TC1223/TC1224 50mA and 100mA CMOS LDOs with Shutdown Features General Description • Extremely Low Ground Current for Longer Battery Life • Very Low Dropout Voltage • Choice of 50mA and 100mA Output (TC1223, TC1224, Respectively) • High Output Voltage Accuracy • Standard or Custom Output Voltages • Power Saving Shutdown Mode • Over Current and Over Temperature Protection • Space-Saving 5-Pin SOT-23A Package • Pin Compatible Upgrades for Bipolar Regulators The TC1223 and TC1224 are high accuracy (typically ±0.5%) CMOS upgrades for older (bipolar) low dropout regulators such as the LP2980. Designed specifically for battery-operated systems, the devices’ CMOS construction eliminates wasted ground current, significantly extending battery life. Total supply current is typically 50µA at full load (20 to 60 times lower than in bipolar regulators). Applications • • • • • • • Battery Operated Systems Portable Computers Medical Instruments Instrumentation Cellular/GSM/PHS Phones Linear Post-Regulators for SMPS Pagers The devices’ key features include ultra low noise operation; very low dropout voltage (typically 85mV, TC1223 and 180mV, TC1224 at full load) and fast response to step changes in load. Supply current is reduced to 0.5µA (max) and VOUT falls to zero when the shutdown input is low. The devices incorporate both over temperature and over current protection. The TC1223 and TC1224 are stable with an output capacitor of only 1µF and have a maximum output current of 50mA and 100mA respectively. For higher output current versions, please see the TC1107, TC1108 and TC1173 (IOUT = 300mA) data sheets. Typical Application Device Selection Table VIN Part Number Package Junction Temp. Range TC1223-xxVCT 5-Pin SOT-23A -40°C to +125°C TC1224-xxVCT 5-Pin SOT-23A -40°C to +125°C 1 VIN VOUT 5 + TC1223 TC1224 2 VOUT 1µF GND NOTE: xx indicates output voltages Available Output Voltages: 2.5, 2.7, 2.8, 2.85, 3.0, 3.3, 3.6, 4.0, 5.0. 3 SHDN NC 4 Other output voltages are available. Please contact Microchip Technology Inc. for details. Package Type 5-Pin SOT-23A VOUT NC 5 4 Shutdown Control (from Power Control Logic) TC1223 TC1224 1 2 3 VIN GND SHDN NOTE: 5-Pin SOT-23A is equivalent to the EIAJ (SC-74A) 2002 Microchip Technology Inc. DS21368B-page 1 TC1223/TC1224 1.0 ELECTRICAL SPECIFICATIONS Absolute Maximum Ratings* Input Voltage .........................................................6.5V Output Voltage........................... (-0.3V) to (VIN + 0.3V) Power Dissipation.............................. Internally Limited Maximum Voltage on Any Pin ........ VIN +0.3V to -0.3V Operating Temperature Range...... -40°C < TJ < 125°C Storage Temperature.......................... -65°C to +150°C Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. TC1223/TC1224 ELECTRICAL SPECIFICATIONS Electrical Characteristics: VIN = VOUT + 1V, IL = 100µA, CL = 3.3µF, SHDN > VIH , TA = 25°C, unless otherwise noted. Boldface type specifications apply for junction temperatures of -40°C to +125°C. Symbol Parameter Min Typ Max Units Test Conditions VIN Input Operating Voltage 2.7 — 6.0 V Note 8 IOUTMAX Maximum Output Current 50 100 — — — — mA TC1223 TC1224 VOUT Output Voltage VR – 2.5% VR ±0.5% VR + 2.5% V Note 1 TCVOUT VOUT Temperature Coefficient — — 20 40 — — ppm/°C Note 2 ∆VOUT/∆VIN Line Regulation — 0.05 0.35 % (VR + 1V) ≤ VIN ≤ 6V ∆VOUT/VOUT Load Regulation — 0.5 2 % IL = 0.1mA to IOUT MAX (Note 3) VIN-VOUT Dropout Voltage — — — — 2 65 85 180 — — 120 250 mV IL = 100µA IL = 20mA IL = 50mA IL = 100mA (Note 4) IIN Supply Current — 50 80 µA SHDN = VIH, IL = 0 (Note 7) IINSD Shutdown Supply Current — 0.05 0.5 µA SHDN = 0V PSRR Power Supply Rejection Ratio — 64 — dB FRE ≤ 1kHz