STMICROELECTRONICS ST10F272M-4QR3

ST10F272M
16-bit MCU with 256 Kbyte Flash memory and 20 Kbyte RAM
Preliminary Data
Features
■
■
■
■
16-bit CPU with DSP functions
– 50ns instruction cycle time at 40 MHz max
CPU clock
– Multiply/accumulate unit (MAC) 16 x 16-bit
multiplication, 40-bit accumulator
– Enhanced boolean bit manipulations
– Single-cycle context switching support
On-chip memories
– 256 Kbyte Flash memory (32-bit fetch)
– Single voltage Flash memories with
erase/program controller and 100K
erasing/programming cycles.
– Up to 16 Mbyte linear address space for
code and data (5 Mbytes with CAN or I2C)
– 2 Kbyte internal RAM (IRAM)
– 18 Kbyte extension RAM (XRAM)
– Programmable external bus configuration &
characteristics for different address ranges
– 5 programmable chip-select signals
– Hold-acknowledge bus arbitration support
Interrupt
– 8-channel peripheral event controller for
single cycle interrupt driven data transfer
– 16-priority-level interrupt system with 56
sources, sampling rate down to 25ns
Timers
– 2 multi-functional general purpose timer
units with 5 timers
■
Two 16-channel capture / compare units
■
Serial channels
– 2 synch. / asynch. serial channels
– 2 high-speed synchronous channels
– One I2C standard interface
May 2007
PQFP144 (28 x 28 x 3.4mm)
LQFP144 (20 x 20 x 1.4mm)
(Plastic Quad Flat Package) (Low Profile Quad Flat Package)
■
24-channel A/D converter
– 16-channel 10-bit, accuracy +/-2LSB
– 8-channel 10-bit, accuracy +/-5LSB
– 4.85 µs minimum conversion time
■
4-channel PWM unit + 4-channel XPWM
■
2 CAN 2.0B interfaces operating on 1 or 2 CAN
busses (64 or 2x32 message, C-CAN version)
■
Fail-safe protection
– Programmable watchdog timer
– Oscillator watchdog
■
On-chip bootstrap loader
■
Clock generation
– On-chip PLL with 4 to 8 MHz oscillator
– Direct or prescaled clock input
■
Real time clock and 32 kHz on-chip oscillator
■
Up to 111 general purpose I/O lines
– Individually programmable as input, output
or special function
– Programmable threshold (hysteresis)
■
Idle, power-down and stand-by modes
■
Single voltage supply: 5V ±10% (embedded
regulator for 1.8V core supply)
■
Temperature range: -40 to +125°C
Rev 1
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to
change without notice.
1/176
www.st.com
1
Contents
ST10F272M
Contents
1
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
1.1
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
1.2
Special characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
1.2.1
1.2.1 XPeripheral clock gating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
1.2.2
1.2.2 Improved supply ring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2
Pin data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3
Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4
Memory organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
5
Internal Flash memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
5.1
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
5.2
Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
5.2.2
Modules structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
5.2.3
Low power mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
5.3
Write operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
5.4
Registers description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
5.5
2/9
5.2.1
5.4.1
Flash control register 0 low (FCR0L) . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
5.4.2
Flash control register 0 high (FCR0H) . . . . . . . . . . . . . . . . . . . . . . . . . . 29
5.4.3
Flash control register 1 low (FCR1L) . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
5.4.4
Flash control register 1 high (FCR1H) . . . . . . . . . . . . . . . . . . . . . . . . . . 31
5.4.5
Flash data register 0 low (FDR0L) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
5.4.6
Flash data register 0 high (FDR0H) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
5.4.7
Flash data register 1 low (FDR1L) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
5.4.8
Flash data register 1 high (FDR1H) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
5.4.9
Flash address register low (FARL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
5.4.10
Flash address register high (FARH) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
5.4.11
Flash error register (FER) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Protection strategy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
5.5.1
Protection registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
5.5.2
Flash non-volatile write protection I register (FNVWPIR) . . . . . . . . . . . 35
ST10F272M
6
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Contents
5.5.3
Flash non-volatile access protection register 0 (FNVAPR0) . . . . . . . . . 36
5.5.4
Flash non-volatile access protection register 1 low (FNVAPR1L) . . . . . 36
5.5.5
Flash non-volatile access protection register 1 high (FNVAPR1H) . . . . 37
5.5.6
XBus Flash volatile temporary access unprotection register
(XFVTAUR0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
5.5.7
Access protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
5.5.8
Write protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
5.5.9
Temporary unprotection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
5.6
Write operation examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
5.7
Write operation summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Bootstrap loader . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
6.1
Selection among user-code, standard or selective bootstrap . . . . . . . . . . 43
6.2
Standard bootstrap loader . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
6.3
Alternate and selective boot mode (ABM and SBM) . . . . . . . . . . . . . . . . 44
6.3.1
Activation of the ABM and SBM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
6.3.2
User mode signature integrity check . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
6.3.3
Selective boot mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Central processing unit (CPU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
7.1
Multiplier-accumulator unit (MAC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
7.2
Instruction set summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
7.3
MAC co-processor specific instructions . . . . . . . . . . . . . . . . . . . . . . . . . . 49
8
External bus controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
9
Interrupt system . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
9.1
X-Peripheral interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
9.2
Exception and error traps list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
10
Capture / compare (CAPCOM) units . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
11
General purpose timer unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
12
11.1
GPT1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
11.2
GPT2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
PWM modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
3/9
Contents
13
ST10F272M
Parallel ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
13.1
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
13.2
I/O’s special features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
13.3
13.2.1
Open drain mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
13.2.2
Input threshold control
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Alternate port functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
14
A/D converter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
15
Serial channels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
15.1
Asynchronous / synchronous serial interfaces . . . . . . . . . . . . . . . . . . . . . 68
15.2
ASCx in asynchronous mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
15.3
ASCx in synchronous mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
15.4
High speed synchronous serial interfaces . . . . . . . . . . . . . . . . . . . . . . . . 69
16
I2C interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
17
CAN modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
17.1
Configuration support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
17.2
CAN bus configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
17.2.1
Single CAN bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
17.2.2
Multiple CAN bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
17.2.3
Parallel mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
18
Real time clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
19
Watchdog timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
20
System reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
4/9
20.1
Input filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
20.2
Asynchronous reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
20.3
Synchronous reset (warm reset) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
20.4
Software reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
20.5
Watchdog timer reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
20.6
Bidirectional reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
20.7
Reset circuitry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
ST10F272M
21
Contents
20.8
Reset application examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
20.9
Reset summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
Power reduction modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
21.1
Idle mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
21.2
Power-down mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
21.3
21.2.1
Protected power-down mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
21.2.2
Interruptible power-down mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
Stand-by mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
21.3.1
Entering stand-by mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
21.3.2
Exiting stand-by mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
21.3.3
Real time clock and stand-by mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
21.3.4
Power reduction modes summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
22
Programmable output clock divider . . . . . . . . . . . . . . . . . . . . . . . . . . 107
23
Register set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108
24
23.1
Special function registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108
23.2
X-registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115
23.3
Flash registers ordered by name . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120
23.4
Identification registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
24.1
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
24.2
Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . 124
24.3
Power considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124
24.4
Parameter interpretation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125
24.5
DC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125
24.6
Flash characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130
24.7
A/D converter characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131
24.8
24.7.1
Conversion timing control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132
24.7.2
A/D conversion accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133
24.7.3
Total unadjusted error . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134
24.7.4
Analog reference pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135
AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141
24.8.1
Test waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141
5/9
Contents
ST10F272M
24.8.2
Definition of internal timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141
24.8.3
Clock generation modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142
24.8.4
Prescaler operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143
24.8.5
Direct drive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143
24.8.6
Oscillator watchdog (OWD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143
24.8.7
Phase Locked Loop (PLL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 144
24.8.8
Voltage controlled oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 144
24.8.9
PLL jitter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145
24.8.10 PLL lock / unlock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 147
24.8.11 Main oscillator specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 148
24.8.12 32 kHz oscillator specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 149
24.8.13 External clock drive XTAL1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150
24.8.14 Memory cycle variables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150
24.8.15 External memory bus timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151
24.8.16 Multiplexed bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151
24.8.17 Demultiplexed bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 157
24.8.18 CLKOUT and READY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 163
24.8.19 External bus arbitration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165
24.8.20 High-speed synchronous serial interface (SSC) timing . . . . . . . . . . . . 166
25
Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170
26
Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 173
27
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 174
6/9
ST10F272M
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Table 18.
Table 19.
Table 20.
Table 21.
Table 22.
Table 23.
Table 24.
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Table 26.
Table 27.
Table 28.
Table 29.
Table 30.
Table 31.
Table 32.
Table 33.
Table 34.
Table 35.
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Table 38.
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Table 51.
Table 52.
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Summary of IFlash address range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Address space reserved for the Flash module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Flash modules sectorization (Read operations) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Flash modules sectorization (Write operations or with ROMS1 = ‘1’ or BootStrap mode) . 26
Control register interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Flash control register 0 low . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Flash control register 0 high . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Flash control register 1 low . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Flash control register 1 high . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Banks (BxS) and sectors (BxFy) status bits meaning. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Flash data register 0 low. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Flash data register 0 high . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Flash data register 1 low. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Flash data register 1 high . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Flash address register low . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Flash address register high . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Flash error register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Flash non-volatile write protection I register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Flash non-volatile access protection register 0. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Flash non-volatile access protection register 1 low . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Flash non-volatile access protection register 1 high . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
XBus Flash volatile temporary access unprotection register . . . . . . . . . . . . . . . . . . . . . . . 37
Summary of access protection level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Flash write operations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
ST10F272M boot mode selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Standard instruction set summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
MAC instruction set summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Interrupt sources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
X-Interrupt detailed mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Trap priorities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Compare modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
CAPCOM timer input frequencies, resolutions and periods at 40 MHz . . . . . . . . . . . . . . . 57
GPT1 timer input frequencies, resolutions and periods at 40 MHz. . . . . . . . . . . . . . . . . . . 58
GPT2 timer input frequencies, resolutions and periods at 40 MHz. . . . . . . . . . . . . . . . . . . 60
PWM unit frequencies and resolutions at 40 MHz CPU clock . . . . . . . . . . . . . . . . . . . . . . 62
ASC asynchronous baudrates by reload value and deviation errors (fCPU = 40 MHz) . . . 68
ASC synchronous baudrates by reload value and deviation errors (fCPU = 40 MHz) . . . . 69
Synchronous baudrate and reload values (fCPU = 40 MHz) . . . . . . . . . . . . . . . . . . . . . . . 70
WDTREL reload value (fCPU = 40 MHz) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
Reset event definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
Reset event. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
PORT0 latched configuration for the different reset events . . . . . . . . . . . . . . . . . . . . . . . 100
Power reduction modes summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
List of special function registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108
List of XBus registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115
List of Flash registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120
IDMANUF register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121
IDCHIP register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121
IDMEM register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121
IDPROG register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
7/176
ST10F272M
Table 53.
Table 54.
Table 55.
Table 56.
Table 57.
Table 58.
Table 59.
Table 60.
Table 61.
Table 62.
Table 63.
Table 64.
Table 65.
Table 66.
Table 67.
Table 68.
Table 69.
Table 70.
Table 71.
Table 72.
Table 73.
Table 74.
Table 75.
Table 76.
Table 77.
8/176
Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124
Thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125
Package characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125
DC characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125
Flash characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130
Flash data retention characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131
A/D converter characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131
A/D converter programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133
On-chip clock generator selections. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142
Internal PLL divider mechanism . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 144
PLL characteristics (VDD = 5V ± 10%, VSS = 0V, TA = -40 to +125°C) . . . . . . . . . . . . . . 147
Main oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 148
Main oscillator negative resistance (module) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 148
32 kHz oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 149
Minimum values of negative resistance (module) for 32 kHz oscillator . . . . . . . . . . . . . . 149
External clock drive. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150
Memory cycle variables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151
Multiplexed bus timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151
Demultiplexed bus timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 157
CLKOUT and READY timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 163
External bus arbitration timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165
SSC master mode timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166
SSC slave mode timings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 168
Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 173
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 174
ST10F272M
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Figure 15.
Figure 16.
Figure 17.
Figure 18.
Figure 19.
Figure 20.
Figure 21.
Figure 22.
Figure 23.
Figure 24.
Figure 25.
Figure 26.
Figure 27.
Figure 28.
Figure 29.
Figure 30.
Figure 31.
Figure 32.
Figure 33.
Figure 34.
Figure 35.
Figure 36.
Figure 37.
Figure 38.
Figure 39.
Figure 40.
Figure 41.
Figure 42.
Figure 43.
Figure 44.
Figure 45.
Figure 46.
Figure 47.
Figure 48.
Figure 49.
Figure 50.
Figure 51.
Figure 52.
Logic symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Pin configuration (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
ST10F272M on-chip memory mapping (ROMEN = 1 / XADRS = 800Bh - Reset value) . . 24
Flash structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Write operation control flow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
CPU block diagram (MAC unit not included) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
MAC unit architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
X-Interrupt basic structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Block diagram of GPT1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
Block diagram of GPT2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Block diagram of PWM module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
Connection to single CAN bus via separate CAN transceivers . . . . . . . . . . . . . . . . . . . . . 73
Connection to single CAN bus via common CAN transceivers. . . . . . . . . . . . . . . . . . . . . . 73
Connection to two different CAN buses (for example, gateway application) . . . . . . . . . . . 74
Connection to one CAN bus with internal parallel mode enabled. . . . . . . . . . . . . . . . . . . . 74
Asynchronous power-on RESET (EA = 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
Asynchronous power-on RESET (EA = 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
Asynchronous hardware RESET (EA = 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
Asynchronous hardware RESET (EA = 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
Synchronous short / long hardware RESET (EA = 1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
Synchronous short / long hardware RESET (EA = 0). . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
Synchronous long hardware RESET (EA = 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
Synchronous long hardware RESET (EA = 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
SW / WDT unidirectional RESET (EA = 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
SW / WDT unidirectional RESET (EA = 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
SW / WDT bidirectional RESET (EA = 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
SW / WDT bidirectional RESET (EA = 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
SW / WDT bidirectional RESET (EA = 0) followed by a HW RESET . . . . . . . . . . . . . . . . . 94
Minimum external reset circuitry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
System reset circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
Internal (simplified) reset circuitry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
Example of software or watchdog bidirectional reset (EA = 1) . . . . . . . . . . . . . . . . . . . . . . 97
Example of software or watchdog bidirectional reset (EA = 0) . . . . . . . . . . . . . . . . . . . . . . 98
PORT0 bits latched into the different registers after reset . . . . . . . . . . . . . . . . . . . . . . . . 101
External RC circuitry on RPD pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
Port2 test mode structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129
Supply current versus the operating frequency (RUN and IDLE modes) . . . . . . . . . . . . . 129
A/D conversion characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135
A/D converter input pins scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136
Charge sharing timing diagram during sampling phase . . . . . . . . . . . . . . . . . . . . . . . . . . 137
Anti-aliasing filter and conversion rate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138
Input / output waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141
Float waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141
Generation mechanisms for the CPU clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142
ST10F272M PLL jitter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 147
Crystal oscillator and resonator connection diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 148
32 kHz crystal oscillator connection diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 149
External clock drive XTAL1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150
External memory cycle: Multiplexed bus, with/without read/write delay, normal ALE. . . . 153
External memory cycle: Multiplexed bus, with/without read/write delay, extended ALE. . 154
External memory cycle: Multiplexed bus, with/without r/w delay, normal ALE, r/w CS. . . 155
9/176
ST10F272M
Figure 53.
Figure 54.
Figure 55.
Figure 56.
Figure 57.
Figure 58.
Figure 59.
Figure 60.
Figure 61.
Figure 62.
Figure 63.
Figure 64.
10/176
External memory cycle: Multiplexed bus, with/without r/w delay, extended ALE, r/w CS . 156
External memory cycle: Demultiplexed bus, with/without r/w delay, normal ALE . . . . . . . 159
External memory cycle: Demultiplexed bus, with/without r/w delay, extended ALE . . . . . 160
External memory cycle: Demultipl. bus, with/without r/w delay, normal ALE, r/w CS . . . . 161
External memory cycle: Demultiplexed bus, without r/w delay, extended ALE, r/w CS . . 162
CLKOUT and READY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 164
External bus arbitration (releasing the bus) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165
External bus arbitration (regaining the bus) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166
SSC master timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 167
SSC slave timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 169
PQFP144 mechanical data and package dimension . . . . . . . . . . . . . . . . . . . . . . . . . . . . 171
LQFP144 mechanical data and package dimension . . . . . . . . . . . . . . . . . . . . . . . . . . . . 172
ST10F272M
Introduction
1
Introduction
1.1
Description
The ST10F272M device is a new derivative of the STMicroelectronics ST10 family of 16-bit
single-chip CMOS microcontrollers.
The ST10F272M combines high CPU performance (up to 20 million instructions per second)
with high peripheral functionality and enhanced I/O capabilities. It also provides on-chip
high-speed single voltage Flash memory, on-chip high-speed RAM, and clock generation
via PLL.
The ST10F272M is processed in 0.18mm CMOS technology. The MCU core and the logic is
supplied with a 5V to 1.8V on-chip voltage regulator. The part is supplied with a single 5V
supply and I/Os work at 5V.
The ST10F272M is an optimized version of the ST10F272E, upward compatible with the
following set of differences:
●
Maximum CPU frequency is 40 MHz
●
Reduced range for the Standby Voltage: VStby must be in the range of 4.5 to 5.5V.
●
Identification registers: the IDMEM register reflects the Flash type difference and can
be used to differentiate the two devices by software
●
Improved EMC behavior thanks to the introduction of an internal RC filter on the 5V for
the ballast transistors
1.2
Special characteristics
1.2.1
1.2.1 XPeripheral clock gating
This new feature have been implemented on the ST10F272M: Once the EINIT instruction
has been executed, only the XPeripherals enabled in the XPERCON register will be clocked.
The new feature allows to reduce the power consumption and also should improve the
emissions as it avoids to propagate useless clock signals across the device.
1.2.2
1.2.2 Improved supply ring
An RC filter has been introduced in the 5V power supply ring of the ballast transistor. In
addition, the supply rings for the internal voltage regulators and the IOs have been split.
These two modifications should improve the behavior of the device regarding conducted
emissions.
11/176
Introduction
Figure 1.
ST10F272M
Logic symbol
V18 VDD VSS
XTAL1
XTAL2
XTAL3
XTAL4
Port 0
16-bit
RSTIN
RSTOUT
VAREF
VAGND
Port 2
16-bit
NMI
EA / VSTBY
READY
ALE
RD
WR / WRL
Port 5
16-bit
12/176
Port 1
16-bit
Port 3
15-bit
ST10F272M
Port 4
8-bit
Port 6
8-bit
Port 7
8-bit
Port 8
8-bit
RPD
ST10F272M
Pin data
Pin configuration (top view)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
ST10F272M
108
107
106
105
104
103
102
101
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
75
74
73
P0H.0 / AD8
P0L.7 / AD7
P0L.6 / AD6
P0L.5 / AD5
P0L.4 / AD4
P0L.3 / AD3
P0L.2 / AD2
P0L.1 / AD1
P0L.0 / AD0
EA / VSTBY
ALE
READY
WR/WRL
RD
VSS
VDD
P4.7 / A23 / CAN2_TxD / SDA
P4.6 / A22 / CAN1_TxD / CAN2_TxD
P4.5 / A21 / CAN1_RxD / CAN2_RxD
P4.4 / A20 / CAN2_RxD / SCL
P4.3 / A19
P4.2 / A18
P4.1 / A17
P4.0 / A16
RPD
VSS
VDD
P3.15 / CLKOUT
P3.13 / SCLK0
P3.12 / BHE / WRH
P3.11 / RxD0
P3.10 / TxD0
P3.9 / MTSR0
P3.8 / MRST0
P3.7 / T2IN
P3.6 / T3IN
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
P6.0 / CS0
P6.1 / CS1
P6.2 / CS2
P6.3 / CS3
P6.4 / CS4
P6.5 / HOLD / SCLK1
P6.6 / HLDA / MTSR1
P6.7 / BREQ / MRST1
P8.0 / XPOUT0 / CC16IO
P8.1 / XPOUT1 / CC17IO
P8.2 / XPOUT2 / CC18IO
P8.3 / XPOUT3 / CC19IO
P8.4 / CC20IO
P8.5 / CC21IO
P8.6 / RxD1 / CC22IO
P8.7 / TxD1 / CC23IO
VDD
VSS
P7.0 / POUT0
P7.1 / POUT1
P7.2 / POUT2
P7.3 / POUT3
P7.4 / CC28IO
P7.5 / CC29IO
P7.6 / CC30IO
P7.7 / CC31IO
P5.0 / AN0
P5.1 / AN1
P5.2 / AN2
P5.3 / AN3
P5.4 / AN4
P5.5 / AN5
P5.6 / AN6
P5.7 / AN7
P5.8 / AN8
P5.9 / AN9
144
143
142
141
140
139
138
137
136
135
134
133
132
131
130
129
128
127
126
125
124
123
122
121
120
119
118
117
116
115
114
113
112
111
110
109
XTAL4
XTAL3
NMI
RSTOUT
RSTIN
VSS
XTAL1
XTAL2
VDD
P1H.7 / A15 / CC27I
P1H.6 / A14 / CC26I
P1H.5 / A13 / CC25I
P1H.4 / A12 / CC24I
P1H.3 / A11
P1H.2 / A10
P1H.1 / A9
P1H.0 / A8
VSS
VDD
P1L.7 / A7 / AN23
P1L.6 / A6 / AN22
P1L.5 / A5 / AN21
P1L.4 / A4 / AN20
P1L.3 / A3 / AN19
P1L.2 / A2 / AN18
P1L.1 / A1 / AN17
P1L.0 / A0 / AN16
P0H.7 / AD15
P0H.6 / AD14
P0H.5 / AD13
P0H.4 / AD12
P0H.3 / AD11
P0H.2 / AD10
P0H.1 / AD9
VSS
VDD
Figure 2.
VAREF
VAGND
P5.10 / AN10 / T6EUD
P5.11 / AN11 / T5EUD
P5.12 / AN12 / T6IN
P5.13 / AN13 / T5IN
P5.14 / AN14 / T4EUD
P5.15 / AN15 / T2EUD
VSS
VDD
P2.0 / CC0IO
P2.1 / CC1IO
P2.2 / CC2IO
P2.3 / CC3IO
P2.4 / CC4IO
P2.5 / CC5IO
P2.6 / CC6IO
P2.7 / CC7IO
VSS
V18
P2.8 / CC8IO / EX0IN
P2.9 / CC9IO / EX1IN
P2.10 / CC10IO / EX2IN
P2.11 / CC11IO / EX3IN
P2.12 / CC12IO / EX4IN
P2.13 / CC13IO / EX5IN
P2.14 / CC14IO / EX6IN
P2.15 / CC15IO / EX7IN / T7IN
P3.0 / T0IN
P3.1 / T6OUT
P3.2 / CAPIN
P3.3 / T3OUT
P3.4 / T3EUD
P3.5 / T4IN
VSS
VDD
2
Pin data
13/176
Pin data
Table 1.
Symbol
ST10F272M
Pin description
Pin
1-8
P6.0 - P6.7
Type
I/O
Function
8-bit bidirectional I/O port, bitwise programmable for input or output via direction
bit. Programming an I/O pin as input forces the corresponding output driver to
high impedance state. Port 6 outputs can be configured as push-pull or open
drain drivers. The input threshold of Port 6 is selectable (TTL or CMOS). The
following Port 6 pins have alternate functions:
1
O
P6.0
CS0
Chip select 0 output
...
...
...
...
...
5
O
P6.4
CS4
Chip select 4 output
I
P6.5
HOLD
External master hold request input
SCLK1
SSC1: master clock output / slave clock input
HLDA
Hold acknowledge output
MTSR1
SSC1: master-transmitter / slave-receiver O/I
BREQ
Bus request output
MRST1
SSC1: master-receiver / slave-transmitter I/O
6
I/O
O
P6.6
7
I/O
O
P6.7
8
I/O
9-16
I/O
8-bit bidirectional I/O port, bitwise programmable for input or output via direction
bit. Programming an I/O pin as input forces the corresponding output driver to
high impedance state. Port 8 outputs can be configured as push-pull or open
drain drivers. The input threshold of Port 8 is selectable (TTL or CMOS).
The following Port 8 pins have alternate functions:
I/O
P8.0
CC16IO
CAPCOM2: CC16 capture input / compare output
XPWM0
PWM1: channel 0 output
9
O
...
P8.0 - P8.7
...
...
...
...
I/O
P8.3
CC19IO
CAPCOM2: CC19 capture input / compare output
XPWM0
PWM1: channel 3 output
12
O
13
I/O
P8.4
CC20IO
CAPCOM2: CC20 capture input / compare output
14
I/O
P8.5
CC21IO
CAPCOM2: CC21 capture input / compare output
I/O
P8.6
CC22IO
CAPCOM2: CC22 capture input / compare output
RxD1
ASC1: Data input (Asynchronous) or I/O (Synchronous)
CC23IO
CAPCOM2: CC23 capture input / compare output
TxD1
ASC1: Clock / Data output
(Asynchronous/Synchronous)
15
I/O
I/O
P8.7
16
O
14/176
ST10F272M
Table 1.
Pin data
Pin description (continued)
Symbol
P7.0 - P7.7
P5.0 - P5.9
P5.10 - P5.15
P2.0 - P2.7
P2.8 - P2.15
Pin
Type
Function
19-26
I/O
8-bit bidirectional I/O port, bitwise programmable for input or output via direction
bit. Programming an I/O pin as input forces the corresponding output driver to
high impedance state. Port 7 outputs can be configured as push-pull or open
drain drivers. The input threshold of Port 7 is selectable (TTL or CMOS).
The following Port 7 pins have alternate functions:
19
O
P7.0
POUT0
PWM0: channel 0 output
...
...
...
...
...
22
O
P7.3
POUT3
PWM0: channel 3 output
23
I/O
P7.4
CC28IO
CAPCOM2: CC28 capture input / compare output
...
...
...
...
...
26
I/O
P7.7
CC31IO
CAPCOM2: CC31 capture input / compare output
27-36
39-44
I
I
16-bit input-only port with Schmitt-Trigger characteristics. The pins of Port 5 can
be the analog input channels (up to 16) for the A/D converter, where P5.x equals
ANx (Analog input channel x), or they are timer inputs. The input threshold of
Port 5 is selectable (TTL or CMOS). The following Port 5 pins have alternate
functions:
39
I
P5.10
T6EUD
GPT2: timer T6 external up/down control input
40
I
P5.11
T5EUD
GPT2: timer T5 external up/down control input
41
I
P5.12
T6IN
GPT2: timer T6 count input
42
I
P5.13
T5IN
GPT2: timer T5 count input
43
I
P5.14
T4EUD
GPT1: timer T4 external up/down control input
44
I
P5.15
T2EUD
GPT1: timer T2 external up/down control input
47-54
57-64
I/O
16-bit bidirectional I/O port, bitwise programmable for input or output via direction
bit. Programming an I/O pin as input forces the corresponding output driver to
high impedance state. Port 2 outputs can be configured as push-pull or open
drain drivers. The input threshold of Port 2 is selectable (TTL or CMOS).
The following Port 2 pins have alternate functions:
47
I/O
P2.0
CC0IO
CAPCOM: CC0 capture input/compare output
...
...
...
...
...
54
I/O
P2.7
CC7IO
CAPCOM: CC7 capture input/compare output
57
I/O
P2.8
CC8IO
CAPCOM: CC8 capture input/compare output
EX0IN
Fast external interrupt 0 input
I
...
...
...
...
...
64
I/O
P2.15
CC15IO
CAPCOM: CC15 capture input/compare output
I
EX7IN
Fast external interrupt 7 input
I
T7IN
CAPCOM2: timer T7 count input
15/176
Pin data
Table 1.
ST10F272M
Pin description (continued)
Symbol
P3.0 - P3.5
P3.6 - P3.13,
P3.15
16/176
Pin
Type
Function
65-70,
73-80,
81
I/O
I/O
I/O
15-bit (P3.14 is missing) bidirectional I/O port, bitwise programmable for input or
output via direction bit. Programming an I/O pin as input forces the
corresponding output driver to high impedance state. Port 3 outputs can be
configured as push-pull or open drain drivers. The input threshold of Port 3 is
selectable (TTL or CMOS). The following Port 3 pins have alternate functions:
65
I
P3.0
T0IN
CAPCOM1: timer T0 count input
66
O
P3.1
T6OUT
GPT2: timer T6 toggle latch output
67
I
P3.2
CAPIN
GPT2: register CAPREL capture input
68
O
P3.3
T3OUT
GPT1: timer T3 toggle latch output
69
I
P3.4
T3EUD
GPT1: timer T3 external up/down control input
70
I
P3.5
T4IN
GPT1; timer T4 input for count/gate/reload/capture
73
I
P3.6
T3IN
GPT1: timer T3 count/gate input
74
I
P3.7
T2IN
GPT1: timer T2 input for count/gate/reload / capture
75
I/O
P3.8
MRST0
SSC0: master-receiver/slave-transmitter I/O
76
I/O
P3.9
MTSR0
SSC0: master-transmitter/slave-receiver O/I
77
O
P3.10
TxD0
ASC0: clock / data output (asynchronous/synchronous)
78
I/O
P3.11
RxD0
ASC0: data input (asynchronous) or I/O (synchronous)
79
O
P3.12
BHE
External memory high byte enable signal
WRH
External memory high byte write strobe
80
I/O
P3.13
SCLK0
SSC0: master clock output / slave clock input
81
O
P3.15
CLKOUT
System clock output (programmable divider on CPU
clock)
ST10F272M
Table 1.
Symbol
Pin data
Pin description (continued)
Pin
Type
Function
85-92
I/O
Port 4 is an 8-bit bidirectional I/O port. It is bitwise programmable for input or
output via direction bit. Programming an I/O pin as input forces the
corresponding output driver to high impedance state. The input threshold is
selectable (TTL or CMOS). Port 4.4, 4.5, 4.6 and 4.7 outputs can be configured
as push-pull or open drain drivers.
In case of an external bus configuration, Port 4 can be used to output the
segment address lines:
85
O
P4.0
A16
Segment address line
86
O
P4.1
A17
Segment address line
87
O
P4.2
A18
Segment address line
88
O
P4.3
A19
Segment address line
A20
Segment address line
CAN2_RxD
CAN2: receive data input
I/O
SCL
I2C Interface: serial clock
O
A21
Segment address line
CAN1_RxD
CAN1: receive data input
I
CAN2_RxD
CAN2: receive data input
O
A22
Segment address line
CAN1_TxD
CAN1: transmit data output
O
CAN2_TxD
CAN2: transmit data output
O
A23
Most significant segment address line
CAN2_TxD
CAN2: transmit data output
SDA
I2C Interface: serial data
O
P4.0 - P4.7
89
90
91
92
I
I
O
O
I/O
RD
WR/WRL
95
96
P4.4
P4.5
P4.6
P4.7
O
External memory read strobe. RD is activated for every external instruction or
data read access.
O
External memory write strobe. In WR-mode this pin is activated for every
external data write access. In WRL mode this pin is activated for low byte data
write accesses on a 16-bit bus, and for every data write access on an 8-bit bus.
See WRCFG in the SYSCON register for mode selection.
READY/
READY
97
I
Ready input. The active level is programmable. When the ready function is
enabled, the selected inactive level at this pin, during an external memory
access, will force the insertion of waitstate cycles until the pin returns to the
selected active level.
ALE
98
O
Address latch enable output. In case of use of external addressing or of
multiplexed mode, this signal is the latch command of the address lines.
17/176
Pin data
Table 1.
ST10F272M
Pin description (continued)
Symbol
EA / VSTBY
Pin
99
Type
Function
I
External access enable pin.
A low level applied to this pin during and after Reset forces the ST10F272M to
start the program from the external memory space. A high level forces
ST10F272M to start in the internal memory space. This pin is also used (when
Stand-by mode is entered, that is ST10F272M under reset and main VDD turned
off) to bias the 32 kHz oscillator amplifier circuit and to provide a reference
voltage for the low-power embedded voltage regulator which generates the
internal 1.8V supply for the RTC module (when not disabled) and to retain data
inside the Stand-by portion of the XRAM (16 Kbyte).
It can range from 4.5 to 5.5V. In running mode, this pin can be tied low during
reset without affecting 32 kHz oscillator, RTC and XRAM activities, since the
presence of a stable VDD guarantees the proper biasing of all those modules.
Two 8-bit bidirectional I/O ports P0L and P0H, bitwise programmable for input or
output via direction bit. Programming an I/O pin as input forces the
corresponding output driver to high impedance state. The input threshold of
Port 0 is selectable (TTL or CMOS).
In case of an external bus configuration, PORT0 serves as the address (A) and
as the address / data (AD) bus in multiplexed bus modes and as the data (D) bus
in demultiplexed bus modes.
Demultiplexed bus modes
P0L.0 - P0L.7, 100-107,
P0H.0,
108,
P0H.1 - P0H.7 111-117
I/O
Data path width
8-bit
16-bit
P0L.0 – P0L.7:
D0 – D7
D0 - D7
P0H.0 – P0H.7:
I/O
D8 - D15
Multiplexed bus modes
18/176
8-bit
16-bit
P0L.0 – P0L.7:
AD0 – AD7
AD0 - AD7
P0H.0 – P0H.7:
A8 – A15
AD8 - AD15
Two 8-bit bidirectional I/O ports P1L and P1H, bitwise programmable for input or
output via direction bit. Programming an I/O pin as input forces the
corresponding output driver to high impedance state. PORT1 is used as the 16bit address bus (A) in demultiplexed bus modes: If at least BUSCONx is
configured such that the demultiplexed mode is selected, the pins of PORT1 are
not available for general purpose I/O function. The input threshold of Port 1 is
selectable (TTL or CMOS).
The pins of P1L also serve as the additional (up to eight) analog input channels
for the A/D converter, where P1L.x equals ANy (Analog input channel y, where
y = x + 16). This additional function has a higher priority on demultiplexed bus
function.
The following PORT1 pins have alternate functions:
118-125
128-135
I/O
132
I
P1H.4
CC24IO
CAPCOM2: CC24 capture input
133
I
P1H.5
CC25IO
CAPCOM2: CC25 capture input
134
I
P1H.6
CC26IO
CAPCOM2: CC26 capture input
135
I
P1H.7
CC27IO
CAPCOM2: CC27 capture input
138
I
XTAL1
Main oscillator amplifier circuit and/or external clock input
P1L.0 - P1L.7,
P1H.0 - P1H.7
XTAL1
Data path width
ST10F272M
Table 1.
Pin data
Pin description (continued)
Symbol
Pin
Type
XTAL2
137
O
Function
XTAL2
Main oscillator amplifier circuit output
To clock the device from an external source, drive XTAL1 while leaving XTAL2
unconnected. Minimum and maximum high / low and rise / fall times specified in
the AC Characteristics must be observed.
XTAL3
143
I
XTAL3
32 kHz oscillator amplifier circuit input
XTAL4
144
O
XTAL4
32 kHz oscillator amplifier circuit output
When 32 kHz oscillator amplifier is not used, to avoid spurious consumption,
XTAL3 must be tied to ground while XTAL4 has to be left open. Additionally, bit
OFF32 in RTCCON register must be set. 32 kHz oscillator can only be driven by
an external crystal, and not by a different clock source.
RSTIN
140
I
Reset Input with CMOS Schmitt-Trigger characteristics. A low level at this pin for
a specified duration while the oscillator is running resets the ST10F272M. An
internal pull-up resistor permits power-on reset using only a capacitor connected
to VSS. In bidirectional reset mode (enabled by setting bit BDRSTEN in SYSCON
register), the RSTIN line is pulled low for the duration of the internal reset
sequence.
RSTOUT
141
O
Internal Reset Indication Output. This pin is driven to a low level during
hardware, software or watchdog timer reset. RSTOUT remains low until the EINIT
(end of initialization) instruction is executed.
NMI
142
I
Non-Maskable Interrupt Input. A high to low transition at this pin causes the CPU
to vector to the NMI trap routine. If bit PWDCFG = ‘0’ in SYSCON register, when
the PWRDN (power-down) instruction is executed, the NMI pin must be low in
order to force the ST10F272M to go into power-down mode. If NMI is high and
PWDCFG =’0’, when PWRDN is executed, the part will continue to run in normal
mode.
If not used, pin NMI should be pulled high externally.
VAREF
37
-
A/D converter reference voltage and analog supply
VAGND
38
-
A/D converter reference and analog ground
RPD
84
-
Timing pin for the return from interruptible power-down mode and synchronous /
asynchronous reset selection.
VDD
17, 46,
72,82,93
, 109,
126, 136
-
Digital supply voltage = +5V during normal operation, idle and power-down
modes.
It can be turned off when Stand-by RAM mode is selected.
VSS
18,45,
55,71,
83,94,
110,
127, 139
-
Digital ground
V18
56
-
1.8V decoupling pin: a decoupling capacitor (typical value of 10nF, max 100nF)
must be connected between this pin and nearest VSS pin.
19/176
Functional description
3
ST10F272M
Functional description
The architecture of the ST10F272M combines advantages of both RISC and CISC
processors and an advanced peripheral subsystem. The block diagram gives an overview of
the different on-chip components and the high bandwidth internal bus structure of the
ST10F272M.
Figure 3.
Block diagram
16
32
IFlash
256K
16
IRAM
2K
CPU-Core and MAC Unit
XRAM1
16
2K
(PEC)
Watchdog
PEC
16
16
XRAM2 16
16K
(STBY)
16
16
16
Interrupt Controller
16
16
16
16
XI2C
Port 6
8
20/176
PLL
XSSC
5V-1.8V
Voltage
Regulator
Port 5
16
Port 3
15
Port 7
Port 8
8
8
Port 2
CAPCOM1
BRG
CAPCOM2
SSC0
BRG
PWM
ASC0
GPT1 / GPT2
XCAN2
10-bit ADC
8
XASC
External Bus
Controller
Port 1
Port 0
16
Port 4
16
32 kHz
Oscillator
XPWM
XRTC
XCAN1
Oscillator
16
ST10F272M
4
Memory organization
Memory organization
The memory space of the ST10F272M is configured in a unified memory architecture. Code
memory, data memory, registers and I/O ports are organized within the same linear address
space of 16 Mbytes. The entire memory space can be accessed Bytewise or Wordwise.
Particular portions of the on-chip memory have additionally been made directly bit
addressable.
IFlash: 256 Kbytes of on-chip Flash memory. It is divided in eight blocks (B0F0...B0F7) that
constitute the Bank 0. When Bootstrap mode is selected, the Test-Flash Block B0TF
(8 Kbytes) appears at address 00’0000h: refer to Chapter 5: Internal Flash memory on
page 25 for more details on memory mapping in boot mode. The summary of address range
for IFlash is the following:
Table 2.
Summary of IFlash address range
Blocks
User mode
Size (bytes)
B0TF
Not visible
8K
B0F0
00’0000h - 00’1FFFh
8K
B0F1
00’2000h - 00’3FFFh
8K
B0F2
00’4000h - 00’5FFFh
8K
B0F3
00’6000h - 00’7FFFh
8K
B0F4
01’8000h - 01’FFFFh
32K
B0F5
02’0000h - 02’FFFFh
64K
B0F6
03’0000h - 03’FFFFh
64K
B0F7
04’0000h - 04’FFFFh
64K
IRAM: 2 Kbytes of on-chip internal RAM (dual-port) is provided as a storage for data,
system stack, general purpose register banks and code. A register bank is 16 Wordwide (R0
to R15) and / or Bytewide (RL0, RH0, …, RL7, RH7) general purpose registers group.
XRAM: 16K + 2K bytes of on-chip extension RAM (single port XRAM) is provided as a
storage for data, user stack and code.
The XRAM is divided into two areas, the first 2 Kbytes named XRAM1 and the second
16 Kbytes named XRAM2, connected to the internal XBUS and are accessed like an
external memory in 16-bit demultiplexed bus-mode without wait state or read/write delay
(50ns access at 40 MHz CPU clock). Byte and Word accesses are possible.
The XRAM1 address range is 00’E000h - 00’E7FFh if XPEN (bit 2 of SYSCON register),
and XRAM1EN (bit 2 of XPERCON register) are set. If XRAM1EN or XPEN is cleared, then
any access in the address range 00’E000h - 00’E7FFh will be directed to external memory
interface, using the BUSCONx register corresponding to address matching ADDRSELx
register.
