EMIF06-HMC01F2 6-line IPAD™, EMI filter including ESD protection Features ■ 6-line low-pass-filter ■ High efficiency in EMI filtering ■ Very low PCB space occupation: < 4.4 mm2 ■ Lead-free package ■ Very thin package: 0.65 mm ■ High efficiency in ESD suppression ■ High reliability offered by monolithic integration ■ High reducing of parasitic elements through integration and wafer level packaging Flip Chip (16 bumps) Figure 1. Pin layout (bump side) 4 3 2 1 Complies with the following standards A ■ IEC 61000-4-2 level 4 on external pins – 15 kV (air discharge) – 8 kV (contact discharge) B MIL STD 883E - Method 3015-6 Class 3 D ■ C A1 A2 A3 A4 B1 B2 B3 B4 Applications ■ High speed MultiMediaCard Description The EMIF06-HMC01F2 is a highly integrated array designed to suppress EMI / RFI noise for high speed MultiMediaCard port filtering. The EMIF06-HMC01F2 Flip Chip packaging means the package size is equal to the die size. Figure 2. cmd clk Vmmc/Vdd MMCclk dat1 dat0 gnd MMCcmd C1 C2 C3 C4 D1 D2 D3 D4 dat2 gnd MMCdat1 MMCdat0 dat3 gnd MMCdat3 MMCdat2 Basic cell configuration R10 R11 R12 R13 R14 Additionally, this filter includes ESD protection circuitry which prevents damage to the application when subjected to ESD surges up to 15 kV. Vmmc MMCclk MMCcmd MMCdat0 MMCdat1 MMCdat2 MMCdat3 Vmmc R2 R3 R4 R5 R6 R7 clk cmd dat0 dat1 dat2 dat3 GND TM: IPAD is a trademark of STMicroelectronics. April 2008 Rev 2 1/8 www.st.com 8 Characteristics 1 EMIF06-HMC01F2 Characteristics Table 1. Absolute maximum ratings (Tamb = 25 °C) Symbol VPP Tj Parameter and test conditions Value Internal pins (A4, B4, C3, C4, D3, D4): ESD discharge IEC61000-4-2, air discharge ESD discharge IEC61000-4-2, contact discharge External pins (A1, A2, A3, B1, B2, C1, D1): ESD discharge IEC61000-4-2, air discharge ESD discharge IEC61000-4-2, contact discharge 15 8 Maximum junction temperature 125 °C 2 2 kV Top Operating temperature range -40 to +85 °C Tstg Storage temperature range -55 to 150 °C Table 2. Electrical characteristics (Tamb = 25 °C) Symbol Parameters VBR Breakdown voltage IRM Leakage current @ VRM VRM Stand-off voltage Cline Input capacitance per line I VBR Symbol Test conditions VRM IRM IRM Tolernace Min Typ V VRM VBR Max 14 Unit VBR IR = 1 mA IRM VRM = 3V 0.1 µA Cline @ 0V 20 pF R2,R3,R4, I = 50 mA R5, R6, R7 2/8 Unit V ± 20 % 50 Ω R10, R11, R12, R13 I = 50 µA ± 30 % 75 kΩ R14 I = 200 µA ± 30 % 7 kΩ EMIF06-HMC01F2 Figure 3. Characteristics S21 (dB) attenuation measurement Figure 4. Analog crosstalk measurement 0.00 0.00 dB dB - 10.00 - 10.00 - 20.00 - 30.00 - 20.00 - 40.00 - 30.00 - 50.00 - 60.00 - 40.00 - 70.00 - 50.00 - 80.00 100.0k 1.0M 10.0M 100.0M 1.0G 100.0k f/Hz Figure 5. 1.0M 10.0M ESD response to IEC 61000-4-2 (+15kV air discharge) on one input (Vin) and on one output (Vout) Figure 6. Input Input 10V/d 10V/d Output Output 10V/d 10V/d 1.0G ESD response to IEC 61000-4-2 (-15kV air discharge) on one input (Vin) and on one output (Vout) 200ns/d 200ns/d Figure 7. 