TC1224 IOUTSC Output Short Circuit Current — 300 450 mA VOUT = 0V ∆VOUT/∆PD Thermal Regulation — 0.04 — V/W Notes 5, 6 TSD Thermal Shutdown Die Temperature — 160 — °C ∆TSD Thermal Shutdown Hysteresis — 10 — °C eN Output Noise — 260 — nV/√Hz VIH SHDN Input High Threshold 45 — — %VIN VIN = 2.5V to 6.5V VIL SHDN Input Low Threshold — — 15 %VIN VIN = 2.5V to 6.5V IL = IOUT MAX SHDN Input Note 1: 2: 3: 4: 5: 6: 7: 8: VR is the regulator output voltage setting. For example: VR = 2.5V, 2.7V, 2.85V, 3.0V, 3.3V, 3.6V, 4.0V, 5.0V. TC VOUT = (VOUT MAX – VOUT MIN) x 10 6 VOUT x ∆T Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value at a 1V differential. Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 msec. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., TA, TJ, θ JA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section 4.0 Thermal Considerations for more details. Apply for Junction Temperatures of -40°C to +85°C. The minimum VIN has to justify the conditions: VIN ≥ VR + VDROPOUT and VIN ≥ 2.7V for IL = 0.1mA to I OUT MAX. DS21368B-page 2 2002 Microchip Technology Inc. TC1223/TC1224 2.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 2-1. TABLE 2-1: Pin No. (5-Pin SOT-23A) PIN FUNCTION TABLE Symbol 1 VIN 2 GND 3 SHDN 4 NC 5 VOUT Description Unregulated supply input. Ground terminal. Shutdown control input. The regulator is fully enabled when a logic high is applied to this input. The regulator enters shutdown when a logic low is applied to this input. During shutdown, output voltage falls to zero and supply current is reduced to 0.5µA (max). No connect. Regulated voltage output. 2002 Microchip Technology Inc. DS21368B-page 3 TC1223/TC1224 3.0 DETAILED DESCRIPTION 3.1 The TC1223 and TC1224 are precision fixed output voltage regulators. Unlike bipolar regulators, the TC1223 and TC1224’s supply current does not increase with load current. In addition, VOUT remains stable and within regulation over the entire 0mA to IOUTMAX operating load current range, (an important consideration in RTC and CMOS RAM battery back-up applications). Figure 3-1 shows a typical application circuit. The regulator is enabled any time the shutdown input (SHDN) is at or above VIH, and shutdown (disabled) when SHDN is at or below VIL. SHDN may be controlled by a CMOS logic gate, or I/O port of a microcontroller. If the SHDN input is not required, it should be connected directly to the input supply. While in shutdown, supply current decreases to 0.05µA (typical) and VOUT falls to zero volts. FIGURE 3-1: 1µF + Battery A 1µF (min) capacitor from VOUT to ground is recommended. The output capacitor should have an effective series resistance greater than 0.1Ω and less than 5.0Ω, and a resonant frequency above 1MHz. A 1µF capacitor should be connected from VIN to GND if there is more than 10 inches of wire between the regulator and the AC filter capacitor, or if a battery is used as the power source. Aluminum electrolytic or tantalum capacitor types can be used. (Since many aluminum electrolytic capacitors freeze at approximately -30°C, solid tantalums are recommended for applications operating below -25°C.) When operating from sources other than batteries, supply-noise rejection and transient response can be improved by increasing the value of the input and output capacitors and employing passive filtering techniques. TYPICAL APPLICATION CIRCUIT VIN + Output Capacitor VOUT VOUT + TC1223 TC1224 1µF GND SHDN NC Shutdown Control (to CMOS Logic or Tie to VIN if unused) DS21368B-page 4 2002 Microchip Technology Inc. TC1223/TC1224 4.0 THERMAL CONSIDERATIONS 4.1 Thermal Shutdown Integrated thermal protection circuitry shuts the regulator off when die temperature