d2
VJ=0.6
TT=100n
Ordering information scheme
EMIF
yy
EMI Filter
Number of lines
Information
3 letters = application
2 digits = version
Package
C = Coated Flip-Chip
x = 2: Leadfree Pitch = 500 µm, Bump = 315 µm
4/7
Cgn d
Rbump
bulk
aplacvar R1 33
aplacvar R2 33
aplacvar R3 1.5k
aplacvar Cz_D1 15pF
aplacvar Rs_D1 1
aplacvar Cz_D2 300pF
aplacvar Rs_D2 0.3
aplacvar Lgnd 100pH
aplacvar Rgnd 100m
aplacvar Cgnd 0.4pF
aplacvar Lbump 50pH
aplacvar Rbump 20m
2
bulk
MODEL = D1
bulk
Figure 7.
Lbump
MODEL = D1
-
xxx zz
Cx
EMIF02-USB05C2
Package information
Figure 8.
Flip-Chip package dimensions
690 µm ± 65
315 µm ± 50
500 µm ± 10
1.92 mm ± 50 µm
500 µm ± 10
3
Package information
0.92 mm ± 50 µm
Figure 9.
Foot print recomendations
Figure 10. Marking
Dot, ST logo
xx = marking
z = manufacturing location
yww = datecode
(y = year
ww = week)
Copper pad Diameter:
250 µm recommended, 300 µm max
Solder stencil opening: 330 µm
E
x x z
y ww
Solder mask opening recommendation:
340 µm min for 315 µm copper pad diameter
Figure 11. Flip-Chip tape and reel specification
Dot identifying Pin A1 location
3.5 +/- 0.1
xxx
yww
STE
STE
xxx
yww
STE
All dimensions in mm
xxx
yww
8 +/- 0.3
0.73 +/- 0.05
1.75 +/- 0.1
Ø 1.5 +/- 0.1
4 +/- 0.1
4 +/- 0.1
User direction of unreeling
5/7
Ordering information
Note:
EMIF02-USB05C2
More packing information is available in the application notes
AN1235: “Flip-Chip: Package description and recommendations for use”
AN1751: “EMI Filters: Recommendations and measurements”
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
4
5
6/7
Ordering information
Ordering code
Marking
Package
Weight
Base qty
Delivery mode
EMIF02-USB05C2
GV
Flip-Chip
2.7 mg
5000
Tape and reel 7”
Revision history
Date
Revision
Changes
14-Mar-2005
1
Initial release.
13-Nov-2006
2
Reformatted to current standards. Modified functional diagram on
page 1 to show connections. Updated Aplac model information.
EMIF02-USB05C2
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2006 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
7/7