The XRAM2 address range is the one selected programming XADRS3 register, if XPEN (bit
2 of SYSCON register), and XRAM2EN (bit 3 of XPERCON register) are set. If bit XPEN is
cleared, then any access in the address range programmed for XRAM2 will be directed to
external memory interface, using the BUSCONx register corresponding to address
matching ADDRSELx register.
21/176
Memory organization
ST10F272M
After reset, the XRAM2 address range is 09’0000h - 09’3FFFh and is mirrored every
16 Kbyte boundary until 0F’FFFFh.
XRAM2 also represents the Stand-by RAM, which can be maintained biased through
EA / VSTBY pin when main supply VDD is turned off.
As the XRAM appears like external memory, it cannot be used as system stack or as
register banks. The XRAM is not provided for single bit storage and therefore is not bit
addressable.
SFR/ESFR: 1024 bytes (2 x 512 bytes) of address space is reserved for the special function
register areas. SFRs are Wordwide registers which are used to control and to monitor the
function of the different on-chip units.
CAN1: Address range 00’EF00h - 00’EFFFh is reserved for the CAN1 Module access. The
CAN1 is enabled by setting XPEN bit 2 of the SYSCON register and by setting CAN1EN bit
0 of the XPERCON register. Accesses to the CAN Module use demultiplexed addresses
and a 16-bit data bus (only word accesses are possible). Two wait states give an access
time of 100ns at 40 MHz CPU clock. No tri-state wait states are used.
CAN2: Address range 00’EE00h - 00’EEFFh is reserved for the CAN2 Module access. The
CAN2 is enabled by setting XPEN bit 2 of the SYSCON register and by setting CAN2EN bit
1 of the new XPERCON register. Accesses to the CAN Module use demultiplexed
addresses and a 16-bit data bus (only word accesses are possible). Two wait states give an
access time of 100ns at 40 MHz CPU clock. No tri-state wait states are used.
Note:
If one or the two CAN modules are used, Port 4 cannot be programmed to output all eight
segment address lines. Thus, only four segment address lines can be used, reducing the
external memory space to 5 Mbytes (1 Mbyte per CS line).
RTC: Address range 00’ED00h - 00’EDFFh is reserved for the RTC Module access. The
RTC is enabled by setting XPEN bit 2 of the SYSCON register and bit 4 of the XPERCON
register. Accesses to the RTC Module use demultiplexed addresses and a 16-bit data bus
(only word accesses are possible). Two waitstates give an access time of 100ns at 40 MHz
CPU clock. No tristate waitstate is used.
PWM1: Address range 00’EC00h - 00’ECFFh is reserved for the PWM1 Module access.
The PWM1 is enabled by setting XPEN bit 2 of the SYSCON register and bit 6 of the
XPERCON register. Accesses to the PWM1 Module use demultiplexed addresses and a 16bit data bus (only word accesses are possible). Two waitstates give an access time of 100ns
at 40 MHz CPU clock. No tristate waitstate is used. Only word access is possible.
ASC1: Address range 00’E900h - 00’E9FFh is reserved for the ASC1 Module access. The
ASC1 is enabled by setting XPEN bit 2 of the SYSCON register and bit 7 of the XPERCON
register. Accesses to the ASC1 Module use demultiplexed addresses and a 16-bit data bus
(only word accesses are possible). Two waitstates give an access time of 100ns at 40 MHz
CPU clock. No tristate waitstate is used.
SSC1: Address range 00’E800h - 00’E8FFh is reserved for the SSC1 Module access. The
SSC1 is enabled by setting XPEN bit 2 of the SYSCON register and bit 8 of the XPERCON
register. Accesses to the SSC1 Module use demultiplexed addresses and a 16-bit data bus
(only word accesses are possible). Two waitstates give an access time of 100ns at 40 MHz
CPU clock. No tristate waitstate is used.
I2C: Address range 00’EA00h - 00’EAFFh is reserved for the I2C Module access. The I2C is
enabled by setting XPEN bit 2 of the SYSCON register and bit 9 of the XPERCON register.
Accesses to the I2C Module use demultiplexed addresses and a 16-bit data bus (only word
22/176
ST10F272M
Memory organization
accesses are possible). Two waitstates give an access time of 100ns at 40 MHz CPU clock.
No tristate waitstate is used.
X-Miscellaneous: Address range 00’EB00h - 00’EBFFh is reserved for the access to a set
of XBUS additional features. They are enabled by setting XPEN bit 2 of the SYSCON
register and bit 10 of the XPERCON register. Accesses to this additional features use
demultiplexed addresses and a 16-bit data bus (only word accesses are possible). Two
waitstates give an access time of 100ns at 40 MHz CPU clock. No tristate waitstate is used.
The following set of features are provided:
●
CLKOUT programmable divider
●
XBUS interrupt management registers
●
ADC multiplexing on P1L register
●
Port1L digital disable register for extra ADC channels
●
CAN2 multiplexing on P4.5/P4.6
●
CAN1-2 main clock prescaler
●
Main Voltage Regulator disable for power-down mode
●
TTL / CMOS threshold selection for Port0, Port1, and Port5
●
Flash Temporary Unprotection
In order to meet the needs of designs where more memory is required than is provided on
chip, up to 16 Mbytes of external memory can be connected to the microcontroller.
Visibility of XBUS peripherals
In order to keep the ST10F272M compatible with the ST10F168 / ST10F269, the XBUS
peripherals can be selected to be visible on the external address / data bus. Different bits for
X-Peripheral enabling in XPERCON register must be set. If these bits are cleared before the
global enabling with XPEN bit in SYSCON register, the corresponding address space, port
pins and interrupts are not occupied by the peripherals, thus the peripheral is not visible and
not available. Refer to Chapter 23: Register set on page 108.
XPERCON and X-Peripheral clock gating
As already mentioned, the XPERCON register must be programmed to enable the single
XBus modules separately. The XPERCON is a read/write ESFR register.
The new feature of Clock Gating has been implemented by means of this register: Once the
EINIT instruction has been executed, all the peripherals (except RAMs and XMISC) not
enabled in the XPERCON register are not be clocked. The clock gating can reduce power
consumption and improve EMI when the user doesn’t use all X-Peripherals.
Note:
When the clock has been gated in the disabled Peripherals, no Reset will be raised once the
EINIT instruction has been executed.
23/176
Memory organization
ST10F272M on-chip memory mapping (ROMEN = 1 / XADRS = 800Bh - Reset value)
Code
Segment
Data
Page
Code
Segment
FF FFFF
1023
11 FFFF
255
17
10 0000
0F FFFF
15
0F 0000
0E FFFF
14
0E 0000
0D FFFF
13
0D 0000
0C FFFF
12
0C 0000
0B FFFF
11
0B 0000
0A FFFF
10
0A 0000
09 FFFF
9
09 0000
08 FFFF
8
XRAM2
XRAM2
XRAM2
46
XRAM2
XRAM2
XRAM2
XRAM2
XRAM2
XRAM2
XRAM2
XRAM2
43
02 0000
01 FFFF
00 0000
16 MB
00 0000
IRAM
2K
Reserved
1K
ESFR
512
2K
61
60
59
00 F600
00 F5FF
58
57
Reserved
56
1K
55
00 F200
00 F1FF
54
53
52
51
50
49
48
47
45
44
00 F000
00 EFFF
00 E800
00 E7FF
ESFR
512
XCAN1
XCAN2
XRTC
XPWM
XMiscellaneous
XI2C
XASC
256
256
256
256
256
256
256
256
XSSC
00 F600
00 F5FF
00 F200
00 F1FF
42
00 F000
00 EFFF
41
40
39
38
XRAM1
2K
Ext. Memory
8K
37
36
34
00 E000
00 DFFF
31
30
29
28
27
Reserved
26
25
24
23
Reserved
22
21
20
19
18
FLASH
17
16
15
FLASH
14
13
12
11
FLASH
10
9
8
FLASH
7
6
01 0000
00 FFFF
0
512
32
Reserved
Ext. Memory
0
SFR
33
1
0
01 0000
00 FFFF
00 FE00
00 FDFF
IRAM
62
35
Reserved
03 0000
02 FFFF
2
512
65
63
04 0000
03 FFFF
3
00 FE00
00 FDFF
SFR
64
05 0000
04 FFFF
4
00 FFFF
66
XRAM2
XRAM2
XRAM2
XRAM2
XRAM2
XRAM2
XRAM2
XRAM2
XRAM2
XRAM2
XRAM2
XRAM2
XRAM2
XRAM2
XRAM2
XRAM2
XRAM2
06 0000
05 FFFF
5
65
67
Ext. Memory
07 0000
06 FFFF
6
66
64
08 0000
07 FFFF
7
RAM / SFR (4Kbyte)
67
Ext. Memory
11 0000
10 FFFF
16
Data
Page
XADRS3 = 800Bh (512K)
Figure 4.
ST10F272M
Address Area, where XRAM2
is mirrored every 16 Kbytes
boundary after reset
5
4
3
Ext. Memory
FLASH
2
1
0
Flash + XRAM - 1Mbyte
Bit-addressable Memory
00 C000
Data Page 3 (Segment 0) - 16Kbyte
* The first 32K of Flash may be remapped from segment 0 to segment 1 by setting SYSCON-ROMS1 (before EINIT).
Absolute Memory Address are hexadecimal values, while Data Page Number are decimal values.
24/176
ST10F272M
Internal Flash memory
5
Internal Flash memory
5.1
Overview
The on-chip Flash is composed of one matrix module, 256 Kbytes wide. This module is
called IFlash because it is on the ST10 Internal bus.
Figure 5.
Flash structure
IFlash
Control Section
Flash Control
Registers
HV and Ref.
Generator
Bank 0: 256 Kbyte
Program Memory
+
8 Kbyte Test-Flash
Program/Erase
Controller
I-Bus Interface
The programming operations of the Flash are managed by an embedded Flash
Program/Erase Controller (FPEC). The high voltages needed for Program/Erase operations
are generated internally.
The Data bus is 32-bit wide for fetch accesses to IFlash, whereas it is 16-bit wide for read
accesses to IFlash Control Registers. Write accesses are possible only in the IFlash Control
Registers area.
5.2
Functional description
5.2.1
Structure
Table 3 below shows the address space reserved for the Flash module.
Table 3.
Address space reserved for the Flash module
Description
5.2.2
Addresses
Size
IFlash sectors
0x00 0000 to 0x04 FFFF
256 Kbytes
Reserved IBus area
0x05 0000 to 0x07 FFFF
192 Kbytes
Registers and Flash internal reserved area
0x08 0000 to 0x08 FFFF
64 Kbytes
Modules structure
The IFlash module is composed of a bank (Bank 0) of 256 Kbytes of Program Memory
divided in eight sectors (B0F0...B0F7). Bank 0 also contains a reserved sector named TestFlash.
25/176
Internal Flash memory
ST10F272M
The Addresses from 0x08 0000 to 0x08 FFFF are reserved for the Control Register
Interface and other internal service memory space used by the Flash Program/Erase
controller.
The following tables show the memory mapping of the Flash when it is accessed in read
mode (Table 4: Flash modules sectorization (Read operations)), and when accessed in
write or erase mode (Table 5: Flash modules sectorization (Write operations or with
ROMS1 = ‘1’ or BootStrap mode)).
Note:
With this second mapping, the first four banks are remapped into code segment 1 (same as
obtained setting bit ROMS1 in SYSCON register).
Table 4.
Bank
Flash modules sectorization (Read operations)
Size
ST10 Bus size
(bytes)
Description
Addresses
Bank 0 Flash 0 (B0F0)
0x0000 0000 - 0x0000 1FFF
8K
Bank 0 Flash 1 (B0F1)
0x0000 2000 - 0x0000 3FFF
8K
Bank 0 Flash 2 (B0F2)
0x0000 4000 - 0x0000 5FFF
8K
Bank 0 Flash 3 (B0F3)
0x0000 6000 - 0x0000 7FFF
8K
Bank 0 Flash 4 (B0F4)
0x0001 8000 - 0x0001 FFFF
32K
Bank 0 Flash 5 (B0F5)
0x0002 0000 - 0x0002 FFFF
64K
Bank 0 Flash 6 (B0F6)
0x0003 0000 - 0x0003 FFFF
64K
Bank 0 Flash 7 (B0F7)
0x0004 0000 - 0x0004 FFFF
64K
B0
Table 5.
Bank
B0
26/176
32-bit (IBus)
Flash modules sectorization (Write operations or with ROMS1 = ‘1’ or
BootStrap mode)
Size
ST10 Bus size
(bytes)
Description
Addresses
Bank 0 Test-Flash (B0TF)
0x0000 0000 - 0x0000 1FFF
8K
Bank 0 Flash 0 (B0F0)
0x0001 0000 - 0x0001 1FFF
8K
Bank 0 Flash 1 (B0F1)
0x0001 2000 - 0x0001 3FFF
8K
Bank 0 Flash 2 (B0F2)
0x0001 4000 - 0x0001 5FFF
8K
Bank 0 Flash 3 (B0F3)
0x0001 6000 - 0x0001 7FFF
8K
Bank 0 Flash 4 (B0F4)
0x0001 8000 - 0x0001 FFFF
32K
Bank 0 Flash 5 (B0F5)
0x0002 0000 - 0x0002 FFFF
64K
Bank 0 Flash 6 (B0F6)
0x0003 0000 - 0x0003 FFFF
64K
Bank 0 Flash 7 (B0F7)
0x0004 0000 - 0x0004 FFFF
64K
32-bit (IBus)
ST10F272M
Internal Flash memory
Table 5 above refers to the configuration when bit ROMS1 of SYSCON register is set. Refer
to the device User Manual for more details on the memory mapping during Bootstrap mode.
In particular, when Bootstrap mode is entered:
●
Test-Flash is seen and available for code fetches (address 00’0000h)
●
User IFlash is only available for read and write accesses
●
Write accesses must be made with addresses starting in segment 1 from 01'0000h,
whatever ROMS1 bit in SYSCON value
●
Read accesses are made in segment 0 or in segment 1 depending of ROMS1 value.
In Bootstrap mode, by default ROMS1 = 0, so the first 32 Kbytes of IFlash are mapped in
segment 0.
Example:
In default configuration, to program address 0, the user must put the value 01'0000h in the
FARL and FARH registers but to verify the content of the address 0, a read to 00'0000h must
be performed.
The next Table 6 shows the Control Register interface composition: This set of registers can
be addressed by the CPU.
Table 6.
Control register interface
Name
5.2.3
Description
Addresses
Size
FCR1-0
Flash Control Registers 1-0
0x0008 0000 - 0x0008 0007
8 bytes
FDR1-0
Flash Data Registers 1-0
0x0008 0008 - 0x0008 000F
8 bytes
FAR
Flash Address Registers
0x0008 0010 - 0x0008 0013
4 bytes
FER
Flash Error Register
0x0008 0014 - 0x0008 0015
2 bytes
FNVWPIR
Flash Non-Volatile Protection I Register
0x0008 DFB0 - 0x0008 DFB1
2 bytes
FNVPIRMirror
Mirror of Flash Non-Volatile Protection I
Register
0x0008 DFB4 - 0x0008 DFB5
2 bytes
FNVAPR0
Flash Non-Volatile Access Protection
Register 0
0x0008 DFB8 - 0x0008 DFB9
2 bytes
FNVAPR1
Flash Non-Volatile Access Protection
Register 1
0x0008 DFBC - 0x0008 DFBF
4 bytes
XFVTAUR0
XBus Flash Volatile Temporary Access
Unprotection Register 0
0x0000 EB50 - 0x0000 EB51
2 bytes
Low power mode
The Flash module is automatically switched off executing PWRDN instruction. The
consumption is drastically reduced, but exiting this state can require a long time (tPD).
Recovery time from Power-down mode for the Flash modules is anyway shorter than the
main oscillator start-up time. To avoid any problem in restarting to fetch code from the Flash,
it is important to size properly the external circuit on RPD pin.
Note:
PWRDN instruction must not be executed while a Flash program/erase operation is in
progress.
27/176
Internal Flash memory
5.3
ST10F272M
Write operation
The Flash module has one single register interface mapped in the memory space of the
IBus (08’0000h - 08’0015h). All the operations are enabled through four 16-bit control
registers: Flash Control Register 1-0 High/Low (FCR1H/L-FCR0H/L). Eight other 16-bit
registers are used to store Flash address and data for program operations (FARH/L and
FDR1H/L-FDR0H/L) and Write Operation Error flags (FERH/L). All registers are accessible
with 8- and 16-bit instructions (since the IBUS operates in 16-bit mode for read/write
accesses to data).
Note:
The register that controls the Temporary Unprotection of the Flash is located on the XBus at
address 00’EB50h in the XMiscellaneous Register area.
Before accessing the IFlash module (and consequently the Flash register to be used for
program/erasing operations), the ROMEN bit in SYSCON register must be set.
Caution:
During a Flash write operation any attempt to read the Flash itself, that is under
modification, will output invalid data (software trap 009Bh). This means that the Flash is not
fetchable when a programming operation is active:The write operation commands must
be executed from another memory (internal RAM or external memory), as in ST10F269
device. In fact, due to IBus characteristics, it is not possible to perform a write operation on
IFlash, when fetching code from IFlash.
Direct addressing is not allowed for write accesses to IFlash Control Registers.
Warning:
During a Write operation, when bit LOCK of FCR0 is set, it is
forbidden to write into the Flash Control Registers.
Power supply drop
If during a write operation the internal low voltage supply drops below a certain internal
voltage threshold, any write operation running is suddenly interrupted and the module is
reset to Read mode. At following Power-on, the interrupted Flash write operation must be
repeated.
5.4
Registers description
5.4.1
Flash control register 0 low (FCR0L)
The Flash Control Register 0 Low (FCR0L) together with the Flash Control Register 0 High
(FCR0H) are used to enable and to monitor all the write operations on the IFlash. The user
has no access in write mode to the Test-Flash (B0TF). Moreover, the Test-Flash block is
seen by the user in Bootstrap mode only.
FCR0L (0x08 0000)
15
14
13
FCR
12
11
10
Reserved
-
28/176
9
8
7
Reset value: 0000h
6
5
4
3
2
1
0
LOCK Reserved BSY0 Res.
RO
-
RO
-
ST10F272M
Internal Flash memory
Table 7.
Flash control register 0 low
Bit Name
5.4.2
Function
4
Flash Registers Access Locked
When this bit is set, it means that the access to the Flash Control Registers FCR0H/FCR1H/L, FDR0H/L-FDR1H/L, FARH/L and FER is locked by the FPEC: any read
access to the registers will output invalid data (software trap 009Bh) and any write
LOCK access will be ineffective. LOCK bit is automatically set when the Flash bit WMS is set.
This is the only bit the user can always access to detect the status of the Flash: once it is
found low, the rest of FCR0L and all the other Flash registers are accessible by the user
as well.
Note that FER content can be read when LOCK is low, but its content is updated only
when the BSY0 bit is reset.
1
Bank 0 Busy (IFlash)
This bit indicates that a write operation is running on Bank 0 (IFlash). It is automatically
set when bit WMS is set. Setting Protection operation sets bit BSY0 (since protection
BSY0 registers are in this Block). When this bit is set, every read access to Bank 0 will output
invalid data (software trap 009Bh), while every write access to the Bank will be ignored.
At the end of the write operation or during a Program or Erase Suspend this bit is
automatically reset and the Bank returns to read mode. After a Program or Erase
Resume this bit is automatically set again.
Flash control register 0 high (FCR0H)
The Flash Control Register 0 High (FCR0H) together with the Flash Control Register 0 Low
(FCR0L) is used to enable and to monitor all the write operations on the IFlash. The user
has no access in write mode to the Test-Flash (B0TF). Moreover, the Test-Flash block is
seen by the user in Bootstrap mode only.
FCR0H (0x08 0002)
15
14
WMS
SUSP
RW
RW
Table 8.
Bit Name
15
WMS
13
FCR
12
11
10
9
8
Reset value: 0000h
7
6
5
4
3
WPG DWPG
SER
Reserved
SPR
Reserved
RW
RW
-
RW
-
RW
2
1
0
Flash control register 0 high
Function
Write Mode Start
This bit must be set to start every write operation in the Flash module. At the end of the
write operation or during a Suspend, this bit is automatically reset. To resume a
suspended operation, this bit must be set again. It is forbidden to set this bit if bit ERR of
FER is high (the operation is not accepted). It is also forbidden to start a new write
(program or erase) operation (by setting WMS high) when bit SUSP of FCR0 is high.
Resetting this bit by software has no effect.
29/176
Internal Flash memory
Table 8.
Bit Name
ST10F272M
Flash control register 0 high (continued)
Function
Suspend
This bit must be set to suspend the current Program (Word or Double Word) or Sector
Erase operation in order to read data in one of the Sectors of the Bank under
modification or to program data in another Bank. The Suspend operation resets the
Flash Bank to normal read mode (automatically resetting bit BSY0). When in Program
Suspend, the Flash module accepts only the following operations: Read and Program
14 SUSP
Resume. When in Erase Suspend the module accepts only the following operations:
Read, Erase Resume and Program (Word or Double Word; Program operations cannot
be suspended during Erase Suspend). To resume a suspended operation, the WMS bit
must be set again, together with the selection bit corresponding to the operation to
resume (WPG, DWPG, SER).
Note: It is forbidden to start a new Write operation with bit SUSP already set.
13
WPG
Word Program
This bit must be set to select the Word (32 bits) Program operation in the Flash module.
The Word Program operation can be used to program 0s in place of 1s. The Flash
Address to be programmed must be written in the FARH/L registers, while the Flash
Data to be programmed must be written in the FDR0H/L registers before starting the
execution by setting bit WMS. WPG bit is automatically reset at the end of the Word
Program operation.
Double Word Program
This bit must be set to select the Double Word (64 bits) Program operation in the Flash
module. The Double Word Program operation can be used to program 0s in place of 1s.
The Flash Address in which to program (aligned with even words) must be written in the
12 DWPG
FARH/L registers, while the two Flash Data words to be programmed must be written in
the FDR0H/L registers (even word) and FDR1H/L registers (odd word) before starting
the execution by setting bit WMS. DWPG bit is automatically reset at the end of the
Double Word Program operation.
11
8
30/176
SER
Sector Erase
This bit must be set to select the Sector Erase operation in the Flash modules. The
Sector Erase operation can be used to erase all the Flash locations to value 0xFF. From
1 to all the sectors of the same Bank (excluded Test-Flash for Bank B0) can be selected
to be erased through bits BxFy of FCR1H/L registers before starting the execution by
setting bit WMS. It is not necessary to preprogram the sectors to 0x00, because this is
done automatically. SER bit is automatically reset at the end of the Sector Erase
operation.
SPR
Set Protection
This bit must be set to select the Set Protection operation. The Set Protection operation
can be used to program 0s in place of 1s in the Flash Non-Volatile Protection Registers.
The Flash Address in which to program must be written in the FARH/L registers, while
the Flash Data to be programmed must be written in the FDR0H/L before starting the
execution by setting bit WMS. A sequence error is flagged by bit SEQER of FER if the
address written in FARH/L is not in the range of 0x0E8FB0 to 0x08DFBF. SPR bit is
automatically reset at the end of the Set Protection operation.
ST10F272M
5.4.3
Internal Flash memory
Flash control register 1 low (FCR1L)
The Flash Control Register 1 Low (FCR1L), together with Flash Control Register 1 High
(FCR1H), is used to select the Sectors to Erase, or during any write operation to monitor the
status of each Sector and Bank.
FCR1L (0x08 0004)
15
14
13
FCR
12
11
10
9
8
Reserved
Bit
7:0
5.4.4
7
6
5
4
3
2
1
0
B0F7 B0F6 B0F5 B0F4 B0F3 B0F2 B0F1 B0F0
-
Table 9.
Reset value: 0000h
RS
RS
RS
RS
RS
RS
RS
RS
Flash control register 1 low
Name
Function
B0F[7:0]
Bank 0 IFlash Sectors 7-0 Status
These bits must be set during a Sector Erase operation to select the sectors to
erase in Bank 0. Moreover, during any erase operation, these bits are
automatically set and give the status of the eight sectors of Bank 0 (B0F7-B0F0).
The meaning of B0Fy bit for Sector y of Bank 0 is given by the next Table 4 Banks
(BxS) and Sectors (BxFy) Status bits meaning. These bits are automatically reset
at the end of a Write operation if no errors are detected.
Flash control register 1 high (FCR1H)
The Flash Control Register 1 High (FCR1H), together with Flash Control Register 1 Low
(FCR1L), is used to select the Sectors to Erase, or during any write operation to monitor the
status of each Sector and Bank.
FCR1H (0x08 0006)
15
14
Table 10.
Bit
8
13
FCR
12
11
10
9
8
Reset value: 0000h
7
6
5
4
3
Reserved
B0S
Reserved
-
RS
-
2
1
0
Flash control register 1 high
Name
Function
B0S
Bank 0 Status (IFlash)
During any erase operation, this bit is automatically modified and gives the status
of the Bank 0. The meaning of B0S bit is given in the next Table 4 Banks (BxS)
and Sectors (BxFy) Status bits meaning. This bit is automatically reset at the end
of an erase operation if no errors are detected.
During any erase operation, this bit is automatically set and gives the status of the Bank 0.
The meaning of B0Fy bit for Sector y of Bank 0 is given by the next Table 4 Banks (BxS) and
Sectors (BxFy) Status bits meaning. These bits are automatically reset at the end of an
erase operation if no errors are detected.
31/176
Internal Flash memory
Table 11.
5.4.5
ST10F272M
Banks (BxS) and sectors (BxFy) status bits meaning
ERR
SUSP
B0S = 1 meaning
B0Fy = 1 meaning
1
-
Erase Error in Bank0
Erase Error in Sector y of Bank0
0
1
Erase Suspended in Bank0
Erase Suspended in Sector y of Bank0
0
0
Don’t care
Don’t care
Flash data register 0 low (FDR0L)
During program operations, the Flash Address Registers (FARH/L) are used to store the
Flash address in which to program and the Flash Data Registers (FDR1H/L-FDR0H/L) are
used to store the Flash data to program.
FDR0L (0x08 0008)
15
14
FCR
13
12
11
10
9
8
Reset value: FFFFh
7
6
5
4
3
2
1
0
DIN15 DIN14 DIN13 DIN12 DIN11 DIN10 DIN9 DIN8 DIN7 DIN6 DIN5 DIN4 DIN3 DIN2 DIN1 DIN0
RW
RW
Table 12.
Bit
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
Flash data register 0 low
Name
Function
Data Input 15:0
15:0 DIN[15:0] These bits must be written with the Data to program the Flash with the following
operations: Word Program (32-bit), Double Word Program (64-bit) and Set
Protection.
5.4.6
Flash data register 0 high (FDR0H)
FDR0H (0x08 000A)
15
14
13
FCR
12
11
10
9
8
Reset value: FFFFh
7
6
5
4
3
2
1
0
DIN31 DIN30 DIN29 DIN28 DIN27 DIN26 DIN25 DIN24 DIN23 DIN22 DIN21 DIN20 DIN19 DIN18 DIN17 DIN16
RW
RW
Table 13.
Bit
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
Flash data register 0 high
Name
Function
Data Input 31:16
15:0 DIN[31:16] These bits must be written with the Data to program the Flash with the following
operations: Word Program (32-bit), Double Word Program (64-bit) and Set
Protection.
32/176
ST10F272M
5.4.7
Internal Flash memory
Flash data register 1 low (FDR1L)
FDR1L (0x08 000C)
15
14
FCR
13
12
11
10
9
8
Reset value: FFFFh
7
6
5
4
3
2
1
0
DIN15 DIN14 DIN13 DIN12 DIN11 DIN10 DIN9 DIN8 DIN7 DIN6 DIN5 DIN4 DIN3 DIN2 DIN1 DIN0
RW
RW
Table 14.
Bit
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
Flash data register 1 low
Name
Function
Data Input 15:0
15:0 DIN[15:0] These bits must be written with the Data to program the Flash with the following
operations: Word Program (32-bit), Double Word Program (64-bit) and Set
Protection.
5.4.8
Flash data register 1 high (FDR1H)
FDR1H (0x08 000E)
15
14
13
FCR
12
11
10
9
8
Reset value: FFFFh
7
6
5
4
3
2
1
0
DIN31 DIN30 DIN29 DIN28 DIN27 DIN26 DIN25 DIN24 DIN23 DIN22 DIN21 DIN20 DIN19 DIN18 DIN17 DIN16
RW
RW
Table 15.
Bit
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
Flash data register 1 high
Name
Function
Data Input 31:16
15:0 DIN[31:16] These bits must be written with the Data to program the Flash with the following
operations: Word Program (32-bit), Double Word Program (64-bit) and Set
Protection.
5.4.9
Flash address register low (FARL)
FARL (0x08 0010)
15
14
13
FCR
12
11
10
9
8
Reset value: 0000h
7
6
5
4
3
2
1
0
ADD15ADD14ADD13ADD12ADD11ADD10 ADD9 ADD8 ADD7 ADD6 ADD5 ADD4 ADD3 ADD2 Reserved
RW
RW
Table 16.
Bit
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
-
Flash address register low
Name
Function
Address 15:2
15:2 ADD[15:2] These bits must be written with the Address of the Flash location to program in the
following operations: Word Program (32-bit) and Double Word Program (64-bit). In
Double Word Program bit ADD2 must be written to ‘0’.
33/176
Internal Flash memory
5.4.10
ST10F272M
Flash address register high (FARH)
FARH (0x08 0012)
15
14
13
FCR
12
11
10
9
8
Reset value: 0000h
7
6
5
Reserved
4
Bit
2
1
0
ADD20 ADD19 ADD18 ADD17 ADD16
-
Table 17.
3
RW
RW
RW
RW
RW
Flash address register high
Name
Function
Address 20:16
4:0 ADD[20:16] These bits must be written with the Address of the Flash location to program in the
following operations: Word Program and Double Word Program.
5.4.11
Flash error register (FER)
The Flash Error register, as well as all the other Flash registers, can be read only once the
LOCK bit of register FCR0L is low. Nevertheless, the FER content is updated after
completion of the Flash operation, that is, when BSY0 is reset. Therefore, the FER content
can only be read once the LOCK and BSY0 bits are cleared.
FER (0x8 0014h)
15
14
13
FCR
12
11
10
Reserved
-
Table 18.
Bit
0
1
2
3
34/176
9
8
Reset value: 0000h
7
6
WPF RESER SEQER
RC
RC
RC
5
4
Reserved
-
3
2
1
10ER PGER ERER
RC
RC
RC
0
ERR
RC
Flash error register
Name
Function
ERR
Write Error
This bit is automatically set when an error occurs during a Flash write operation or
when a bad write operation setup is done. Once the error has been discovered and
understood, ERR bit must be software reset.
ERER
Erase Error
This bit is automatically set when an Erase error occurs during a Flash write
operation. This error is due to a real failure of a Flash cell, that can no more be
erased. This kind of error is fatal and the sector where it occurred must be
discarded. This bit has to be software reset.
PGER
Program Error
This bit is automatically set when a Program error occurs during a Flash write
operation. This error is due to a real failure of a Flash cell, that can no more be
programmed. The word where this error occurred must be discarded. This bit has
to be software reset.
10ER
1 over 0 Error
This bit is automatically set when trying to program at 1 bits previously set at 0 (this
does not happen when programming the Protection bits). This error is not due to a
failure of the Flash cell, but only flags that the desired data has not been written.
This bit has to be software reset.
ST10F272M
Internal Flash memory
Table 18.
Bit
6
7
8
5.5
Flash error register (continued)
Name
Function
SEQER
Sequence Error
This bit is automatically set when the control registers (FCR1H/L-FCR0H/L,
FARH/L, FDR1H/L-FDR0H/L) are not correctly filled to execute a valid Write
Operation. In this case no Write Operation is executed. This bit has to be software
reset.
RESER
Resume Error
This bit is automatically set when a suspended Program or Erase operation is not
resumed correctly due to a protocol error. In this case the suspended operation is
aborted. This bit has to be software reset.
WPF
Write Protection Flag
This bit is automatically set when trying to program or erase in a sector write
protected. In case of multiple Sector Erase, the not protected sectors are erased,
while the protected sectors are not erased and bit WPF is set. This bit has to be
software reset.
Protection strategy
The protection bits are stored in Non-Volatile Flash cells inside IFlash module, that are read
once at reset and stored in four Volatile registers. Before they are read from the NonVolatile cells, all the available protections are forced active during reset.
The protections can be programmed using the Set Protection operation (see Flash Control
Registers paragraph), that can be executed from all the internal or external memories
except from the Flash itself.
Two kind of protections are available: write protections to avoid unwanted writings and
access protections to avoid piracy. In next paragraphs all different level of protections are
shown, and architecture limitations are highlighted as well.
5.5.1
Protection registers
The four Non-Volatile Protection Registers are one time programmable for the user.
One register (FNVWPIR) is used to store the Write Protection fuses respectively for each
sector IFlash module. The other three Registers (FNVAPR0 and FNVAPR1L/H) are used to
store the Access Protection fuses.
5.5.2
Flash non-volatile write protection I register (FNVWPIR)
FNVWPIR (0x08 DFB0)
15
14
13
NVR
12
11
Reserved
-
10
9
8
Reset value: FFFFh
7
6
5
4
3
2
1
0
W0P7W0P6W0P5W0P4W0P3W0P2W0P1W0P0
RW
RW
RW
RW
RW
RW
RW
RW
35/176
Internal Flash memory
Table 19.
5.5.3
ST10F272M
Flash non-volatile write protection I register
Bit
Name
Function
7:0
W0P[7:0]
Write Protection Bank 0 / Sectors 7-0 (IFlash)
These bits, if programmed at 0, disable any write access to the sectors of Bank 0
(IFlash)
Flash non-volatile access protection register 0 (FNVAPR0)
FNVAPR0 (0x08 DFB8)
15
14
13
12
NVR
11
10
9
8
Delivery value: ACFFh
7
6
5
4
3
2
Reserved
Bit
0
1
5.5.4
0
DBGP ACCP
-
Table 20.
1
RW
RW
Flash non-volatile access protection register 0
Name
Function
ACCP
Access Protection
This bit, if programmed at 0, disables any access (read/write) to data mapped
inside IFlash Module address space, unless the current instruction is fetched from
IFlash.
DBGP
Debug Protection
This bit, if erased at 1, can be used to by-pass all the protections using the Debug
features through the Test Interface. If programmed at 0, on the contrary, all the
debug features, the Test Interface and all the Flash Test modes are disabled. Even
STMicroelectronics will not be able to access the device to run any eventual failure
analysis.
Flash non-volatile access protection register 1 low (FNVAPR1L)
FNVAPR1L (0x08 DFBC)
15
14
13
12
NVR
11
10
9
8
Delivery value: FFFFh
7
6
5
4
3
2
1
0
PDS15 PDS14 PDS13 PDS12 PDS11 PDS10 PDS9 PDS8 PDS7 PDS6 PDS5 PDS4 PDS3 PDS2 PDS1 PDS0
RW
RW
Table 21.
Bit
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
Flash non-volatile access protection register 1 low
Name
Function
Protections Disable 15-0
If bit PDSx is programmed at 0 and bit PENx is erased at 1, the action of bit ACCP
15:0 PDS[15:0] is disabled. Bit PDS0 can be programmed at 0 only if both bits DBGP and ACCP
have already been programmed at 0. Bit PDSx can be programmed at 0 only if bit
PENx-1 has already been programmed at 0.
36/176
ST10F272M
5.5.5
Internal Flash memory
Flash non-volatile access protection register 1 high (FNVAPR1H)
FNVAPR1H (0x08 DFBE)
15
14
13
12
NVR
11
10
9
Delivery value: FFFFh
8
7
6
5
4
3
2
1
0
PEN15PEN14PEN13PEN12PEN11PEN10 PEN9 PEN8 PEN7 PEN6 PEN5 PEN4 PEN3 PEN2 PEN1 PEN0
RW
RW
Table 22.
Bit
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
Flash non-volatile access protection register 1 high
Name
Function
Protections Enable 15-0
15:0 PEN[15:0] If bit PENx is programmed at 0 and bit PDSx+1 is erased at 1, the action of bit
ACCP is enabled again. Bit PENx can be programmed at 0 only if bit PDSx has
already been programmed at 0.
5.5.6
XBus Flash volatile temporary access unprotection register
(XFVTAUR0)
XFVTAUR0 (0x00 EB50)
15
14
Table 23.
Bit
0
5.5.7
13
12
NVR
11
10
9
8
Reset value: 0000h
7
6
5
4
3
2
1
0
Reserved
TAUB
-
RW
XBus Flash volatile temporary access unprotection register
Name
Function
TAUB
Temporary Access Unprotection bit
If this bit is set to 1, the Access Protection is temporary disabled.
The fact that this bit can be written only while executing from IFlash guarantees that
only a code executed in IFlash can unprotect the IFlash when it is Access
Protected.
Access protection
The IFlash module has one level of access protection (access to data both in Reading and
Writing).
When bit ACCP of FNVAPR0 is programmed at 0 and bit TAUB in XFVTAUR0 is set at 0, the
IFlash module becomes access protected (data in the IFlash module can be read only if the
current execution is from the IFlash module itself).
Trying to read into the access protected Flash from internal RAM or external memories will
output a dummy data (software trap 009Bh).
When the Flash module is protected in access, data access through PEC transfers is also
forbidden. To read/write data through PEC in a protected Bank, first it is necessary to
temporarily unprotect the Flash module.
37/176
Internal Flash memory
ST10F272M
To enable Access Protection, the following sequence of operations is recommended:
●
execution from external memory or internal Rams
●
program TAUB bit at 1 in XFVTAUR0 register
●
program ACCP bit in FNVAPR0 to 0 using Set Protection operation
●
program TAUB bit at 0 in XFVTAUR0 register
●
Access Protection is active when both ACCP bit and TAUB bit are set to 0.
Protection can be permanently disabled by programming bit PDS0 of FNVAPR1H, in order
to analyze rejects. Protection can be permanently enabled again by programming bit PEN0
of FNVAPR1L. The action to disable and enable again Access Protections in a permanent
way can be executed a maximum of 16 times. To execute the above described operations,
the Flash has to be temporarily unprotected (see Section 5.5.9: Temporary unprotection).
Trying to write into the access protected Flash from internal RAM or external memories will
be unsuccessful. Trying to read into the access protected Flash from internal RAM or
external memories will output dummy data (software trap 0x009Bh).
When the Flash module is protected in access, data access through PEC of a peripheral is
also forbidden. To read/write data in PEC mode from/to a protected Bank, it is necessary to
first temporarily unprotect the Flash module.
The following table summarizes all possible Access Protection levels: In particular, it shows
what is possible and not possible to do when fetching from a memory (see fetch location
column) supposing all possible access protections are enabled.
Table 24.
Summary of access protection level
Read IFlash /
Jump to IFlash
Read XRAM or
External Memory /
Jump to XRAM or
External Memory
Read Flash
registers
Write Flash
registers
Fetching from IFlash
Yes / Yes
Yes / Yes
Yes
No
Fetching from IRAM
No / Yes
Yes / Yes
No
No
Fetching from XRAM
No / Yes
Yes / Yes
No
No
Fetching from External
Memory
No / Yes
Yes / Yes
No
No
Fetch location
When the Access Protection is enabled, Flash registers can not be written, so no
program/erase operation can be run on IFlash. To enable the access to registers again, the
Temporary Access Unprotection procedure has to be followed (see Section 5.5.9).
5.5.8
Write protection
The Flash modules have one level of Write Protections: each Sector of each Bank of each
Flash Module can be Software Write Protected by programming at 0 the related bit W0Px in
FNVWPIRL register.
5.5.9
Temporary unprotection
Bits W0Px of FNVWPIRL can be temporarily unprotected by executing the Set Protection
operation and by writing 1 into these bits.
38/176
ST10F272M
Internal Flash memory
To restore the write protection bits it is necessary to reset the microcontroller or to execute a
Set Protection operation and write 0 into the desired bits.
In reality, when a temporary write unprotection operation is executed, the corresponding
volatile register is written to 1, while the non-volatile registers bits previously written to 0 (for
a protection set operation), will continue to maintain the 0. For this reason, the User
software must be in charge to track the current write protection status (for instance using a
specific RAM area), it is not possible to deduce it by reading the non-volatile register content
(a temporary unprotection cannot be detected).
To temporarily unprotect the Flash when the Access Protection is active, it is necessary to
set to ‘1’ the bit TAUB in XFVTAUR0. This bit can be set to ‘1’ only while executing from
Flash: In this way only an instruction executed from Flash can unprotect the Flash itself.
To restore the Access Protection, it is necessary to reset the microcontroller or to write at 0
the bit TAUB in XFVTAUR0.
5.6
Write operation examples
In the following, examples for each kind of Flash write operation are presented.
