L7220 Disk drive spindle and VCM motor driver Data Brief Features ■ Suitable for enterprise and multi-platter desktop high performance drives ■ Register based architecture ■ Serial communication interface up to 60MHz TQFP64 VCM driver (exposed pad down) ■ 2.5A peak current drive capability ■ Integrated bridge power devices with 0.3Ω max bridge impedance ■ 15 bit linear DAC for current command with gain switch ■ ■ Power on ramp loading and unloading capability with 10 bit ADC Fully integrated discontinuous mode ramp unload circuitry at power off with end of travel detection or alternate voltage mode power off scheme 3.0A peak current drive capability ■ Integrated bridge power devices with 0.3Ω max bridge impedance ■ ST’s SmoothDrive™ architecture ■ Voltage mode sinusoidal driving ■ Inductance sense start-up capability ■ Voltage monitoring ■ Power-on reset with soft start and programmable integrated delay ■ 10 bit ADC with multiplexed inputs ■ Thermal sense circuit and overtemperature shutdown The spindle motor driver subsystem integrates all power FETs driven by ST’s SmoothDrive commutation technology. The voice coil driver block includes the power FETs, as well as ramp load and unload capability. Hysteretic switching regulator controllers are included. 4 high efficiency hysteretic switching positive regulators controllers with voltage margining L7220 embeds a serial interface with a maximum speed of 60MHz. -5V regulator controller with voltage margining Table 1. ■ L7220 is a motor controller IC designed for both enterprise and multi-platter desktop hard disk drive applications. Other functions ■ External isolation FET driver Description Spindle driver ■ ■ Device summary Order code Package Packing L7220 TQFP64 Tray December 2007 Rev 1 For further information contact your local STMicroelectronics sales office. 1/4 www.st.com 4 Package information 1 L7220 Package information In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 1. TQFP64 mechanical data & package dimensions mm inch DIM. MIN. TYP. A MAX. MIN. TYP. 1.20 MAX. 0.0472 A1 0.05 0.15 0.002 A2 0.95 1.00 1.05 0.0374 0.0393 0.0413 b 0.17 0.22 0.27 0.0066 0.0086 0.0086 c 0.09 0.20 0.0035 D 11.80 12.00 12.20 0.464 0.472 0.480 D1 9.80 10.00 10.20 0.386 0.394 0.401 D2 2.00 D3 0.006 0.0078 0.787 7.50 0.295 E 11.80 12.00 12.20 0.464 0.472 0.480 E1 9.80 10.00 10.20 0.386 0.394 0.401 E2 2.00 0.787 E3 7.50 0.295 e 0.50 0.0197 L 0.45 L1 k ccc 0.60 0.75 0.0177 0.0236 0.0295 1.00 0˚ OUTLINE AND MECHANICAL DATA 3.5˚ 0.0393 7˚ 0.080 0˚ 3.5˚ 7˚ TQFP64 (10x10x1.0mm) Exposed Pad Down 0.0031 7278840 B 2/4 L7220 2 Revision history Revision history Table 2. Document revision history Date Revision 24-Dec-2007 1 Changes Initial release. 3/4 L7220 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. 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