STMICROELECTRONICS L2293Q

L2293Q
Push-pull four channel driver with diodes
Features
■
600 mA output current capability per channel
■
1.2 A peak output current (non repetitive) per
channel
■
Enable facility
■
Overtemperature protection
■
Logical “0” input voltage up to 1.5 V (high noise
immunity)
■
Internal clamp diodes
Description
The device is a monolithic integrated high voltage,
high current four channel driver designed to
accept standard DTL or TTL logic levels and drive
inductive loads (such as relays solenoides, DC
and stepping motors) and switching power
transistors.
Figure 1.
July 2008
VFQFPN 5 mm x 5 mm 32L
To simplify use as two bridges each pair of
channels is equipped with an enable input. A
separate supply input is provided for the logic,
allowing operation at a lower voltage and internal
clamp diodes are included.
This device is suitable for use in switching
applications at frequencies up to 5 kHz.
The L2293Q is assembled in a VFQFPN-32L 5x5
package which has exposed pad available for
heatsinking.
Block diagram
Rev 1
1/12
www.st.com
12
Contents
L2293Q
Contents
1
Electrical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2
Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2
Pin connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
4
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5
Order codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
6
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2/12
L2293Q
Electrical data
1
Electrical data
1.1
Absolute maximum ratings
Table 1.
Absolute maximum ratings
Symbol
Value
Unit
VS
Supply voltage
36
V
VSS
Logic supply voltage
36
V
Input voltage
7
V
Enable voltage
7
V
1.2
A
4
W
Vi
Ven
Io
1.2
Parameter
Peak output current (100 µs non repetitive)
Ptot
Total power dissipation at Tpins = 90 °C
TJ
Junction temperature
150
°C
TSTG
Storage temperature
– 40 to 150
°C
Recommended conditions
Table 2.
Recommended conditions
Value
Symbol
Parameter
Unit
Min
VS
Supply voltage
Typ
VSS
(1)
VSS
Logic supply voltage
2.8
TJ
Junction temperature
-20 (1)
Max
36
V
36
V
125
°C
1. See Figure 2
Figure 2.
Typical minimum logic supply voltage vs junction temperature
VSS_min [V]
2.8
2.7
-20
1.3
-10
0
Tj [°C]
Thermal data
Table 3.
Symbol
Rth(JA)
Thermal data
Parameter
Thermal resistance junction-ambient max (1).
Value
Unit
22
°C/W
1. Mounted on a double-layer FR4 PCB with a dissipating copper surface of 0.5 cm2 on the top side plus
6 cm2 ground layer connected through 18 via holes (9 below the IC).
3/12
Pin connection
2
Pin connection
Figure 2.
Note:
L2293Q
Pin connection (top view)
NC(1) These NC pins are connected to the exposed PAD.
The exposed PAD must be connected to GND pins.
NC(2) These NC pins can be connected to GND pins and exposed PAD.
Figure 3.
Recommended PCB layout for Rth(JA) optimization
L2293Q
TOP LAYER
(connected to GND)
BOTTOM LAYER (connected to GND)
GND pins
4/12
VIA holes
L2293Q
Pin connection
Table 4.
Pin description
N°
Pin
Type
Function
1, 18, 19, 20,
21, 22, 23
NC
Not connected
2, 3, 4, 5, 6, 7,
NC
Pins connected to the exposed PAD
8, 9, 17, 24, 28,
32
GND
10
OUTPUT2
O
Output 2
11
INPUT2
I
Input 2
12, 13
VS
14
ENABLE2
I
Enable 2 input, the LOW state disables the Output 3 and
Output 4.
15
INPUT3
I
Input 3
16
OUTPUT3
O
Output 3
25
OUTPUT4
O
Output 4
26
INPUT4
I
Input 4
27
VSS
29
ENABLE1
I
Enable 1 input, the LOW state disables the Output 1 and
Output 2.
30
INPUT1
I
Input 1
31
OUTPUT1
O
Output 1
Ground
Supply voltage for the power output stages. A non-inductive
100 nF capacitor must be connected between these pins and
ground.
Supply voltage for the logic blocks. A 100 nF capacitor must
be connected between this pin and ground.