Note:
The write operation commands must be executed from another memory (internal RAM or
external memory), as in ST10F269 device. In fact, due to IBus characteristics, it is not
possible to perform write operation in Flash while fetching code from Flash.
Moreover, direct addressing is not allowed for write accesses to IFlash control registers.
This means that both address and data for a writing operation must be loaded in one of
ST10 GPR register (R0...R15).
Write operation on IBus registers is 16 bits wide.
Example of indirect addressing mode
MOV
MOV
MOV
RWm, #ADDRESS;
RWn, #DATA;
[RWm], RWn;
/*Load Add in RWm*/
/*Load Data in RWn*/
/*Indirect addressing*/
Word program
Example: 32-bit Word Program of data 0xAAAAAAAA at address 0x025554
FCR0H|=
FARL =
FARH =
FDR0L =
FDR0H =
FCR0H|=
0x2000;
0x5554;
0x0002;
0xAAAA;
0xAAAA;
0x8000;
/*Set WPG in FCR0H*/
/*Load Add in FARL*/
/*Load Add in FARH*/
/*Load Data in FDR0L*/
/*Load Data in FDR0H*/
/*Operation start*/
Double word program
Example: Double Word Program (64-bit) of data 0x55AA55AA at address 0x035558 and
data 0xAA55AA55 at address 0x03555C in IFlash Module.
FCR0H
FARL
FARH
FDR0L
|= 0x1000;
= 0x5558;
= 0x0003;
= 0x55AA;
/*Set DWPG/
/*Load Add in FARL*/
/*Load Add in FARH*/
/*Load Data in FDR0L*/
39/176
Internal Flash memory
FDR0H
FDR1L
FDR1H
FCR0H
ST10F272M
=
=
=
|=
0x55AA;
0xAA55;
0xAA55;
0x8000;
/*Load Data
/*Load Data
/*Load Data
/*Operation
in FDR0H*/
in FDR1L*/
in FDR1H*/
start*/
Double Word Program is always performed on the Double Word aligned on an even Word:
bit ADD2 of FARL is ignored.
Sector erase
Example: Sector Erase of sectors B0F1 and B0F0 of Bank 0 in IFlash Module.
FCR0H
FCR1L
FCR0H
|= 0x0800;
|= 0x0003;
|= 0x8000;
/*Set SER in FCR0H*/
/*Set B0F1, B0F0*/
/*Operation start*/
Suspend and resume
Word Program, Double Word Program, and Sector Erase operations can be suspended in
the following way:
FCR0H
|= 0x4000;
/*Set SUSP in FCR0H*/
Then the operation can be resumed in the following way:
FCR0H
FCR0H
|= 0x0800;
|= 0x8000;
/*Set SER in FCR0H*/
/*Operation resume*/
Before resuming a suspended Erase, FCR1H/FCR1L must be read to check if the Erase is
already completed (FCR1H = FCR1L = 0x0000 if Erase is complete). Original setup of
Select Operation bits in FCR0H/L must be restored before the operation resume, otherwise
the operation is aborted and bit RESER of FER is set.
Set protection
Example 1: Enable Write Protection of sectors B0F3-0 of Bank 0 in IFlash module.
FCR0H
FARL
FARH
FDR0L
FDR0H
FCR0H
|=
=
=
=
=
|=
0x0100;
0xDFB4;
0x0008;
0xFFF0;
0xFFFF;
0x8000;
/*Set SPR in FCR0H*/
/*Load Add of register FNVWPIR in FARL*/
/*Load Add of register FNVWPIR in FARH*/
/*Load Data in FDR0L*/
/*Load Data in FDR0H*/
/*Operation start*/
Example 2: Enable Access and Debug Protection.
FCR0H
FARL
FARH
FDR0L
FCR0H
|=
=
=
=
|=
0x0100;
0xDFB8;
0x0008;
0xFFFC;
0x8000;
/*Set SPR in FCR0H*/
/*Load Add of register FNVAPR0 in FARL*/
/*Load Add of register FNVAPR0 in FARH*/
/*Load Data in FDR0L*/
/*Operation start*/
Example 3: Disable in a permanent way Access and Debug Protection.
XFVTAUR0 = 0x0001;
FCR0H
|= 0x0100;
FARL
= 0xDFBC;
FARH
= 0x0008;
FDR0L
= 0xFFFE;
40/176
/*Set TAUB in XFVTAUR0*/
/*Set SPR in FCR0H*/
/*Load Add of register FNVAPR1L in FARL*/
/*Load Add of register FNVAPR1L in FARH*/
/*Load Data in FDR0L for clearing PDS0*/
ST10F272M
Internal Flash memory
FCR0H
|= 0x8000;
/*Operation start*/
Example 4: Enable again in a permanent way Access and Debug Protection, after having
disabled them.
XFVTAUR0 = 0x0001;
FCR0H
|= 0x0100;
FARL
= 0xDFBC;
FARH
= 0x0008;
FDR0H
= 0xFFFE;
PEN0*/
FCR0H
|= 0x8000;
XFVTAUR0 = 0x0000;
/*Set TAUB in XFVTAUR0*/
/*Set SPR in FCR0H*/
/*Load Add register FNVAPR1H in FARL*/
/*Load Add register FNVAPR1H in FARH*/
/*Load Data in FDR0H for clearing
/*Operation start*/
/*Reset TAUB in XFVTAUR0*/
Disable and re-enable of Access and Debug Protection in a permanent way (as shown by
examples 3 and 4) can be done for a maximum of 16 times.
41/176
Internal Flash memory
5.7
ST10F272M
Write operation summary
In general, each write operation is started through a sequence of three steps:
1.
The first instruction is used to select the desired operation by setting its corresponding
selection bit in the Flash Control Register 0.
2.
The second step is the definition of the Address and Data for programming or the
Sectors or Banks to erase.
3.
The last instruction is used to start the write operation, by setting the start bit WMS in
the FCR0.
Once selected, but not yet started, one operation can be canceled by resetting the operation
selection bit.
Available Flash Module Write Operations are summarized in the following Table 25.
Table 25.
Flash write operations
Operation
Select bit
Address and data
Start bit
WPG
FARL/FARH
FDR0L/FDR0H
WMS
DWPG
FARL/FARH
FDR0L/FDR0H
FDR1L/FDR1H
WMS
Sector Erase
SER
FCR1L/FCR1H
WMS
Set Protection
SPR
FDR0L/FDR0H
WMS
SUSP
None
None
Word Program (32-bit)
Double Word Program (64-bit)
Program/Erase Suspend
Figure 6 shows the complete flow needed for a Write operation.
Figure 6.
Write operation control flow
Start Write Operation
FCR0L.LOCK == 0?
No
Yes
Write Operation finished?
No
(Check related busy bit)
Yes
Check Error Status
42/176
No error:
Error:
Proceed with application
Error handler, ...
Re-start operation
ST10F272M
6
Bootstrap loader
Bootstrap loader
The ST10F272M implements Boot capabilities in order to:
6.1
●
Support bootstrap via UART or bootstrap via CAN for the standard bootstrap
●
Support a Selective Bootstrap Loader, to manage the bootstrap sequence in a different
way
Selection among user-code, standard or selective bootstrap
The boot modes are triggered with a special combination set on Port0L[5...4]. Those
signals, as other configuration signals, are latched on the rising edge of RSTIN pin.
●
Decoding of reset configuration (P0L.5 = 1, P0L.4 = 1) selects the normal mode (also
called User mode) and selects the user Flash to be mapped from address 00’0000h.
●
Decoding of reset configuration (P0L.5 = 1, P0L.4 = 0) selects ST10 standard bootstrap
mode (Test-Flash is active and overlaps user Flash for code fetches from address
00'0000h; user Flash is active and available for read accesses).
●
Decoding of reset configuration (P0L.5 = 0, P0L.4 = 1) activates new verifications to
select which bootstrap software to execute:
–
if the User mode signature in the User Flash is programmed correctly, then a
software reset sequence is selected and the User code is executed;
–
if the User mode signature is not programmed correctly in the user Flash, then the
User key location is read again. Its value determines which communication
channel will be enabled for bootstrapping.
.
Table 26.
6.2
ST10F272M boot mode selection
P0.5
P0.4
ST10 decoding
1
1
User mode: User Flash mapped at 00’0000h
1
0
Standard Bootstrap Loader: User Flash mapped from 00’0000h, code fetches
redirected to Test-Flash at 00’0000h
0
1
Selective Boot mode: User Flash mapped from 00’0000h, code fetches
redirected to Test-Flash at 00’0000h (different sequence execution compared to
Standard Bootstrap Loader)
0
0
Reserved
Standard bootstrap loader
After entering the standard BSL mode and the respective initialization, the ST10F272M
scans the RxD0 line and the CAN1_RxD line to receive either a valid dominant bit from the
CAN interface or a start condition from the UART line.
Start condition on UART RxD: ST10F272M starts standard bootstrap loader. This
bootstrap loader is identical to that of other ST10 devices (example: ST10F269, ST10F168).
Valid dominant bit on CAN1 RxD: ST10F272M start bootstrapping via CAN1.
Caution:
As both UART_RxD and CAN1_RxD lines are polled to detect a start of communication,
ensure a stable level on the unused channel by adding a pull-up resistor.
43/176
Bootstrap loader
6.3
Alternate and selective boot mode (ABM and SBM)
6.3.1
Activation of the ABM and SBM
ST10F272M
Alternate boot is activated with the combination ‘01’ on Port0L[5..4] at the rising edge of
RSTIN.
6.3.2
User mode signature integrity check
The behavior of the Selective Boot mode is based on the computing of a signature between
the content of two memory locations and a comparison with a reference signature. This
requires that users who use Selective Boot have reserved and programmed the Flash
memory locations.
6.3.3
Selective boot mode
When the user signature is not correct, instead of executing the Standard Bootstrap Loader
(triggered by P0L.4 low at reset), additional check is made.
Depending on the value at the User key location, the following behavior occurs:
44/176
●
A jump is performed to the Standard Bootstrap Loader
●
Only UART is enabled for bootstrapping
●
Only CAN1 is enabled for bootstrapping
●
The device enters an infinite loop
ST10F272M
7
Central processing unit (CPU)
Central processing unit (CPU)
The CPU includes a 4-stage instruction pipeline, a 16-bit arithmetic and logic unit (ALU) and
dedicated SFRs. Additional hardware has been added for a separate multiply and divide
unit, a bit-mask generator and a barrel shifter.
Most of the ST10F272M’s instructions can be executed in one instruction cycle which
requires 50ns at 40 MHz CPU clock. For example, shift and rotate instructions are
processed in one instruction cycle independent of the number of bits to be shifted.
Multiple-cycle instructions have been optimized: branches are carried out in 2 cycles,
16 x 16-bit multiplication in 5 cycles and a 32-/16-bit division in 10 cycles.
The jump cache reduces the execution time of repeatedly performed jumps in a loop, from
2 cycles to 1 cycle.
The CPU uses a bank of 16 word registers to run the current context. This bank of General
Purpose Registers (GPR) is physically stored within the on-chip Internal RAM (IRAM) area.
A Context Pointer (CP) register determines the base address of the active register bank to
be accessed by the CPU.
The number of register banks is only restricted by the available Internal RAM space. For
easy parameter passing, a register bank may overlap others.
A system stack of up to 2048 bytes is provided as a storage for temporary data. The system
stack is allocated in the on-chip RAM area, and it is accessed by the CPU via the stack
pointer (SP) register.
Two separate SFRs, STKOV and STKUN, are implicitly compared against the stack pointer
value upon each stack access for the detection of a stack overflow or underflow.
Figure 7.
CPU block diagram (MAC unit not included)
16
CPU
SP
STKOV
STKUN
256 Kbyte
Flash
memory
Exec. Unit
Instr. Ptr
4-Stage
Pipeline
32
PSW
SYSCON
BUSCON 0
BUSCON 1
BUSCON 2
BUSCON 3
BUSCON 4
Data Pg. Ptrs
MDH
MDL
Mul./Div.-HW
Bit-Mask Gen.
ALU
2K Byte
Internal
RAM
R15
Bank
n
General
Purpose
Registers
16-Bit
Barrel-Shift
CP
ADDRSEL 1
ADDRSEL 2
ADDRSEL 3
ADDRSEL 4
Code Seg. Ptr.
R0
Bank
i
16
Bank
0
45/176
Central processing unit (CPU)
7.1
ST10F272M
Multiplier-accumulator unit (MAC)
The MAC co-processor is a specialized co-processor added to the ST10 CPU Core in order
to improve the performances of the ST10 Family in signal processing algorithms.
The standard ST10 CPU has been modified to include new addressing capabilities which
enable the CPU to supply the new co-processor with up to 2 operands per instruction cycle.
This new co-processor (so-called MAC) contains a fast multiply-accumulate unit and a
repeat unit.
The co-processor instructions extend the ST10 CPU instruction set with multiply, multiplyaccumulate, 32-bit signed arithmetic operations.
Figure 8.
MAC unit architecture
Operand 1
16
(1)
GPR Pointers
Operand 2
16
IDX0 Pointer
IDX1 Pointer
QR0 GPR Offset Register
QR1 GPR Offset Register
QX0 IDX Offset Register
QX1 IDX Offset Register
16 x 16
signed/unsigned
Multiplier
Concatenation
32
32
Mux
Sign Extend
MRW
Scaler
0h
40
Repeat Unit
Interrupt
Controller
08000h
0h
40
40
40 40
Mux
Mux
40
MCW
40
A
B
40-bit Signed Arithmetic Unit
ST10 CPU
MSW
Flags MAE
40
MAH
MAL
Control Unit
40
8-bit Left/Right
Shifter
1. Shared with standard ALU
46/176
ST10F272M
7.2
Central processing unit (CPU)
Instruction set summary
Table 27 lists the instructions of the ST10F272M. The detailed description of each
instruction can be found in the ST10 Family Programming Manual.
Table 27.
Standard instruction set summary
Mnemonic
Description
Bytes
ADD(B)
Add word (byte) operands
2/4
ADDC(B)
Add word (byte) operands with Carry
2/4
SUB(B)
Subtract word (byte) operands
2/4
SUBC(B)
Subtract word (byte) operands with Carry
2/4
MUL(U)
(Un)Signed multiply direct GPR by direct GPR (16-/16-bit)
2
DIV(U)
(Un)Signed divide register MDL by direct GPR (16-/16-bit)
2
DIVL(U)
(Un)Signed long divide reg. MD by direct GPR (32-/16-bit)
2
CPL(B)
Complement direct word (byte) GPR
2
NEG(B)
Negate direct word (byte) GPR
2
AND(B)
Bitwise AND, (word/byte operands)
2/4
OR(B)
Bitwise OR, (word/byte operands)
2/4
XOR(B)
Bitwise XOR, (word/byte operands)
2/4
BCLR
Clear direct bit
2
BSET
Set direct bit
2
BMOV(N)
Move (negated) direct bit to direct bit
4
BAND, BOR, BXOR
AND/OR/XOR direct bit with direct bit
4
BCMP
Compare direct bit to direct bit
4
BFLDH/L
Bitwise modify masked high/low byte of bit-addressable direct word
memory with immediate data
4
CMP(B)
Compare word (byte) operands
2/4
CMPD1/2
Compare word data to GPR and decrement GPR by 1/2
2/4
CMPI1/2
Compare word data to GPR and increment GPR by 1/2
2/4
PRIOR
Determine number of shift cycles to normalize direct word GPR and
store result in direct word GPR
2
SHL / SHR
Shift left/right direct word GPR
2
ROL / ROR
Rotate left/right direct word GPR
2
ASHR
Arithmetic (sign bit) shift right direct word GPR
2
MOV(B)
Move word (byte) data
2/4
MOVBS
Move byte operand to word operand with sign extension
2/4
MOVBZ
Move byte operand to word operand with zero extension
2/4
JMPA, JMPI, JMPR
Jump absolute/indirect/relative if condition is met
4
JMPS
Jump absolute to a code segment
4
47/176
Central processing unit (CPU)
Table 27.
ST10F272M
Standard instruction set summary (continued)
Mnemonic
48/176
Description
Bytes
J(N)B
Jump relative if direct bit is (not) set
4
JBC
Jump relative and clear bit if direct bit is set
4
JNBS
Jump relative and set bit if direct bit is not set
4
CALLA, CALLI,
CALLR
Call absolute/indirect/relative subroutine if condition is met
4
CALLS
Call absolute subroutine in any code segment
4
PCALL
Push direct word register onto system stack and call absolute
subroutine
4
TRAP
Call interrupt service routine via immediate trap number
2
PUSH, POP
Push/pop direct word register onto/from system stack
2
SCXT
Push direct word register onto system stack and update register
with word operand
4
RET
Return from intra-segment subroutine
2
RETS
Return from inter-segment subroutine
2
RETP
Return from intra-segment subroutine and pop direct word register
from system stack
2
RETI
Return from interrupt service subroutine
2
SRST
Software Reset
4
IDLE
Enter Idle Mode
4
PWRDN
Enter Power-down Mode (supposes NMI-pin being low)
4
SRVWDT
Service Watchdog Timer
4
DISWDT
Disable Watchdog Timer
4
EINIT
Signify End-of-Initialization on RSTOUT-pin
4
ATOMIC
Begin ATOMIC sequence
2
EXTR
Begin EXTended Register sequence
2
EXTP(R)
Begin EXTended Page (and Register) sequence
2/4
EXTS(R)
Begin EXTended Segment (and Register) sequence
2/4
NOP
Null operation
2
ST10F272M
7.3
Central processing unit (CPU)
MAC co-processor specific instructions
Table 28 lists the MAC instructions of the ST10F272M. The detailed description of each
instruction can be found in the ST10 Family Programming Manual. Note that all MAC
instructions are encoded on 4 bytes.
Table 28.
MAC instruction set summary
Mnemonic
Description
CoABS
Absolute Value of the Accumulator
CoADD(2)
Addition
CoASHR(rnd)
Accumulator Arithmetic Shift Right & Optional Round
CoCMP
Compare Accumulator with Operands
CoLOAD(-,2)
Load Accumulator with Operands
CoMAC(R,u,s,-,rnd)
(Un)Signed/(Un)Signed Multiply-Accumulate & Optional Round
CoMACM(R)(u,s,-,rnd)
(Un)Signed/(Un)Signed Multiply-Accumulate with Parallel Data
Move & Optional Round
CoMAX / CoMIN
Maximum / Minimum of Operands and Accumulator
CoMOV
Memory to Memory Move
CoMUL(u,s,-,rnd)
(Un)Signed/(Un)Signed multiply & Optional Round
CoNEG(rnd)
Negate Accumulator & Optional Round
CoNOP
No-Operation
CoRND
Round Accumulator
CoSHL / CoSHR
Accumulator Logical Shift Left / Right
CoSTORE
Store a MAC Unit Register
CoSUB(2,R)
Subtraction
49/176
External bus controller
8
ST10F272M
External bus controller
All of the external memory accesses are performed by the on-chip external bus controller.
The EBC can be programmed to single chip mode when no external memory is required, or
to one of four different external memory access modes:
●
16- / 18- / 20- / 24-bit addresses and 16-bit data, demultiplexed
●
16- / 18- / 20- / 24-bit addresses and 16-bit data, multiplexed
●
16- / 18- / 20- / 24-bit addresses and 8-bit data, multiplexed
●
16- / 18- / 20- / 24-bit addresses and 8-bit data, demultiplexed
In demultiplexed bus modes addresses are output on PORT1 and data is input / output on
PORT0 or P0L, respectively. In the multiplexed bus modes both addresses and data use
PORT0 for input / output.
Timing characteristics of the external bus interface (memory cycle time, memory tri-state
time, length of ALE and read / write delay) are programmable giving the choice of a wide
range of memories and external peripherals.
Up to four independent address windows may be defined (using register pairs ADDRSELx /
BUSCONx) to access different resources and bus characteristics.
These address windows are arranged hierarchically where BUSCON4 overrides BUSCON3
and BUSCON2 overrides BUSCON1.
All accesses to locations not covered by these four address windows are controlled by
BUSCON0. Up to five external CS signals (four windows plus default) can be generated in
order to save external glue logic. Access to very slow memories is supported by a ‘Ready’
function.
A HOLD / HLDA protocol is available for bus arbitration which shares external resources
with other bus masters.
The bus arbitration is enabled by setting bit HLDEN in register PSW. After setting HLDEN
once, pins P6.7...P6.5 (BREQ, HLDA, HOLD) are automatically controlled by the EBC. In
master mode (default after reset) the HLDA pin is an output. By setting bit DP6.7 to’1’ the
slave mode is selected where pin HLDA is switched to input. This directly connects the slave
controller to another master controller without glue logic.
For applications which require less external memory space, the address space can be
restricted to 1 Mbyte, 256 Kbytes or to 64 Kbytes. Port 4 outputs all eight address lines if an
address space of 16 Mbytes is used, otherwise four, two or no address lines.
Chip select timing can be made programmable. By default (after reset), the CSx lines
change half a CPU clock cycle after the rising edge of ALE. With the CSCFG bit set in the
SYSCON register the CSx lines change with the rising edge of ALE.
The active level of the READY pin can be set by bit RDYPOL in the BUSCONx registers.
When the READY function is enabled for a specific address window, each bus cycle within
the window must be terminated with the active level defined by bit RDYPOL in the
associated BUSCON register.
50/176
ST10F272M
9
Interrupt system
Interrupt system
The interrupt response time for internal program execution is from 125ns to 300ns at
40 MHz CPU clock.
The ST10F272M architecture supports several mechanisms for fast and flexible response to
service requests that can be generated from various sources (internal or external) to the
microcontroller. Any of these interrupt requests can be serviced by the Interrupt Controller or
by the Peripheral Event Controller (PEC).
In contrast to a standard interrupt service where the current program execution is
suspended and a branch to the interrupt vector table is performed, just one cycle is ‘stolen’
from the current CPU activity to perform a PEC service. A PEC service implies a single Byte
or Word data transfer between any two memory locations with an additional increment of
either the PEC source or destination pointer. An individual PEC transfer counter is implicitly
decremented for each PEC service except when performing in the continuous transfer
mode. When this counter reaches zero, a standard interrupt is performed to the
corresponding source related vector location. PEC services are very well suited to perform
the transmission or the reception of blocks of data. The ST10F272M has eight PEC
channels, each of them offers such fast interrupt-driven data transfer capabilities.
An interrupt control register which contains an interrupt request flag, an interrupt enable flag
and an interrupt priority bit-field is dedicated to each existing interrupt source. Thanks to its
related register, each source can be programmed to one of sixteen interrupt priority levels.
Once starting to be processed by the CPU, an interrupt service can only be interrupted by a
higher prioritized service request. For the standard interrupt processing, each of the
possible interrupt sources has a dedicated vector location.
Software interrupts are supported by means of the ‘TRAP’ instruction in combination with an
individual trap (interrupt) number.
Fast external interrupt inputs are provided to service external interrupts with high precision
requirements. These fast interrupt inputs feature programmable edge detection (rising edge,
falling edge or both edges).
Fast external interrupts may also have interrupt sources selected from other peripherals; for
example, the CANx controller receives signals (CANx_RxD) and I2C serial clock signal can
be used to interrupt the system.
Table 29 shows all the available ST10F272M interrupt sources and the corresponding
hardware-related interrupt flags, vectors, vector locations and trap (interrupt) numbers.
Table 29.
Interrupt sources
Source of interrupt or
PEC service request
Request
flag
Enable
flag
Interrupt
vector
Vector
location
Trap
number
CAPCOM Register 0
CC0IR
CC0IE
CC0INT
00’0040h
10h
CAPCOM Register 1
CC1IR
CC1IE
CC1INT
00’0044h
11h
CAPCOM Register 2
CC2IR
CC2IE
CC2INT
00’0048h
12h
CAPCOM Register 3
CC3IR
CC3IE
CC3INT
00’004Ch
13h
CAPCOM Register 4
CC4IR
CC4IE
CC4INT
00’0050h
14h
CAPCOM Register 5
CC5IR
CC5IE
CC5INT
00’0054h
15h
51/176
Interrupt system
Table 29.
ST10F272M
Interrupt sources (continued)
Source of interrupt or
PEC service request
52/176
Request
flag
Enable
flag
Interrupt
vector
Vector
location
Trap
number
CAPCOM Register 6
CC6IR
CC6IE
CC6INT
00’0058h
16h
CAPCOM Register 7
CC7IR
CC7IE
CC7INT
00’005Ch
17h
CAPCOM Register 8
CC8IR
CC8IE
CC8INT
00’0060h
18h
CAPCOM Register 9
CC9IR
CC9IE
CC9INT
00’0064h
19h
CAPCOM Register 10
CC10IR
CC10IE
CC10INT
00’0068h
1Ah
CAPCOM Register 11
CC11IR
CC11IE
CC11INT
00’006Ch
1Bh
CAPCOM Register 12
CC12IR
CC12IE
CC12INT
00’0070h
1Ch
CAPCOM Register 13
CC13IR
CC13IE
CC13INT
00’0074h
1Dh
CAPCOM Register 14
CC14IR
CC14IE
CC14INT
00’0078h
1Eh
CAPCOM Register 15
CC15IR
CC15IE
CC15INT
00’007Ch
1Fh
CAPCOM Register 16
CC16IR
CC16IE
CC16INT
00’00C0h
30h
CAPCOM Register 17
CC17IR
CC17IE
CC17INT
00’00C4h
31h
CAPCOM Register 18
CC18IR
CC18IE
CC18INT
00’00C8h
32h
CAPCOM Register 19
CC19IR
CC19IE
CC19INT
00’00CCh
33h
CAPCOM Register 20
CC20IR
CC20IE
CC20INT
00’00D0h
34h
CAPCOM Register 21
CC21IR
CC21IE
CC21INT
00’00D4h
35h
CAPCOM Register 22
CC22IR
CC22IE
CC22INT
00’00D8h
36h
CAPCOM Register 23
CC23IR
CC23IE
CC23INT
00’00DCh
37h
CAPCOM Register 24
CC24IR
CC24IE
CC24INT
00’00E0h
38h
CAPCOM Register 25
CC25IR
CC25IE
CC25INT
00’00E4h
39h
CAPCOM Register 26
CC26IR
CC26IE
CC26INT
00’00E8h
3Ah
CAPCOM Register 27
CC27IR
CC27IE
CC27INT
00’00ECh
3Bh
CAPCOM Register 28
CC28IR
CC28IE
CC28INT
00’00F0h
3Ch
CAPCOM Register 29
CC29IR
CC29IE
CC29INT
00’0110h
44h
CAPCOM Register 30
CC30IR
CC30IE
CC30INT
00’0114h
45h
CAPCOM Register 31
CC31IR
CC31IE
CC31INT
00’0118h
46h
CAPCOM Timer 0
T0IR
T0IE
T0INT
00’0080h
20h
CAPCOM Timer 1
T1IR
T1IE
T1INT
00’0084h
21h
CAPCOM Timer 7
T7IR
T7IE
T7INT
00’00F4h
3Dh
CAPCOM Timer 8
T8IR
T8IE
T8INT
00’00F8h
3Eh
GPT1 Timer 2
T2IR
T2IE
T2INT
00’0088h
22h
GPT1 Timer 3
T3IR
T3IE
T3INT
00’008Ch
23h
GPT1 Timer 4
T4IR
T4IE
T4INT
00’0090h
24h
GPT2 Timer 5
T5IR
T5IE
T5INT
00’0094h
25h
ST10F272M
Interrupt system
Table 29.
Interrupt sources (continued)
Source of interrupt or
PEC service request
Request
flag
Enable
flag
Interrupt
vector
Vector
location
Trap
number
GPT2 Timer 6
T6IR
T6IE
T6INT
00’0098h
26h
GPT2 CAPREL Register
CRIR
CRIE
CRINT
00’009Ch
27h
A/D Conversion Complete
ADCIR
ADCIE
ADCINT
00’00A0h
28h
A/D Overrun Error
ADEIR
ADEIE
ADEINT
00’00A4h
29h
ASC0 Transmit
S0TIR
S0TIE
S0TINT
00’00A8h
2Ah
ASC0 Transmit Buffer
S0TBIR
S0TBIE
S0TBINT
00’011Ch
47h
ASC0 Receive
S0RIR
S0RIE
S0RINT
00’00ACh
2Bh
ASC0 Error
S0EIR
S0EIE
S0EINT
00’00B0h
2Ch
SSC Transmit
SCTIR
SCTIE
SCTINT
00’00B4h
2Dh
SSC Receive
SCRIR
SCRIE
SCRINT
00’00B8h
2Eh
SSC Error
SCEIR
SCEIE
SCEINT
00’00BCh
2Fh
PWM Channel 0...3
PWMIR
PWMIE
PWMINT
00’00FCh
3Fh
See Paragraph 9.1
XP0IR
XP0IE
XP0INT
00’0100h
40h
See Paragraph 9.1
XP1IR
XP1IE
XP1INT
00’0104h
41h
See Paragraph 9.1
XP2IR
XP2IE
XP2INT
00’0108h
42h
See Paragraph 9.1
XP3IR
XP3IE
XP3INT
00’010Ch
43h
Hardware traps are exceptions or error conditions that arise during run-time. They cause
immediate non-maskable system reaction similar to a standard interrupt service (branching
to a dedicated vector table location).
The occurrence of a hardware trap is additionally signified by an individual bit in the trap flag
register (TFR). A hardware trap will interrupt any other program execution except when
another higher prioritized trap service is in progress. Hardware trap services cannot not be
interrupted by a standard interrupt or by PEC interrupts.
9.1
X-Peripheral interrupt
The limited number of X-Bus interrupt lines of the present ST10 architecture, imposes some
constraints on the implementation of the new functionality. In particular, the additional XPeripherals SSC1, ASC1, I2C, PWM1 and RTC need some resources to implement interrupt
and PEC transfer capabilities. For this reason, a multiplexed structure for the interrupt
management is proposed. In the next Figure 9, the principle is explained through a simple
diagram, which shows the basic structure replicated for each of the four X-interrupt available
vectors (XP0INT, XP1INT, XP2INT and XP3INT).
It is based on a set of 16-bit registers XIRxSEL (x = 0,1,2,3), divided in two portions each:
●
Byte High
XIRxSEL[15:8]
Interrupt Enable bits
●
Byte Low
XIRxSEL[7:0]
Interrupt Flag bits
When different sources submit an interrupt request, the enable bits (Byte High of XIRxSEL
register) define a mask which controls which sources will be associated with the unique
53/176
Interrupt system
ST10F272M
available vector. If more than one source is enabled to issue the request, the service routine
will have to take care to identify the real event to be serviced. This can easily be done by
checking the flag bits (Byte Low of XIRxSEL register). Note that the flag bits can also
provide information about events which are not currently serviced by the interrupt controller
(since they are masked through the enable bits), allowing an effective software management
even if the related interrupt request cannot be served: A periodic polling of the flag bits may
be implemented inside the user application.
Figure 9.
X-Interrupt basic structure
7
0
XIRxSEL[7:0] (x = 0, 1, 2, 3)
Flag[7:0]
IT Source 7
IT Source 6
IT Source 5
IT Source 4
XPxIC.XPxIR (x = 0, 1, 2, 3)
IT Source 3
IT Source 2
IT Source 1
IT Source 0
XIRxSEL[15:8] (x = 0, 1, 2, 3)
Enable[7:0]
15
8
Table 30 summarizes the mapping of the different interrupt sources which shares the four Xinterrupt vectors.
Table 30.
X-Interrupt detailed mapping
Interrupt source
CAN1 Interrupt
XP0INT
XP1INT
XP2INT
x
CAN2 Interrupt
x
x
x
I2C Receive
x
x
x
I2C Transmit
x
x
x
I2C Error
x
SSC1 Receive
x
x
x
SSC1 Transmit
x
x
x
SSC1 Error
54/176
XP3INT
x
ASC1 Receive
x
x
x
ASC1 Transmit
x
x
x
ASC1 Transmit Buffer
x
x
x
ST10F272M
Interrupt system
Table 30.
X-Interrupt detailed mapping (continued)
Interrupt source
XP0INT
XP1INT
XP3INT
ASC1 Error
x
PLL Unlock / OWD
x
PWM1 Channel 3...0
9.2
XP2INT
x
x
Exception and error traps list
Table 31 shows all of the possible exceptions or error conditions that can arise during runtime.
Table 31.
Trap priorities
Trap
vector
Vector
location
Trap
number
Trap
priority(1)
RESET
RESET
RESET
00’0000h
00’0000h
00’0000h
00h
00h
00h
III
III
III
NMI
STKOF
STKUF
NMITRAP
STOTRAP
STUTRAP
00’0008h
00’0010h
00’0018h
02h
04h
06h
II
II
II
UNDOPC
MACTRP
PRTFLT
ILLOPA
ILLINA
ILLBUS
BTRAP
BTRAP
BTRAP
BTRAP
BTRAP
BTRAP
00’0028h
00’0028h
00’0028h
00’0028h
00’0028h
00’0028h
0Ah
0Ah
0Ah
0Ah
0Ah
0Ah
I
I
I
I
I
I
Reserved
[002Ch - 003Ch]
[0Bh - 0Fh]
Software Traps
TRAP Instruction
Any
0000h – 01FCh
in steps of 4h
Any
[00h - 7Fh]
Exception condition
Trap
flag
Reset Functions:
Hardware Reset
Software Reset
Watchdog Timer Overflow
Class A Hardware Traps:
Non-Maskable Interrupt
Stack Overflow
Stack Underflow
Class B Hardware Traps:
Undefined Opcode
MAC Interruption
Protected Instruction Fault
Illegal word Operand Access
Illegal Instruction Access
Illegal External Bus Access
Current
CPU
Priority
1. - All the class B traps have the same trap number (and vector) and the same lower priority compared to the
class A traps and to the resets.
- Each class A trap has a dedicated trap number (and vector). They are prioritized in the second priority
level.
- The resets have the highest priority level and the same trap number.
- The PSW.ILVL CPU priority is forced to the highest level (15) when these exceptions are serviced.
55/176
Capture / compare (CAPCOM) units
10
ST10F272M
Capture / compare (CAPCOM) units
The ST10F272M has two 16-channel CAPCOM units which support generation and control
of timing sequences on up to 32 channels with a maximum resolution of 125ns at 40 MHz
CPU clock.
The CAPCOM units are typically used to handle high speed I/O tasks such as pulse and
waveform generation, pulse width modulation (PMW), Digital to Analog (D/A) conversion,
software timing, or time recording relative to external events.
Four 16-bit timers (T0/T1, T7/T8) with reload registers provide two independent time bases
for the capture/compare register array.
The input clock for the timers is programmable to several prescaled values of the internal
system clock, or may be derived from an overflow/underflow of timer T6 in module GPT2.
This provides a wide range of variation for the timer period and resolution, and allows
precise adjustments to application specific requirements. In addition, external count inputs
for CAPCOM timers T0 and T7 allow event scheduling for the capture/compare registers
relative to external events.
Each of the two capture/compare register arrays contain 16 dual purpose capture/compare
registers, each of which may be individually allocated to either CAPCOM timer T0 or T1 (T7
or T8, respectively), and programmed for capture or compare functions. Each of the 32
registers has one associated port pin which serves as an input pin for triggering the capture
function, or as an output pin to indicate the occurrence of a compare event.
When a capture/compare register has been selected for capture mode, the current contents
of the allocated timer will be latched (captured) into the capture/compare register in
response to an external event at the port pin which is associated with this register. In
addition, a specific interrupt request for this capture/compare register is generated.
Either a positive, a negative, or both a positive and a negative external signal transition at
the pin can be selected as the triggering event. The contents of all registers which have
been selected for one of the five compare modes are continuously compared with the
contents of the allocated timers.
When a match occurs between the timer value and the value in a capture / compare
register, specific actions will be taken based on the selected compare mode.
The input frequencies fTx, for the timer input selector Tx, are determined as a function of the
CPU clocks. The timer input frequencies, resolution and periods which result from the
selected prescaler option in TxI when using a 40 MHz CPU clock are listed in Table 33.
The numbers for the timer periods are based on a reload value of 0000h. Note that some
numbers may be rounded off to three significant figures.
Table 32.
Compare modes
Compare modes
Function
Mode 0
Interrupt-only compare mode; several compare interrupts per timer period are possible
Mode 1
Pin toggles on each compare match; several compare events per timer period are possible
Mode 2
Interrupt-only compare mode; only one compare interrupt per timer period is generated
56/176
ST10F272M
Table 32.
Capture / compare (CAPCOM) units
Compare modes (continued)
Compare modes
Function
Mode 3
Pin set ‘1’ on match; pin reset ‘0’ on compare time overflow; only one compare event per
timer period is generated
Double Register Mode
Two registers operate on one pin; pin toggles on each compare match; several compare
events per timer period are possible.
Table 33.
CAPCOM timer input frequencies, resolutions and periods at 40 MHz
Timer input selection TxI
fCPU = 40 MHz
000b
001b
010b
011b
100b
101b
110b
111b
8
16
32
64
128
256
512
1024
Input frequency
5 MHz
2.5 MHz
1.25 MHz
625 kHz
312.5 kHz
156.25
kHz
78.125
kHz
39.1 kHz
Resolution
200ns
400ns
0.8µs
1.6µs
3.2µs
6.4µs
12.8µs
25.6µs
Period
13.1ms
26.2ms
52.4ms
104.8 ms
209.7ms
419.4ms
838.9ms
1.678s
Prescaler for
fCPU
57/176
General purpose timer unit
11
ST10F272M
General purpose timer unit
The GPT unit is a flexible multifunctional timer/counter structure which is used for time
related tasks such as event timing and counting, pulse width and duty cycle measurements,
pulse generation, or pulse multiplication. The GPT unit contains five 16-bit timers organized
into two separate modules GPT1 and GPT2. Each timer in each module may operate
independently in several different modes, or may be concatenated with another timer of the
same module.
11.1
GPT1
Each of the three timers T2, T3, T4 of the GPT1 module can be configured individually for
one of four basic modes of operation: timer, gated timer, counter mode and incremental
interface mode.
In timer mode, the input clock for a timer is derived from the CPU clock, divided by a
programmable prescaler.
In counter mode, the timer is clocked in reference to external events.
Pulse width or duty cycle measurement is supported in gated timer mode where the
operation of a timer is controlled by the ‘gate’ level on an external input pin. For these
purposes, each timer has one associated port pin (TxIN) which serves as gate or clock
input.
Table 34 lists the timer input frequencies, resolution and periods for each prescaler option at
40 MHz CPU clock.
In Incremental Interface mode, the GPT1 timers (T2, T3, T4) can be directly connected to
the incremental position sensor signals A and B by their respective inputs TxIN and TxEUD.
Direction and count signals are internally derived from these two input signals so that the
contents of the respective timer Tx corresponds to the sensor position. The third position
sensor signal TOP0 can be connected to an interrupt input.
Timer T3 has output toggle latches (TxOTL) which changes state on each timer over flow /
underflow. The state of this latch may be output on port pins (TxOUT) for time out monitoring
of external hardware components, or may be used internally to clock timers T2 and T4 for
high resolution of long duration measurements.
In addition to their basic operating modes, timers T2 and T4 may be configured as reload or
capture registers for timer T3.
Table 34.
GPT1 timer input frequencies, resolutions and periods at 40 MHz
Timer input selection T2I / T3I / T4I
fCPU = 40 MHz
000b
001b
010b
011b
100b
101b
110b
111b
Prescaler factor
8
16
32
64
128
256
512
1024
Input frequency
5 MHz
2.5 MHz
1.25 MHz
625 kHz
Resolution
200ns
400ns
0.8µs
1.6µs
3.2µs
6.4µs
12.8µs
25.6µs
Period maximum
13.1ms
26.2ms
52.4ms
104.8 ms
209.7ms
419.4ms
838.9ms
1.678s
58/176
312.5 kHz 156.25 kHz 78.125 kHz
39.1 kHz
ST10F272M
General purpose timer unit
Figure 10. Block diagram of GPT1
T2EUD
CPU Clock
U/D
T2IN
CPU Clock
Interrupt
Request
GPT1 Timer T2
2n n=3...10
2n n=3...10
T3IN
T2
Mode
Control
Reload
Capture
T3OUT
T3
Mode
Control
GPT1 Timer T3
T3OTL
U/D
T3EUD
Capture
T4IN
CPU Clock
2n n=3...10
T4EUD
T4
Mode
Control
Interrupt
Request
Reload
GPT1 Timer T4
Interrupt
Request
U/D
59/176
General purpose timer unit
11.2
ST10F272M
GPT2
The GPT2 module provides precise event control and time measurement. It includes two
timers (T5, T6) and a capture/reload register (CAPREL). Both timers can be clocked with an
input clock which is derived from the CPU clock via a programmable prescaler or with
external signals. The count direction (up/down) for each timer is programmable by software
or may additionally be altered dynamically by an external signal on a port pin (TxEUD).