100.0M f/Hz Junction capacitance versus reverse voltage applied (typical values) CLINE (pF) 16 14 Vosc=30mV F=1MHz Ta=25 °C 12 10 8 6 4 2 0 0 1 2 3 4 5 VLINE (V) 3/8 Application information 2 EMIF06-HMC01F2 Application information Figure 8. Aplac model device structure R10 R11 R12 Lbump Rbump Vmmc_Vdd R13 Cbump Rsub A3 bulk Vmmc_Vdd R14 Lbump Rbump R2 MMCclk Cbump Rsub A4 clk MMCclk MMCcmd cmd bulk Lbump R4 MMCdat0 Rbump MMCcmd R5 MMCdat1 Lbump Rbump MMCdat0 Cbump Rsub C4 MMCdat3 cmd dat2 bulk dat3 A2 A1 Rbump Lbump MODEL = demif06 Rsub Cbump bulk MMCdat1 bulk dat1 B2 Rbump Lbump MODEL = demif06_gnd Rsub Cbump bulk bulk Lbump Rbump Lbump MMCdat2 dat2 Cbump Rsub D4 B1 Rbump Lbump Rbump bulk Rsub Cbump bulk Lbump Rbump MMCdat3 Cbump Rsub D3 Lgnd dat3 Rgnd bulk C1 Rbump Lbump Rsub Cbump bulk Cgnd Figure 9. Aplac parameters Variables Variables demif06_gnd demif06 R2 50 Cz 11pF BV=14 BV=14 R3 50 Cz_gnd 45pF IBV=1m IBV=1m R4 50 RS_gnd 480m CJO=Cz_gnd CJO=Cz Ls 950pH M=0.31 M=0.31 Rs 150m RS=RS_gnd RS=1 Rbump 100m VJ=0.6 VJ=0.6 Lbump 50pH TT=100n TT=100n R5 50 R6 50 R7 50 R10 75k R11 75k R12 75k 4/8 Cbump dat0 MODEL = demif06 Cbump Rsub C3 dat1 R7 Cbump Rbump Lbump Rsub MMCdat2 bulk Lbump Rbump Rsub R6 bulk Rbump Lbump bulk dat0 Cbump Rsub B4 clk R3 Cbump 0.15pF R13 75k Lgnd 50pH R14 7k Rgnd 100m Rsub 100m Cgnd 0.15pF D1 EMIF06-HMC01F2 3 Ordering information scheme Ordering information scheme Figure 10. Ordering information scheme EMIF yy - xxx zz Fx EMI Filter Number of lines Information x = resistance value (Ohms) z = capacitance value / 10(pF) or 3 letters = application 2 digits = version Package F = Flip Chip x = 2: Lead-free, pitch = 500 µm, bump = 315 µm Package information In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at www.st.com. Figure 11. Package dimensions 500 µm ± 10 315 µm ± 50 650 µm ± 65 1.92 mm ± 50 µm 500 µm ± 10 210 µm 1.92 mm ± 50 µm 210 µm 4 5/8 Ordering information EMIF06-HMC01F2 Figure 12. Footprint Figure 13. Marking Dot, ST logo xx = marking z = manuafacturing location yww = datecode (y = year ww = week) Copper pad Diamete : 250 µm recommended, 300 µm max Solder stencil opening: 330 µm E x x z y ww Solder mask opening recommendation: 340 µm min for 315 µm copper pad diameter Figure 14. Flip Chip tape and reel specification Dot identifying Pin A1 location 3.5 ± 0.1 2.06 STE xxx yww 4 ± 0.1 User direction of unreeling All dimensions in mm Note: 2.06 STE xxx yww STE xxx yww 8 ± 0.3 0.73 ± 0.05 1.75 ± 0.1 Ø 1.5 ± 0.1 4 ± 0.1 More information is available in the application notes: AN1235:"Flip Chip: Package description and recommendations for use" AN1751: “EMI filters: Recommendations and measurements” 5 Ordering information Table 3. 6/8 Ordering information Order code Marking Package Weight Base qty Delivery mode EMIF06-HMC01F2 GH Flip Chip 5.3 mg 5000 Tape and reel 7” EMIF06-HMC01F2 6 Revision history Revision history Table 4. Document revision history Date Revision Changes 25-Jan-2005 1 Initial release. 28-Apr-2008 2 Updated ECOPACK statement. Updated Figure 10, Figure 11, Figure 12, Figure 13 and Figure 14. Reformatted to current standards. 7/8 EMIF06-HMC01F2 Please Read Carefully: Information in this document is provided solely in connection with ST products. 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