5/12
Electrical characteristics
L2293Q
3
Electrical characteristics
Table 5.
Electrical characteristics (for each channel, VS = 24 V, VSS = 5 V, TA = 25 °C,
unless otherwise specified)
Symbol
IS
Pin
12,13
Parameter
Total quiescent supply current
Test condition
Min
Typ
Max
Unit
Vi = L; IO = 0; Ven = H
2
6
mA
Vi = H; IO = 0; Ven = H
16
24
mA
4
mA
Ven = L
27
Total quiescent logic supply
current
ISS
Vi = L; IO = 0; Ven = H
44
60
mA
Vi = H; IO = 0; Ven = H
16
22
mA
Ven = L
16
24
mA
– 0.3
1.5
V
VSS ≤ 7 V
2.3
VSS
V
VSS > 7 V
2.3
7
V
– 10
µA
100
µA
– 0.3
1.5
V
VSS ≤ 7 V
2.3
VSS
V
VSS > 7 V
2.3
7
V
VIL
11, 15,
26, 30
Input low voltage
VIH
11, 15,
26, 30
Input high voltage
IIL
11, 15,
26, 30
Low voltage input current
VIL = 1.5 V
IIH
11, 15,
26, 30
High voltage input current
2.3 V ≤ VIH ≤ VSS – 0.6 V
Ven L
14, 29
Enable low voltage
Ven H
14, 29
Enable high voltage
Ien L
14, 29
Low voltage enable current
Ven L = 1.5 V
Ien H
14, 29
High voltage enable current
2.3 V ≤ Ven H ≤ VSS – 0.6 V
VCE(sat)H
10, 16,
25, 31
Source output saturation voltage
IO = – 0.6 A
VCE(sat)L
10, 16,
25, 31
Sink output saturation voltage
Clamp diode forward voltage
VF
6/12
30
– 30 – 100
µA
± 10
µA
1.4
1.8
V
IO = + 0.6 A
1.2
1.8
V
IO = 600 nA
1.3
V
L2293Q
Electrical characteristics
Table 6.
AC operation (Vs = 24 V, Vss = 5 V, TA = 25 °C, unless otherwise specified)
Symbol
t
r
Parameter
Rise time (1)
Min
Typ
Max
Unit
0.1 to 0.9 VO
250
ns
0.9 to 0.1 VO
250
ns
ton
Turn-on delay
(1)
0.5 Vi to 0.5 VO
750
ns
toff
Turn-off delay (1)
0.5 Vi to 0.5 VO
200
ns
tf
Fall time
(1)
Test condition
1. See Figure 4
Figure 4.
Switching times
Table 7.
Truth table (one channel)
Input
Enable(1)
Output
H
H
H
L
H
L
H
L
Z (2)
L
L
Z (2)
1. Relative to the considered channel
2. Z = High output impedance
7/12
Package mechanical data
4
L2293Q
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com
Table 8.
VFQFPN 5x5x1.0 32L pitch 0.50
Databook (mm)
Dim.
Min
Typ
Max
A
0.80
0.85
0.95
b
0.18
0.25
0.30
b1
0.165
0.175
0.185
D
4.85
5.00
5.15
D2
3.00
3.10
3.20
D3
1.10
1.20
1.30
E
4.85
5.00
5.15
E2
4.20
4.30
4.40
E3
0.60
0.70
0.80
e
L
ddd
Note:
8/12
0.50
0.30
0.40
0.50
0.08
1
VFQFPN stands for thermally enhanced very thin profile fine pitch Quad Flat Package No
lead. Very thin profile: 0.80 < A ≤ 1.00 mm.
2
Details of terminal 1 are optional but must be located on the top surface of the package by
using either a mold or marked features.
L2293Q
Package mechanical data
Figure 5.
Package dimensions
9/12
Order codes
5
Order codes
Table 9.
10/12
L2293Q
Order code
Order code
Package
Packaging
L2293Q
VFQFPN 5x5x1.0 32L
Tube
L2293Q
6
Revision history
Revision history
Table 10.
Document revision history
Date
Revision
10-Jul-2008
1
Changes
First release
11/12
L2293Q
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