Concatenation of the timers is supported via the output toggle latch (T6OTL) of timer T6
which changes its state on each timer overflow/underflow.
The state of this latch may be used to clock timer T5, or it may be output on a port pin
(T6OUT). The overflow / underflow of timer T6 can additionally be used to clock the
CAPCOM timers T0 or T1, and to cause a reload from the CAPREL register. The CAPREL
register may capture the contents of timer T5 based on an external signal transition on the
corresponding port pin (CAPIN), and timer T5 may optionally be cleared after the capture
procedure. This allows absolute time differences to be measured or pulse multiplication to
be performed without software overhead.
The capture trigger (timer T5 to CAPREL) may also be generated upon transitions of GPT1
timer T3 inputs T3IN and/or T3EUD. This is advantageous when T3 operates in Incremental
Interface mode.
Table 35 lists the timer input frequencies, resolution and periods for each prescaler option at
40 MHz CPU clock.
Table 35.
GPT2 timer input frequencies, resolutions and periods at 40 MHz
Timer Input Selection T5I / T6I
fCPU = 40 MHz
000b
001b
010b
011b
100b
101b
110b
111b
Prescaler factor
4
8
16
32
64
128
256
512
Input frequency
10 MHz
5 MHz
2.5 MHz
1.25 MHz
625 kHz
312.5 kHz
156.25
kHz
78.125
kHz
Resolution
100ns
200ns
400ns
0.8µs
1.6µs
3.2µs
6.4µs
12.8µs
Period maximum
6.55ms
13.1ms
26.2ms
52.4ms
104.8ms
209.7ms
419.4ms
838.9ms
60/176
ST10F272M
General purpose timer unit
Figure 11. Block diagram of GPT2
T5EUD
CPU Clock
U/D
2n n=2...9
T5IN
T5
Mode
Control
Interrupt
Request
GPT2 Timer T5
Clear
Capture
Interrupt
Request
CAPIN
GPT2 CAPREL
Reload
T6IN
CPU Clock
T6EUD
2n n=2...9
T6
Mode
Control
Interrupt
Request
Toggle FF
GPT2 Timer T6
U/D
T60TL
T6OUT
to CAPCOM
Timers
61/176
PWM modules
12
ST10F272M
PWM modules
Two pulse width modulation modules are available on ST10F272M: standard PWM0 and
XBUS PWM1. They can generate up to four PWM output signals each, using edge-aligned
or center-aligned PWM. In addition, the PWM modules can generate PWM burst signals and
single shot outputs. Table 36 shows the PWM frequencies for different resolutions. The level
of the output signals is selectable and the PWM modules can generate interrupt requests.
Figure 12. Block diagram of PWM module
PPx Period Register *
Match
Comparator
Clock 1
Clock 2
Input
Control
*
PTx
16-bit Up/Down Counter
Run
Comparator
Up/Down/
Clear Control
Match
Output Control
POUTx
Enable
Shadow Register
* User readable / writeable register
Table 36.
62/176
Write Control
PWx Pulse Width Register *
PWM unit frequencies and resolutions at 40 MHz CPU clock
Mode 0
Resolution
8-bit
10-bit
12-bit
14-bit
16-bit
CPU Clock/1
25ns
156.25 kHz
39.1 kHz
9.77 kHz
2.44Hz
610Hz
CPU
Clock/64
1.6µs
2.44 kHz
610Hz
152.6Hz
38.15Hz
9.54Hz
Mode 1
Resolution
8-bit
10-bit
12-bit
14-bit
16-bit
CPU Clock/1
25ns
78.12 kHz
19.53 kHz
4.88 kHz
1.22 kHz
305.2Hz
CPU
Clock/64
1.6µs
1.22 kHz
305.17Hz
76.29Hz
19.07Hz
4.77Hz
ST10F272M
Parallel ports
13
Parallel ports
13.1
Introduction
The ST10F272M MCU provides up to 111 I/O lines with programmable features. These
capabilities permit this MCU to be adapted to a wide range of applications.
ST10F272M has nine groups of I/O lines gathered as follows:
●
Port 0 is a two time 8-bit port named P0L (low as less significant byte) and P0H (high
as most significant byte)
●
Port 1 is a two time 8-bit port named P1L and P1H
●
Port 2 is a 16-bit port
●
Port 3 is a 15-bit port (P3.14 line is not implemented)
●
Port 4 is an 8-bit port
●
Port 5 is a 16-bit port input only
●
Port 6, Port 7 and Port 8 are 8-bit ports
These ports may be used as general purpose bidirectional input or output, software
controlled with dedicated registers.
For example, the output drivers of six of the ports (2, 3, 4, 6, 7, 8) can be configured
(bitwise) for push-pull or open drain operation using ODPx registers.
The input threshold levels are programmable (TTL/CMOS) for all the ports. The logic level of
a pin is clocked into the input latch once per state time, regardless whether the port is
configured for input or output. The threshold is selected with PICON and XPICON registers
control bits.
A write operation to a port pin configured as an input causes the value to be written into the
port output latch, while a read operation returns the latched state of the pin itself. A readmodify-write operation reads the value of the pin, modifies it, and writes it back to the output
latch.
Writing to a pin configured as an output (DPx.y = ‘1’) causes the output latch and the pin to
have the written value, since the output buffer is enabled. Reading this pin returns the value
of the output latch. A read-modify-write operation reads the value of the output latch,
modifies it, and writes it back to the output latch, thus also modifying the level at the pin.
I/O lines support an alternate function which is detailed in the following description of each
port.
13.2
I/O’s special features
13.2.1
Open drain mode
Some of the I/O ports of ST10F272M support the open drain capability. This programmable
feature may be used with an external pull-up resistor, in order to provide an AND wired
logical function.
This feature is implemented for ports P2, P3, P4, P6, P7 and P8 (see respective sections),
and is controlled through the respective Open Drain Control Registers ODPx.
63/176
Parallel ports
13.2.2
ST10F272M
Input threshold control
The standard inputs of the ST10F272M determine the status of input signals according to
TTL levels. In order to accept and recognize noisy signals, CMOS input thresholds can be
selected instead of the standard TTL thresholds for all the pins. These CMOS thresholds
are defined above the TTL thresholds and feature a higher hysteresis to prevent the inputs
from toggling while the respective input signal level is near the thresholds.
The Port Input Control registers PICON and XPICON are used to select these thresholds for
each byte of the indicated ports, this means the 8-bit ports P0L, P0H, P1L, P1H, P4, P7 and
P8 are controlled by one bit each while ports P2, P3 and P5 are controlled by two bits each.
All options for individual direction and output mode control are available for each pin,
independent of the selected input threshold.
13.3
Alternate port functions
Each port line has one associated programmable alternate input or output function.
●
PORT0 and PORT1 may be used as address and data lines when accessing external
memory. Additionally, PORT1 provides:
–
Input capture lines
–
8 additional analog input channels to the A/D converter
●
Port 2, Port 7 and Port 8 are associated with the capture inputs or compare outputs of
the CAPCOM units and/or with the outputs of the PWM0 module, of the PWM1 module
and of the ASC1.
Port 2 is also used for fast external interrupt inputs and for timer 7 input.
●
Port 3 includes the alternate functions of timers, serial interfaces, the optional bus
control signal BHE and the system clock output (CLKOUT).
●
Port 4 outputs the additional segment address bit A23...A16 in systems where more
than 64 Kbytes of memory are to be access directly. In addition, CAN1, CAN2 and I2C
lines are provided.
●
Port 5 is used as analog input channels of the A/D converter or as timer control signals.
●
Port 6 provides optional bus arbitration signals (BREQ, HLDA, HOLD) and chip select
signals and the SSC1 lines.
If the alternate output function of a pin is to be used, the direction of this pin must be
programmed for output (DPx.y = ‘1’), except for some signals that are used directly after
reset and are configured automatically. Otherwise the pin remains in the high-impedance
state and is not effected by the alternate output function. The respective port latch should
hold a ‘1’, because its output is ANDed with the alternate output data (except for PWM
output signals).
If the alternate input function of a pin is used, the direction of the pin must be programmed
for input (DPx.y = ‘0’) if an external device is driving the pin. The input direction is the default
after reset. If no external device is connected to the pin, however, the direction for this pin
can also be set to output. In this case, the pin reflects the state of the port output latch.
Thus, the alternate input function reads the value stored in the port output latch. This can be
used for testing purposes to allow a software trigger of an alternate input function by writing
to the port output latch.
On most of the port lines, the user software is responsible for setting the proper direction
when using an alternate input or output function of a pin.
64/176
ST10F272M
Parallel ports
This is done by setting or clearing the direction control bit DPx.y of the pin before enabling
the alternate function.
There are port lines, however, where the direction of the port line is switched automatically.
For instance, in the multiplexed external bus modes of PORT0, the direction must be
switched several times for an instruction fetch in order to output the addresses and to input
the data.
Obviously, this cannot be done through instructions. In these cases, the direction of the port
line is switched automatically by hardware if the alternate function of such a pin is enabled.
To determine the appropriate level of the port output latches, check how the alternate data
output is combined with the respective port latch output.
There is one basic structure for all port lines with only an alternate input function. Port lines
with only an alternate output function, however, have different structures due to the way the
direction of the pin is switched and depending on whether the pin is accessible by the user
software or not in the alternate function mode.
All port lines that are not used for these alternate functions may be used as general purpose
I/O lines.
65/176
A/D converter
14
ST10F272M
A/D converter
A 10-bit A/D converter with 16+8 multiplexed input channels and a sample and hold circuit is
integrated on-chip. An automatic self-calibration adjusts the A/D converter module to
process parameter variations at each reset event. The sample time (for loading the
capacitors) and the conversion time is programmable and can be adjusted to the external
circuitry.
The ST10F272M has 16+8 multiplexed input channels on Port 5 and Port 1. The selection
between Port 5 and Port 1 is made via a bit in an XBus register. Refer to the User Manual for
a detailed description.
A different accuracy is guaranteed (Total Unadjusted Error) on Port 5 and Port 1 analog
channels (with higher restrictions when overload conditions occur); in particular, Port 5
channels are more accurate than the Port 1 channels. Refer to Section 24: Electrical
characteristics for details.
The A/D converter input bandwidth is limited by the achievable accuracy: supposing a
maximum error of 0.5LSB (2mV) impacting the global TUE (TUE also depends on other
causes), in worst case of temperature and process, the maximum frequency for a sine wave
analog signal is approximately 7.5 kHz. Of course, to reduce the effect of the input signal
variation on the accuracy down to 0.05LSB, the maximum input frequency of the sine wave
must be reduced to 800 Hz.
If static signal is applied during sampling phase, series resistance must not be greater than
20kΩ (this taking into account eventual input leakage). It is suggested to not connect any
capacitance on analog input pins, in order to reduce the effect of charge partitioning (and
consequent voltage drop error) between the external and the internal capacitance: in case
an RC filter is necessary the external capacitance must be greater than 10nF to minimize
the accuracy impact.
Overrun error detection / protection is controlled by the ADDAT register. Either an interrupt
request is generated when the result of a previous conversion has not been read from the
result register at the time the next conversion is complete, or the next conversion is
suspended until the previous result has been read. For applications which require less than
16+8 analog input channels, the remaining channel inputs can be used as digital input port
pins.
The A/D converter of the ST10F272M supports different conversion modes:
66/176
●
Single channel single conversion: The analog level of the selected channel is
sampled once and converted. The result of the conversion is stored in the ADDAT
register.
●
Single channel continuous conversion: The analog level of the selected channel is
repeatedly sampled and converted. The result of the conversion is stored in the ADDAT
register.
●
Auto scan single conversion: The analog level of the selected channels are sampled
once and converted. After each conversion the result is stored in the ADDAT register.
The data can be transferred to the RAM by interrupt software management or using the
powerful Peripheral Event Controller (PEC) data transfer.
●
Auto scan continuous conversion: The analog level of the selected channels are
repeatedly sampled and converted. The result of the conversion is stored in the ADDAT
ST10F272M
A/D converter
register. The data can be transferred to the RAM by interrupt software management or
using the PEC data transfer.
●
Wait for ADDAT read mode: When using continuous modes, in order to avoid to
overwrite the result of the current conversion by the next one, the ADWR bit of ADCON
control register must be activated. Then, until the ADDAT register is read, the new
result is stored in a temporary buffer and the conversion is on hold.
●
Channel injection mode: When using continuous modes, a selected channel can be
converted in between without changing the current operating mode. The 10-bit data of
the conversion are stored in ADRES field of ADDAT2. The current continuous mode
remains active after the single conversion is completed.
A full calibration sequence is performed after a reset. This full calibration lasts up to 40.630
CPU clock cycles. During this time, the busy flag ADBSY is set to indicate the operation. It
compensates the capacitance mismatch, so the calibration procedure does not need any
update during normal operation.
No conversion can be performed during this time: The bit ADBSY has to be polled to verify
that the calibration is over, and the module is able to start a conversion.
67/176
Serial channels
15
ST10F272M
Serial channels
Serial communication with other microcontrollers, microprocessors, terminals or external
peripheral components is provided by up to four serial interfaces: two asynchronous /
synchronous serial channels (ASC0 and ASC1) and two high-speed synchronous serial
channel (SSC0 and SSC1). Dedicated baudrate generators set up all standard baudrates
without the requirement of oscillator tuning. For transmission, reception and erroneous
reception, separate interrupt vectors are provided for ASC0 and SSC0 serial channel. A
more complex mechanism of interrupt sources multiplexing is implemented for ASC1 and
SSC1 (XBUS mapped).
15.1
Asynchronous / synchronous serial interfaces
The asynchronous / synchronous serial interfaces (ASC0 and ASC1) provides serial
communication between the ST10F272M and other microcontrollers, microprocessors or
external peripherals.
15.2
ASCx in asynchronous mode
In asynchronous mode, 8- or 9-bit data transfer, parity generation and the number of stop
bits can be selected. Parity framing and overrun error detection is provided to increase the
reliability of data transfers. Transmission and reception of data is double-buffered. Fullduplex communication up to 1.25 Mbaud (at 40 MHz of fCPU) is supported in this mode.
Table 37.
ASC asynchronous baudrates by reload value and deviation errors (fCPU = 40 MHz)
S0BRS = ‘0’, fCPU = 40 MHz
S0BRS = ‘1’, fCPU = 40 MHz
Baudrate (baud)
Deviation error
Reload value
(hex)
Baudrate (baud)
Deviation error
Reload value
(hex)
1 250 000
0.0% / 0.0%
0000 / 0000
833 333
0.0% / 0.0%
0000 / 0000
112 000
+1.5% / -7.0%
000A / 000B
112 000
+6.3% / -7.0%
0006 / 0007
56 000
+1.5% / -3.0%
0015 / 0016
56 000
+6.3% / -0.8%
000D / 000E
38 400
+1.7% / -1.4%
001F / 0020
38 400
+3.3% / -1.4%
0014 / 0015
19 200
+0.2% / -1.4%
0040 / 0041
19 200
+0.9% / -1.4%
002A / 002B
9 600
+0.2% / -0.6%
0081 / 0082
9 600
+0.9% / -0.2%
0055 / 0056
4 800
+0.2% / -0.2%
0103 / 0104
4 800
+0.4% / -0.2%
00AC / 00AD
2 400
+0.2% / 0.0%
0207 / 0208
2 400
+0.1% / -0.2%
015A / 015B
1 200
0.1% / 0.0%
0410 / 0411
1 200
+0.1% / -0.1%
02B5 / 02B6
600
0.0% / 0.0%
0822 / 0823
600
+0.1% / 0.0%
056B / 056C
300
0.0% / 0.0%
1045 / 1046
300
0.0% / 0.0%
0AD8 / 0AD9
153
0.0% / 0.0%
1FE8 / 1FE9
102
0.0% / 0.0%
1FE8 / 1FE9
Note:
68/176
The deviation errors given in the Table 37 are rounded off. To avoid deviation errors use a
baudrate crystal (providing a multiple of the ASC0 sampling frequency).
ST10F272M
15.3
Serial channels
ASCx in synchronous mode
In synchronous mode, data is transmitted or received synchronously to a shift clock which is
generated by the ST10F272M. Half-duplex communication up to 5 Mbaud (at 40 MHz of
fCPU) is possible in this mode.
Table 38.
ASC synchronous baudrates by reload value and deviation errors (fCPU = 40 MHz)
S0BRS = ‘0’, fCPU = 40 MHz
S0BRS = ‘1’, fCPU = 40 MHz
Baudrate (baud)
Deviation error
Reload value
(hex)
Baudrate (baud)
Deviation error
Reload value
(hex)
5 000 000
0.0% / 0.0%
0000 / 0000
3 333 333
0.0% / 0.0%
0000 / 0000
112 000
+1.5% / -0.8%
002B / 002C
112 000
+2.6% / -0.8%
001C / 001D
56 000
+0.3% / -0.8%
0058 / 0059
56 000
+0.9% / -0.8%
003A / 003B
38 400
+0.2% / -0.6%
0081 / 0082
38 400
+0.9% / -0.2%
0055 / 0056
19 200
+0.2% / -0.2%
0103 / 0104
19 200
+0.4% / -0.2%
00AC / 00AD
9 600
+0.2% / 0.0%
0207 / 0208
9 600
+0.1% / -0.2%
015A / 015B
4 800
+0.1% / 0.0%
0410 / 0411
4 800
+0.1% / -0.1%
02B5 / 02B6
2 400
0.0% / 0.0%
0822 / 0823
2 400
+0.1% / 0.0%
056B / 056C
1 200
0.0% / 0.0%
1045 / 1046
1 200
0.0% / 0.0%
0AD8 / 0AD9
900
0.0% / 0.0%
15B2 / 15B3
600
0.0% / 0.0%
15B2 / 15B3
612
0.0% / 0.0%
1FE8 / 1FE9
407
0.0% / 0.0%
1FFD / 1FFE
Note:
The deviation errors given in the Table 38 are rounded off. To avoid deviation errors use a
baudrate crystal (providing a multiple of the ASC0 sampling frequency).
15.4
High speed synchronous serial interfaces
The High-Speed Synchronous Serial Interfaces (SSC0 and SSC1) provides flexible highspeed serial communication between the ST10F272M and other microcontrollers,
microprocessors or external peripherals.
The SSCx supports full-duplex and half-duplex synchronous communication. The serial
clock signal can be generated by the SSCx itself (master mode) or be received from an
external master (slave mode). Data width, shift direction, clock polarity and phase are
programmable.
This allows communication with SPI-compatible devices. Transmission and reception of data
is double-buffered. A 16-bit baudrate generator provides the SSCx with a separate serial
clock signal. The serial channel SSCx has its own dedicated 16-bit baudrate generator with
16-bit reload capability, allowing baudrate generation independent from the timers.
Table 39 lists some possible baudrates against the required reload values and the resulting
bit times for the 40 MHz CPU clock. The maximum is limited to 8 Mbaud.
69/176
Serial channels
Table 39.
ST10F272M
Synchronous baudrate and reload values (fCPU = 40 MHz)
Baudrate
70/176
Bit time
Reload value
Reserved
-
0000h
Can be used only with fCPU = 32 MHz (or lower)
-
0001h
6.6 Mbaud
150ns
0002h
5 Mbaud
200ns
0003h
2.5 Mbaud
400ns
0007h
1 Mbaud
1µs
0013h
100 Kbaud
10µs
00C7h
10 Kbaud
100µs
07CFh
1 Kbaud
1ms
4E1Fh
306 baud
3.26ms
FF4Eh
ST10F272M
16
I2C interface
I2C interface
The integrated I2C Bus Module handles the transmission and reception of frames over the
two-line SDA/SCL in accordance with the I2C Bus specification. The I2C Module can
operate in slave mode, in master mode or in multi-master mode. It can receive and transmit
data using 7-bit or 10-bit addressing. Data can be transferred at speeds up to 400 Kbit/s
(both Standard and Fast I2C bus modes are supported).
The module can generate three different types of interrupt:
●
requests related to bus events, such as start or stop events, or arbitration lost
●
requests related to data transmission
●
requests related to data reception
These requests are issued to the interrupt controller by three different lines, and identified as
Error, Transmit, and Receive interrupt lines.
When the I2C module is enabled by setting bit XI2CEN in XPERCON register, pins P4.4 and
P4.7 (where SCL and SDA are respectively mapped as alternate functions) are
automatically configured as bidirectional open-drain: the value of the external pull-up
resistor depends on the application. P4, DP4 and ODP4 cannot influence the pin
configuration.
When the I2C cell is disabled (clearing bit XI2CEN), P4.4 and P4.7 pins are standard I/ O
controlled by P4, DP4 and ODP4.
The speed of the I2C interface can be selected between Standard mode (0 to 100 kHz) and
Fast I2C mode (100 to 400 kHz).
71/176
CAN modules
17
ST10F272M
CAN modules
The two integrated CAN modules (CAN1 and CAN2) are identical and handle the
completely autonomous transmission and reception of CAN frames according to the CAN
specification V2.0 part B (active). It is based on the C-CAN specification.
Each on-chip CAN module can receive and transmit standard frames with 11-bit identifiers
as well as extended frames with 29-bit identifiers.
Because of duplication of the CAN controllers, the following adjustments are to be
considered:
●
Same internal register addresses of both CAN controllers, but with base addresses
differing in address bit A8; separate chip select for each CAN module. Refer to
Chapter 4: Memory organization on page 21.
●
The CAN1 transmit line (CAN1_TxD) is the alternate function of the Port P4.6 pin and
the receive line (CAN1_RxD) is the alternate function of the Port P4.5 pin.
●
The CAN2 transmit line (CAN2_TxD) is the alternate function of the Port P4.7 pin and
the receive line (CAN2_RxD) is the alternate function of the Port P4.4 pin.
●
Interrupt request lines of the CAN1 and CAN2 modules are connected to the XBUS
interrupt lines together with other X-Peripherals sharing the four vectors.
●
The CAN modules must be selected with corresponding CANxEN bit of XPERCON
register before the bit XPEN of SYSCON register is set.
●
The reset default configuration is: CAN1 enabled, CAN2 disabled.
Note:
If one or both CAN modules is used, Port 4 cannot be programmed to output all eight
segment address lines. Thus, only four segment address lines can be used, reducing the
external memory space to 5 Mbytes (1 Mbyte per CS line).
17.1
Configuration support
It is possible that both CAN controllers are working on the same CAN bus, supporting
together up to 64 message objects. In this configuration, both receive signals and both
transmit signals are linked together when using the same CAN transceiver. This
configuration is especially supported by providing open drain outputs for the CAN1_Txd and
CAN2_TxD signals. The open drain function is controlled with the ODP4 register for port P4:
in this way it is possible to connect together P4.4 with P4.5 (receive lines) and P4.6 with
P4.7 (transmit lines configured to be configured as Open-Drain).
The user may also internally map both CAN modules on the same pins P4.5 and P4.6. In
this way, P4.4 and P4.7 can be used either as general purpose I/O lines, or used for I2C
interface. This is possible by setting bit CANPAR of the XMISC register. To access this
register it is necessary to set bit XMISCEN of the XPERCON register and bit XPEN of the
SYSCON register.
17.2
CAN bus configurations
Depending on the application, CAN bus configuration may be one single bus with a single or
multiple interfaces or a multiple bus with a single or multiple interfaces. The ST10F272M can
support both configurations.
72/176
ST10F272M
17.2.1
CAN modules
Single CAN bus
The single CAN bus multiple interfaces configuration may be implemented using two CAN
transceivers as shown in Figure 13.
Figure 13. Connection to single CAN bus via separate CAN transceivers
XMISC.CANPAR = 0
CAN1
RX
CAN2
TX
P4.5
RX
TX
P4.6 P4.4
CAN
Transceiver
P4.7
CAN
Transceiver
CAN_H
CAN bus
CAN_L
The ST10F272M also supports single CAN bus multiple (dual) interfaces using the open
drain option of the CANx_TxD output as shown in Figure 14. Thanks to the OR-Wired
Connection, only one transceiver is required. In this case the design of the application must
take in account the wire length and the noise environment.
Figure 14. Connection to single CAN bus via common CAN transceivers
XMISC.CANPAR = 0
CAN1
RX
CAN2
TX
RX
TX
+5V
P4.5
2.7kW
P4.6 P4.4
OD
P4.7
OD
CAN
Transceiver
CAN_H
CAN_L
CAN bus
OD = Open Drain Output
73/176
CAN modules
17.2.2
ST10F272M
Multiple CAN bus
The ST10F272M provides two CAN interfaces to support such kind of bus configuration as
shown in Figure 15.
Figure 15. Connection to two different CAN buses (for example, gateway
application)
XMISC.CANPAR = 0
CAN1
RX
CAN2
TX
P4.5
RX
TX
P4.6 P4.4
CAN
Transceiver
P4.7
CAN
Transceiver
CAN_H
CAN_H
CAN_L
CAN_L
CAN bus 1
17.2.3
CAN bus 2
Parallel mode
In addition to previous configurations, a parallel mode is supported. This is shown in
Figure 16.
Figure 16. Connection to one CAN bus with internal parallel mode enabled
CAN1
RX
P4.5
XMISC.CANPAR = 1
(Both CAN enabled)
CAN2
TX
RX
P4.6
TX
P4.4(1)
P4.7(1)
CAN
Transceiver
CAN_H
CAN_L
CAN bus
1. P4.4 and P4.7 when not used as CAN functions can be used as general purpose I/O while they cannot be
used as external bus address lines.
74/176
ST10F272M
18
Real time clock
Real time clock
The Real Time Clock is an independent timer, in which the clock is derived directly from the
clock oscillator on XTAL1 (main oscillator) input or XTAL3 input (32 kHz low-power oscillator)
so that it can continue running even in Idle or Power-down modes (if so enabled). Registers
access is implemented onto the XBUS. This module is designed with the following
characteristics:
●
generation of the current time and date for the system
●
cyclic time based interrupt, on Port2 external interrupts every “RTC basic clock tick”
and after n ’RTC basic clock ticks’ (n is programmable) if enabled
●
58-bit timer for long term measurement
●
capability to exit the ST10 chip from Power-down mode (if PWDCFG of SYSCON set)
after a programmed delay
The real time clock is based on two main blocks of counters. The first block is a prescaler
which generates a basic reference clock (for example, a 1 second period). This basic
reference clock is provided by the 20-bit DIVIDER. This 20-bit counter is driven by an input
clock derived from the on-chip CPU clock, predivided by a 1/64 fixed counter. This 20-bit
counter is loaded at each basic reference clock period with the value of the 20-bit
PRESCALER register. The value of the 20-bit RTCP register determines the period of the
basic reference clock.
A timed interrupt request (RTCSI) may be sent on each basic reference clock period. The
second block of the RTC is a 32-bit counter that may be initialized with the current system
time. This counter is driven with the basic reference clock signal. In order to provide an
alarm function the contents of the counter is compared with a 32-bit alarm register. The
alarm register may be loaded with a reference date. An alarm interrupt request (RTCAI),
may be generated when the value of the counter matches the alarm register.
The timed RTCSI and the alarm RTCAI interrupt requests can trigger a fast external
interrupt via the EXISEL register of port 2 and wake up the ST10 chip when running powerdown mode. Using the RTCOFF bit of the RTCCON register, the user may switch off the
clock oscillator when entering the power-down mode.
The last function implemented in the RTC is to switch off the main on-chip oscillator and the
32 kHz on chip oscillator if the ST10 enters the Power-down mode, so that the chip can be
fully switched off (if RTC is disabled).
At power-on, and after Reset phase, if the presence of a 32 kHz oscillation on XTAL3 /
XTAL4 pins is detected, then the RTC counter is driven by this low frequency reference
clock: when Power-down mode is entered, the RTC can either be stopped or left running,
and in both the cases the main oscillator is turned off, reducing the power consumption of
the device to the minimum required to keep on running the RTC counter and relative
reference oscillator. This is also valid if Stand-by mode is entered (switching off the main
supply VDD), since both the RTC and the low power oscillator (32 kHz) are biased by the
VSTBY. Vice versa, when at power on and after Reset, the 32 kHz is not present, the main
oscillator drives the RTC counter, and since it is powered by the main power supply, it
cannot be maintained running in Stand-by mode, while in Power-down mode the main
oscillator is maintained running to provide the reference to the RTC module (if not disabled).
75/176
Watchdog timer
19
ST10F272M
Watchdog timer
The Watchdog Timer is a fail-safe mechanism which prevents the microcontroller from
malfunctioning for long periods of time.
The Watchdog Timer is always enabled after a reset of the chip and can only be disabled in
the time interval until the EINIT (end of initialization) instruction has been executed.
Therefore, the chip start-up procedure is always monitored. The software must be designed
to service the watchdog timer before it overflows. If, due to hardware or software related
failures, the software fails to do so, the watchdog timer overflows and generates an internal
hardware reset. It pulls the RSTOUT pin low in order to allow external hardware components
to be reset.
Each of the different reset sources is indicated in the WDTCON register:
●
Watchdog Timer Reset in case of an overflow
●
Software Reset in case of execution of the SRST instruction
●
Short, Long and Power-On Reset in case of hardware reset (and depending of reset
pulse duration and RPD pin configuration)
The indicated bits are cleared with the EINIT instruction. The source of the reset can be
identified during the initialization phase.
The Watchdog Timer is 16-bit, clocked with the system clock divided by 2 or 128. The high
byte of the watchdog timer register can be set to a prespecified reload value (stored in
WDTREL).
Each time it is serviced by the application software, the high byte of the watchdog timer is
reloaded. For security, rewrite WDTCON each time before the watchdog timer is serviced
Table 40 shows the watchdog time range for 40 MHz CPU clock.
Table 40.
WDTREL reload value (fCPU = 40 MHz)
Prescaler for fCPU = 40 MHz
Reload value in WDTREL
76/176
2 (WDTIN = ‘0’)
128 (WDTIN = ‘1’)
FFh
12.8µs
819.2µs
00h
3.277ms
209.7ms
ST10F272M
20
System reset
System reset
System reset initializes the MCU in a predefined state. There are six ways to activate a reset
state. The system start-up configuration is different for each case as shown in Table 41.
Table 41.
Reset event definition
Flag
RPD
status
PONR
Low
Power-on
Low
tRSTIN >(1)
Synchronous Long Hardware
reset
High
tRSTIN > (1032 + 12) TCL + max(4 TCL, 500ns)(2)
Synchronous Short Hardware
SHWR
reset
High
tRSTIN > max(4 TCL, 500ns)(2)
tRSTIN < (1032 + 12) TCL + max(4 TCL, 500ns)(2)
Reset source
Power-on reset
Asynchronous Hardware
reset
Conditions
LHWR
Watchdog Timer reset
Software reset
WDTR
(3)
WDT overflow
SWR
(3)
SRST instruction execution
1. RSTIN pulse should be longer than 500ns (Filter) and than settling time for configuration of Port0.
2. See next Section 20.1 for more details on minimum reset pulse duration.
3. The RPD status has no influence unless Bidirectional Reset is activated (bit BDRSTEN in SYSCON): RPD
low inhibits the Bidirectional reset on SW and WDT reset events, that is RSTIN is not activated (refer to
Sections 20.4, 20.5 and 20.6).
The figures in the upcoming sections 20.2, 20.3, 20.5 and 20.6 use the following
terminology:
20.1
●
transparent
●
not transparent = level of the pin does not affect internal logic
= level of the pin affects the internal reset logic
Input filter
On the RSTIN input pin an on-chip RC filter is implemented. It is sized to filter all spikes
shorter than 50ns. On the other hand, a valid pulse longer than 500ns is required for the
ST10 to recognize a reset command. In between 50ns and 500ns a pulse can either be
filtered or recognized as valid, depending on the operating conditions and process
variations.
For this reason all minimum durations mentioned in this chapter for the different kinds of
reset events must be carefully evaluated, taking into account the above requirements.
In particular, for Short Hardware Reset, where only 4 TCL is specified as minimum input
reset pulse duration, the operating frequency is a key factor.
Examples:
●
For a CPU clock of 40 MHz, 4 TCL is 50ns, so it would be filtered. In this case the
minimum becomes the one imposed by the filter (that is 500ns).
●
For a CPU clock of 4 MHz, 4 TCL is 500ns. In this case the minimum from the formula
is coherent with the limit imposed by the filter.
77/176
System reset
20.2
ST10F272M
Asynchronous reset
An asynchronous reset is triggered when RSTIN pin is pulled low while RPD pin is at low
level. Then the ST10F272M is immediately (after the input filter delay) forced in reset default
state. It pulls low RSTOUT pin, it cancels pending internal hold states if any, it aborts all
internal/external bus cycles, it switches buses (data, address and control signals) and I/O
pin drivers to high-impedance, it pulls high Port0 pins.
Note:
If an asynchronous reset occurs during a read or write phase in internal memories, the
content of the memory itself could be corrupted: to avoid this, synchronous reset usage is
strongly recommended.
Power-on reset
The asynchronous reset must be used during the power-on of the device. Depending
on crystal or resonator frequency, the on-chip oscillator needs about 1ms to 10ms to
stabilize (refer to Section 24: Electrical characteristics), with an already stable VDD. The
logic of the ST10F272M does not need a stabilized clock signal to detect an asynchronous
reset, so it is suitable for power-on conditions. To ensure a proper reset sequence, the
RSTIN pin and the RPD pin must be held at low level until the device clock signal is
stabilized and the system configuration value on Port0 is settled.
At power-on it is important to respect some additional constraints introduced by the start-up
phase of the different embedded modules.
In particular, the on-chip voltage regulator needs at least 1ms to stabilize the internal 1.8V
for the core logic: This time is computed from when the external reference (VDD) becomes
stable (inside specification range, that is, at least 4.5V). This is a constraint for the
application hardware (external voltage regulator): The RSTIN pin assertion has to be
extended to guarantee the voltage regulator stabilization.
A second constraint is imposed by the embedded Flash. When booting from internal
memory, starting from RSTIN releasing, it needs a maximum of 1ms for its initialization:
before that, the internal reset (RST signal) is not released, so the CPU does not start code
execution in internal memory.
Note:
This is not true if external memory is used (pin EA held low during reset phase). In this case,
once the RSTIN pin is released, and after a few CPU clock cycles (Filter delay plus 3...8
TCL), the internal reset signal RST is released as well, so the code execution can start
immediately after. Obviously, an eventual access to the data in internal Flash is forbidden
before its initialization phase is completed: An eventual access during starting phase will
return FFFFh (just at the beginning), while later 009Bh (an illegal opcode trap can be
generated).
At power-on, the RSTIN pin must be tied low for a minimum time that also includes the startup time of the main oscillator (tSTUP = 1ms for resonator, 10ms for crystal) and PLL
synchronization time (tPSUP = 200µs): This means if the internal Flash is used, the RSTIN
pin could be released before the main oscillator and PLL are stable to recover some time in
the start-up phase (Flash initialization only needs stable V18, but does not need stable
system clock since an internal dedicated oscillator is used).
Warning:
78/176
It is recommended to provide the external hardware with a
current limitation circuitry. This is necessary to avoid
permanent damage of the device during the power-on
transient, when the capacitance on V18 pin is charged. For
ST10F272M
System reset
the on-chip voltage regulator functionality 10nF is sufficient:
In any case, a maximum of 100nF on V18 pin should not
generate problems of over-current (higher value is allowed if
current is limited by the external hardware). External current
limitation is nevertheless also recommended to avoid risks of
damage in case of a temporary short between V18 and
ground: The internal 1.8V drivers are sized to drive currents
of several tens of Amps, so the current must be limited by the
external hardware.
The limit of current is imposed by power dissipation
considerations (refer to Section 24: Electrical
characteristics).
In the next Figures 17 and 18 Asynchronous Power-on timing diagrams are shown,
respectively with boot from internal or external memory, highlighting the reset phase
extension introduced by the embedded Flash module when selected.
Caution:
Never power the device without keeping the RSTIN pin grounded: The device could enter
into unpredictable states, risking also permanent damage.
79/176
System reset
ST10F272M
Figure 17. Asynchronous power-on RESET (EA = 1)
≤ 1.2 ms (for resonator oscillation + PLL stabilization)
≤ 10.2 ms (for crystal oscillation + PLL stabilization)
≥ 1ms (for on-chip VREG stabilization)
VDD
≤ 2 TCL
V18
XTAL1
...
RPD
RSTIN
RSTF
(After Filter)
≥ 50ns
≤ 500ns
3..4 TCL
not t.
P0[15:13]
transparent
P0[12:2]
transparent
not t.
P0[1:0]
not transparent
not t.
not t.
7 TCL
IBUS-CS
(Internal)
≤ 1ms
FLARST
RST
Latching point of Port0 for
system start-up configuration
80/176
ST10F272M
System reset
Figure 18. Asynchronous power-on RESET (EA = 0)
≥ 1.2ms (for resonator oscillation + PLL stabilization)
≥ 10.2ms (for crystal oscillation + PLL stabilization)
≥ 1ms (for on-chip VREG stabilization)
VDD
3..8 TCL(1)
V18
XTAL1
...
RPD
RSTIN
≥ 50ns
≤ 500ns
RSTF
(After Filter)
3..4 TCL
P0[15:13]
transparent
not t.
P0[12:2]
transparent
not t.
P0[1:0]
not transparent
not t.
8 TCL
ALE
RST
Latching point of Port0 for
system start-up configuration
1. 3 to 8 TCL depending on clock source selection
Hardware reset
The asynchronous reset must be used to recover from catastrophic situations of the
application. It may be triggered by the hardware of the application. Internal hardware logic
and application circuitry are described in Reset circuitry chapter and Figures 30, 31 and 32.
It occurs when RSTIN is low and RPD is detected (or becomes) low as well.
81/176
System reset
ST10F272M
Figure 19. Asynchronous hardware RESET (EA = 1)
≤ 2 TCL
(1)
RPD
≥ 50ns
≤ 500ns
RSTIN
≥ 50ns
≤ 500ns
RSTF
(After Filter)
3..4 TCL
P0[15:13]
not transparent
transparent
P0[12:2]
not transparent
transparent
not t.
not transparent
not t.
P0[1:0]
not t.
not t.
7 TCL
IBUS-CS
(internal)
≤ 1ms
FLARST
RST
Latching point of Port0 for
system start-up configuration
1. Longer than Port0 settling time + PLL synchronization (if needed, that is P0(15:13) changed).
Longer than 500ns to take into account of Input Filter on RSTIN pin.
82/176
ST10F272M
System reset
Figure 20. Asynchronous hardware RESET (EA = 0)
(1)
3..8 TCL(2)
RPD
≥ 50ns
≤ 500ns
RSTIN
≥ 50ns
≤ 500ns
RSTF
(After Filter)
3..4 TCL
P0[15:13]
not transparent
transparent
not t.
P0[12:2]
not transparent
transparent
not t.
not transparent
not t.
P0[1:0]
8 TCL
ALE
RST
Latching point of Port0 for
system start-up configuration
1. Longer than Port0 settling time + PLL synchronization (if needed, that is P0(15:13) changed).
Longer than 500ns to take into account of Input Filter on RSTIN pin.
2. 3 to 8 TCL depending on clock source selection.
Exit from asynchronous reset state
When the RSTIN pin is pulled high, the device restarts: As already mentioned, if internal
Flash is used, the restarting occurs after the embedded Flash initialization routine is
completed. The system configuration is latched from Port0: ALE, RD and WR/WRL pins are
driven to their inactive level. The ST10F272M starts program execution from memory
location 00'0000h in code segment 0. This starting location will typically point to the general
initialization routine. The timings of asynchronous Hardware Reset sequence are
summarized in Figure 19 and Figure 20.
20.3
Synchronous reset (warm reset)
A synchronous reset is triggered when RSTIN pin is pulled low while RPD pin is at high
level. In order to properly activate the internal reset logic of the device, the RSTIN pin must
be held low, at least, during 4 TCL (two periods of CPU clock): refer also to Section 20.1 for
details on minimum reset pulse duration. The I/O pins are set to high impedance and
RSTOUT pin is driven low. After RSTIN level is detected, a short duration of a maximum of
12 TCL (six periods of CPU clock) elapses, during which pending internal hold states are
cancelled and the current internal access cycle if any is completed. External bus cycle is
aborted. The internal pull-down of RSTIN pin is activated if bit BDRSTEN of SYSCON
83/176
System reset
ST10F272M
register was previously set by software. Note that this bit is always cleared on power-on or
after a reset sequence.
Short and long synchronous reset
Once the first maximum 16 TCL are elapsed (4+12TCL), the internal reset sequence starts.
