FC30 MEMS functional sensor: smart 3D orientation and click detection standalone device Features ■ 3D orientation sensor: 3 orthogonal directions (6 positions) ■ Embedded click/double-click functionality ■ Low power consumption ■ Power down mode ■ High shock survivability ■ -40 ° C to +85 ° C temperature range ■ Excellent quality and reliability ■ Testable after assembly without movement ■ Housed in a small, thin 3x5x0.9 SMD package ■ ECOPACK®, RoHS and “Green” compliant LGA-14 (3x5x0.9mm) The device can be used for image rotation (portrait/landscape) and position-based applications. When a single or double mechanical tap is detected, the FC30 provides an interrupt signal, enabling a “mouse button-like” function for intuitive man-machine interface solutions. Applications ■ Image rotation in mobile phones & portable devices ■ Digital photo frames ■ Orientation detection ■ Button replacement ■ Motion triggered wake up A power-down mode selectable through a dedicated input pin ensures very low current consumption in battery-operated devices. The FC30 is available in an LGA-14 3x5x0.9mm SMD plastic full-moulded package compliant with lead-free, RoHS and halogen-free regulations. Compatible with a -40 ° C to +85 ° C temperature range, the FC30 is shipped in standard tape and reels for automatic pick and place machines and is washable after reflow due to its completely sealed and hermetic structure. Description The FC30 is a stand-alone 3D orientation and click/double-click detection device. When in a steady position, it is able to detect 6 different orientations with respect to the gravity field, with notification provided through dedicated signal lines. Table 1. Order codes Order code Temp range (° C) Package Packing FC30 -40 to +85 LGA-14 Tray FC30TR -40 to +85 LGA-14 Tape and reel May 2008 Rev 1 1/13 www.st.com 13 Contents FC30 Contents 1 Pin configuration and description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Device functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Orientation detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1.1 3 Output response vs. orientation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.2 Tap detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.3 Post assembly device verification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.4 Power down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3.1 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3.2 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 4 Device and technology information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 5 Application hints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 5.1 Soldering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 6 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 2/13 FC30 1 Pin configuration and description Pin configuration and description Figure 1. Pin configuration Face 1 Port 1 6 13 8 Land 13 6 8 BOTTOM VIEW TOP VIEW Table 2. Pin description Pin# Name Function 1 Vdd_IO 2 GND 0V supply 3 Vdd Power supply 4 Res Connect to 0V supply 5 GND 0V supply 6 Vdd Power supply 7 Res Leave unconnected 8 PC Portrait interrupt (logic 1: portrait orientation) 9 LC Landscape interrupt (logic 1: landscape orientation) 10 Res Connect to 0V supply 11 PD Power-down (logic 0: normal mode; logic 1: power-down mode) 12 SIGN 13-14 Res Power supply for I/O pins Sign interrupt for landscape/portrait/face orientation Leave unconnected 3/13 Device functionality FC30 2 Device functionality 2.1 Orientation detection The device output can be configured to provide its orientation relative to gravity based on orientation definitions, as illustrated in Figure 2 below. Figure 2. Orientation definitions Portrait Up Landscape Left Landscape Right FC30 Portrait Down Top Gravity Face Up Bottom Bottom Face Down Top 2.1.1 Output response vs. orientation Figure 3 shows the three interrupt output lines for the selected orientation. 4/13 FC30 Device functionality Figure 3. Output response vs. orientation LC = 1 PC = 0 PORT SIGN = 1 Bottom LEFT UP Top DOWN LC = 0 PC = 0 SIGN = 1 Top RIGHT LC = 1 PC = 0 PORT SIGN = 0 LC = 0 PC = 1 SIGN = 0 Gravity LANDSCAPE 2.2 LC = 0 PC = 1 SIGN = 1 LC = 0 PC = 0 Bottom SIGN = 0 PORTRAIT FACE Tap detection The device can be configured to send an interrupt signal on a dedicated pin when “clicked” in any direction (see Figure 4). A more advanced feature also allows the detection of a “double click” event, with a programmable time interval between the first and second click, to enable a “mouse buttonlike” functionality. These functions can be fully programmed. For additional information, please contact your local STMicroelectronics sales office. Figure 4. Tap or “click” detection LC or PC interrupts FC30 Equipment with the FC30 mounted 5/13 Device functionality 2.3 FC30 Post assembly device verification A special function allows the user to check the sensor functionality without moving the device (device verification). This functionality is enabled by connecting the FC30 to an MCU. For the connection scheme and additional information, please contact your local STMicroelectronics sales office. 