exceeds 160°C. The regulator remains off until the die temperature drops to approximately 150°C. 4.2 Equation 4-1 can be used in conjunction with Equation 4-2 to ensure regulator thermal operation is within limits. For example: Given: VINMAX ILOADMAX = 40mA Power Dissipation The amount of power the regulator dissipates is primarily a function of input and output voltage, and output current. The following equation is used to calculate worst case actual power dissipation: EQUATION 4-1: PD ≈ (VINMAX – V OUTMIN)ILOADMAX Where: PD VIN MAX VOUT MIN ILOAD MAX = 3.0V ±10% VOUTMIN = 2.7V – 2.5% TJMAX = 125°C TAMAX = 55°C Find: 1. Actual power dissipation 2. Maximum allowable dissipation Actual power dissipation: PD ≈ (VINMAX – VOUTMIN)ILOADMAX = [(3.0 x 1.1) – (2.7 x .975)]40 x 10–3 = 26.7mW Maximum allowable power dissipation: = Worst case actual power dissipation = Maximum voltage on VIN = Minimum regulator output voltage = Maximum output (load) current PDMAX = (TJMAX – TAMAX) θJA = (125 – 55) 220 = 318mW The maximum allowable power dissipation (Equation 4-2) is a function of the maximum ambient temperature (TAMAX), the maximum allowable die temperature (TJMAX) and the thermal resistance from junction-to-air (θJA). The 5-Pin SOT-23A package has a θJA of approximately 220°C/Watt. In this example, the TC1223 dissipates a maximum of 26.7mW; below the allowable limit of 318mW. In a similar manner, Equation 4-1 and Equation 4-2 can be used to calculate maximum current and/or input voltage limits. EQUATION 4-2: 4.3 PDMAX = (TJMAX – TAMAX) θJA Where all terms are previously defined. 2002 Microchip Technology Inc. Layout Considerations The primary path of heat conduction out of the package is via the package leads. Therefore, layouts having a ground plane, wide traces at the pads, and wide power supply bus lines combine to lower θJA and therefore increase the maximum allowable power dissipation limit. DS21368B-page 5 TC1223/TC1224 5.0 TYPICAL CHARACTERISTICS (Unless Otherwise Specified, All Parts Are Measured At Temperature = 25°C) The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 0.020 DROPOUT VOLTAGE (V) 0.018 Dropout Voltage vs. Temperature (VOUT = 3.3V) ILOAD = 10mA 0.014 0.012 0.010 0.008 0.006 0.004 CIN = 1µF COUT = 1µF 0.200 0 20 50 TEMPERATURE (°C) 70 0.060 0.050 0.040 0.030 0.020 0 20 50 TEMPERATURE (°C) 70 125 Ground Current vs. VIN (VOUT = 3.3V) 90 ILOAD = 100mA ILOAD = 10mA 80 0.120 0.100 0.080 0.060 0.040 CIN = 1µF COUT = 1µF -40 -20 70 60 50 40 30 20 CIN = 1µF COUT = 1µF 10 0 0.000 0 20 50 70 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 7.5 VIN (V) 125 TEMPERATURE (°C) Ground Current vs. VIN (VOUT = 3.3V) VOUT vs. VIN (VOUT = 3.3V) 3.5 ILOAD = 0 ILOAD = 100mA 80 3 70 2.5 60 VOUT (V) GND CURRENT (µA) -20 Dropout Voltage vs. Temperature (VOUT = 3.3V) 0.140 90 CIN = 1µF COUT = 1µF -40 0.160 0.020 0.070 0.000 125 GND CURRENT (µA) DROPOUT VOLTAGE (V) 0.180 -20 0.080 0.010 0.000 -40 ILOAD = 50mA 0.090 0.016 0.002 Dropout Voltage vs. Temperature (VOUT = 3.3V) 0.100 DROPOUT VOLTAGE (V) Note: 50 40 30 2 1.5 1 20 CIN = 1µF COUT = 1µF 10 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 7.5 VIN (V) DS21368B-page 6 0.5 CIN = 1µF COUT = 1µF 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 VIN (V) 2002 Microchip Technology Inc. TC1223/TC1224 5.0 TYPICAL CHARACTERISTICS (CONTINUED) (Unless Otherwise Specified, All Parts Are Measured At Temperature = 25°C) VOUT vs. VIN (VOUT = 3.3V) 3.5 3.0 Output Voltage vs. Temperature (VOUT = 3.3V) 3.320 ILOAD = 100mA ILOAD = 10mA 3.315 3.310 2.5 VOUT (V) VOUT (V) 3.305 2.0 1.5 3.300 3.295 3.290 1.0 3.285 0.5 CIN = 1µF COUT = 1µF 0.0 0 5.020 3.275 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 