It is 1024 TCL cycles long: at the end of it, and after other 8TCL the level of RSTIN is
sampled (after the filter, see RSTF in the drawings): if it is already at high level, only Short
Reset is flagged (refer to Chapter 19 for details on reset flags); if it is recognized still low, the
Long reset is flagged as well. The major difference between Long and Short reset is that
during the Long reset, also P0(15:13) become transparent, so it is possible to change the
clock options.
Warning:
In case of a short pulse on RSTIN pin, and when Bidirectional
reset is enabled, the RSTIN pin is held low by the internal
circuitry. At the end of the 1024 TCL cycles, the RTSIN pin is
released, but due to the presence of the input analog filter the
internal input reset signal (RSTF in the drawings) is released
later (from 50 to 500ns). This delay is in parallel with the
additional 8 TCL, at the end of which the internal input reset
line (RSTF) is sampled, to decide if the reset event is Short or
Long. In particular:
●
If 8 TCL > 500ns (fCPU < 8 MHz), the reset event is always recognized as Short
●
If 8 TCL < 500ns (fCPU > 8 MHz), the reset event could be recognized either as Short or
Long, depending on the real filter delay (between 50 and 500ns) and the CPU
frequency (RSTF sampled High means Short reset, RSTF sampled Low means Long
reset). Note that in case a Long Reset is recognized, once the 8 TCL are elapsed, the
P0(15:13) pins becomes transparent, so the system clock can be reconfigured. The
port returns not transparent 3-4TCL after the internal RSTF signal becomes high.
The same behavior just described, occurs also when unidirectional reset is selected and
RSTIN pin is held low till the end of the internal sequence (exactly 1024TCL + max 16 TCL)
and released exactly at that time.
Note:
When running with CPU frequency lower than 40 MHz, the minimum valid reset pulse to be
recognized by the CPU (4 TCL) could be longer than the minimum analog filter delay (50ns);
so it might happen that a short reset pulse is not filtered by the analog input filter, but on the
other hand it is not long enough to trigger a CPU reset (shorter than 4 TCL): this would
generate a Flash reset but not a system reset. In this condition, the Flash answers always
with FFFFh, which leads to an illegal opcode and consequently a trap event is generated.
Exit from synchronous reset state
The reset sequence is extended until the RSTIN level becomes high. Moreover, it is
internally prolonged by the Flash initialization when EA = 1 (internal memory selected).
Then, the code execution restarts. The system configuration is latched from Port0, and ALE,
RD and WR/WRL pins are driven to their inactive level. The ST10F272M starts program
execution from memory location 00'0000h in code segment 0. This starting location will
typically point to the general initialization routine. Timing of synchronous reset sequence are
summarized in Figures 21 and 22 where a Short Reset event is shown, with particular
emphasis on the fact that it can degenerate into Long Reset: the two figures show the
84/176
ST10F272M
System reset
behavior when booting from internal or external memory respectively. Figures 23 and 24
report the timing of a typical synchronous Long Reset, again when booting from internal or
external memory.
Synchronous reset and RPD pin
Whenever the RSTIN pin is pulled low (by external hardware or as a consequence of a
Bidirectional reset), the RPD internal weak pull-down is activated. The external capacitance
(if any) on RPD pin is slowly discharged through the internal weak pull-down. If the voltage
level on RPD pin reaches the input low threshold (approximately 2.5V), the reset event
becomes immediately asynchronous. In case of hardware reset (short or long) the situation
goes immediately to the one illustrated in Figure 19. There is no effect if RPD comes again
above the input threshold: the asynchronous reset is completed coherently. To correctly
complete a synchronous reset, the value of the capacitance must be big enough to maintain
a sufficiently high voltage on the RPD pin for the duration of the internal reset sequence.
For a Software or Watchdog reset events, an active synchronous reset is completed
regardless of the RPD status.
It is important to highlight that the signal that makes RPD status transparent under reset is
the internal RSTF (after the noise filter).
85/176
System reset
ST10F272M
Figure 21. Synchronous short / long hardware RESET (EA = 1)
≤4 TCL(4) ≤12 TCL
(1)
RSTIN
< 1032 TCL
(3)
≥ 50ns
≤ 500ns
≥ 50ns
≤ 500ns
≥ 50ns
≤ 500ns
≤ 2 TCL
RSTF
(After Filter)
P0[15:13]
P0[12:2]
not transparent
not t.
P0[1:0]
transparent
not t.
not transparent
not t.
7 TCL
IBUS-CS
(Internal)
≤ 1ms
FLARST
1024 TCL
8 TCL
RST
At this time RSTF is sampled HIGH or LOW
so it is SHORT or LONG reset
RSTOUT
RPD
(2)
200µA Discharge
VRPD > 2.5V Asynchronous Reset not entered
1. RSTIN assertion can be released there. Refer also to Section 21.1 for details on minimum pulse duration.
2. If during the reset condition (RSTIN low), RPD voltage drops below the threshold voltage (about 2.5V for
5V operation), the asynchronous reset is then immediately entered.
3. RSTIN pin is pulled low if bit BDRSTEN (bit 3 of SYSCON register) was previously set by software. Bit
BDRSTEN is cleared after reset.
4. Minimum RSTIN low pulse duration shall also be longer than 500ns to guarantee the pulse is not masked
by the internal filter (refer to Section 21.1)
86/176
ST10F272M
System reset
Figure 22. Synchronous short / long hardware RESET (EA = 0)
≤4 TCL(5) ≤12 TCL
(1)
RSTIN
≥ 50 ns
≤ 500 ns
< 1032 TCL
(4)
≥ 50 ns
≤ 500 ns
≥ 50 ns
≤ 500 ns
RSTF
(After Filter)
P0[15:13]
P0[12:2]
not transparent
not t.
P0[1:0]
transparent
not t.
not t.
not transparent
(3)
3..8 TCL
8 TCL
ALE
1024 TCL
8 TCL
RST
At this time RSTF is sampled HIGH or LOW
so it is SHORT or LONG reset
RSTOUT
RPD
(2)
200µA Discharge
VRPD > 2.5V Asynchronous Reset not entered
1. RSTIN assertion can be released there. Refer also to Section 21.1 for details on minimum pulse duration.
2. If during the reset condition (RSTIN low), RPD voltage drops below the threshold voltage (about 2.5V for
5V operation), the asynchronous reset is then immediately entered.
3. 3 to 8 TCL depending on clock source selection.
4. RSTIN pin is pulled low if bit BDRSTEN (bit 3 of SYSCON register) was previously set by software. Bit
BDRSTEN is cleared after reset.
5. Minimum RSTIN low pulse duration shall also be longer than 500ns to guarantee the pulse is not masked
by the internal filter (refer to Section 21.1).
87/176
System reset
ST10F272M
Figure 23. Synchronous long hardware RESET (EA = 1)
≤4 TCL(2) ≤12 TCL
1024+8 TCL
RSTIN
≥ 50ns
≤ 500ns
≥ 50ns
≤ 500ns
≥ 50ns
≤ 500ns
RSTF
(After Filter)
P0[15:13]
P0[12:2]
≤ 2 TCL
3..4 TCL
transparent
not transparent
not t.
P0[1:0]
not t.
transparent
not t.
not transparent
not t.
7 TCL
IBUS-CS
(Internal)
≤ 1ms
FLARST
1024+8 TCL
RST
At this time RSTF is sampled LOW
so it is definitely LONG reset
RSTOUT
RPD
(1)
200µA Discharge
VRPD > 2.5V Asynchronous Reset not entered
1. If during the reset condition (RSTIN low), RPD voltage drops below the threshold voltage (about 2.5V for
5V operation), the asynchronous reset is then immediately entered. Even if RPD returns above the
threshold,the reset is defnitively taken as asynchronous.
2. Minimum RSTIN low pulse duration shall also be longer than 500ns to guarantee the pulse is not masked
by theinternal filter (refer to Section 21.1).
88/176
ST10F272M
System reset
Figure 24. Synchronous long hardware RESET (EA = 0)
4 TCL(2) 12 TCL
1024+8 TCL
RSTIN
≥ 50ns
≤ 500ns
≥ 50ns
≤ 500ns
≥ 50ns
≤ 500ns
RSTF
(After Filter)
3..4 TCL
P0[15:13]
not transparent
not t.
transparent
P0[12:2]
transparent
P0[1:0]
not transparent
not t.
not t.
3..8
TCL(3)
8 TCL
ALE
1024+8 TCL
RST
At this time RSTF is sampled LOW
so it is LONG reset
RSTOUT
RPD
(1)
200µA Discharge
VRPD > 2.5V Asynchronous Reset not entered
1. If during the reset condition (RSTIN low), RPD voltage drops below the threshold voltage (about 2.5V for
5V operation), the asynchronous reset is then immediately entered.
2. Minimum RSTIN low pulse duration shall also be longer than 500ns to guarantee the pulse is not masked
by theinternal filter (refer to Section 21.1).
3. 3 to 8 TCL depending on clock source selection.
20.4
Software reset
A software reset sequence can be triggered at any time by the protected SRST (software
reset) instruction. This instruction can be deliberately executed within a program, for
example, to leave bootstrap loader mode, or on a hardware trap that reveals system failure.
On execution of the SRST instruction, the internal reset sequence is started. The
microcontroller behavior is the same as for a synchronous short reset, except that only bits
P0.12...P0.8 are latched at the end of the reset sequence, while previously latched, bits
P0.7...P0.2 are cleared (that is written at ‘1’).
A Software reset is always taken as synchronous: there is no influence on Software Reset
behavior with RPD status. In case Bidirectional Reset is selected, a Software Reset event
pulls RSTIN pin low: this occurs only if RPD is high; if RPD is low, RSTIN pin is not pulled
low even though Bidirectional Reset is selected.
89/176
System reset
ST10F272M
Refer to the next Figures 25 and 26 for unidirectional SW reset timing, and to Figures 27, 28
and 29 for bidirectional.
20.5
Watchdog timer reset
When the watchdog timer is not disabled during the initialization, or serviced regularly
during program execution, it will overflow and trigger the reset sequence.
Unlike hardware and software resets, the watchdog reset completes a running external bus
cycle if this bus cycle either does not use READY, or if READY is sampled active (low) after
the programmed wait states.
When READY is sampled inactive (high) after the programmed wait states the running
external bus cycle is aborted. Then the internal reset sequence is started.
Bit P0.12...P0.8 are latched at the end of the reset sequence and bit P0.7...P0.2 are cleared
(that is written at ‘1’).
A Watchdog reset is always taken as synchronous: there is no influence on Watchdog Reset
behavior with RPD status. In case Bidirectional Reset is selected, a Watchdog Reset event
pulls RSTIN pin low: this occurs only if RPD is high; if RPD is low, RSTIN pin is not pulled
low even though Bidirectional Reset is selected.
Refer to next Figures 25 and 26 for unidirectional SW reset timing, and to Figures 27, 28 and
29 for bidirectional.
Figure 25. SW / WDT unidirectional RESET (EA = 1)
RSTIN
≤ 2 TCL
P0[15:13]
not transparent
P0[12:8]
transparent
P0[7:2]
not transparent
P0[1:0]
not transparent
not t.
not t.
7 TCL
IBUS-CS
(Internal)
≤ 1ms
FLARST
1024 TCL
RST
RSTOUT
90/176
ST10F272M
System reset
Figure 26. SW / WDT unidirectional RESET (EA = 0)
RSTIN
P0[15:13]
not transparent
P0[12:8]
transparent
P0[7:2]
not transparent
P0[1:0]
not transparent
not t.
not t.
8 TCL
ALE
1024 TCL
RST
RSTOUT
20.6
Bidirectional reset
As shown in the previous sections, the RSTOUT pin is driven active (low level) at the
beginning of any reset sequence (synchronous/asynchronous hardware, software and
watchdog timer resets). RSTOUT pin stays active low beyond the end of the initialization
routine, until the protected EINIT instruction (End of Initialization) is completed.
The Bidirectional Reset function is useful when external devices require a reset signal but
cannot be connected to RSTOUT pin, because RSTOUT signal lasts during initialization. It
is, for instance, the case of external memory running initialization routine before the
execution of EINIT instruction.
Bidirectional reset function is enabled by setting bit 3 (BDRSTEN) in SYSCON register. It
only can be enabled during the initialization routine, before EINIT instruction is completed.
When enabled, the open drain of the RSTIN pin is activated, pulling down the reset signal,
for the duration of the internal reset sequence (synchronous/asynchronous hardware,
synchronous software and synchronous watchdog timer resets). At the end of the internal
reset sequence the pull down is released and:
●
After a Short Synchronous Bidirectional Hardware Reset, if RSTF is sampled low eight
TCL periods after the internal reset sequence completion (refer to Figure 21 and
Figure 22), the Short Reset becomes a Long Reset. On the contrary, if RSTF is
sampled high the device simply exits reset state.
●
After a Software or Watchdog Bidirectional Reset, the device exits from reset. If RSTF
remains still low for at least four TCL periods (minimum time to recognize a Short
Hardware reset) after the reset exiting (refer to Figure 27 and Figure 28), the Software
or Watchdog Reset become a Short Hardware Reset. On the contrary, if RSTF remains
low for less than 4 TCL, the device simply exits reset state.
91/176
System reset
ST10F272M
The Bidirectional reset is not effective in case RPD is held low, when a Software or
Watchdog reset event occurs. On the contrary, if a Software or Watchdog Bidirectional reset
event is active and RPD becomes low, the RSTIN pin is immediately released, while the
internal reset sequence is completed regardless of RPD status change (1024 TCL).
Note:
The bidirectional reset function is disabled by any reset sequence (bit BDRSTEN of
SYSCON is cleared). To be activated again it must be enabled during the initialization
routine.
WDTCON flags
Similar to what is highlighted in the previous section, when discussing Short reset and the
degeneration into Long reset, comparable situations may occur when Bidirectional reset is
enabled. The presence of the internal filter on RSTIN pin introduces a delay: When RSTIN is
released, the internal signal after the filter (see RSTF in the drawings) is delayed, so it
remains still active (low) for a while. It means that depending on the internal clock speed, a
short reset may be recognized as a long reset: The WDTCON flags are set accordingly.
Moreover, when either Software or Watchdog bidirectional reset events occur, when the
RSTIN pin is released (at the end of the internal reset sequence), the RSTF internal signal
(after the filter) remains low for a while, and depending on the clock frequency it is
recognized high or low: 8TCL after the completion of the internal sequence, the level of
RSTF signal is sampled, and if recognized still low a Hardware reset sequence starts, and
WDTCON will flag this last event, masking the previous one (Software or Watchdog reset).
Typically, a Short Hardware reset is recognized, unless the RSTIN pin (and consequently
internal signal RSTF) is sufficiently held low by the external hardware to inject a Long
Hardware reset. After this occurrence, the initialization routine is not able to recognize a
Software or Watchdog bidirectional reset event, since a different source is flagged inside
WDTCON register. This phenomenon does not occur when internal Flash is selected during
reset (EA = 1), since the initialization of the Flash itself extend the internal reset duration
well beyond the filter delay.
The next Figures 27, 28 and 29 summarize the timing for Software and Watchdog Timer
Bidirectional reset events: In particular Figure 29 shows the degeneration into Hardware
reset.
92/176
ST10F272M
System reset
Figure 27. SW / WDT bidirectional RESET (EA = 1)
RSTIN
≥ 50 ns
≤ 500 ns
≥ 50 ns
≤ 500 ns
RSTF
(After Filter)
P0[15:13]
not transparent
P0[12:8]
transparent
P0[7:2]
not transparent
P0[1:0]
not transparent
not t.
not t.
≤ 2 TCL
7 TCL
IBUS-CS
(Internal)
≤ 1ms
FLARST
1024 TCL
RST
RSTOUT
Figure 28. SW / WDT bidirectional RESET (EA = 0)
RSTIN
≥ 50 ns
≤ 500 ns
≥ 50 ns
≤ 500 ns
RSTF
(After Filter)
P0[15:13]
not transparent
P0[12:8]
transparent
P0[7:2]
not transparent
P0[1:0]
not transparent
not t.
not t.
8 TCL
ALE
1024 TCL
RST
RSTOUT
At this time RSTF is sampled HIGH
so SW or WDT Reset is flagged in WDTCON
93/176
System reset
ST10F272M
Figure 29. SW / WDT bidirectional RESET (EA = 0) followed by a HW RESET
RSTIN
≥ 50 ns
≤ 500 ns
≥ 50 ns
≤ 500 ns
RSTF
(After Filter)
P0[15:13]
not transparent
P0[12:8]
transparent
P0[7:2]
not transparent
P0[1:0]
not transparent
not t.
not t.
8 TCL
ALE
1024 TCL
RST
RSTOUT
20.7
At this time RSTF is sampled LOW
so HW Reset is entered
Reset circuitry
Internal reset circuitry is described in Figure 32. The RSTIN pin provides an internal pull-up
resistor of 50kΩ to 250kΩ (The minimum reset time must be calculated using the lowest
value).
It also provides a programmable (BDRSTEN bit of SYSCON register) pull-down to output
internal reset state signal (synchronous reset, watchdog timer reset or software reset).
This bidirectional reset function is useful in applications where external devices require a
reset signal but cannot be connected to RSTOUT pin.
This is the case of an external memory running codes before EINIT (end of initialization)
instruction is executed. RSTOUT pin is pulled high only when EINIT is executed.
The RPD pin provides an internal weak pull-down resistor which discharges external
capacitor at a typical rate of 200µA. If bit PWDCFG of SYSCON register is set, an internal
pull-up resistor is activated at the end of the reset sequence. This pull-up will charge any
capacitor connected on RPD pin.
The simplest way to reset the ST10F272M is to insert a capacitor C1 between RSTIN pin
and VSS, and a capacitor between RPD pin and VSS (C0) with a pull-up resistor R0 between
RPD pin and VDD. The input RSTIN provides an internal pull-up device equalling a resistor of
50kΩ to 250kΩ (the minimum reset time must be determined by the lowest value). Select C1
that produce a sufficient discharge time to permit the internal or external oscillator and / or
internal PLL and the on-chip voltage regulator to stabilize.
94/176
ST10F272M
System reset
To ensure correct power-up reset with controlled supply current consumption, specially if
clock signal requires a long period of time to stabilize, an asynchronous hardware reset is
required during power-up. For this reason, it is recommended to connect the external R0-C0
circuit shown in Figure 30 to the RPD pin. On power-up, the logical low level on RPD pin
forces an asynchronous hardware reset when RSTIN is asserted low. The external pull-up
R0 will then charge the capacitor C0. Note that an internal pull-down device on RPD pin is
turned on when RSTIN pin is low, and causes the external capacitor (C0) to begin
discharging at a typical rate of 100-200µA. With this mechanism, after power-up reset, short
low pulses applied on RSTIN produce synchronous hardware reset. If RSTIN is asserted
longer than the time needed for C0 to be discharged by the internal pull-down device, then
the device is forced in an asynchronous reset. This mechanism insures recovery from very
catastrophic failure.
Figure 30. Minimum external reset circuitry
RSTOUT
RSTIN
External Hardware
+
C1
a) Hardware
Reset
VCC
R0
RPD
+
b) For Power-up
Reset
(and Interruptible
Power-down
mode)
C0
ST10F272M
The minimum reset circuit of Figure 30 is not adequate when the RSTIN pin is driven from
the ST10F272M itself during software or watchdog triggered resets, because of the
capacitor C1 that will keep the voltage on RSTIN pin above VIL after the end of the internal
reset sequence, and thus will trigger an asynchronous reset sequence.
Figure 31 shows an example of a reset circuit. In this example, R1-C1 external circuit is only
used to generate power-up or manual reset, and R0-C0 circuit on RPD is used for power-up
reset and to exit from Power-down mode. Diode D1 creates a wired-OR gate connection to
the reset pin and may be replaced by open-collector Schmitt trigger buffer. Diode D2
provides a faster cycle time for repetitive power-on resets.
R2 is an optional pull-up for faster recovery and correct biasing of TTL Open Collector
drivers.
95/176
System reset
ST10F272M
Figure 31. System reset circuit
VDD
VDD
R2
External Hardware
R1
D2
RSTIN
+
VDD
D1
C1
o.d.
External
Reset Source
R0
Open Drain Inverter
RPD
+
C0
ST10F272M
Figure 32. Internal (simplified) reset circuitry
EINIT Instruction
Clr
Q
RSTOUT
Set
Reset State
Machine
Clock
Internal
Reset
Signal
VDD
SRST instruction
watchdog overflow
Trigger
RSTIN
Clr
BDRSTEN
Reset Sequence
(512 CPU Clock Cycles)
VDD
Asynchronous
Reset
RPD
From/to Exit
Powerdown
Circuit
96/176
Weak Pulldown
(~200µA)
ST10F272M
Reset application examples
The next two timing diagrams (Figure 33 and Figure 34) provide additional examples of
bidirectional internal reset events (Software and Watchdog) including in particular the
external capacitances charge and discharge transients (refer also to Figure 31 for the
external circuit scheme).
Latching point
transparent
transparent
not transparent
P0[1:0]
not transparent
P0[7:2]
not transparent
P0[12:8]
P0[15:13]
04h
WDTCON
[5:0]
RST
VIL
RPD
not transparent
4 TCL
Tfilter RST
< 500 ns
RSTF
ideal
VIH
VIL
RSTIN
RSTOUT
not transparent
Latching point
Latching point
not transparent
not transparent
< 4 TCL
0Ch
1 ms (C1 charge)
transparent
Tfilter RST
< 500 ns
1Ch
3..8 TCL
Latching point
not transparent
EINIT
00h
Figure 33. Example of software or watchdog bidirectional reset (EA = 1)
1024 TCL (12.8 us)
20.8
System reset
97/176
98/176
VIL
VIL
VIH
P0[1:0]
P0[7:2]
P0[12:8]
P0[15:13]
WDTCON
[5:0]
RST
RPD
RSTF
ideal
RSTIN
RSTOUT
not transparent
not transparent
not transparent
04h
Tfilter RST
< 500 ns
1024 TCL (12.8 us)
0Ch
not transparent
4 TCL
Tfilter RST
< 500 ns
transparent
transparent
transparent
1 ms (C1 charge)
< 4 TCL
1Ch
Latching point
Latching point
not transparent
not transparent
not transparent
not transparent
Latching point
Latching point
3..8 TCL
00h
EINIT
System reset
ST10F272M
Figure 34. Example of software or watchdog bidirectional reset (EA = 0)
ST10F272M
20.9
System reset
Reset summary
The following table summarizes the different reset events.
Short Hardware
Reset
(Synchronous) (1)
Min
Max
LHWR
SHWR
SWR
WDTR
WDTCON flags
-
1
1
1
1
0
-
1
1
1
1
0
0
0
N Asynch.
1 ms (VREG)
1.2 ms
(Reson. + PLL)
10.2 ms
(Crystal + PLL)
0
1
N Asynch.
1ms (VREG)
1
x
x
FORBIDDEN
x
x
Y
-
0
0
N Asynch.
500ns
-
0
1
1
1
0
0
1
N Asynch.
500ns
-
0
1
1
1
0
0
0
Y
Asynch.
500ns
-
0
1
1
1
0
0
1
Y
Asynch.
500ns
-
0
1
1
1
0
1
0
N Synch.
max (4 TCL, 500ns)
1032 + 12 TCL +
max(4 TCL, 500ns)
0
0
1
1
0
1
1
N Synch.
max (4 TCL, 500ns)
1032 + 12 TCL +
max(4 TCL, 500ns)
0
0
1
1
0
max (4 TCL, 500ns)
1
0
Y
1032 + 12 TCL +
max(4 TCL, 500ns)
0
0
1
1
0
0
0
1
1
0
Power-on Reset
Hardware Reset
(Asynchronous)
RSTIN
PONR
Synch.
Asynch.
Bidir
Event
EA
Reset event
RPD
Table 42.
Synch.
Activated by internal logic for 1024 TCL
max (4 TCL, 500ns)
1
1
Y
Synch.
1032 + 12 TCL +
max(4 TCL, 500ns)
Activated by internal logic for 1024 TCL
Long Hardware
Reset
(Synchronous)
1
0
N Synch.
1032 + 12 TCL +
max(4 TCL, 500ns)
-
0
1
1
1
0
1
1
N Synch.
1032 + 12 TCL +
max(4 TCL, 500ns)
-
0
1
1
1
0
1032 + 12 TCL +
max(4 TCL, 500ns)
0
1
1
1
0
0
1
1
1
0
1
0
Y
Synch.
Activated by internal logic only for 1024 TCL
1
1
Y
Synch.
1032 + 12 TCL +
max(4 TCL, 500ns)
-
Activated by internal logic only for 1024 TCL
99/176
System reset
Reset event (continued)
Synch.
Asynch.
SHWR
SWR
WDTR
Bidir
LHWR
Watchdog Reset (2)
PONR
Software Reset (2)
WDTCON flags
EA
Event
RSTIN
RPD
Table 42.
ST10F272M
x
0
N Synch.
Not activated
0
0
0
1
0
x
0
N Synch.
Not activated
0
0
0
1
0
0
1
Y
Synch.
Not activated
0
0
0
1
0
1
1
Y
Synch.
Activated by internal logic for 1024 TCL
0
0
0
1
0
x
0
N Synch.
Not activated
0
0
0
1
1
x
0
N Synch.
Not activated
0
0
0
1
1
0
1
Y
Synch.
Not activated
0
0
0
1
1
1
1
Y
Synch.
Activated by internal logic for 1024 TCL
0
0
0
1
1
Min
Max
1. It can degenerate into a Long Hardware Reset and consequently differently flagged (see Section 20.3 for details).
2. When Bidirectional is active (and with RPD = 0), it can be followed by a Short Hardware Reset and consequently differently
flagged (see Section 20.6 for details).
The start-up configurations and some system features are selected on reset sequences as
described in Table 43 and Figure 35.
Table 43 describes the system configuration latched on PORT0 in the six different reset
modes. Figure 35 summarizes the state of bits of PORT0 latched in RP0H, SYSCON,
BUSCON0 registers.
Table 43.
PORT0 latched configuration for the different reset events
BSL
Reserved
Reserved
Adapt mode
Emu mode
P0H.4
P0H.3
P0H.2
P0H.1
P0H.0 WR configuration
Reserved
P0H.5
P0L.7
P0L.6
P0L.5
P0L.4
P0L.3
P0L.2
P0L.1
P0L.0
-
-
-
X
X
X
X
X
X
X
-
-
-
-
-
-
Watchdog Reset
-
-
-
X
X
X
X
X
X
X
-
-
-
-
-
-
Synchronous Short Hardware Reset
-
-
-
X
X
X
X
X
X
X
X
X
X
X
X
X
Synchronous Long Hardware Reset
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Asynchronous Hardware Reset
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Asynchronous Power-On Reset
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Sample event
100/176
Chip selects
Segment
address lines
X: Pin is sampled
-: Pin is not sampled
Bus type
P0H.6
Software Reset
Clock options
P0H.7
PORT0
ST10F272M
System reset
Figure 35. PORT0 bits latched into the different registers after reset
PORT0
H.7
H.6
H.5
CLKCFG
H.4
H.3
H.2
H.1
H.0
SALSEL
CSSEL
WRC
CLKCFG
SALSEL
CSSEL
WRC
Clock
Generator
Port 4
Logic
Port 6
Logic
L.7
L.6
L.5
BUSTYP
L.4
L.3
BSL
L.2
Res.
L.1
L.0
ADP
EMU
RP0H
Bootstrap Loader
Internal Control Logic
2
EA / VSTBY
P0L.7
P0L.7
SYSCON
ROMEN BYTDIS
10
9
8
BUSCON0
BUS
ACT0
WRCFG
7
10
9
ALE
CTL0
BTYP
7
6
101/176
Power reduction modes
21
ST10F272M
Power reduction modes
Three different power reduction modes with different levels of power reduction have been
implemented in the ST10F272M. In Idle mode only CPU is stopped, while peripheral still
operate. In Power-down mode both CPU and peripherals are stopped. In Stand-by mode the
main power supply (VDD) can be turned off while a portion of the internal RAM remains
powered via VSTBY dedicated power pin.
Idle and Power-down modes are software activated by a protected instruction and are
terminated in different ways as described in the following sections.
Stand-by mode is entered simply removing VDD, holding the MCU under reset state.
Note:
All external bus actions are completed before Idle or Power-down mode is entered.
However, Idle or Power-down mode is not entered if READY is enabled, but has not been
activated (driven low for negative polarity, or driven high for positive polarity) during the last
bus access.
21.1
Idle mode
Idle mode is entered by running IDLE protected instruction. The CPU operation is stopped
and the peripherals still run.
Idle mode is terminate by any interrupt request. Whatever the interrupt is serviced or not,
the instruction following the IDLE instruction will be executed after return from interrupt
(RETI) instruction, then the CPU resumes the normal program.
21.2
Power-down mode
Power-down mode starts by running PWRDN protected instruction. Internal clock is
stopped, all MCU parts are on hold including the watchdog timer. The only exception could
be the Real Time Clock if opportunely programmed and one of the two oscillator circuits as
a consequence (either the main or the 32 kHz on-chip oscillator).
When Real Time Clock module is used, when the device is in Power-down mode a
reference clock is needed. In this case, two possible configurations may be selected by the
user application according to the desired level of power reduction:
●
A 32 kHz crystal is connected to the on-chip low-power oscillator (pins XTAL3 / XTAL4)
and running. In this case the main oscillator is stopped when Power-down mode is
entered, while the Real Time Clock continue counting using 32 kHz clock signal as
reference. The presence of a running low-power oscillator is detected after the Poweron: this clock is immediately assumed (if present, or as soon as it is detected) as
reference for the Real Time Clock counter and it will be maintained forever (unless
specifically disabled via software).
●
Only the main oscillator is running (XTAL1 / XTAL2 pins). In this case the main
oscillator is not stopped when Power-down is entered, and the Real Time Clock
continue counting using the main oscillator clock signal as reference.
There are two different operating Power-down modes: protected mode and interruptible
mode.
102/176
ST10F272M
Power reduction modes
Before entering Power-down mode (by executing the instruction PWRDN), bit VREGOFF in
XMISC register must be set.
Note:
Leaving the main voltage regulator active during Power-down may lead to unexpected
behavior (example: CPU wake-up) and power consumption higher than what is specified.
21.2.1
Protected power-down mode
This mode is selected when PWDCFG (bit 5) of SYSCON register is cleared. The Protected
Power-down mode is only activated if the NMI pin is pulled low when executing PWRDN
instruction (this means that the PWRD instruction belongs to the NMI software routine). This
mode is only deactivated with an external hardware reset on RSTIN pin.
21.2.2
Interruptible power-down mode
This mode is selected when PWDCFG (bit 5) of SYSCON register is set.
The Interruptible Power-down mode is only activated if all the enabled Fast External
Interrupt pins are in their inactive level.
This mode is deactivated with an external reset applied to RSTIN pin or with an interrupt
request applied to one of the Fast External Interrupt pins, or with an interrupt generated by
the Real Time Clock, or with an interrupt generated by the activity on CAN’s and I2C module
interfaces. To allow the internal PLL and clock to stabilize, the RSTIN pin must be held low
according the recommendations described in Chapter 20: System reset on page 77.
An external RC circuit must be connected to RPD pin, as shown in the Figure 36.
Figure 36. External RC circuitry on RPD pin
ST10F272M
VDD
R0
220kΩ minimum
RPD
+
C0
1µF Typical
To exit Power-down mode with an external interrupt, an EXxIN (x = 7...0) pin has to be
asserted for at least 40ns.
21.3
Stand-by mode
In Stand-by mode, it is possible to turn off the main VDD provided that VSTBY is available
through the dedicated pin of the ST10F272M.
To enter Stand-by mode it is mandatory to held the device under reset: once the device is
under reset, the RAM is disabled (see XRAM2EN bit of XPERCON register), and its digital
interface is frozen in order to avoid any kind of data corruption.
A dedicated embedded low-power voltage regulator is implemented to generate the internal
low voltage supply (about 1.65V in Stand-by mode) to bias all those circuits that shall remain
active: the portion of XRAM (16 Kbytes for ST10F272M), the RTC counters and 32 kHz onchip oscillator amplifier.
103/176
Power reduction modes
ST10F272M
In normal running mode (that is when main VDD is on) the VSTBY pin can be tied to VSS
during reset to exercise the EA functionality associated with the same pin: the voltage
supply for the circuitries which are usually biased with VSTBY (see in particular the 32 kHz
oscillator used in conjunction with Real Time Clock module), is granted by the active main
VDD.
It must be noted that Stand-by mode can generate problems associated with the usage of
different power supplies in CMOS systems; particular attention must be paid when the
ST10F272M I/O lines are interfaced with other external CMOS integrated circuits: if VDD of
ST10F272M becomes (for example, in Stand-by mode) lower than the output level forced by
the I/O lines of these external integrated circuits, the ST10F272M could be directly powered
through the inherent diode existing on ST10F272M output driver circuitry. The same is valid
for ST10F272M interfaced to active/inactive communication buses during Stand-by mode:
current injection can be generated through the inherent diode.
Furthermore, the sequence of turning on/off of the different voltage could be critical for the
system (not only for the ST10F272M device). The device Stand-by mode current (ISTBY)
may vary while VDD to VSTBY (and vice versa) transition occurs: some current flows between
VDD and VSTBY pins. System noise on both VDD and VSTBY can contribute to increase this
phenomenon.
21.3.1
Entering stand-by mode
As already stated, to enter Stand-by mode the XRAM2EN bit in the XPERCON register
must be cleared: This allows the RAM interface to be frozen immediately, avoiding any data
corruption. As a consequence of a RESET event, the RAM power supply is switched to the
internal low-voltage supply V18SB (derived from VSTBY through the low-power voltage
regulator). The RAM interface remains frozen until the bit XRAM2EN is set again by
software initialization routine (at next exit from main VDD power-on reset sequence).
Since V18 is falling down (as a consequence of VDD turning off), it can happen that the
XRAM2EN bit is no longer able to guarantee its content (logic “0”), being the XPERCON
Register powered by internal V18. This does not generate any problem, because the Standby mode switching dedicated circuit continues to confirm the RAM interface freezing,
irrespective the XRAM2EN bit content; XRAM2EN bit status is considered again when
internal V18 comes back over internal stand-by reference V18SB.
If internal V18 becomes lower than internal stand-by reference (V18SB) of about 0.3 to 0.45V
with bit XRAM2EN set, the RAM Supply switching circuit is not active: in case of a
temporary drop on internal V18 voltage versus internal V18SB during normal code execution,
no spurious Stand-by mode switching can occur (the RAM is not frozen and can still be
accessed).
The ST10F272M Core module, generating the RAM control signals, is powered by internal
V18 supply; during turning off transient these control signals follow the V18, while RAM is
switched to V18SB internal reference. It could happen that a high level of RAM write strobe
from ST10F272M Core (active low signal) is low enough to be recognized as a logic “0” by
the RAM interface (due to V18 lower than V18SB): The bus status could contain a valid
address for the RAM and an unwanted data corruption could occur. For this reason, an extra
interface, powered by the switched supply, is used to prevent the RAM from this kind of
potential corruption mechanism.
104/176
ST10F272M
Power reduction modes
Warning:
21.3.2
During power-off phase, it is important that the external
hardware maintains a stable ground level on RSTIN pin,
without any glitch, in order to avoid spurious exiting from
reset status with unstable power supply.
Exiting stand-by mode
After the system has entered the Stand-by mode, the procedure to exit this mode consists of
a standard Power-on sequence, with the only difference that the RAM is already powered
through V18SB internal reference (derived from VSTBY pin external voltage).
It is recommended to held the device under RESET (RSTIN pin forced low) until external
VDD voltage pin is stable. Even though, at the very beginning of the power-on phase, the
device is maintained under reset by the internal low voltage detector circuit (implemented
inside the main voltage regulator) till the internal V18 becomes higher than about 1.0V, there
is no guaranty that the device stays under reset status if RSTIN is at high level during
power ramp up. So, it is important the external hardware is able to guarantee a stable
ground level on RSTIN along the power-on phase, without any temporary glitch.
The external hardware is responsible for driving the RSTIN pin low until the VDD is stable,
even though the internal LVD is active.
Once the internal Reset signal goes low, the RAM (still frozen) power supply is switched to
the main V18.
At this time, everything becomes stable, and the execution of the initialization routines can
start: XRAM2EN bit can be set, enabling the RAM.
21.3.3
Real time clock and stand-by mode
When Stand-by mode is entered (turning off the main supply VDD), the Real Time Clock
counting can be maintained running in case the on-chip 32 kHz oscillator is used to provide
the reference to the counter. This is not possible if the main oscillator is used as reference
for the counter: Being the main oscillator powered by VDD, once this is switched off, the
oscillator is stopped.
21.3.4
Power reduction modes summary
The different Power reduction modes are summarized in the following Table 44.
VSTBY
CPU
Peripherals
RTC
Main OSC
32 kHz OSC
STBY XRAM
XRAM
Mode
Power reduction modes summary
VDD
Table 44.
on
on
off
on
off
run
off
biased
biased
on
on
off
on
on
run
on
biased
biased
Idle
105/176
Power reduction modes
CPU
Peripherals
RTC
Main OSC
32 kHz OSC
STBY XRAM
XRAM
Power-down
VSTBY
Mode
Power reduction modes summary (continued)
VDD
Table 44.
ST10F272M
on
on
off
off
off
off
off
biased
biased
on
on
off
off
on
on
off
biased
biased
on
on
off
off
on
off
on
biased
biased
off
on
off
off
off
off
off
biased
off
off
on
off
off
on
off
on
biased
off
Stand-by
106/176
ST10F272M
22
Programmable output clock divider
Programmable output clock divider
A specific register mapped on the XBUS can be used to choose the division factor on the
CLKOUT signal (P3.15). This register is mapped on X-Miscellaneous memory address
range.
When CLKOUT function is enabled by setting bit CLKEN of register SYSCON, by default the
CPU clock is output on P3.15. Setting bit XMISCEN of register XPERCON and bit XPEN of
register SYSCON, it is possible to program the clock prescaling factor: in this way on P3.15
a prescaled value of the CPU clock can be output.
When CLKOUT function is not enabled (bit CLKEN of register SYSCON cleared), P3.15
does not output any clock signal, even though XCLKOUTDIV register is programmed.
107/176
Register set
23
ST10F272M
Register set
This section summarizes all registers implemented in the ST10F272M, ordered by name.
23.1
Special function registers
The following table lists all SFRs which are implemented in the ST10F272M in alphabetical
order.
Bit-addressable SFRs are marked with the letter “b” in column “Name”.
SFRs within the Extended SFR-Space (ESFRs) are marked with the letter “E” in column
“Physical Address”.
Table 45.
List of special function registers
Physical
address
Name
8-bit
address
Description
Reset
value
ADCIC
b
FF98h
CCh
A/D converter end of conversion interrupt control
register
- - 00h
ADCON
b
FFA0h
D0h
A/D converter control register
0000h
ADDAT
FEA0h
50h
A/D converter result register
0000h
ADDAT2
F0A0h
50h
A/D converter 2 result register
0000h
ADDRSEL1
FE18h
0Ch
Address select register 1
0000h
ADDRSEL2
FE1Ah
0Dh
Address select register 2
0000h
ADDRSEL3
FE1Ch
0Eh
Address select register 3
0000h
ADDRSEL4
FE1Eh
0Fh
Address select register 4
0000h
b
FF9Ah
CDh
A/D converter overrun error interrupt control register
- - 00h
BUSCON0 b
FF0Ch
86h
Bus configuration register 0
0xx0h
BUSCON1 b
FF14h
8Ah
Bus configuration register 1
0000h
BUSCON2 b
FF16h
8Bh
Bus configuration register 2
0000h
BUSCON3 b
FF18h
8Ch
Bus configuration register 3
0000h
BUSCON4 b
FF1Ah
8Dh
Bus configuration register 4
0000h
CAPREL
FE4Ah
25h
GPT2 capture/reload register
0000h
CC0
FE80h
40h
CAPCOM register 0
0000h
FF78h
BCh
CAPCOM register 0 interrupt control register
- - 00h
FE82h
41h
CAPCOM register 1
0000h
FF7Ah
BDh
CAPCOM register 1 interrupt control register
- - 00h
FE84h
42h
CAPCOM register 2
0000h
FF7Ch
BEh
CAPCOM register 2 interrupt control register
- - 00h
FE86h
43h
CAPCOM register 3
0000h
FF7Eh
BFh
CAPCOM register 3 interrupt control register
- - 00h
ADEIC
CC0IC
b
CC1
CC1IC
b
CC2
CC2IC
b
CC3
CC3IC
108/176
b
E
ST10F272M
Table 45.