2.4 Power down The power down function allows the device to be put in an ultra-low power consumption mode by applying a "logic 1" voltage value to the PD pad. In this state the measurement chain is powered off. 6/13 FC30 Electrical specifications 3 Electrical specifications 3.1 Electrical characteristics Table 3. Electrical characteristics(1) (2) Symbol Vdd Vdd_IO Idd IddPdn Min. Typ.(3) Max. Unit Supply voltage 2.16 2.5 3.6 V I/O pins supply voltage 1.71 Vdd+0.1 V 0.4 mA Parameter Test conditions Supply current T = 25°C 0.3 Current consumption in power-down mode T = 25°C 1 µA Ton Turn-on time(4) 30 ms Ac Accuracy(5) ±3 deg Top Operating temperature range Wh Product weight -40 +85 30 °C mg 1. The product is factory calibrated at 2.5 V. The device can be used from 2.16 V to 3.6 V 2. All the parameters are specified @ Vdd=2.5 V, T = 25 °C unless otherwise noted 3. Typical specification are not guaranteed 4. Time to obtain valid data after exiting power-down mode 5. Accuracy defines the angle around the three orthogonal directions where orientation is detected (see Figure 5) Figure 5. Orientation accuracy angle Gravity Accuracy 3.2 Absolute maximum ratings Stresses above those listed as “absolute maximum ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device under these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. 7/13 Electrical specifications Table 4. Symbol Vdd, Vdd_IO Vin AMAX FC30 Absolute maximum ratings Ratings Maximum Value Unit -0.3 to 6 V Input voltage on any control pin -0.3 to Vdd_IO +0.3 V Acceleration (any axis, powered and unpowered) 10000 g for 0.1ms g Supply voltage and I/O pins supply voltage TOP Operating temperature range -40 to +85 °C TSTG Storage temperature range -40 to +125 °C 4.0 (HBM) kV 200 (MM) V 1.5 (CDM) kV ESD Electrostatic discharge protection This is a Mechanical Shock sensitive device, improper handling can cause permanent damage to the part This is an ESD sensitive device, improper handling can cause permanent damage to the part 8/13 FC30 4 Device and technology information Device and technology information The FC30 is an ultra-compact, low power 3-dimensional orientation and click/double-click sensor. Manufactured with MEMS technology, the FC30 offers many advantages compared to the conventional fabrication technology used nowadays in portable devices, including: ● Potential for additional strong miniaturization, leveraging the characteristics of micromachining technology ● No surface friction effects, wear effects and acoustic noise generation ● Embedded electronic signal conditioning allows reduced power consumption 9/13 Application hints 5 FC30 Application hints Figure 6. FC30 electrical connection for 3D orientation detection Vdd Vdd_IO 1 6 Face 10uF 1 Port Top VIEW Land 13 6 100nF 8 13 8 SIGN PD LC PC TOP VIEW GND Digital signal from/to signal controller.Signal’s levels are defined by proper selection of Vdd_IO The diagram above refers to the electrical connection scheme for application of 3D orientation detection. The device core is supplied through the Vdd line while the I/O pads are supplied through the Vdd_IO line. Power supply decoupling capacitors (100 nF ceramic, 10 µF Al) should be placed as near as possible to pin 6 of the device (common design practice). All the voltage and ground supplies must be present at the same time for proper behavior of the IC (Figure 6). 5.1 Soldering information The LGA package is compliant with the ECOPACK, RoHS and “green” standards. Leave the pin 1 indicator unconnected during soldering. Land pattern and soldering recommendations are available at www.st.com 10/13 FC30 6 Package information Package information In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 7. LGA 14: mechanical data and package dimensions mm inch DIM. MIN. A1 TYP. MAX. 0.920 1.000 0.0362 0.0394 0.700 0.0275 A2 MIN. TYP. MAX. A3 0.180 0.220 0.260 0.0071 0.0087 0.0102 D1 2.850 3.000 3.150 0.1122 0.1181 0.1240 E1 4.850 5.000 5.150 0.1909 0.1968 0.2027 e 0.800 d 0.300 0.0118 L1 4.000 0.1575 OUTLINE AND MECHANICAL DATA 0.0315 N 1.360 0.0535 N1 1.200 0.0472 P1 0.965 0.975 P2 0.640 0.650 0.985 0.0380 0.0384 0.0386 0.660 0.0252 0.0256 0.0260 T1 0.750 0.800 0.850 0.0295 0.0315 0.0335 T2 0.450 0.500 0.550 0.0177 0.0197 0.0217 R 1.200 1.600 0.0472 0.0630 h 0.150 0.0059 k 0.050 0.0020 i 0.100 0.0039 s 0.100 0.0039 LGA14 (3x5x0.92mm) Pitch 0.8mm Land Grid Array Package 7773587 C 11/13 Revision history 7 FC30 Revision history Table 5. 12/13 Document revision history Date Revision 29-May-2008 1 Changes Initial release FC30 Please Read Carefully: Information in this document is provided solely in connection with ST products. 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