VIN (V) -40 70 ILOAD = 10mA 60 GND CURRENT (µA) VOUT (V) 5.015 5.010 5.005 5.000 4.995 4.990 4.985 VIN = 6V CIN = 1µF COUT = 1µF -40 -20 -10 0 20 40 85 -20 -10 0 20 40 85 125 TEMPERATURE (°C) Output Voltage vs. Temperature (VOUT = 5V) 5.025 CIN = 1µF COUT = 1µF VIN = 4.3V 3.280 125 Temperature vs. Quiescent Current (VOUT = 5V) ILOAD = 10mA 50 40 30 20 10 TEMPERATURE (°C) VIN = 6V CIN = 1µF COUT = 1µF 0 -40 Output Noise vs. Frequency -40 100 -45 10 1 Stable Region 85 125 Power Supply Rejection Ratio -30 -35 COUT = 1µF to 10µF PSRR (dB) 1.0 -10 0 20 40 TEMPERATURE (°C) Stability Region vs. Load Current 1000 RLOAD = 50Ω COUT = 1µF CIN = 1µF COUT ESR (Ω) NOISE (µV/√Hz) 10.0 -20 -50 IOUT = 10mA VINDC = 4V VINAC = 100mVp-p VOUT = 3V CIN = 0 COUT = 1µF -55 -60 -65 0.1 -70 0.1 -75 0.0 0.01K 0.1K 0.01 1K 10K 100K 1000K FREQUENCY (Hz) 2002 Microchip Technology Inc. 0 10 20 30 40 50 60 70 80 90 100 LOAD CURRENT (mA) -80 0.01K 0.1K 1K 10K 100K 1000K FREQUENCY (Hz) DS21368B-page 7 TC1223/TC1224 5.0 TYPICAL CHARACTERISTICS (CONTINUED) Measure Rise Time of 3.3V LDO Measure Fall Time of 3.3V LDO Conditions: CIN = 1µF, COUT = 1µF, ILOAD = 100mA, VIN = 4.3V, Temp = 25°C, Fall Time = 184µS Conditions: CIN = 1µF, COUT = 1µF, ILOAD = 100mA, VIN = 4.3V, Temp = 25°C, Fall Time = 52µS VSHDN VSHDN VOUT VOUT Measure Rise Time of 5.0V LDO Measure Fall Time of 5.0V LDO Conditions: CIN = 1µF, COUT = 1µF, ILOAD = 100mA, VIN = 6V, Temp = 25°C, Fall Time = 192µS Conditions: CIN = 1µF, COUT = 1µF, ILOAD = 100mA, VIN = 6V, Temp = 25°C, Fall Time = 88µS VSHDN VSHDN VOUT VOUT Thermal Shutdown Response of 5.0V LDO Conditions: VIN = 6V, CIN = 0µF, COUT = 1µF VOUT ILOAD was increased until temperature of die reached about 160°C, at which time integrated thermal protection circuitry shuts the regulator off when die temperature exceeds approximately 160°C. The regulator remains off until die temperature drops to approximately 150°C. DS21368B-page 8 2002 Microchip Technology Inc. TC1223/TC1224 6.0 PACKAGING INFORMATION 6.1 Package Marking Information “1” & “2” = part number code + temperature range and voltage (V) TC1223 Code TC1224 Code 2.5 L1 M1 2.7 L2 M2 2.8 LZ MZ 2.85 L8 M8 3.0 L3 M3 3.3 L5 M5 3.6 L9 M9 4.0 L0 M0 5.0 L7 M7 “3” represents year and quarter code “4” represents lot ID number 6.2 Taping Form Component Taping Orientation for 5-Pin SOT-23A (EIAJ SC-74A) Devices User Direction of Feed Device Marking W PIN 1 P Standard Reel Component Orientation TR Suffix Device (Mark Right Side Up) Carrier Tape, Number of Components Per Reel and Reel Size Package 5-Pin SOT-23A 2002 Microchip Technology Inc. Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 8 mm 4 mm 3000 7 in DS21368B-page 9 TC1223/TC1224 6.3 Package Dimensions SOT-23A-5 .075 (1.90) REF. .071 (1.80) .059 (1.50) .122 (3.10) .098 (2.50) .020 (0.50) .012 (0.30) PIN 1 .037 (0.95) REF. .122 (3.10) .106 (2.70) .057 (1.45) .035 (0.90) .006 (0.15) .000 (0.00) .010 (0.25) .004 (0.09) 10° MAX. .024 (0.60) .004 (0.10) Dimensions: inches (mm) DS21368B-page 10 2002 Microchip Technology Inc. TC1223/TC1224 SALES AND SUPPORT Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products. 2002 Microchip Technology Inc. DS21368B-page 11 TC1223/TC1224 NOTES: DS21368B-page 12 2002 Microchip Technology Inc. TC1223/TC1224 Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. 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Le Colleoni 1 20041 Agrate Brianza Milan, Italy Tel: 39-039-65791-1 Fax: 39-039-6899883 United Kingdom Microchip Ltd. 505 Eskdale Road Winnersh Triangle Wokingham Berkshire, England RG41 5TU Tel: 44 118 921 5869 Fax: 44-118 921-5820 05/01/02 *DS21368* DS21368B-page 14 2002 Microchip Technology Inc.