Register set
List of special function registers (continued)
Physical
address
Name
CC4
CC4IC
b
CC5
CC5IC
b
CC6
CC6IC
b
CC7
CC7IC
b
CC8
CC8IC
b
CC9
CC9IC
b
CC10
CC10IC
b
CC11
CC11IC
b
CC12
CC12IC
b
CC13
CC13IC
b
CC14
CC14IC
b
CC15
CC15IC
b
CC16
CC16IC
b
CC17
CC17IC
b
CC19
CC19IC
CC20
CC20IC
CAPCOM register 4
0000h
FF80h
C0h
CAPCOM register 4 interrupt control register
- - 00h
FE8Ah
45h
CAPCOM register 5
0000h
FF82h
C1h
CAPCOM register 5 interrupt control register
- - 00h
FE8Ch
46h
CAPCOM register 6
0000h
FF84h
C2h
CAPCOM register 6 interrupt control register
- - 00h
FE8Eh
47h
CAPCOM register 7
0000h
FF86h
C3h
CAPCOM register 7 interrupt control register
- - 00h
FE90h
48h
CAPCOM register 8
0000h
FF88h
C4h
CAPCOM register 8 interrupt control register
- - 00h
FE92h
49h
CAPCOM register 9
0000h
FF8Ah
C5h
CAPCOM register 9 interrupt control register
- - 00h
FE94h
4Ah
CAPCOM register 10
0000h
FF8Ch
C6h
CAPCOM register 10 interrupt control register
- - 00h
FE96h
4Bh
CAPCOM register 11
0000h
FF8Eh
C7h
CAPCOM register 11 interrupt control register
- - 00h
FE98h
4Ch
CAPCOM register 12
0000h
FF90h
C8h
CAPCOM register 12 interrupt control register
- - 00h
FE9Ah
4Dh
CAPCOM register 13
0000h
FF92h
C9h
CAPCOM register 13 interrupt control register
- - 00h
FE9Ch
4Eh
CAPCOM register 14
0000h
FF94h
CAh
CAPCOM register 14 interrupt control register
- - 00h
FE9Eh
4Fh
CAPCOM register 15
0000h
FF96h
CBh
CAPCOM register 15 interrupt control register
- - 00h
FE60h
30h
CAPCOM register 16
0000h
B0h
CAPCOM register 16 interrupt control register
- - 00h
31h
CAPCOM register 17
0000h
B1h
CAPCOM register 17 interrupt control register
- - 00h
32h
CAPCOM register 18
0000h
B2h
CAPCOM register 18 interrupt control register
- - 00h
33h
CAPCOM register 19
0000h
B3h
CAPCOM register 19 interrupt control register
- - 00h
34h
CAPCOM register 20
0000h
B4h
CAPCOM register 20 interrupt control register
- - 00h
F160h
E
F162h
E
F164h
E
FE66h
b
F166h
E
FE68h
b
Reset
value
44h
FE64h
b
Description
FE88h
FE62h
CC18
CC18IC
8-bit
address
F168h
E
109/176
Register set
Table 45.
List of special function registers (continued)
Physical
address
Name
CC21
CC21IC
b
b
b
b
b
b
b
b
E
F172h
E
F174h
E
F176h
E
F178h
E
FE7Ah
b
CC30
CC30IC
F170h
FE78h
CC29
CC29IC
E
FE76h
CC28
CC28IC
F16Eh
FE74h
CC27
CC27IC
E
FE72h
CC26
CC26IC
F16Ch
FE70h
CC25
CC25IC
E
FE6Eh
CC24
CC24IC
F16Ah
FE6Ch
CC23
CC23IC
8-bit
address
FE6Ah
CC22
CC22IC
ST10F272M
F184h
E
FE7Ch
b
CC31
F18Ch
E
FE7Eh
Reset
value
35h
CAPCOM register 21
0000h
B5h
CAPCOM register 21 interrupt control register
- - 00h
36h
CAPCOM register 22
0000h
B6h
CAPCOM register 22 interrupt control register
- - 00h
37h
CAPCOM register 23
0000h
B7h
CAPCOM register 23 interrupt control register
- - 00h
38h
CAPCOM register 24
0000h
B8h
CAPCOM register 24 interrupt control register
- - 00h
39h
CAPCOM register 25
0000h
B9h
CAPCOM register 25 interrupt control register
- - 00h
3Ah
CAPCOM register 26
0000h
BAh
CAPCOM register 26 interrupt control register
- - 00h
3Bh
CAPCOM register 27
0000h
BBh
CAPCOM register 27 interrupt control register
- - 00h
3Ch
CAPCOM register 28
0000h
BCh
CAPCOM register 28 interrupt control register
- - 00h
3Dh
CAPCOM register 29
0000h
C2h
CAPCOM register 29 interrupt control register
- - 00h
3Eh
CAPCOM register 30
0000h
C6h
CAPCOM register 30 interrupt control register
- - 00h
3Fh
CAPCOM register 31
0000h
CAh
CAPCOM register 31 interrupt control register
- - 00h
CC31IC
b
F194h
CCM0
b
FF52h
A9h
CAPCOM Mode Control register 0
0000h
CCM1
b
FF54h
AAh
CAPCOM Mode Control register 1
0000h
CCM2
b
FF56h
ABh
CAPCOM Mode Control register 2
0000h
CCM3
b
FF58h
ACh
CAPCOM mode Control register 3
0000h
CCM4
b
FF22h
91h
CAPCOM Mode Control register 4
0000h
CCM5
b
FF24h
92h
CAPCOM Mode Control register 5
0000h
CCM6
b
FF26h
93h
CAPCOM Mode Control register 6
0000h
CCM7
b
FF28h
94h
CAPCOM Mode Control register 7
0000h
FE10h
08h
CPU Context Pointer register
FC00h
FF6Ah
B5h
GPT2 CAPREL interrupt control register
- - 00h
FE08h
04h
CPU Code Segment Pointer register (read only)
0000h
80h
P0L direction control register
- - 00h
CP
CRIC
b
CSP
DP0L
110/176
b
F100h
E
Description
E
ST10F272M
Table 45.
Register set
List of special function registers (continued)
Physical
address
Name
8-bit
address
Description
Reset
value
DP0H
b
F102h
E
81h
P0h direction control register
- - 00h
DP1L
b
F104h
E
82h
P1L direction control register
- - 00h
DP1H
b
F106h
E
83h
P1h direction control register
- - 00h
DP2
b
FFC2h
E1h
Port 2 direction control register
0000h
DP3
b
FFC6h
E3h
Port 3 direction control register
0000h
DP4
b
FFCAh
E5h
Port 4 direction control register
- - 00h
DP6
b
FFCEh
E7h
Port 6 direction control register
- - 00h
DP7
b
FFD2h
E9h
Port 7 direction control register
- - 00h
DP8
b
FFD6h
EBh
Port 8 direction control register
- - 00h
DPP0
FE00h
00h
CPU data page pointer 0 register (10-bit)
0000h
DPP1
FE02h
01h
CPU data page pointer 1 register (10-bit)
0001h
DPP2
FE04h
02h
CPU data page pointer 2 register (10-bit)
0002h
DPP3
FE06h
03h
CPU data page pointer 3 register (10-bit)
0003h
EMUCON
FE0Ah
05h
Emulation control register
- - XXh
EXICON
b
F1C0h
E
E0h
External interrupt control register
0000h
EXISEL
b
F1DAh
E
EDh
External interrupt source selection register
0000h
IDCHIP
F07Ch
E
3Eh
Device identifier register (n is the device revision)
110nh
IDMANUF
F07Eh
E
3Fh
Manufacturer identifier register
0403h
IDMEM
F07Ah
E
3Dh
On-chip memory identifier register
2040h
IDPROG
F078h
E
3Ch
Programming voltage identifier register
0040h
IDX0
b
FF08h
84h
MAC unit address pointer 0
0000h
IDX1
b
FF0Ah
85h
MAC unit address pointer 1
0000h
MAH
FE5Eh
2Fh
MAC unit accumulator - high word
0000h
MAL
FE5Ch
2Eh
MAC unit accumulator - low word
0000h
MCW
b
FFDCh
EEh
MAC unit control word
0000h
MDC
b
FF0Eh
87h
CPU multiply divide control register
0000h
MDH
FE0Ch
06h
CPU multiply divide register – high word
0000h
MDL
FE0Eh
07h
CPU multiply divide register – low word
0000h
MRW
b
FFDAh
EDh
MAC unit repeat word
0000h
MSW
b
FFDEh
EFh
MAC unit status word
0200h
ODP2
b
F1C2h
E
E1h
Port 2 open drain control register
0000h
ODP3
b
F1C6h
E
E3h
Port 3 open drain control register
0000h
ODP4
b
F1CAh
E
E5h
Port 4 open drain control register
- - 00h
ODP6
b
F1CEh
E
E7h
Port 6 open drain control register
- - 00h
111/176
Register set
Table 45.
ST10F272M
List of special function registers (continued)
Physical
address
Name
8-bit
address
Description
Reset
value
ODP7
b
F1D2h
E
E9h
Port 7 open drain control register
- - 00h
ODP8
b
F1D6h
E
EBh
Port 8 open drain control register
- - 00h
ONES
b
FF1Eh
8Fh
Constant value 1’s register (read only)
FFFFh
P0L
b
FF00h
80h
PORT0 low register (lower half of PORT0)
- - 00h
P0H
b
FF02h
81h
PORT0 high register (upper half of PORT0)
- - 00h
P1L
b
FF04h
82h
PORT1 low register (lower half of PORT1)
- - 00h
P1H
b
FF06h
83h
PORT1 high register (upper half of PORT1)
- - 00h
P2
b
FFC0h
E0h
Port 2 register
0000h
P3
b
FFC4h
E2h
Port 3 register
0000h
P4
b
FFC8h
E4h
Port 4 register (8-bit)
- - 00h
P5
b
FFA2h
D1h
Port 5 register (read only)
P6
b
FFCCh
E6h
Port 6 register (8-bit)
- - 00h
P7
b
FFD0h
E8h
Port 7 register (8-bit)
- - 00h
P8
b
FFD4h
EAh
Port 8 register (8-bit)
- - 00h
P5DIDIS
b
FFA4h
D2h
Port 5 digital disable register
0000h
PECC0
FEC0h
60h
PEC channel 0 control register
0000h
PECC1
FEC2h
61h
PEC channel 1 control register
0000h
PECC2
FEC4h
62h
PEC channel 2 control register
0000h
PECC3
FEC6h
63h
PEC channel 3 control register
0000h
PECC4
FEC8h
64h
PEC channel 4 control register
0000h
PECC5
FECAh
65h
PEC channel 5 control register
0000h
PECC6
FECCh
66h
PEC channel 6 control register
0000h
PECC7
FECEh
67h
PEC channel 7 control register
0000h
PICON
F1C4h
E
E2h
Port input threshold control register
- - 00h
PP0
F038h
E
1Ch
PWM module period register 0
0000h
PP1
F03Ah
E
1Dh
PWM module period register 1
0000h
PP2
F03Ch
E
1Eh
PWM module period register 2
0000h
PP3
F03Eh
E
1Fh
PWM module period register 3
0000h
88h
CPU program status word
0000h
PSW
b
XXXXh
b
FF10h
PT0
F030h
E
18h
PWM module up/down counter 0
0000h
PT1
F032h
E
19h
PWM module up/down counter 1
0000h
PT2
F034h
E
1Ah
PWM module up/down counter 2
0000h
PT3
F036h
E
1Bh
PWM module up/down counter 3
0000h
PW0
FE30h
18h
PWM module pulse width register 0
0000h
112/176
ST10F272M
Table 45.
Register set
List of special function registers (continued)
Physical
address
Name
8-bit
address
Description
Reset
value
PW1
FE32h
19h
PWM module pulse width register 1
0000h
PW2
FE34h
1Ah
PWM module pulse width register 2
0000h
PW3
FE36h
1Bh
PWM module pulse width register 3
0000h
PWMCON0 b
FF30h
98h
PWM module control register 0
0000h
PWMCON1 b
FF32h
99h
PWM module control register 1
0000h
PWMIC
F17Eh
E
BFh
PWM module interrupt control register
- - 00h
QR0
F004h
E
02h
MAC unit offset register r0
0000h
QR1
F006h
E
03h
MAC unit offset register R1
0000h
QX0
F000h
E
00h
MAC unit offset register X0
0000h
QX1
F002h
E
01h
MAC unit offset register X1
0000h
F108h
E
84h
System start-up configuration register (read only)
FEB4h
5Ah
Serial channel 0 baudrate generator reload register
0000h
RP0H
b
b
S0BG
- - XXh
S0CON
b
FFB0h
D8h
Serial channel 0 control register
0000h
S0EIC
b
FF70h
B8h
Serial channel 0 error interrupt control register
- - 00h
FEB2h
59h
Serial channel 0 receive buffer register (read only)
- - XXh
B7h
Serial channel 0 receive interrupt control register
- - 00h
CEh
Serial channel 0 transmit buffer interrupt control reg.
- - 00h
FEB0h
58h
Serial channel 0 transmit buffer register (write only)
0000h
FF6Ch
B6h
Serial channel 0 transmit interrupt control register
- - 00h
SP
FE12h
09h
CPU system stack pointer register
FC00h
SSCBR
F0B4h
5Ah
SSC baudrate register
0000h
S0RBUF
S0RIC
b
FF6Eh
S0TBIC
b
F19Ch
S0TBUF
S0TIC
b
E
E
SSCCON
b
FFB2h
D9h
SSC control register
0000h
SSCEIC
b
FF76h
BBh
SSC error interrupt control register
- - 00h
59h
SSC receive buffer (read only)
BAh
SSC receive interrupt control register
- - 00h
58h
SSC transmit buffer (write only)
0000h
FF72h
B9h
SSC transmit interrupt control register
- - 00h
STKOV
FE14h
0Ah
CPU stack overflow pointer register
FA00h
STKUN
FE16h
0Bh
CPU stack underflow pointer register
FC00h
FF12h
89h
CPU system configuration register
FE50h
28h
CAPCOM timer 0 register
0000h
SSCRB
SSCRIC
F0B2h
b
SSCTB
SSCTIC
SYSCON
FF74h
F0B0h
b
b
T0
E
E
XXXXh
0xx0h(1)
T01CON
b
FF50h
A8h
CAPCOM timer 0 and timer 1 control register
0000h
T0IC
b
FF9Ch
CEh
CAPCOM timer 0 interrupt control register
- - 00h
FE54h
2Ah
CAPCOM timer 0 reload register
0000h
T0REL
113/176
Register set
Table 45.
ST10F272M
List of special function registers (continued)
Physical
address
Name
T1
8-bit
address
Description
Reset
value
FE52h
29h
CAPCOM timer 1 register
0000h
FF9Eh
CFh
CAPCOM timer 1 interrupt control register
- - 00h
T1REL
FE56h
2Bh
CAPCOM timer 1 reload register
0000h
T2
FE40h
20h
GPT1 timer 2 register
0000h
T1IC
b
T2CON
b
FF40h
A0h
GPT1 timer 2 control register
0000h
T2IC
b
FF60h
B0h
GPT1 timer 2 interrupt control register
- - 00h
FE42h
21h
GPT1 timer 3 register
0000h
T3
T3CON
b
FF42h
A1h
GPT1 timer 3 control register
0000h
T3IC
b
FF62h
B1h
GPT1 timer 3 interrupt control register
- - 00h
FE44h
22h
GPT1 timer 4 register
0000h
T4
T4CON
b
FF44h
A2h
GPT1 timer 4 control register
0000h
T4IC
b
FF64h
B2h
GPT1 timer 4 interrupt control register
- - 00h
FE46h
23h
GPT2 timer 5 register
0000h
T5
T5CON
b
FF46h
A3h
GPT2 timer 5 control register
0000h
T5IC
b
FF66h
B3h
GPT2 timer 5 interrupt control register
- - 00h
FE48h
24h
GPT2 timer 6 register
0000h
T6
T6CON
b
FF48h
A4h
GPT2 timer 6 control register
0000h
T6IC
b
FF68h
B4h
GPT2 timer 6 interrupt control register
- - 00h
28h
CAPCOM timer 7 register
0000h
90h
CAPCOM timer 7 and 8 control register
0000h
T7
F050h
E
T78CON
b
FF20h
T7IC
b
F17Ah
E
BDh
CAPCOM timer 7 interrupt control register
- - 00h
T7REL
F054h
E
2Ah
CAPCOM timer 7 reload register
0000h
T8
F052h
E
29h
CAPCOM timer 8 register
0000h
F17Ch
E
BEh
CAPCOM timer 8 interrupt control register
- - 00h
F056h
E
2Bh
CAPCOM timer 8 reload register
0000h
FFACh
D6h
Trap Flag register
0000h
FEAEh
57h
Watchdog timer register (read only)
0000h
FFAEh
D7h
Watchdog timer control register
00xxh(2)
800Bh
T8IC
b
T8REL
TFR
b
WDT
WDTCON
b
XADRS3
F01Ch
E
0Eh
XPER address select register 3
XP0IC
b
F186h
E
C3h
See Section 9.1
- - 00h(3)
XP1IC
b
F18Eh
E
C7h
See Section 9.1
- - 00h(3)
XP2IC
b
F196h
E
CBh
See Section 9.1
- - 00h(3)
XP3IC
b
F19Eh
E
CFh
See Section 9.1
- - 00h(3)
114/176
ST10F272M
Table 45.
Register set
List of special function registers (continued)
Physical
address
Name
XPERCON b
F024h
ZEROS
FF1Ch
b
8-bit
address
E
Description
Reset
value
12h
XPER configuration register
- - 05h
8Eh
Constant value 0’s register (read only)
0000h
1. The system configuration is selected during reset. SYSCON reset value is 0000 0xx0 x000 0000b.
2.
Reset value depends on different triggered reset event.
3. The XPnIC Interrupt Control Registers control interrupt requests from integrated X-Bus peripherals. Some software
controlled interrupt requests may be generated by setting the XPnIR bits (of XPnIC register) of the unused X-Peripheral
nodes.
23.2
X-registers
The following table lists all X-Bus registers which are implemented in the ST10F272M
ordered by their name. The Flash control registers are listed in a separate section, in spite of
they also are physically mapped on X-Bus memory space.
Note:
The X-Registers are not bit-addressable.
Table 46.
List of XBus registers
Name
Physical
address
Description
Reset
value
CAN1BRPER
EF0Ch
CAN1: BRP extension register
0000h
CAN1BTR
EF06h
CAN1: Bit timing register
2301h
CAN1CR
EF00h
CAN1: CAN control register
0001h
CAN1EC
EF04h
CAN1: error counter
0000h
CAN1IF1A1
EF18h
CAN1: IF1 arbitration 1
0000h
CAN1IF1A2
EF1Ah
CAN1: IF1 arbitration 2
0000h
CAN1IF1CM
EF12h
CAN1: IF1 command mask
0000h
CAN1IF1CR
EF10h
CAN1: IF1 command request
0001h
CAN1IF1DA1
EF1Eh
CAN1: IF1 data A 1
0000h
CAN1IF1DA2
EF20h
CAN1: IF1 data A 2
0000h
CAN1IF1DB1
EF22h
CAN1: IF1 data B 1
0000h
CAN1IF1DB2
EF24h
CAN1: IF1 data B 2
0000h
CAN1IF1M1
EF14h
CAN1: IF1 mask 1
FFFFh
CAN1IF1M2
EF16h
CAN1: IF1 mask 2
FFFFh
CAN1IF1MC
EF1Ch
CAN1: IF1 message control
0000h
CAN1IF2A1
EF48h
CAN1: IF2 arbitration 1
0000h
CAN1IF2A2
EF4Ah
CAN1: IF2 arbitration 2
0000h
CAN1IF2CM
EF42h
CAN1: IF2 command mask
0000h
CAN1IF2CR
EF40h
CAN1: IF2 command request
0001h
CAN1IF2DA1
EF4Eh
CAN1: IF2 data A 1
0000h
115/176
Register set
ST10F272M
Table 46.
List of XBus registers (continued)
Name
116/176
Physical
address
Description
Reset
value
CAN1IF2DA2
EF50h
CAN1: IF2 data A 2
0000h
CAN1IF2DB1
EF52h
CAN1: IF2 data B 1
0000h
CAN1IF2DB2
EF54h
CAN1: IF2 data B 2
0000h
CAN1IF2M1
EF44h
CAN1: IF2 Mask 1
FFFFh
CAN1IF2M2
EF46h
CAN1: IF2 mask 2
FFFFh
CAN1IF2MC
EF4Ch
CAN1: IF2 message control
0000h
CAN1IP1
EFA0h
CAN1: interrupt pending 1
0000h
CAN1IP2
EFA2h
CAN1: interrupt pending 2
0000h
CAN1IR
EF08h
CAN1: interrupt register
0000h
CAN1MV1
EFB0h
CAN1: message valid 1
0000h
CAN1MV2
EFB2h
CAN1: message valid 2
0000h
CAN1ND1
EF90h
CAN1: new data 1
0000h
CAN1ND2
EF92h
CAN1: new data 2
0000h
CAN1SR
EF02h
CAN1: status register
0000h
CAN1TR
EF0Ah
CAN1: test register
00x0h
CAN1TR1
EF80h
CAN1: transmission request 1
0000h
CAN1TR2
EF82h
CAN1: transmission request 2
0000h
CAN2BRPER
EE0Ch
CAN2: BRP extension register
0000h
CAN2BTR
EE06h
CAN2: bit timing register
2301h
CAN2CR
EE00h
CAN2: CAN control register
0001h
CAN2EC
EE04h
CAN2: error counter
0000h
CAN2IF1A1
EE18h
CAN2: IF1 arbitration 1
0000h
CAN2IF1A2
EE1Ah
CAN2: IF1 arbitration 2
0000h
CAN2IF1CM
EE12h
CAN2: IF1 command mask
0000h
CAN2IF1CR
EE10h
CAN2: IF1 command request
0001h
CAN2IF1DA1
EE1Eh
CAN2: IF1 data A 1
0000h
CAN2IF1DA2
EE20h
CAN2: IF1 data A 2
0000h
CAN2IF1DB1
EE22h
CAN2: IF1 data B 1
0000h
CAN2IF1DB2
EE24h
CAN2: IF1 data B 2
0000h
CAN2IF1M1
EE14h
CAN2: IF1 mask 1
FFFFh
CAN2IF1M2
EE16h
CAN2: IF1 mask 2
FFFFh
CAN2IF1MC
EE1Ch
CAN2: IF1 message control
0000h
CAN2IF2A1
EE48h
CAN2: IF2 arbitration 1
0000h
CAN2IF2A2
EE4Ah
CAN2: IF2 arbitration 2
0000h
ST10F272M
Register set
Table 46.
List of XBus registers (continued)
Name
Physical
address
Description
Reset
value
CAN2IF2CM
EE42h
CAN2: IF2 command mask
0000h
CAN2IF2CR
EE40h
CAN2: IF2 command request
0001h
CAN2IF2DA1
EE4Eh
CAN2: IF2 data A 1
0000h
CAN2IF2DA2
EE50h
CAN2: IF2 data A 2
0000h
CAN2IF2DB1
EE52h
CAN2: IF2 data B 1
0000h
CAN2IF2DB2
EE54h
CAN2: IF2 data B 2
0000h
CAN2IF2M1
EE44h
CAN2: IF2 mask 1
FFFFh
CAN2IF2M2
EE46h
CAN2: IF2 mask 2
FFFFh
CAN2IF2MC
EE4Ch
CAN2: IF2 message control
0000h
CAN2IP1
EEA0h
CAN2: interrupt pending 1
0000h
CAN2IP2
EEA2h
CAN2: interrupt pending 2
0000h
CAN2IR
EE08h
CAN2: interrupt register
0000h
CAN2MV1
EEB0h
CAN2: message valid 1
0000h
CAN2MV2
EEB2h
CAN2: message valid 2
0000h
CAN2ND1
EE90h
CAN2: new data 1
0000h
CAN2ND2
EE92h
CAN2: new data 2
0000h
CAN2SR
EE02h
CAN2: status register
0000h
CAN2TR
EE0Ah
CAN2: test register
00x0h
CAN2TR1
EE80h
CAN2: transmission request 1
0000h
CAN2TR2
EE82h
CAN2: Transmission request 2
0000h
I2CCCR1
EA06h
I2C clock control register 1
0000h
I2CCCR2
EA0Eh
I2C clock control register 2
0000h
I2CCR
EA00h
I2C control register
0000h
I2CDR
EA0Ch
I2C data register
0000h
I2COAR1
EA08h
I2C own address register 1
0000h
I2COAR2
EA0Ah
I2C own address register 2
0000h
I2CSR1
EA02h
I2C status register 1
0000h
I2CSR2
EA04h
I2C status register 2
0000h
RTCAH
ED14h
RTC alarm register high byte
XXXXh
RTCAL
ED12h
RTC alarm register low byte
XXXXh
RTCCON
ED00H
RTC control register
000Xh
RTCDH
ED0Ch
RTC divider counter high byte
XXXXh
RTCDL
ED0Ah
RTC divider counter low byte
XXXXh
RTCH
ED10h
RTC programmable counter high byte
XXXXh
117/176
Register set
ST10F272M
Table 46.
List of XBus registers (continued)
Name
118/176
Physical
address
Description
Reset
value
RTCL
ED0Eh
RTC programmable counter low byte
XXXXh
RTCPH
ED08h
RTC prescaler register high byte
XXXXh
RTCPL
ED06h
RTC prescaler register low byte
XXXXh
XCLKOUTDIV
EB02h
CLKOUT divider control register
- - 00h
XEMU0
EB76h
XBUS emulation register 0 (write only)
XXXXh
XEMU1
EB78h
XBUS emulation register 1 (write only)
XXXXh
XEMU2
EB7Ah
XBUS emulation register 2 (write only)
XXXXh
XEMU3
EB7Ch
XBUS emulation register 3 (write only)
XXXXh
XIR0CLR
EB14h
X-Interrupt 0 clear register (write only)
0000h
XIR0SEL
EB10h
X-Interrupt 0 selection register
0000h
XIR0SET
EB12h
X-Interrupt 0 set register (write only)
0000h
XIR1CLR
EB24h
X-Interrupt 1 clear register (write only)
0000h
XIR1SEL
EB20h
X-Interrupt 1 selection register
0000h
XIR1SET
EB22h
X-Interrupt 1 set register (write only)
0000h
XIR2CLR
EB34h
X-Interrupt 2 clear register (write only)
0000h
XIR2SEL
EB30h
X-Interrupt 2 selection register
0000h
XIR2SET
EB32h
X-Interrupt 2 set register (write only)
0000h
XIR3CLR
EB44h
X-Interrupt 3 clear selection register (write only)
0000h
XIR3SEL
EB40h
X-Interrupt 3 selection register
0000h
XIR3SET
EB42h
X-Interrupt 3 set selection register (write only)
0000h
XMISC
EB46h
XBUS miscellaneous features register
0000h
XP1DIDIS
EB36h
Port 1 digital disable register
0000h
XPEREMU
EB7Eh
XPERCON copy for emulation (write only)
XXXXh
XPICON
EB26h
Extended port input threshold control register
- - 00h
XPOLAR
EC04h
XPWM module channel polarity register
0000h
XPP0
EC20h
XPWM module period register 0
0000h
XPP1
EC22h
XPWM module period register 1
0000h
XPP2
EC24h
XPWM module period register 2
0000h
XPP3
EC26h
XPWM module period register 3
0000h
XPT0
EC10h
XPWM module up/down counter 0
0000h
XPT1
EC12h
XPWM module up/down counter 1
0000h
XPT2
EC14h
XPWM module up/down counter 2
0000h
XPT3
EC16h
XPWM module up/down counter 3
0000h
XPW0
EC30h
XPWM module pulse width register 0
0000h
ST10F272M
Register set
Table 46.
List of XBus registers (continued)
Name
Physical
address
Description
Reset
value
XPW1
EC32h
XPWM module pulse width register 1
0000h
XPW2
EC34h
XPWM module pulse width register 2
0000h
XPW3
EC36h
XPWM module pulse width register 3
0000h
XPWMCON0
EC00h
XPWM module control register 0
0000h
XPWMCON0CLR
EC08h
XPWM module clear control reg. 0 (write only)
0000h
XPWMCON0SET
EC06h
XPWM module set control register 0 (write only)
0000h
XPWMCON1
EC02h
XPWM module control register 1
0000h
XPWMCON1CLR
EC0Ch
XPWM module clear control reg. 0 (write only)
0000h
XPWMCON1SET
EC0Ah
XPWM module set control register 0 (write only)
0000h
XPWMPORT
EC80h
XPWM module port control register
0000h
XS1BG
E906h
XASC baudrate generator reload register
0000h
XS1CON
E900h
XASC control register
0000h
XS1CONCLR
E904h
XASC clear control register (write only)
0000h
XS1CONSET
E902h
XASC set control register (write only)
0000h
XS1PORT
E980h
XASC port control register
0000h
XS1RBUF
E90Ah
XASC receive buffer register
0000h
XS1TBUF
E908h
XASC transmit buffer register
0000h
XSSCBR
E80Ah
XSSC baudrate register
0000h
XSSCCON
E800h
XSSC control register
0000h
XSSCCONCLR
E804h
XSSC clear control register (write only)
0000h
XSSCCONSET
E802h
XSSC set control register (write only)
0000h
XSSCPORT
E880h
XSSC port control register
0000h
XSSCRB
E808h
XSSC receive buffer
XXXXh
XSSCTB
E806h
XSSC transmit buffer
0000h
119/176
Register set
23.3
ST10F272M
Flash registers ordered by name
The following table lists all Flash Control Registers which are implemented in the
ST10F272M ordered by their name. These registers are physically mapped on the IBus,
except for XFVTAUR0, which is mapped on XBus. Note that these registers are not bitaddressable.
Table 47.
Name
23.4
List of Flash registers
Physical
address
Description
Reset value
FARH
0x0008 0012
Flash address register - high
0000h
FARL
0x0008 0010
Flash address register - low
0000h
FCR0H
0x0008 0002
Flash control register 0 - high
0000h
FCR0L
0x0008 0000
Flash control register 0 - low
0000h
FCR1H
0x0008 0006
Flash control register 1 - high
0000h
FCR1L
0x0008 0004
Flash control register 1 - low
0000h
FDR0H
0x0008 000A
Flash data register 0 - high
FFFFh
FDR0L
0x0008 0008
Flash data register 0 - low
FFFFh
FDR1H
0x0008 000E
Flash data register 1 - high
FFFFh
FDR1L
0x0008 000C
Flash data register 1 - low
FFFFh
FER
0x0008 0014
Flash error register
0000h
FNVAPR0
0x0008 DFB8
Flash non-volatile access protection reg.0
ACFFh
FNVAPR1H
0x0008 DFBE
Flash non-volatile access protection reg.1 - high
FFFFh
FNVAPR1L
0x0008 DFBC
Flash non-volatile access protection reg.1 - low
FFFFh
FNVWPIR
0x0008 DFB0
Flash non-volatile protection I register
FFFFh
XFVTAUR0
0x0000 EB50
XBus Flash volatile temporary access
unprotection register 0
0000h
Identification registers
The ST10F272M have four Identification registers, mapped in ESFR space. These registers
contain:
120/176
●
A manufacturer identifier
●
A chip identifier with its revision
●
An internal Flash and size identifier
●
Programming voltage description
ST10F272M
Register set
IDMANUF (F07Eh / 3Fh)
15
14
Table 48.
13
12
ESFR
11
10
9
8
Name
15:5
MANUF
4
3
2
1
0
MANUF
0
0
0
1
1
RO
RO
RO
RO
RO
RO
14
Manufacturer identifier
020h: STMicroelectronics manufacturer (JTAG worldwide normalization)
13
12
ESFR
11
10
9
8
7
Reset value: 110Xh
6
5
3
2
1
REVID
RO
RO
0
IDCHIP register description
Name
15:4
IDCHIP
Device identifier
110h: ST10F272M identifier (272)
3:0
REVID
Device revision identifier
Xh: According to revision number
Function
IDMEM (F07Ah / 3Dh)
14
13
12
ESFR
11
10
9
8
7
Reset value: 2040h
6
5
MEMTYP
MEMSIZE
RO
RO
Table 50.
4
IDCHIP
Bit
15
5
Function
IDCHIP (F07Ch / 3Eh)
Table 49.
6
IDMANUF register description
Bit
15
7
Reset value: 0403h
4
3
2
1
0
IDMEM register description
Bit
Name
15:12
MEMSIZE
Function
Internal memory size
Internal memory size is 4 x (MEMSIZE) (in Kbyte)
040h for 256 Kbytes (ST10F272M)
Internal memory type
11:0
MEMTYP
0h: ROM-Less
1h: (M) ROM memory
2h: (S) Standard Flash memory (ST10F272M)
3h: (H) High performance Flash memory
4h...Fh: Reserved
121/176
Register set
ST10F272M
IDPROG (F078h / 3Ch)
15
14
Table 51.
Bit
Note:
122/176
13
ESFR
12
11
10
9
8
7
Reset value: 0040h
6
5
4
3
PROGVPP
PROGVDD
RO
RO
2
1
0
IDPROG register description
Name
Function
15:8
PROGVPP Programming VPP voltage (no need of external VPP) - 00h
7:0
Programming VDD voltage
PROGVDD VDD voltage when programming EPROM or Flash devices is calculated
using the following formula: VDD = 20 x [PROGVDD] / 256 (volts) - 40h
for ST10F272M (5V).
All identification words are read-only registers.
ST10F272M
Electrical characteristics
24
Electrical characteristics
24.1
Absolute maximum ratings
Table 52.
Absolute maximum ratings
Symbol
Parameter
Values
Unit
VDD
Voltage on VDD pins with respect to ground (VSS)
-0.5 to +6.5
V
VSTBY
Voltage on VSTBY pin with respect to ground (VSS)
-0.5 to +6.5
V
VAREF
Voltage on VAREF pins with respect to ground (VSS)
-0.3 to VDD
V
VAGND
Voltage on VAGND pins with respect to ground (VSS)
VSS
V
-0.5 to VDD + 0.5
V
VIO
Voltage on any pin with respect to ground (VSS)
IOV
Input current on any pin during overload condition
± 10
mA
ITOV
Absolute sum of all input currents during overload condition
| 75 |
mA
TST
Storage temperature
-65 to +150
°C
ESD
ESD Susceptibility (Human Body Model)
2000
V
Note:
Stresses above those listed under “Absolute Maximum Ratings” may cause permanent
damage to the device. This is a stress rating only and functional operation of the device at
these or any other conditions above those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions for extended
periods may affect device reliability. During overload conditions (VIN > VDD or VIN < VSS) the
voltage on pins with respect to ground (VSS) must not exceed the values defined by the
Absolute Maximum Ratings.
During Power-on and Power-off transients (including Standby entering/exiting phases), the
relationships between voltages applied to the device and the main VDD must always be
respected. In particular, power-on and power-off of VAREF must be coherent with VDD
transient, in order to avoid undesired current injection through the on-chip protection diodes.
123/176
Electrical characteristics
ST10F272M
24.2
Recommended operating conditions
Table 53.
Recommended operating conditions
Value
Symbol
VDD
Parameter
Unit
Min
Max
4.5
5.5
Operating supply voltage
VSTBY
Operation stand-by supply voltage(1)
VAREF
Operating analog reference voltage(2)
TA
Ambient temperature under bias
TJ
Junction temperature under bias
V
+125
-40
°C
+150
1. The value of the VSTBY voltage is specified in the range of 4.5 to 5.5 volts. When VSTBY voltage is lower than main VDD, the
input section of VSTBY/EA pin can generate a spurious static consumption on VDD power supply (in the range of tenth of
µA).
2. For details on operating conditions concerning the usage of A/D Converter refer to Section 24.7.
24.3
Power considerations
The average chip-junction temperature, TJ, in degrees Celsius, may be calculated using the
following equation:
TJ = TA + (PD x ΘJA) (1)
Where:
TA is the Ambient Temperature in °C,
ΘJA is the Package Junction-to-Ambient Thermal Resistance, in °C/W,
PD is the sum of PINT and PI/O (PD = PINT + PI/O),
PINT is the product of IDD and VDD, expressed in Watt. This is the Chip Internal Power,
PI/O represents the Power Dissipation on Input and Output Pins; User Determined.
Most of the time for the applications PI/O < PINT and may be neglected. On the other hand,
PI/O may be significant if the device is configured to drive continuously external modules
and/or memories.
An approximate relationship between PD and TJ (if PI/O is neglected) is given by:
PD = K / (TJ + 273°C) (2)
Therefore (solving equations 1 and 2):
K = PD x (TA + 273°C) + ΘJA x PD2 (3)
Where:
K is a constant for the particular part, which may be determined from equation (3) by
measuring PD (at equilibrium) for a known TA. Using this value of K, the values of PD and TJ
may be obtained by solving equations (1) and (2) iteratively for any value of TA.
124/176
ST10F272M
Electrical characteristics
Table 54.
Thermal characteristics
Symbol
Description
Value (typical)
Unit
30
40
35
°C/W
Thermal Resistance Junction-Ambient
PQFP 144 - 28 x 28 x 3.4 mm / 0.65 mm pitch
LQFP 144 - 20 x 20 mm / 0.5 mm pitch
LQFP 144 - 20 x 20 mm / 0.5 mm pitch on four-layer FR4
board (2 layers signals / 2 layers power)
ΘJA
Based on thermal characteristics of the package and with reference to the power
consumption figures provided in the next tables and diagrams, the following product
classification can be proposed. However, the exact power consumption of the device inside
the application must be computed according to different working conditions, thermal profiles,
real thermal resistance of the system (including printed circuit board or other substrata), I/O
activity, and so on.
Table 55.
Package characteristics
Package
Ambient temperature range
CPU frequency range
-40 to +125°C
1 to 40 MHz
PQFP 144
LQFP 144
24.4
Parameter interpretation
The parameters listed in the following tables represent the characteristics of the
ST10F272M and its demands on the system.
Where the ST10F272M logic provides signals with their respective timing characteristics,
the symbol “CC” for Controller Characteristics, is included in the “Symbol” column. Where
the external system must provide signals with their respective timing characteristics to the
ST10F272M, the symbol “SR” for System Requirement, is included in the “Symbol” column.
24.5
DC characteristics
VDD = 5 V ± 10%, VSS = 0 V, TA = -40 to +125°C
Table 56.
DC characteristics
Limit values
Parameter
Symbol
Min
Max
Unit
Test condition
Input low voltage (TTL mode)
(except RSTIN, EA, NMI, RPD, XTAL1,
READY)
VIL
SR
-0.3
0.8
V
–
Input low voltage (CMOS mode)
(except RSTIN, EA, NMI, RPD, XTAL1,
READY)
VILS
SR
-0.3
0.3 VDD
V
–
Input low voltage RSTIN, EA, NMI, RPD
VIL1
SR
-0.3
0.3 VDD
V
–
Input low voltage XTAL1 (CMOS only)
VIL2
SR
-0.3
0.3 VDD
V
Direct Drive mode
125/176
Electrical characteristics
Table 56.
ST10F272M
DC characteristics (continued)
Limit values
Parameter
Symbol
Min
Max
Unit
Test condition
Input low voltage READY (TTL only)
VIL3
SR
-0.3
0.8
V
–
Input high voltage (TTL mode)
(except RSTIN, EA, NMI, RPD, XTAL1)
VIH
SR
2.0
VDD + 0.3
V
–
Input high voltage (CMOS mode)
(except RSTIN, EA, NMI, RPD, XTAL1)
VIHS
SR
0.7 VDD
VDD + 0.3
V
–
Input high voltage RSTIN, EA, NMI, RPD VIH1
SR
0.7 VDD
VDD + 0.3
V
–
Input high voltage XTAL1 (CMOS only)
VIH2
SR
0.7 VDD
VDD + 0.3
V
Direct Drive mode
Input high voltage READY (TTL only)
VIH3
SR
2.0
VDD + 0.3
V
–
Input Hysteresis (TTL mode)
(except RSTIN, EA, NMI, XTAL1, RPD)
VHYS
CC
400
700
mV
(1)
Input Hysteresis (CMOS mode)
(except RSTIN, EA, NMI, XTAL1, RPD)
VHYSS CC
750
1400
mV
(1)
Input Hysteresis RSTIN, EA, NMI
VHYS1 CC
750
1400
mV
(1)
Input Hysteresis XTAL1
VHYS2 CC
0
50
mV
(1)
Input Hysteresis READY (TTL only)
VHYS3 CC
400
700
mV
(1)
Input Hysteresis RPD
VHYS4 CC
500
1500
mV
(1)
Output low voltage
(P6[7:0], ALE, RD, WR/WRL,
BHE/WRH, CLKOUT, RSTIN,
RSTOUT)
VOL
CC
–
0.4
0.05
V
IOL = 8mA
IOL = 1mA
Output low voltage
(P0[15:0], P1[15:0], P2[15:0],
P3[15,13:0], P4[7:0], P7[7:0],
P8[7:0])
VOL1
CC
–
0.4
0.05
V
IOL1 = 4mA
IOL1 = 0.5mA
Output low voltage RPD
VOL2
CC
–
VDD
0.5 VDD
0.3 VDD
V
IOL2 = 85µA
IOL2 = 80µA
IOL2 = 60µA
Output high voltage
(P6[7:0], ALE, RD, WR/WRL,
BHE/WRH, CLKOUT, RSTOUT)
VOH
CC
VDD - 0.8
VDD - 0.08
–
V
IOH = – 8mA
IOH = – 1mA
Output high voltage(2)
(P0[15:0], P1[15:0], P2[15:0],
P3[15,13:0], P4[7:0], P7[7:0],
P8[7:0])
VOH1
CC
VDD - 0.8
VDD - 0.08
–
V
IOH1 = – 4mA
IOH1 = – 0.5mA
Output high voltage RPD
VOH2
CC
0
0.3 VDD
0.5 VDD
–
V
IOH2 = – 2mA
IOH2 = – 750µA
IOH2 = – 150µA
Input leakage current (P5[15:0])(3)
|IOZ1 |
CC
–
±0.2
µA
–
Input leakage current
(all except P5[15:0], P2[0], RPD, P3[12],
P3[15])
|IOZ2 |
CC
–
±0.5
µA
–
126/176
ST10F272M
Table 56.
Electrical characteristics
DC characteristics (continued)
Limit values
Parameter
Symbol
Min
Max
Unit
Test condition
Input leakage current (P2[0])(4)
|IOZ3 |
CC
–
+1.0
-0.5
µA
–
Input leakage current (RPD)
|IOZ4 |
CC
–
±3.0
µA
–
Input leakage current (P3[12], P3[15])
|IOZ5 |
CC
–
±1.0
µA
–
Overload current (all except P2[0])
|IOV1 |
SR
–
±5
mA
(1)(5)
Overload current (P2[0])(4)
|IOV2 |
SR
–
+5
-1
mA
(1)(5)
RSTIN pull-up resistor
RRST
CC
50
250
kΩ
100 kΩ nominal
IRWH
–
-40
µA
VOUT = 2.4V
IRWL
-500
–
µA
VOUT = 0.4V
IALEL
20
–
µA
VOUT = 0.4V
IALEH
–
300
µA
VOUT = 2.4V
IP6H
–
-40
µA
VOUT = 2.4V
IP6L
Read/Write inactive current(6)(7)
(6)(8)
Read/Write active current
ALE inactive
current(6)(7)
ALE active current
(6)(8)
Port 6 inactive current (P6[4:0])(6)(7)
(6)(8)
Port 6 active current (P6[4:0])
PORT0 configuration current(6)
-500
–
µA
VOUT = 0.4V
IP0H(6)
–
-10
µA
VIN = 2.0V
IP0L(7)
-100
–
µA
VIN = 0.8V
–
10
pF
(1)(6)
Pin Capacitance (Digital inputs / outputs) CIO
CC
Run Mode Power supply current(9)
(Execution from Internal RAM)
ICC1
–
15 + 1.5
fCPU
mA
–
Run Mode Power supply current(1)(10)
(Execution from Internal Flash)
ICC2
–
15 + 1.5
fCPU
mA
–
Idle mode supply current(11)
IID
–
15 + 0.6
fCPU
mA
–
Power-down supply current(12)
(RTC off, Oscillators off,
Main Voltage Regulator off)
IPD1
–
200
µA
TA = 25°C
Power-down supply current(12)
(RTC on, Main Oscillator on,
Main Voltage Regulator off)
IPD2
–
400
Typical
Value
µA
TA = 25°C
Power-down supply current(12)
(RTC on, 32 kHz Oscillator on,
Main Voltage Regulator off)
IPD3
–
200
µA
TA = 25°C
–
120
µA
VSTBY = 5.5V
TA = TJ = 25°C
–
500
µA
VSTBY = 5.5V
TA = TJ = 125°C
Stand-by supply current(12)
(RTC off, Oscillators off, VDD off, VSTBY
on)
ISB1
127/176
Electrical characteristics
Table 56.
ST10F272M
DC characteristics (continued)
Limit values
Parameter
Symbol
Stand-by supply current(12)
(RTC on, 32 kHz Oscillator on,
main VDD off, VSTBY on)
ISB2
Stand-by supply current(1)(12)
(VDD transient condition)
ISB3
Unit
Test condition
120
µA
VSTBY = 5.5V
TA = TJ = 25°C
–
500
µA
VSTBY = 5.5V
TA = TJ = 125°C
–
2.5
mA
–
Min
Max
–
1. Not 100% tested, guaranteed by design characterization.
2. This specification is not valid for outputs which are switched to open drain mode. In this case the respective output will float
and the voltage is imposed by the external circuitry.
3. Port 5 leakage values are granted for not selected A/D Converter channel. One channels is always selected (by default,
after reset, P5.0 is selected). For the selected channel the leakage value is similar to that of other port pins.
4. The leakage of P2.0 is higher than other pins due to the additional logic (pass gates active only in specific test modes)
implemented on input path. Pay attention to not stress P2.0 input pin with negative overload beyond the specified limits:
failures in Flash reading may occur (sense amplifier perturbation). Refer to next Figure 37 for a scheme of the input
circuitry.
5. Overload conditions occur if the standard operating conditions are exceeded, that is, the voltage on any pin exceeds the
specified range (that is, VOV > VDD + 0.3V or VOV < -0.3V). The absolute sum of input overload currents on all port pins may
not exceed 50mA. The supply voltage must remain within the specified limits.
6. This specification is only valid during Reset, or during Hold- or Adapt-mode. Port 6 pins are only affected, if they are used
for CS output and the open drain function is not enabled.
7. The maximum current may be drawn while the respective signal line remains inactive.
8. The minimum current must be drawn in order to drive the respective signal line active.
9. The power supply current is a function of the operating frequency (fCPU is expressed in MHz). This dependency is
illustrated in Figure 38 below. This parameter is tested at VDDmax and at maximum CPU clock frequency with all outputs
disconnected and all inputs at VIL or VIH, RSTIN pin at VIH1min: this implies I/O current is not considered. The device is
doing the following:
Fetching code from IRAM and XRAM1, accessing in read and write to both XRAM modules
Watchdog Timer is enabled and regularly serviced
RTC is running with main oscillator clock as reference, generating a tick interrupts every 192 clock cycles
Four channel of XPWM are running (waves period: 2, 2.5, 3 and 4 CPU clock cycles): no output toggling
Five General Purpose Timers are running in timer mode with prescaler equal to 8 (T2, T3, T4, T5, T6)
ADC is in Auto Scan Continuous Conversion mode on all 16 channels of Port5
All interrupts generated by XPWM, RTC, Timers and ADC are not serviced
10. The power supply current is a function of the operating frequency (fCPU is expressed in MHz). This dependency is
illustrated in Figure 38 below. This parameter is tested at VDDmax and at maximum CPU clock frequency with all outputs
disconnected and all inputs at VIL or VIH, RSTIN pin at VIH1min: this implies I/O current is not considered. The device is
doing the following:
- Fetching code from all sectors of IFlash, accessing in read (few fetches) and write to XRAM
- Watchdog Timer is enabled and regularly serviced
- RTC is running with main oscillator clock as reference, generating a tick interrupts every 192 clock cycles
- Four channel of XPWM are running (waves period: 2, 2.5, 3 and 4 CPU clock cycles): no output toggling
- Five General Purpose Timers are running in timer mode with prescaler equal to 8 (T2, T3, T4, T5, T6)
- ADC is in Auto Scan Continuous Conversion mode on all 16 channels of Port5
- All interrupts generated by XPWM, RTC, Timers and ADC are not serviced
11. The Idle mode supply current is a function of the operating frequency (fCPU is expressed in MHz). This dependency is
illustrated in Figure 37 below. These parameters are tested and at maximum CPU clock with all outputs disconnected and
all inputs at VIL or VIH, RSTIN pin at VIH1min.
12. This parameter is tested including leakage currents. All inputs (including pins configured as inputs) at 0V to 0.1V or at VDD
- 0.1V to VDD, VAREF = 0V, all outputs (including pins configured as outputs) disconnected. Also, the Main Voltage
Regulator is assumed to be off; if it is not, an additional 1mA must be added.
128/176
ST10F272M
Electrical characteristics
Figure 37. Port2 test mode structure
P2.0
CC0IO
Output
buffer
Clock
Alternate data input
Input
latch
Fast external interrupt input
Test mode
Flash sense amplifier
and column decoder
Figure 38. Supply current versus the operating frequency (RUN and IDLE modes)
150
ICC1 = ICC2
I [mA]
100
IID
50
0
0
10
20
30
40
fCPU [MHz]
50
60
70
129/176
Electrical characteristics
24.6
ST10F272M
Flash characteristics
VDD = 5V ± 10%, VSS = 0V
Table 57.
Flash characteristics
Parameter
Typical
Maximum
TA = 25°C
TA = 125°C
Unit
Notes
0 cycles(1)
0 cycles(1)
100k cycles
35
80
290
µs
–
Double Word Program (64-bit)
60
150
570
µs
–
Bank 0 Program (256 Kbyte)
(Double Word Program)
1.6
2.0
3.9
s
–
Sector Erase (8 Kbyte)
0.6
0.5
0.9
0.8
1.0
0.9
s
not preprogrammed
preprogrammed
Sector Erase (32 Kbyte)
1.1
0.8
2.0
1.8
2.7
2.5
s
not preprogrammed
preprogrammed
Sector Erase (64 Kbyte)
1.7
1.3
3.7
3.3
5.1
4.7
s
not preprogrammed
preprogrammed
Bank 0 Erase (256 Kbyte)(3)
5.6
4.0
13.6
11.9
19.2
17.5
s
not preprogrammed
preprogrammed
Recovery from Power-Down (tPD)
–
40
40
µs
(4)
Program Suspend Latency(4)
–
10
10
µs
–
–
30
30
µs
–
Erase Suspend Request Rate(4)
20
20
20
ms
Minimum delay between
two requests
Set Protection(4)
40
90
300
µs
–
Word Program (32-bit) (2)
(2)
Erase Suspend Latency
(4)
1. The figures are given after about 100 cycles due to testing routines (0 cycles at the final customer).
2. Word and Double Word Programming times are provided as average values derived from a full sector programming time:
absolute value of a Word or Double Word Programming time could be longer than the average value.
3. Bank Erase is obtained through a multiple Sector Erase operation (setting bits related to all sectors of the Bank). As
ST10F272M implements only one bank, the Bank Erase operation is equivalent to Module and Chip Erase operations.
4. Not 100% tested, guaranteed by Design Characterization.
130/176
ST10F272M
Table 58.
Electrical characteristics
Flash data retention characteristics
Data retention time
(average ambient temperature 60°C)
Number of program / erase cycles
(-40°C < TA < 125°C)
256 Kbyte (code store)
64 Kbyte (EEPROM emulation)(1)
0 - 100
> 20 years
> 20 years
1000
-
> 20 years
10000
-
10 years
100000
-
1 year
1. Two 64 Kbyte Flash Sectors may be typically used to emulate up to 4, 8 or 16 Kbytes of EEPROM. Therefore, in case of an
emulation of a 16 Kbyte EEPROM, 100,000 Flash Program / Erase cycles are equivalent to 800,000 EEPROM
Program/Erase cycles. For an efficient use of the EEPROM Emulation please refer to dedicated Application Note document
(AN2061 - “EEPROM Emulation with ST10F2xx”). Contact your local field service, local sales person or STMicroelectronics
representative to obtain a copy of such a guideline document.
24.7
A/D converter characteristics
VDD = 5V ± 10%, VSS = 0V, TA = -40 to +125°C, 4.5V ≤ VAREF ≤ VDD,
VSS ≤ VAGND ≤ VSS + 0.2V
Table 59.
A/D converter characteristics
Limit values
Parameter
Symbol
Unit
Min
Max
Analog Reference voltage(1)
VAREF SR
4.5
VDD
V
Analog Ground voltage
VAGND SR
VSS
VSS + 0.2
V
(2)
Test condition
Analog Input voltage
VAIN
SR
VAGND
VAREF
V
Reference supply current
IAREF
CC
–
–
5
1
mA
µA
Running mode(3)
Power-down mode
Sample time
tS
CC
1
–
µs
(4)
Conversion time
tC
CC
3
–
µs
(5)
DNL
CC
-1
+1
LSB
No overload
INL
CC
-1.5
+1.5
LSB
No overload
Offset Error(6)
OFS
CC
-1.5
+1.5
LSB
No overload
Total unadjusted error(6)
TUE
CC
-2.0
-5.0
-7.0
+2.0
+5.0
+7.0
LSB
Port5
Port1 - No overload(3)
Port1 - Overload(3)
Coupling Factor between inputs(3)(7)
K
CC
–
10–6
–
CP1
CC
–
3
pF
CP2
CC
–
4
6
pF
CS
CC
–
3.5
pF
Differential Non Linearity(6)
Integral Non Linearity
Input Pin
(6)
Capacitance(3)(8)
Sampling Capacitance(3)(8)
On both Port5 and Port1
Port5
Port1
131/176
Electrical characteristics
Table 59.
ST10F272M
A/D converter characteristics (continued)
Limit values
Parameter
Analog Switch Resistance(3)(8)
Symbol
Unit
Min
Max
RSW
CC
–
–
600
1600
W
RAD
CC
–
1300
W
Test condition
Port5
Port1
1. VAREF can be tied to ground when A/D Converter is not in use: There is increased consumption (approximately 200µA) on
main VDD due to internal analog circuitry not being completely turned off. Therefore, it is suggested to maintain the VAREF
at VDD level even when not in use, and to eventually switch off the A/D Converter circuitry setting bit ADOFF in ADCON
register.
2. VAIN may exceed VAGND or VAREF up to the absolute maximum ratings. However, the conversion result in these cases will
be 0x000H or 0x3FFH, respectively
3. Not 100% tested, guaranteed by design characterization
4. During the sample time the input capacitance CAIN can be charged/discharged by the external source. The internal
resistance of the analog source must allow the capacitance to reach its final voltage level within tS. After the end of the
sample time tS, changes of the analog input voltage have no effect on the conversion result.
Values for the sample clock tS depend on programming and can be taken from Table 60: A/D converter programming.
5. This parameter includes the sample time tS, the time for determining the digital result and the time to load the result register
with the conversion result. Values for the conversion clock tCC depend on programming and can be taken from the next
Table 60.
6. DNL, INL, OFS and TUE are tested at VAREF = 5.0V, VAGND = 0V, VDD = 5.0V. It is guaranteed by design characterization
for all other voltages within the defined voltage range.
‘LSB’ has a value of VAREF/1024.
For Port5 channels, the specified TUE (± 2LSB) is guaranteed also with an overload condition (see IOV specification)
occurring on maximum 2 not selected analog input pins of Port5 and the absolute sum of input overload currents on all
Port5 analog input pins does not exceed 10mA.
For Port1 channels, the specified TUE is guaranteed when no overload condition is applied to Port1 pins: when an overload
condition occurs on maximum 2 not selected analog input pins of Port1 and the input positive overload current on all analog
input pins does not exceed 10mA (either dynamic or static injection), the specified TUE is degraded (± 7LSB). To obtain the
same accuracy, the negative injection current on Port1 pins must not exceed -1mA in case of both dynamic and static
injection.
7. The coupling factor is measured on a channel while an overload condition occurs on the adjacent not selected channels
with the overload current within the different specified ranges (for both positive and negative injection current).
8. Refer to scheme shown in Figure 40.
24.7.1
Conversion timing control
When a conversion is started, first the capacitances of the converter are loaded via the
respective analog input pin to the current analog input voltage. The time to load the
capacitances is referred to as sample time. Next the sampled voltage is converted to a
digital value several successive steps, which correspond to the 10-bit resolution of the ADC.
During these steps the internal capacitances are repeatedly charged and discharged via the
VAREF pin.
The current that has to be drawn from the sources for sampling and changing charges
depends on the time that each respective step takes, because the capacitors must reach
their final voltage level within the given time, at least with a certain approximation. The
maximum current, however, that a source can deliver, depends on its internal resistance.
The time that the two different actions during conversion take (sampling, and converting)
can be programmed within a certain range in the ST10F272M relative to the CPU clock. The
absolute time that is consumed by the different conversion steps therefore is independent
from the general speed of the controller. This allows adjustment of the ST10F272M A/D
converter to the system’s properties:
132/176
ST10F272M
Electrical characteristics
Fast conversion can be achieved by programming the respective times to their absolute
possible minimum. This is preferable for scanning high frequency signals. The internal
resistance of analog source and analog supply must be sufficiently low, however.
High internal resistance can be achieved by programming the respective times to a higher
value, or the possible maximum. This is preferable when using analog sources and supply
with a high internal resistance in order to keep the current as low as possible. The
conversion rate in this case may be considerably lower, however.
The conversion times are programmed via the upper four bits of register ADCON. Bit fields
ADCTC and ADSTC are used to define the basic conversion time and in particular the
partition between sample phase and comparison phases. The table below lists the possible
combinations. The timings refer to the unit TCL, where fCPU = 1/2TCL. A complete
conversion time includes the conversion itself, the sample time and the time required to
transfer the digital value to the result register.
Table 60.
A/D converter programming
ADCTC
ADSTC
Sample
Comparison
Extra
Total conversion
00
00
TCL * 120
TCL * 240
TCL * 28
TCL * 388
00
01
TCL * 140
TCL * 280
TCL * 16
TCL * 436
00
10
TCL * 200
TCL * 280
TCL * 52
TCL * 532
00
11
TCL * 400
TCL * 280
TCL * 44
TCL * 724
11
00
TCL * 240
TCL * 480
TCL * 52
TCL * 772
11
01
TCL * 280
TCL * 560
TCL * 28
TCL * 868
11
10
TCL * 400
TCL * 560
TCL * 100
TCL * 1060
11
11
TCL * 800
TCL * 560
TCL * 52
TCL * 1444
10
00
TCL * 480
TCL * 960
TCL * 100
TCL * 1540
10
01
TCL * 560
TCL * 1120
TCL * 52
TCL * 1732
10
10
TCL * 800
TCL * 1120
TCL * 196
TCL * 2116
10
11
TCL * 1600
TCL * 1120
TCL * 164
TCL * 2884
Note:
The total conversion time is compatible with the formula valid for ST10F269, while the
meaning of the bit fields ADCTC and ADSTC is no longer compatible: the minimum
conversion time is 388 TCL, which at 40 MHz CPU frequency corresponds to 4.85µs (see
ST10F269).
24.7.2
A/D conversion accuracy
The A/D Converter compares the analog voltage sampled on the selected analog input
channel to its analog reference voltage (VAREF) and converts it into 10-bit digital data. The
absolute accuracy of the A/D conversion is the deviation between the input analog value and
the output digital value. It includes the following errors:
●
Offset error (OFS)
●
Gain Error (GE)
●
Quantization error
●
Non-Linearity error (Differential and Integral)
133/176
Electrical characteristics
ST10F272M
These four error quantities are explained below using Figure 39.
Offset error
Offset error is the deviation between actual and ideal A/D conversion characteristics when
the digital output value changes from the minimum (zero voltage) 00 to 01 (Figure 39, see
OFS).
Gain error
Gain error is the deviation between the actual and ideal A/D conversion characteristics when
the digital output value changes from the 3FE to the maximum 3FF, once offset error is
subtracted. Gain error combined with offset error represents the so-called full-scale error
(Figure 39, OFS + GE).
Quantization error
Quantization error is the intrinsic error of the A/D converter and is expressed as 1/2 LSB.
Non-linearity error
Non-Linearity error is the deviation between actual and the best-fitting A/D conversion
characteristics (see Figure 39):
●
Differential Non-Linearity error is the actual step dimension versus the ideal one (1
LSBIDEAL).
●
Integral Non-Linearity error is the distance between the center of the actual step and
the center of the bisector line, in the actual characteristics. Note that for Integral NonLinearity error, the effect of offset, gain and quantization errors is not included.
Note:
Bisector characteristic is obtained drawing a line from 1/2 LSB before the first step of the
real characteristic, and 1/2 LSB after the last step again of the real characteristic.
24.7.3
Total unadjusted error
The Total Unadjusted Error specifies the maximum deviation from the ideal characteristic:
the number provided in the Data Sheet represents the maximum error with respect to the
entire characteristic. It is a combination of the Offset, Gain and Integral Linearity errors. The
different errors may compensate each other depending on the relative sign of the Offset and
Gain errors. Refer to Figure 39, see TUE.
134/176
ST10F272M
Electrical characteristics
Figure 39. A/D conversion characteristics
Offset Error OFS
Gain Error GE
3FF
3FE
(6)
3FD
Ideal Characteristic
3FC
3FB
3FA
Bisector Characteristic
(2)
Digital
Out
(HEX)
007
(7)
(1)
006
005
(5)
004
(4)
003
002
(3)
001
(1) Example of an actual transfer curve
(2) The ideal transfer curve
(3) Differential Non-Linearity Error (DNL)
(4) Integral Non-Linearity Error (INL)
(5) Center of a step of the actual transfer curve
(6) Quantization Error (1/2 LSB)
(7) Total Unadjusted Error (TUE)
1 LSB (ideal)
000
1
2
3
4
Offset Error OFS
24.7.4
5
6
7
1018
1020
VAIN (LSBIDEAL)
[LSBIDEAL = VAREF / 1024]
1022
1024
Analog reference pins
The accuracy of the A/D converter depends on how accurate is its analog reference: a noise
in the reference results in at least that much error in a conversion. A low pass filter on the
A/D converter reference source (supplied through pins VAREF and VAGND), is recommended
in order to clean the signal, minimizing the noise. A simple capacitive bypassing may be
sufficient in most of the cases; in presence of high RF noise energy, inductors or ferrite
beads may be necessary.
In this architecture, VAREF and VAGND pins represents also the power supply of the analog
circuitry of the A/D converter: there is an effective DC current requirement from the
reference voltage by the internal resistor string in the R-C DAC array and by the rest of the
analog circuitry.
An external resistance on VAREF could introduce error under certain conditions: for this
reasons, series resistance are not advisable, and more in general any series devices in the
filter network should be designed to minimize the DC resistance.
Analog Input pins
To improve the accuracy of the A/D converter, it is definitively necessary that analog input
pins have low AC impedance. Placing a capacitor with good high frequency characteristics
at the input pin of the device, can be effective: the capacitor should be as large as possible,
ideally infinite. This capacitor contributes to attenuating the noise present on the input pin;
moreover, it sources charge during the sampling phase, when the analog signal source is a
high-impedance source.
135/176
Electrical characteristics
ST10F272M
A real filter, can typically be obtained by using a series resistance with a capacitor on the
input pin (simple RC Filter). The RC filtering may be limited according to the value of source
impedance of the transducer or circuit supplying the analog signal to be measured. The filter
at the input pins must be designed taking into account the dynamic characteristics of the
input signal (bandwidth).
Figure 40. A/D converter input pins scheme
EXTERNAL CIRCUIT
INTERNAL CIRCUIT SCHEME
VDD
Source
Filter
RS
Current Limiter
RF
VA
RL
CF
RS
RF
CF
RL
RSW
RAD
CP
CS
CP1
Channel
Selection
Sampling
RSW
RAD
CP2
CS
Source Impedance
Filter Resistance
Filter Capacitance
Current Limiter Resistance
Channel Selection Switch Impedance
Sampling Switch Impedance
Pin Capacitance (two contributions, CP1 and CP2)
Sampling Capacitance
Input Leakage and external circuit
The series resistor utilized to limit the current to a pin (see RL in Figure 40), in combination
with a large source impedance can lead to a degradation of A/D converter accuracy when
input leakage is present.
Data about maximum input leakage current at each pin is provided in the Data Sheet
(Electrical Characteristics section). Input leakage is greatest at high operating temperatures,
and in general it decreases by one half for each 10° C decrease in temperature.
Considering that, for a 10-bit A/D converter one count is about 5mV (assuming VAREF = 5V),
an input leakage of 100nA acting though an RL = 50kΩ of external resistance leads to an
error of exactly one count (5mV); if the resistance were 100kΩ the error would become two
counts.
Eventual additional leakage due to external clamping diodes must also be taken into
account in computing the total leakage affecting the A/D converter measurements. Another
contribution to the total leakage is represented by the charge sharing effects with the
sampling capacitance: being CS substantially a switched capacitance, with a frequency
equal to the conversion rate of a single channel (maximum when fixed channel continuous
conversion mode is selected), it can be seen as a resistive path to ground. For instance,
assuming a conversion rate of 250 kHz, with CS equal to 4pF, a resistance of 1MΩ is
obtained (REQ = 1 / fCCS, where fC represents the conversion rate at the considered
channel). To minimize the error induced by the voltage partitioning between this resistance
136/176
ST10F272M
Electrical characteristics
(sampled voltage on CS) and the sum of RS + RF + RL + RSW + RAD, the external circuit
must be designed to respect the following relation:
R S + R F + R L + R SW + R AD
1
V A ⋅ ------------------------------------------------------------------------------ < --- LSB
R EQ
2
The formula above provides constraints for external network design, in particular on
resistive path.
A second aspect involving the capacitance network must be considered. Assuming the three
capacitances CF, CP1 and CP2 initially charged at the source voltage VA (refer to the
equivalent circuit shown in Figure 40), when the sampling phase is started (A/D switch
close), a charge sharing phenomena is installed.
Figure 41. Charge sharing timing diagram during sampling phase
Voltage Transient on CS
VCS
VA
VA2
∆V < 0.5 LSB
1
2
τ1 < (RSW + RAD) CS << TS
τ2 = RL (CS + CP1 + CP2)
VA1
TS
t
In particular two different transient periods can be distinguished (see Figure 41):
●
A first and quick charge transfer from the internal capacitance CP1 and CP2 to the
sampling capacitance CS occurs (CS is supposed initially completely discharged):
considering a worst case (since the time constant in reality would be faster) in which
CP2 is shown in parallel to CP1 (call CP = CP1 + CP2), the two capacitance CP and CS
are in series, and the time constant is:
CP ⋅ CS
τ 1 = ( R SW + R AD ) ⋅ ----------------------CP + CS
This relation can again be simplified considering only CS as an additional worst
condition. In reality, the transient is faster, but the A/D Converter circuitry has been
designed to be robust also in the very worst case: the sampling time TS is always much
longer than the internal time constant:
τ 1 < ( R SW + R AD ) ⋅ C S < < T S
The charge of CP1 and CP2 is redistributed also on CS, determining a new value of the
voltage VA1 on the capacitance according to the following equation:
V A1 ⋅ ( C S + C P1 + C P2 ) = V A ⋅ ( C P1 + C P2 )
137/176
Electrical characteristics
●
ST10F272M
A second charge transfer involves also CF (that is typically bigger than the on-chip
capacitance) through the resistance RL: again considering the worst case in which CP2
and CS were in parallel to CP1 (since the time constant in reality would be faster), the
time constant is:
τ 2 < R L ⋅ ( C S + C P1 + C P2 )
In this case, the time constant depends on the external circuit: in particular imposing
that the transient is completed well before the end of sampling time TS, a constraint on
RL sizing is obtained:
10 ⋅ τ 2 = 10 ⋅ R L ⋅ ( C S + C P1 + C P2 ) ≤ TS
Of course, RL must also be sized according to the current limitation constraints, in
combination with RS (source impedance) and RF (filter resistance). Being CF
definitively bigger than CP1, CP2 and CS, then the final voltage VA2 (at the end of the
charge transfer transient) will be much higher than VA1. The following equation must be
respected (charge balance assuming now CS already charged at VA1):
VA2 ⋅( C S + C P1 + C P2 + C F ) = V A ⋅C F + V A1 ⋅( C P1 + C P2 + C S )
The two transients above are not influenced by the voltage source that, due to the presence
of the RFCF filter, is not able to provide the extra charge to compensate the voltage drop on
CS with respect to the ideal source VA; the time constant RFCF of the filter is very high with
respect to the sampling time (TS). The filter is typically designed to act as anti-aliasing (see
Figure 42).
Calling f0 the bandwidth of the source signal (and as a consequence the cut-off frequency of
the anti-aliasing filter, fF), according to Nyquist theorem the conversion rate fC must be at
least 2f0; it means that the constant time of the filter is greater than or at least equal to twice
the conversion period (TC). Again the conversion period TC is longer than the sampling time
TS, which is just a portion of it, even when fixed channel continuous conversion mode is
selected (fastest conversion rate at a specific channel): in conclusion it is evident that the
time constant of the filter RFCF is definitively much higher than the sampling time TS, so the
charge level on CS cannot be modified by the analog signal source during the time in which
the sampling switch is closed.
Figure 42. Anti-aliasing filter and conversion rate
Analog Source Bandwidth (VA)
Noise
TC ≤ 2 RFCF (Conversion Rate vs. Filter Pole)
fF = f0 (Anti-aliasing Filtering Condition)
2 f0 ≤ fC (Nyquist)
f0
f
Anti-Aliasing Filter (fF = RC Filter pole) Sampled Signal Spectrum (fC = conversion Rate)
fF
138/176
f
f0
fC
f
ST10F272M
Electrical characteristics
The considerations above lead to impose new constraints to the external circuit, to reduce
the accuracy error due to the voltage drop on CS; from the two charge balance equations
above, it is simple to derive the following relation between the ideal and real sampled
voltage on CS:
VA
C P1 + C P2 + C F
----------- = -----------------------------------------------------------V A2
C P1 + C P2 + C F + C S
From this formula, in the worst case (when VA is maximum, that is for instance 5V),
assuming to accept a maximum error of half a count (~2.44mV), a constraint is immediately
evident on CF value:
C F > 2048 ⋅C S
In the next section an example of how to design the external network is provided, assuming
some reasonable values for the internal parameters and making a hypothesis on the
characteristics of the analog signal to be sampled.
Example of external network sizing
The following hypotheses are formulated in order to proceed in designing the external
network on A/D Converter input pins:
●
Analog Signal Source Bandwidth (f0): 10 kHz
●
conversion Rate (fC): 25 kHz
●
Sampling Time (TS): 1µs
●
Pin Input Capacitance (CP1): 5pF
●
Pin Input Routing Capacitance (CP2): 1pF
●
Sampling Capacitance (CS): 4pF
●
Maximum Input Current Injection (IINJ): 3mA
●
Maximum Analog Source Voltage (VAM): 12V
●
Analog Source Impedance (RS): 100Ω
●
Channel Switch Resistance (RSW): 500Ω
●
Sampling Switch Resistance (RAD): 200Ω
139/176
Electrical characteristics
1.
ST10F272M
Supposing to design the filter with the pole exactly at the maximum frequency of the
signal, the time constant of the filter is:
1
R C C F = ------------ = 15.9µs
2πf 0
2.
Using the relation between CF and CS and taking some margin (4000 instead of 2048),
it is possible to define CF:
C F = 4000 C
⋅ S = 16nF
3.
As a consequence of step 1 and 2, RC can be chosen:
1
R F = --------------------- = 995Ω ≅ 1kΩ
2πf 0 C F
4.
Considering the current injection limitation and supposing that the source can go up to
12V, the total series resistance can be defined as:
V AM
R S + R F + R L = ------------- = 4kΩ
I INJ
from which is now simple to define the value of RL:
V AM
R L = ------------- – R F – R S = 2.9kΩ
I INJ
5.
Now the three elements of the external circuit RF, CF and RL are defined. Some
conditions discussed in the previous paragraphs have been used to size the
component, the other must now be verified. The relation which allows minimization of
the accuracy error introduced by the switched capacitance equivalent resistance is in
this case:
1
R EQ = --------------- = 10MΩ
fC CS
So the error due to the voltage partitioning between the real resistive path and CS is
less then half a count (considering the worst case when VA = 5V):
R S + R F + R L + R SW + R AD
1
V A ⋅ --------------------------------------------------------------------------- = 2.35mV < --- LSB
2
R EQ
The other condition to be verified is if the time constants of the transients are really and
significantly shorter than the sampling period duration TS:
τ 1 = ( R SW + R AD ) ⋅ C S = 2.8ns
<< TS = 1µs
10 ⋅τ 2 = 10 ⋅R L⋅( C S + C P1 + C P2 ) = 290ns
< TS = 1µs
For the complete set of parameters characterizing the ST10F272M A/D Converter
equivalent circuit, refer to Section 24.7: A/D converter characteristics on page 131.
140/176
ST10F272M
Electrical characteristics
24.8
AC characteristics
24.8.1
Test waveforms
Figure 43. Input / output waveforms
2.4V
2.0V
2.0V
Test Points
0.4V
0.8V
0.8V
AC inputs during testing are driven at 2.4V for a logic ‘1’ and 0.4V for a logic ‘0’.
Timing measurements are made at VIH min. for a logic ‘1’ and VIL max for a logic ‘0’.
Figure 44. Float waveforms
VOH
VLOAD + 0.1V
VLOAD
VLOAD - 0.1V
VOH - 0.1V
Timing
Reference
Points
VOL + 0.1V
VOL
For timing purposes a port pin is no longer floating when VLOAD changes of ±100mV.
It begins to float when a 100mV change from the loaded VOH/VOL level occurs (IOH/IOL = 20mA).
24.8.2
Definition of internal timing
The internal operation of the ST10F272M is controlled by the internal CPU clock fCPU. Both
edges of the CPU clock can trigger internal (for example, pipeline) or external (for example,
bus cycles) operations.
The specification of the external timing (AC Characteristics) therefore depends on the time
between two consecutive edges of the CPU clock, called “TCL”.
The CPU clock signal can be generated by different mechanisms. The duration of TCL and
its variation (and also the derived external timing) depends on the mechanism used to
generate fCPU.
This influence must be regarded when calculating the timings for the ST10F272M.
The example for PLL operation shown in Figure 45 refers to a PLL factor of 4.
The mechanism used to generate the CPU clock is selected during reset by the logic levels
on pins P0.15-13 (P0H.7-5).
141/176
Electrical characteristics
ST10F272M
Figure 45. Generation mechanisms for the CPU clock
Phase locked loop operation
fXTAL
fCPU
TCLTCL
Direct Clock Drive
fXTAL
fCPU
TCLTCL
Prescaler Operation
fXTAL
fCPU
TCL
24.8.3
TCL
Clock generation modes
The next Table 61 associates the combinations of these three bits with the respective clock
generation mode.
Table 61.
On-chip clock generator selections
P0.15-13
(P0H.7-5)
CPU frequency
fCPU = fXTAL x F
External clock
input range(1)(3)
1
1
1
fXTAL x 4
4 to 8 MHz
1
1
0
fXTAL x 3
5.3 to 8 MHz
1
0
1
fXTAL x 8
4 to 8 MHz
1
0
0
fXTAL x 5
6.4 to 8 MHz
0
1
1
fXTAL x 1
1 to 64 MHz
0
1
0
fXTAL x 10
4 to 6.4 MHz
0
0
1
fXTAL / 2
4 to 8 MHz
0
0
0
fXTAL x 16
4 MHz
Notes
Default configuration
Direct Drive (oscillator bypassed)(2)
CPU clock via prescaler(3)
1. The external clock input range refers to a CPU clock range of 1...40 MHz. Moreover, the PLL usage is
limited to 4-8 MHz. All configurations need a crystal (or ceramic resonator) to generate the CPU clock
through the internal oscillator amplifier (apart from Direct Drive): vice versa, the clock can be forced
through an external clock source only in Direct Drive mode (on-chip oscillator amplifier disabled, so no
crystal or resonator can be used).
2. The maximum depends on the duty cycle of the external clock signal: when 40 MHz is used, 50% duty
cycle is granted (low phase = high phase = 12.5ns); when 20 MHz is selected a 25% duty cycle can be
accepted (minimum phase, high or low, again equal to 12.5ns).
3. The limits on input frequency are 4-8 MHz since the usage of the internal oscillator amplifier is required.
Also when the PLL is not used and the CPU clock corresponds to fXTAL/2, an external crystal or resonator
must be used: It is not possible to force any clock though an external clock source.
142/176
ST10F272M
24.8.4
Electrical characteristics
Prescaler operation
When pins P0.15-13 (P0H.7-5) equal “001” during reset, the CPU clock is derived from the
internal oscillator (input clock signal) by a 2:1 prescaler.
The frequency of fCPU is half the frequency of fXTAL and the high and low time of fCPU (that
is, the duration of an individual TCL) is defined by the period of the input clock fXTAL.
The timings listed in the AC Characteristics that refer to TCL therefore can be calculated
using the period of fXTAL for any TCL.
Note that if the bit OWDDIS in SYSCON register is cleared, the PLL runs on its free-running
frequency and delivers the clock signal for the Oscillator Watchdog. If bit OWDDIS is set,
then the PLL is switched off.
24.8.5
Direct drive
When pins P0.15-13 (P0H.7-5) equal “011” during reset the on-chip phase locked loop is
disabled, the on-chip oscillator amplifier is bypassed and the CPU clock is directly driven by
the input clock signal on XTAL1 pin.
The frequency of CPU clock (fCPU) directly follows the frequency of fXTAL so the high and
low time of fCPU (that is, the duration of an individual TCL) is defined by the duty cycle of the
input clock fXTAL.
Therefore, the timings given in this chapter refer to the minimum TCL. This minimum value
can be calculated by the following formula:
TCL min = 1 ⁄ f XTALl xlDC min
DC = duty cycle
For two consecutive TCLs, the deviation caused by the duty cycle of fXTAL is compensated,
so the duration of 2TCL is always 1/fXTAL.
The minimum value TCLmin has to be used only once for timings that require an odd number
of TCLs (1,3,...). Timings that require an even number of TCLs (2,4,...) may use the formula:
2TCL = 1 ⁄ f XTAL
The address float timings in Multiplexed bus mode (t11 and t45) use the maximum duration of
TCL (TCLmax = 1/fXTAL x DCmax) instead of TCLmin.
Similarly to what happen for Prescaler Operation, if the bit OWDDIS in SYSCON register is
cleared, the PLL runs on its free-running frequency and delivers the clock signal for the
Oscillator Watchdog. If bit OWDDIS is set, then the PLL is switched off.
24.8.6
Oscillator watchdog (OWD)
An on-chip watchdog oscillator is implemented in the ST10F272M. This feature is used for
safety operation with external crystal oscillator (available only when using direct drive mode
with or without prescaler, so the PLL is not used to generate the CPU clock multiplying the
frequency of the external crystal oscillator). This watchdog oscillator operates as following.
The reset default configuration enables the watchdog oscillator. It can be disabled by setting
the OWDDIS (bit 4) of SYSCON register.
When the OWD is enabled, the PLL runs at its free-running frequency, and it increments the
watchdog counter. On each transition of external clock, the watchdog counter is cleared. If
143/176
Electrical characteristics
ST10F272M
an external clock failure occurs, then the watchdog counter overflows (after 16 PLL clock
cycles).
The CPU clock signal will be switched to the PLL free-running clock signal, and the oscillator
watchdog Interrupt Request is flagged. The CPU clock will not switch back to the external
clock even if a valid external clock exits on XTAL1 pin. Only a hardware reset (or
bidirectional Software / Watchdog reset) can switch the CPU clock source back to direct
clock input.
When the OWD is disabled, the CPU clock is always the external oscillator clock (in Direct
Drive or Prescaler Operation) and the PLL is switched off to decrease consumption supply
current.
24.8.7
Phase Locked Loop (PLL)
For all other combinations of pins P0.15-13 (P0H.7-5) during reset the on-chip phase locked
loop is enabled and it provides the CPU clock (see Table 61). The PLL multiplies the input
frequency by the factor F which is selected via the combination of pins P0.15-13 (fCPU =
fXTAL x F). With every F’th transition of fXTAL the PLL circuit synchronizes the CPU clock to
the input clock. This synchronization is done smoothly, so the CPU clock frequency does not
change abruptly.
Due to this adaptation to the input clock the frequency of fCPU is constantly adjusted so it is
locked to fXTAL. The slight variation causes a jitter of fCPU which also effects the duration of
individual TCLs.
The timings listed in the AC Characteristics that refer to TCLs therefore must be calculated
using the minimum TCL that is possible under the respective circumstances.
The real minimum value for TCL depends on the jitter of the PLL. The PLL tunes fCPU to
keep it locked on fXTAL. The relative deviation of TCL is the maximum when it is referred to
one TCL period.
This is especially important for bus cycles using wait states and for example, such as for the
operation of timers or serial interfaces. For all slower operations and longer periods (for
example, pulse train generation or measurement, or lower baudrates) the deviation caused
by the PLL jitter is negligible. Refer to next Section 24.8.9: PLL jitter for more details.
24.8.8
Voltage controlled oscillator
The ST10F272M implements a PLL which combines different levels of frequency dividers
with a Voltage Controlled Oscillator (VCO) working as frequency multiplier. The following
table gives a detailed summary of the internal settings and VCO frequency.
Table 62.
Internal PLL divider mechanism
P0.15-13
(P0H.7-5)
1
1
1
1
1
0
1
0
1
1
0
0
0
1
1
144/176
XTAL frequency
4 to 8 MHz
5.3 to 10.6
MHz(1)
4 to 8 MHz
(1)
6.4 to 8 MHz
1 to 40 MHz
Input
prescaler
PLL
Output
prescaler
CPU frequency
fCPU = fXTAL x F
Multiply by
Divide by
fXTAL / 4
64
4
–
fXTAL x 4
fXTAL / 4
48
4
–
fXTAL x 3
fXTAL / 4
64
2
–
fXTAL x 8
fXTAL / 4
40
2
–
fXTAL x 5
–
fXTAL x 1
–
PLL bypassed
ST10F272M
Table 62.
Electrical characteristics
Internal PLL divider mechanism (continued)
P0.15-13
(P0H.7-5)
0
1
XTAL frequency
0
0
0
1
0
0
0
4 MHz
4 to 8
Input
prescaler
PLL
Multiply by
Divide by
40
2
fXTAL / 2
MHz(1)
–
PLL bypassed
Output
prescaler
CPU frequency
fCPU = fXTAL x F
–
fXTAL x 10
fPLL / 2
fXTAL / 2
–
1. The PLL input frequency range is limited to 1 to 3.5 MHz, while the VCO oscillation range is 64 to 128 MHz. The CPU clock
frequency range when PLL is used is 16 to 40 MHz.
Example 1
●
fXTAL = 4 MHz
●
P0(15:13) = ‘110’ (multiplication by 3)
●
PLL input frequency = 1 MHz
●
VCO frequency = 48 MHz: NOT VALID, must be 64 to 128 MHz
●
fCPU = NOT VALID
Example 2
24.8.9
●
fXTAL = 8 MHz
●
P0(15:13) = ‘100’ (multiplication by 5)
●
PLL input frequency = 2 MHz
●
VCO frequency = 80 MHz
●
PLL output frequency = 40 MHz (VCO frequency divided by 2)
●
fCPU = 40 MHz (no effect of Output Prescaler)
PLL jitter
The following terminology is hereafter defined:
●
Self referred single period jitter
Also called “Period Jitter”, it can be defined as the difference of the Tmax and Tmin,
where Tmax is maximum time period of the PLL output clock and Tmin is the minimum
time period of the PLL output clock.
●
Self referred long term jitter
Also called “N period jitter”, it can be defined as the difference of Tmax and Tmin, where
Tmax is the maximum time difference between N+1 clock rising edges and Tmin is the
minimum time difference between N+1 clock rising edges. Here N should be kept
sufficiently large to have the long term jitter. For N=1, this becomes the single period
jitter.
Jitter at the PLL output can be due to the following reasons:
●
Jitter in the input clock
●
Noise in the PLL loop
145/176
Electrical characteristics
ST10F272M
Jitter in the input clock
PLL acts like a low pass filter for any jitter in the input clock. Input Clock jitter with the
frequencies within the PLL loop bandwidth is passed to the PLL output and higher frequency
jitter (frequency > PLL bandwidth) is attenuated @20dB/decade.
Noise in the PLL loop
This contribution again can be caused by the following sources:
●
Device noise of the circuit in the PLL
●
Noise in supply and substrate.
Device noise of the circuit in the PLL
The long term jitter is inversely proportional to the bandwidth of the PLL: the wider the loop
bandwidth is, the lower the jitter is due to noise in the loop. Moreover, the long term jitter is
practically independent of the multiplication factor.
The most noise sensitive circuit in the PLL circuit is definitively the VCO (Voltage Controlled
Oscillator). There are two main sources of noise: thermal (random noise, frequencyindependent noise, thus, practically white noise) and flicker (low frequency noise, 1/f). For
the frequency characteristics of the VCO circuitry, the effect of the thermal noise results in a
1/f2 region in the output noise spectrum, while the flicker noise in a 1/f3. Assuming a
noiseless PLL input and supposing that the VCO is dominated by its 1/f2 noise, the R.M.S.
value of the accumulated jitter is proportional to the square root of N, where N is the number
of clock periods within the considered time interval.
On the contrary, assuming again a noiseless PLL input and supposing that the VCO is
dominated by its 1/f3 noise, the R.M.S. value of the accumulated jitter is proportional to N,
where N is the number of clock periods within the considered time interval.
The jitter in the PLL loop can be modelized as dominated by the i1/f2 noise for N smaller
than a certain value depending on the PLL output frequency and on the bandwidth
characteristics of loop. Above this first value, the jitter becomes dominated by the i1/f3 noise
component. Lastly, for N greater than a second value of N, a saturation effect is evident, so
the jitter does not grow anymore when considering a longer time interval (jitter stable
increasing the number of clock periods N). The PLL loop acts as a high pass filter for any
noise in the loop, with cutoff frequency equal to the bandwidth of the PLL. The saturation
value corresponds to what has been called self referred long term jitter of the PLL. In
Figure 46 the maximum jitter trend versus the number of clock periods N (for some typical
CPU frequencies) is shown: The curves represent the very worst case, computed taking into
account all corners of temperature, power supply and process variations: The real jitter is
always measured well below the given worst case values.
Noise in supply and substrate
Digital supply noise adds deterministic components to the PLL output jitter, independent of
the multiplication factor. Its effects are strongly reduced thanks to the particular care used in
the physical implementation and integration of the PLL module inside the device.
Nonetheless, the contribution of the digital noise to the global jitter is widely taken into
account in the curves provided in Figure 46.
146/176
ST10F272M
Electrical characteristics
Figure 46. ST10F272M PLL jitter
±5
16MHz 24MHz 32MHz 40MHz
64MHz
Jitter [ns]
±4
±3
±2
±1
TJIT
0
24.8.10
0
200
400
1000
600
800
N (CPU clock periods)
1400
1200
PLL lock / unlock
During normal operation, if the PLL gets unlocked for any reason, an interrupt request to the
CPU is generated, and the reference clock (oscillator) is automatically disconnected from
the PLL input: in this way, the PLL goes into free-running mode, providing the system with a
backup clock signal (free running frequency ffree). This feature allows recovery from a crystal
failure occurrence without risking to go into an undefined configuration: The system is
provided with a clock allowing the execution of the PLL unlock interrupt routine in a safe
mode.
The path between reference clock and PLL input can be restored only by a hardware reset,
or by a bidirectional software or watchdog reset event that forces the RSTIN pin low.
Note:
The external RC circuit on RSTIN pin must be properly sized in order to extend the duration
of the low pulse to lock the PLL before the level at RSTIN pin is recognized high: A
bidirectional reset internally drives the RSTIN pin low for just 1024 TCL (definitly not
sufficient to lock the PLL starting from free-running mode).
Table 63.
PLL characteristics (VDD = 5V ± 10%, VSS = 0V, TA = -40 to +125°C)
Value
Symbol
Parameter
Conditions
Unit
Min
Max
tPSUP
PLL Start-up time(1)
Stable VDD and reference clock
–
300
µs
tLOCK
PLL Lock-in time
Stable VDD and reference clock,
starting from free-running mode
–
250
µs
TJIT
Single Period Jitter(1)
(cycle to cycle = 2 TCL)
6 sigma time period variation
(peak to peak)
-500
+500
ps
Multiplication factors: 3, 4
250
2000
ffree
PLL free running frequency
Multiplication factors: 5, 8, 10, 16
500
4000
kHz
1. Not 100% tested, guaranteed by design characterization
147/176
Electrical characteristics
24.8.11
ST10F272M
Main oscillator specifications
VDD = 5V ± 10%, VSS = 0V, TA = -40 to +125°C
Table 64.
Main oscillator characteristics
Value
Symbol
gm
VOSC
VAV
tSTUP
Parameter
Conditions
Unit
Min
Typ
Max
1.4
2.6
4.2
mA/V
Peak to Peak
–
1.5
–
V
Sine wave middle
–
0.8
–
V
Stable VDD - Crystal
–
6
10
ms
Stable VDD - Resonator
–
1
2
ms
Oscillator
Transconductance
Oscillation Amplitude(1)
Oscillation Voltage level
(1)
Oscillator Start-up Time(1)
1. Not 100% tested, guaranteed by design characterization
Figure 47. Crystal oscillator and resonator connection diagram
Crystal
Resonator
CA
Table 65.
XTAL2
XTAL1
ST10F272M
XTAL2
XTAL1
ST10F272M
CA
Main oscillator negative resistance (module)
CA = 15pF
CA = 25pF
CA = 35pF
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
4 MHz
545 Ω
1035 Ω
–
550 Ω
1050 Ω
–
430 Ω
850 Ω
–
8 MHz
240 Ω
450 Ω
–
170 Ω
350 Ω
–
120 Ω
250 Ω
–
The given values of CA do not include the stray capacitance of the package and of the
printed circuit board: the negative resistance values are calculated assuming additional 5pF
to the values in the table. The crystal shunt capacitance (C0) and the package capacitance
between XTAL1 and XTAL2 pins is globally assumed equal to 10pF.
The external resistance between XTAL1 and XTAL2 is not necessary, since already present
on the silicon.
148/176
ST10F272M
32 kHz oscillator specifications
VDD = 5V ± 10%, VSS = 0V, TA = -40 to +125°C
Table 66.
32 kHz oscillator characteristics
Value
Symbol
gm32
Parameter
Oscillator Transconductance(1)
VOSC32 Oscillation Amplitude(2)
VAV32
Conditions
Oscillation Voltage level(2)
tSTUP32 Oscillator Start-up Time(2)
Unit
Min
Typ
Max
Start-up
20
31
50
µA/V
Normal run
8
17
30
µA/V
Peak to Peak
0.5
1.0
2.4
V
Sine wave middle
0.7
0.9
1.2
V
–
1
5
s
Stable VDD
1. At power-on a high current biasing is applied for faster oscillation start-up. Once the oscillation is started,
the current biasing is reduced to lower the power consumption of the system.
2. Not 100% tested, guaranteed by design characterization.
Figure 48. 32 kHz crystal oscillator connection diagram
XTAL4
ST10F272M
XTAL3
24.8.12
Electrical characteristics
Crystal
CA
Table 67.
CA
Minimum values of negative resistance (module) for 32 kHz oscillator
Frequency
CA = 6pF
32 kHz
-
CA = 12pF CA = 15pF CA = 18pF CA = 22pF CA = 27pF CA = 33pF
-
-
-
150 kΩ
120 kΩ
90 kΩ
The given values of CA do not include the stray capacitance of the package and of the
printed circuit board: the negative resistance values are calculated assuming additional 5pF
to the values in the table. The crystal shunt capacitance (C0) and the package capacitance
between XTAL3 and XTAL4 pins is globally assumed equal to 4pF. The external resistance
between XTAL3 and XTAL4 is not necessary, since already present on the silicon.
Warning:
Direct driving on XTAL3 pin is not supported. Always use a
32 kHz crystal oscillator.
149/176
Electrical characteristics
24.8.13
ST10F272M
External clock drive XTAL1
When Direct Drive configuration is selected during reset, it is possible to drive the CPU clock
directly from the XTAL1 pin, without particular restrictions on the maximum frequency, since
the on-chip oscillator amplifier is bypassed. The speed limit is imposed by internal logic that
targets a maximum CPU frequency of 40 MHz.
In all other clock configurations (Direct Drive with Prescaler or PLL usage) the on-chip
oscillator amplifier is not bypassed, so it determines the input clock speed limit. Then, when
the on-chip oscillator is enabled it is forbidden to use any external clock source different
from crystal or ceramic resonator.
Table 68.
External clock drive
Parameter
Direct drive with
prescaler
fCPU = fXTAL / 2
Direct drive
fCPU = fXTAL
Symbol
XTAL1 period(1)(2) tOSC SR
PLL usage
fCPU = fXTAL x F
Unit
Min
Max
Min
Max
Min
Max
25
–
83.3
250
83.3
250
ns
time(3)
t1
SR
6
–
3
–
6
–
ns
(3)
Low time
t2
SR
6
–
3
–
6
–
ns
Rise time(3)
t3
SR
–
2
–
2
–
2
ns
t4
SR
–
2
–
2
–
2
ns
High
Fall
time(3)
1. The minimum value for the XTAL1 signal period is considered the theoretical minimum. The real minimum
value depends on the duty cycle of the input clock signal.
2. 4 to 8 MHz is the input frequency range when using an external clock source. 40 MHz can be applied with
an external clock source only when Direct Drive mode is selected: in this case, the oscillator amplifier is
bypassed so it does not limit the input frequency.
3. The input clock signal must reach the defined levels VIL2 and VIH2.
Figure 49. External clock drive XTAL1
t3
t1
t4
VIH2
VIL2
t2
tOSC
Note:
When Direct Drive is selected, an external clock source can be used to drive XTAL1. The
maximum frequency of the external clock source depends on the duty cycle: When 40 MHz
is used, 50% duty cycle is granted (low phase = high phase = 12.5ns); when for instance
20 MHz is used, a 25% duty cycle can be accepted (minimum phase, high or low, again
equal to 12.5ns).
24.8.14
Memory cycle variables
The tables below use three variables which are derived from the BUSCONx registers and
represent the special characteristics of the programmed memory cycle. The following table
describes how these variables are to be computed.
150/176
ST10F272M
Electrical characteristics
Table 69.
Memory cycle variables
Description
24.8.15
Symbol
Values
ALE Extension
tA
TCL x [ALECTL]
Memory Cycle Time wait states
tC
2TCL x (15 - [MCTC])
Memory Tri-state Time
tF
2TCL x (1 - [MTTC])
External memory bus timing
The following sections include the External Memory Bus timings. The given values are
computed for a maximum CPU clock of 40 MHz.
Note:
All External Memory Bus Timings and SSC Timings listed in the following tables are granted
by Design Characterization and not fully tested in production.
24.8.16
Multiplexed bus
VDD = 5V ± 10%, VSS = 0V, TA = -40 to +125°C, CL = 50pF,
ALE cycle time = 6 TCL + 2tA + tC + tF (75ns at 40 MHz CPU clock without wait states)
Table 70.
Symbol
Multiplexed bus timings
Parameter
fCPU = 40 MHz
TCL = 12.5ns
Variable CPU clock
1/2 TCL = 1 to 40 MHz
Unit
Min
Max
Min
Max
4 + tA
–
TCL – 8.5 + tA
–
ns
1.5 + tA
–
TCL – 11 + tA
–
ns
t5
CC
ALE high time
t6
CC
Address setup to ALE
t7
CC
Address hold after ALE
4 + tA
–
TCL – 8.5 + tA
–
ns
t8
tCC
ALE falling edge to RD, WR
(with RW-delay)
4 + tA
–
TCL – 8.5 + tA
–
ns
t9
CC
ALE falling edge to RD, WR
(no RW-delay)
– 8.5 + tA
–
– 8.5 + tA
–
ns
t10 CC
Address float after RD, WR (with
RW-delay)1
–
6
–
6
ns
t11 CC
Address float after RD, WR
(no RW-delay)1
–
18.5
–
TCL + 6
ns
t12 CC
RD, WR low time
(with RW-delay)
15.5 + tC
–
2TCL – 9.5 + tC
–
ns
t13 CC
RD, WR low time
(no RW-delay)
28 + tC
–
3TCL – 9.5 + tC
–
ns
t14 SR
RD to valid data in
(with RW-delay)
–
6 + tC
–
2TCL – 19 + tC
ns
t15 SR
RD to valid data in
(no RW-delay)
–
18.5 + tC
–
3TCL – 19 + tC
ns
t16 SR
ALE low to valid data in
–
17.5 +
+ tA + tC
–
3TCL – 20 +
+ tA + tC
ns
151/176
Electrical characteristics
Table 70.
Symbol
ST10F272M
Multiplexed bus timings (continued)
Parameter
fCPU = 40 MHz
TCL = 12.5ns
Variable CPU clock
1/2 TCL = 1 to 40 MHz
Min
Max
Min
Max
Unit
t17 SR
Address/Unlatched CS to valid
data in
–
20 + 2tA +
+ tC
–
4TCL – 30 +
+ 2tA + tC
ns
t18 SR
Data hold after RD
rising edge
0
–
0
–
ns
t19 SR
Data float after RD1
–
16.5 + tF
–
2TCL – 8.5 + tF
ns
t22 CC
Data valid to WR
10 + tC
–
2TCL – 15 + tC
–
ns
t23 CC
Data hold after WR
4 + tF
–
2TCL – 8.5 + tF
–
ns
t25 CC
ALE rising edge after RD, WR
15 + tF
–
2TCL – 10 + tF
–
ns
t27 CC
Address/Unlatched CS hold
after RD, WR
10 + tF
–
2TCL – 15 + tF
–
ns
t38 CC
ALE falling edge to Latched CS
– 4 – tA
10 – tA
– 4 – tA
10 – tA
ns
t39 SR
Latched CS low to Valid Data In
–
16.5 + tC +
+ 2tA
–
3TCL - 21 +
+ tC + 2tA
ns
t40 CC
Latched CS hold after RD, WR
27 + tF
–
3TCL - 10.5 + tF
–
ns
t42 CC
ALE fall. edge to RdCS, WrCS
(with RW delay)
7 + tA
–
TCL - 5.5 + tA
–
ns
t43 CC
ALE fall. edge to RdCS, WrCS
(no RW delay)
-5.5 + tA
–
-5.5 + tA
–
ns
t44 CC
Address float after RdCS, WrCS
(with RW delay)1
–
1.5
–
1.5
ns
t45 CC
Address float after RdCS, WrCS
(no RW delay)1
–
14
–
TCL + 1.5
ns
t46 SR
RdCS to Valid Data In
(with RW delay)
–
4 + tC
–
2TCL - 21 + tC
ns
t47 SR
RdCS to Valid Data In
(no RW delay)
–
16.5 + tC
–
3TCL - 21 + tC
ns
t48 CC
RdCS, WrCS Low Time
(with RW delay)
15.5 + tC
–
2TCL - 9.5 + tC
–
ns
t49 CC
RdCS, WrCS Low Time
(no RW delay)
28 + tC
–
3TCL - 9.5 + tC
–
ns
t50 CC
Data valid to WrCS
10 + tC
–
2TCL - 15 + tC
–
ns
t51 SR
Data hold after RdCS
0
–
0
–
ns
t52 SR
Data float after RdCS1
–
16.5 + tF
–
2TCL - 8.5 + tF
ns
t54 CC
Address hold after
RdCS, WrCS
6 + tF
–
2TCL - 19 + tF
–
ns
t56 CC
Data hold after WrCS
6 + tF
–
2TCL - 19 + tF
–
ns
152/176
ST10F272M
Electrical characteristics
Figure 50. External memory cycle: Multiplexed bus, with/without read/write delay, normal ALE
CLKOUT
t5
t25
t16
ALE
t6
t38
t17
t40
t27
t39
CSx
t6
t27
t17
A23-A16
(A15-A8)
BHE
Address
t16
Read cycle
Address/data
bus (P0)
t6
t7
t1
Address
Data in
t10
t8
Address
t19
t14
RD
t12
t13
t9
t1
t15
Write cycle
Address/data
bus (P0)
t23
Address
Data out
t8
WR
WRL
WRH
t22
t9
t12
t13
153/176
Electrical characteristics
ST10F272M
Figure 51. External memory cycle: Multiplexed bus, with/without read/write delay, extended ALE
CLKOUT
t16
t5
t25
ALE
t6
t38
t40
t17
t39
t27
CSx
t6
t17
A23-A16
(A15-A8)
BHE
Address
t27
Read cycle
Address/Data
Bus (P0)
t6
t7
Data in
Address
t8
t9
t18
t10
t19
t11
t14
RD
t15
t12
t13
Write cycle
Address/Data
Bus (P0)
Address
Data out
t23
t8
WR
WRL
WRH
t9
t10
t11
t13
154/176
t22
t12
ST10F272M
Electrical characteristics
Figure 52. External memory cycle: Multiplexed bus, with/without r/w delay, normal ALE, r/w CS
CLKOUT
t5
t25
t16
ALE
t6
t27
t17
A23-A16
(A15-A8)
BHE
Address
t16
t6
Read Cycle
Address/Data
Bus (P0)
t7
t51
Address
Address
Data In
t42
t52
t44
t46
RdCSx
t48
t49
t43
t45
t47
t55
Write Cycle
Address/Data
Bus (P0)
Address
Data Out
t42
WrCSx
t50
t43
t48
t49
155/176
Electrical characteristics
ST10F272M
Figure 53. External memory cycle: Multiplexed bus, with/without r/w delay, extended ALE, r/w CS
CLKOUT
t16
t5
t25
ALE
t6
t17
A23-A16
(A15-A8)
BHE
Address
t54
Read cycle
Address/Data
Bus (P0)
t6
t7
Data in
Address
t42
t43
t18
t44
t19
t45
t46
RdCSx
t48
t47
t49
Write cycle
Address/data
bus (P0)
Address
Data out
t42
t43
t56
t44
t45
t50
WrCSx
t48
t49
156/176
ST10F272M
24.8.17
Electrical characteristics
Demultiplexed bus
VDD = 5V ± 10%, VSS = 0V, TA = -40 to +125°C, CL = 50pF,
ALE cycle time = 4 TCL + 2tA + tC + tF (50ns at 40 MHz CPU clock without wait states).
Table 71.
Symbol
.
Demultiplexed bus timings
Parameter
fCPU = 40 MHz
TCL = 12.5ns
Variable CPU clock
1/2 TCL = 1 to 40 MHz
Unit
Min
Max
Min
Max
4 + tA
–
TCL - 8.5 + tA
–
ns
1.5 + tA
–
TCL - 11 + tA
–
ns
t5
CC ALE high time
t6
CC Address setup to ALE
t80
Address/Unlatched CS setup
CC to RD, WR
(with RW-delay)
12.5 + 2tA
–
2TCL - 12.5 +
+ 2tA
–
ns
t81
Address/Unlatched CS setup
CC to RD, WR
(no RW-delay)
0.5 + 2tA
–
TCL - 12 + 2tA
–
ns
t12
CC
RD, WR low time
(with RW-delay)
15.5 + tC
–
2TCL - 9.5 + tC
–
ns
t13
CC
RD, WR low time
(no RW-delay)
28 + tC
–
3TCL - 9.5 + tC
–
ns
t14
SR
RD to valid data in
(with RW-delay)
–
6 + tC
–
2TCL - 19 + tC
ns
t15
SR
RD to valid data in
(no RW-delay)
–
18.5 + tC
–
3TCL - 19 + tC
ns
t16
SR ALE low to valid data in
–
17.5 + tA +
+ tC
–
3TCL - 20 +
+ tA + tC
ns
t17
SR
Address/Unlatched CS to
valid data in
–
20 + 2tA +
+ tC
–
4TCL - 30 +
+ 2tA + tC
ns
t18
SR
Data hold after RD
rising edge
0
–
0
–
ns
t20
SR
Data float after RD rising
edge (with RW-delay)(1)
–
16.5 + tF
–
2TCL - 8.5 +
+ tF + 2tA
ns
t21
SR
Data float after RD rising
edge (no RW-delay)(1)
–
4 + tF
–
TCL - 8.5 +
+ tF + 2tA
ns
t22
CC Data valid to WR
10 + tC
–
2TCL - 15 + tC
–
ns
t24
CC Data hold after WR
4 + tF
–
TCL - 8.5 + tF
–
ns
t26
CC ALE rising edge after RD, WR
-10 + tF
–
-10 + tF
–
ns
t28
CC
Address/Unlatched CS hold
after RD, WR(2)
0 + tF
–
0 + tF
–
ns
t28h CC
Address/Unlatched CS hold
after WRH
-5 + tF
–
-5 + tF
–
ns
t38
ALE falling edge to Latched
CS
-4 - tA
6 - tA
-4 - tA
6 - tA
ns
CC
157/176
Electrical characteristics
Table 71.
Symbol
ST10F272M
Demultiplexed bus timings (continued)
Parameter
fCPU = 40 MHz
TCL = 12.5ns
Variable CPU clock
1/2 TCL = 1 to 40 MHz
Unit
Min
Max
Min
Max
–
16.5 +
+ tC + 2tA
–
3TCL - 21 +
+ tC + 2tA
ns
2 + tF
–
TCL - 10.5 + tF
–
ns
t39
SR
Latched CS low to Valid Data
In
t41
CC
Latched CS hold after RD,
WR
t82
Address setup to RdCS,
CC WrCS
(with RW-delay)
14 + 2tA
–
2TCL - 11 + 2tA
–
ns
t83
Address setup to RdCS,
CC WrCS
(no RW-delay)
2 + 2tA
–
TCL - 10.5 + 2tA
–
ns
t46
SR
RdCS to Valid Data In
(with RW-delay)
–
4 + tC
–
2TCL - 21 + tC
ns
t47
SR
RdCS to Valid Data In
(no RW-delay)
–
16.5 + tC
–
3TCL - 21 + tC
ns
t48
CC
RdCS, WrCS Low Time
(with RW-delay)
15.5 + tC
–
2TCL - 9.5 + tC
–
ns
t49
CC
RdCS, WrCS Low Time
(no RW-delay)
28 + tC
–
3TCL - 9.5 + tC
–
ns
t50
CC Data valid to WrCS
10 + tC
–
2TCL - 15 + tC
–
ns
t51
SR Data hold after RdCS
0
–
0
–
ns
t53
SR
Data float after RdCS
(with RW-delay)(3)
–
16.5 + tF
–
2TCL - 8.5 + tF
ns
t68
SR
Data float after RdCS
(no RW-delay)(3)
–
4 + tF
–
TCL - 8.5 + tF
ns
t55
CC
Address hold after
RdCS, WrCS
-8.5 + tF
–
-8.5 + tF
–
ns
t57
CC Data hold after WrCS
2 + tF
–
TCL - 10.5 + tF
–
ns
1. RW-delay and tA refer to the next following bus cycle.
2. Read data is latched with the same clock edge that triggers the address change and the rising RD edge. Therefore address
changes before the end of RD have no impact on read cycles.
3. Partially tested, guaranteed by design characterization.
158/176
ST10F272M
Electrical characteristics
Figure 54. External memory cycle: Demultiplexed bus, with/without r/w delay, normal ALE
CLKOUT
t5
t26
t9
ALE
t6
t38
t41
t17
t41u
t39
CSx
t6
A23-A16
A15-A0 (P1)
BHE
t28 (or t28h)
t17
Address
t18
Read cycle
Data bus (P0)
(D15-D8) D7-D0
Data in
t80
t81
t20
t14
t21
t15
RD
t12
t13
Write cycle
Data bus (P0)
(D15-D8) D7-D0
Data out
t80
t22
t81
WR
WRL
WRH
t24
t12
t13
159/176
Electrical characteristics
ST10F272M
Figure 55. External memory cycle: Demultiplexed bus, with/without r/w delay, extended ALE
CLKOUT
t5
t26
t16
ALE
t6
t38
t41
t17
t28
t39
CSx
t6
t17
A23-A16
A15-A0 (P1)
BHE
t28
Address
t18
Read cycle
Data bus (P0)
(D15-D8) D7-D0
Data in
t80
t20
t14
t15
t81
t21
RD
t12
t13
Write cycle
Data bus (P0)
(D15-D8) D7-D0
Data out
t80
t22
t81
WR
WRL
WRH
t12
t13
160/176
t24
ST10F272M
Electrical characteristics
Figure 56. External memory cycle: Demultipl. bus, with/without r/w delay, normal ALE, r/w CS
CLKOUT
t5
t26
t16
ALE
t6
t55
t17
A23-A16
A15-A0 (P1)
BHE
Address
t5
Read cycle
Data bus (P0)
(D15-D8) D7-D0
Data in
t82
t53
t46
t68
t47
t83
RdCSx
t48
t49
Write cycle
Data bus (P0)
(D15-D8) D7-D0
Data out
t82
t50
t83
t57
WrCSx
t48
t49
161/176
Electrical characteristics
ST10F272M
Figure 57. External memory cycle: Demultiplexed bus, without r/w delay, extended ALE, r/w CS
CLKOUT
t5
t26
t16
ALE
t6
t55
t17
A23-A16
A15-A0 (P1)
BHE
Address
t51
Read cycle
Data bus (P0)
(D15-D8) D7-D0
Data in
t53
t46
t82
t47
t83
t68
RdCSx
t48
t49
Write cycle
Data bus (P0)
(D15-D8) D7-D0
Data out
t82
t83
t50
WrCSx
t48
t49
162/176
t57
ST10F272M
24.8.18
Electrical characteristics
CLKOUT and READY
VDD = 5V ± 10%, VSS = 0V, TA = -40 to + 125°C, CL = 50pF
Table 72.
Symbol
CLKOUT and READY timings
fCPU = 40 MHz
TCL = 12.5ns
Parameter
Variable CPU clock
1/2 TCL = 1 to 40 MHz
Unit
Min
Max
Min
Max
t29 CC CLKOUT cycle time
25
25
2TCL
2TCL
ns
t30 CC CLKOUT high time
9
–
TCL - 3.5
–
ns
t31 CC CLKOUT low time
10
–
TCL - 2.5
–
ns
t32 CC CLKOUT rise time
–
4
–
4
ns
t33 CC CLKOUT fall time
–
4
–
4
ns
-2 + tA
8 + tA
-2 + tA
8 + tA
ns
t34 CC CLKOUT rising edge to ALE falling edge
t35 SR
Synchronous READY setup time to
CLKOUT
17
–
17
–
ns
t36 SR
Synchronous READY hold time after
CLKOUT
2
–
2
–
ns
35
–
2TCL + 10
–
ns
17
–
17
–
ns
2
–
2
–
ns
0
2tA + tC + tF
0
2tA + tC + tF
ns
t37 SR Asynchronous READY low time
t58 SR Asynchronous READY setup
time(1)
t59 SR Asynchronous READY hold time(1)
t60 SR
Asynchronous READY hold time after RD,
WR high (Demultiplexed Bus)(2)
1. These timings are given for characterization purposes only, in order to assure recognition at a specific clock edge.
2. Demultiplexed bus is the worst case. For multiplexed bus 2TCL are to be added to the maximum values. This adds even
more time for deactivating READY. 2tA and tC refer to the next following bus cycle, tF refers to the current bus cycle.
163/176
Electrical characteristics
ST10F272M
Figure 58. CLKOUT and READY
READY
wait state
Running cycle 1)
CLKOUT
t32
MUX / Tri-state 6)
t33
t30
t29
t31
t34
ALE
7)
RD, WR
2)
t35
Synchronous
READY
Asynchronous
READY
t36
t35
3)
3)
t58
t59
t58
3)
t36
t59
t60 4)
3)
t37
5)
6)
1. Cycle as programmed, including MCTC wait states (Example shows 0 MCTC WS).
2. The leading edge of the respective command depends on RW-delay.
3. READY sampled HIGH at this sampling point generates a READY controlled wait state, READY sampled
LOW at this sampling point terminates the currently running bus cycle.
4. READY may be deactivated in response to the trailing (rising) edge of the corresponding command (RD or
WR).
5. If the Asynchronous READY signal does not fulfill the indicated setup and hold times with respect to
CLKOUT (for example, because CLKOUT is not enabled), it must fulfill t37 in order to be safely
synchronized. This is guaranteed, if READY is removed in response to the command (see Note 4).
6. Multiplexed bus modes have a MUX wait state added after a bus cycle, and an additional MTTC wait state
may be inserted here.
For a multiplexed bus with MTTC wait state this delay is two CLKOUT cycles, for a demultiplexed bus
without MTTC wait state this delay is zero.
7. The next external bus cycle may start here.
164/176
ST10F272M
24.8.19
Electrical characteristics
External bus arbitration
VDD = 5V ± 10%, VSS = 0V, TA = -40 to +125°C, CL = 50pF
Table 73.
External bus arbitration timings
Symbol
fCPU = 40 MHz
TCL = 12.5ns
Parameter
Variable CPU clock
1/2 TCL = 1 to 40 MHz
Min
Max
Min
Max
Unit
t61 SR
HOLD input setup time
to CLKOUT
18.5
–
18.5
–
ns
t62 CC
CLKOUT to HLDA high
or BREQ low delay
–
12.5
–
12.5
ns
t63 CC
CLKOUT to HLDA low
or BREQ high delay
–
12.5
–
12.5
ns
–
20
–
20
ns
-4
15
-4
15
ns
t66 CC Other signals release
–
20
–
20
ns
t67 CC Other signals drive
-4
15
-4
15
ns
t64 CC CSx release(1)
t65 CC CSx drive
(1)
1. Partially tested, guaranteed by design characterization
Figure 59. External bus arbitration (releasing the bus)
CLKOUT
t61
HOLD
t63
HLDA
1)
t62
2)
BREQ
t64
3)
CSx
(P6.x)
1)
t66
Others
1. The ST10F272M will complete the currently running bus cycle before granting bus access.
2. This is the first possibility for BREQ to become active.
3. The CS outputs will be resistive high (pull-up) after t64.
165/176
Electrical characteristics
ST10F272M
Figure 60. External bus arbitration (regaining the bus)
(2)
CLKOUT
t61
HOLD
t62
HLDA
t62
t62
t63
(1)
BREQ
t65
CSx
(On P6.x)
t67
Other
signals
1. This is the last chance for BREQ to trigger the indicated regain-sequence. Even if BREQ is activated
earlier, the regain-sequence is initiated by HOLD going high. Please note that HOLD may also be
deactivated without the ST10F272M requesting the bus.
2. The next ST10F272M driven bus cycle may start here.
24.8.20
High-speed synchronous serial interface (SSC) timing
24.8.20.1 Master mode
VDD = 5V ±10%, VSS = 0V, TA = -40 to +125°C, CL = 50pF
Table 74.
Symbol
SSC master mode timings
Maximum baudrate
6.6 Mbaud(1)
@ fCPU = 40 MHz
(<SSCBR> = 0002h)
Parameter
Variable baudrate
(<SSCBR> = 0001h - FFFFh)
Min
Max
Min
Max
Unit
t300
CC SSC clock cycle time(2)
150
150
8TCL
262144 TCL
ns
t301
CC SSC clock high time
63
–
t300 / 2 - 12
–
ns
t302
CC SSC clock low time
63
–
t300 / 2 - 12
–
ns
t303
CC SSC clock rise time
–
10
–
10
ns
t304
CC SSC clock fall time
–
10
–
10
ns
t305
CC Write data valid after shift edge
–
15
–
15
ns
-2
–
-2
–
ns
t306
CC Write data hold after shift
166/176
edge(3)
ST10F272M
Table 74.
Electrical characteristics
SSC master mode timings (continued)
Symbol
Maximum baudrate
6.6 Mbaud(1)
@ fCPU = 40 MHz
(<SSCBR> = 0002h)
Parameter
Read data setup time before latch
t307p SR edge, phase error detection on
(SSCPEN = 1)
Read data hold time after latch
t308p SR edge, phase error detection on
(SSCPEN = 1)
Variable baudrate
(<SSCBR> = 0001h - FFFFh)
Unit
Min
Max
Min
Max
37.5
–
2TCL + 12.5
–
ns
50
–
4TCL
–
ns
t307
Read data setup time before latch
SR edge, phase error detection off
(SSCPEN = 0)
25
–
2TCL
–
ns
t308
Read data hold time after latch
SR edge, phase error detection off
(SSCPEN = 0)
0
–
0
–
ns
1. When 40 MHz CPU clock is used the maximum baudrate cannot be higher than 6.6Mbaud (<SSCBR> = ‘2h’) due to the
limited granularity of <SSCBR>. Value ‘1h’ for <SSCBR> can be used only with CPU clock equal to (or lower than) 32 MHz.
2. Formula for SSC Clock Cycle time: t300 = 4 TCL x (<SSCBR> + 1) Where <SSCBR> represents the content of the SSC
baudrate register, taken as unsigned 16-bit integer. Minimum limit allowed for t300 is 125ns (corresponding to 8Mbaud).
3. Partially tested, guaranteed by design characterization.
Figure 61. SSC master timing
t300
(1)
t301
t302
(2)
SCLK
t304
t305
t305
MTSR
1st out bit
t303
t306
2nd out bit
t307 t308
MRST
1st in bit
t305
Last out bit
t307 t308
2nd In bit
Last in bit
1. The phase and polarity of shift and latch edge of SCLK is programmable. This figure uses the leading clock
edge as shift edge (drawn in bold), with latch on trailing edge (SSCPH = 0b), Idle clock line is low, leading
clock edge is low-to-high transition (SSCPO = 0b).
2. The bit timing is repeated for all bits to be transmitted or received.
167/176
Electrical characteristics
ST10F272M
24.8.20.2 Slave mode
VDD = 5V ±10%, VSS = 0V, TA = -40 to +125°C, CL = 50pF
Table 75.
Symbol
SSC slave mode timings
Parameter
Maximum baudrate
6.6 Mbaud(1)
@ fCPU = 40 MHz
(<SSCBR> = 0002h)
Variable baudrate
(<SSCBR> = 0001h - FFFFh)
Min
Max
Min
Max
Unit
t310
SR SSC clock cycle time(2)
150
150
8TCL
262144 TCL
ns
t311
SR SSC clock high time
63
–
t310 / 2 - 12
–
ns
t312
SR SSC clock low time
63
–
t310 / 2 - 12
–
ns
t313
SR SSC clock rise time
–
10
–
10
ns
t314
SR SSC clock fall time
–
10
–
10
ns
t315
CC Write data valid after shift edge
–
55
–
2TCL + 30
ns
t316
CC Write data hold after shift edge
0
–
0
–
ns
Read data setup time before latch
t317p SR edge, phase error detection on
(SSCPEN = 1)
62
–
4TCL + 12
–
ns
Read data hold time after latch
t318p SR edge, phase error detection on
(SSCPEN = 1)
87
–
6TCL + 12
–
ns
t317
Read data setup time before latch
SR edge, phase error detection off
(SSCPEN = 0)
6
–
6
–
ns
t318
Read data hold time after latch
SR edge, phase error detection off
(SSCPEN = 0)
31
–
2TCL + 6
–
ns
1. When 40 MHz CPU clock is used the maximum baudrate cannot be higher than 6.6Mbaud (<SSCBR> = ‘2h’) due to the
limited granularity of <SSCBR>. Value ‘1h’ for <SSCBR> may be used only with CPU clock lower than 32 MHz (after
checking that resulting timings are suitable for the master).
2. Formula for SSC Clock Cycle time: t310 = 4 TCL * (<SSCBR> + 1)
Where <SSCBR> represents the content of the SSC baudrate register, taken as unsigned 16-bit integer.
Minimum limit allowed for t310 is 125ns (corresponding to 8Mbaud).
168/176
ST10F272M
Electrical characteristics
Figure 62. SSC slave timing
t310
(1)
t311
t312
(2)
SCLK
t315
MRST
t314
t313
t315
t316
1st out bit
2nd out bit
t317 t318
MTSR
1st in bit
t315
Last out bit
t317 t318
2nd in bit
Last in bit
1. The phase and polarity of shift and latch edge of SCLK is programmable. This figure uses the leading clock
edge as shift edge (drawn in bold), with latch on trailing edge (SSCPH = 0b), Idle clock line is low, leading
clock edge is low-to-high transition (SSCPO = 0b).
2. The bit timing is repeated for all bits to be transmitted or received.
169/176
Package information
25
ST10F272M
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
Second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK® specifications are available at www.st.com.
170/176
ST10F272M
Package information
Figure 63. PQFP144 mechanical data and package dimension
mm
DIM.
MIN.
inch
TYP.
MAX.
A
MIN.
TYP.
4.07
A1
0.25
A2
3.17
0.160
0.010
3.42
3.67
0.125
0.135
0.144
B
0.22
0.38
0.009
0.015
C
0.13
0.23
0.005
0.009
D
30.95
31.20
31.45
1.219
1.228
1.238
D1
27.90
28.00
28.10
1.098
1.102
1.106
D3
22.75
0.896
e
0.65
0.026
E
30.95
31.20
31.45
1.219
1.228
1.238
E1
27.90
28.00
28.10
1.098
1.102
1.106
E3
22.75
L
OUTLINE AND
MECHANICAL DATA
MAX.
0.65
0.896
0.80
L1
0.95
0.026
1.60
0.031
0.037
0.063
PQFP144
0°(min.), 7°(max.)
K
D
D1
A
D3
A2
A1
108
109
73
72
0.10mm
.004
E
E1
E3
B
B
Seating Plane
37
144
1
36
C
L
L1
e
K
PQFP144
171/176
Package information
ST10F272M
Figure 64. LQFP144 mechanical data and package dimension
mm
inch
DIM.
MIN.
TYP.
A
MAX.
MIN.
TYP.
1.60
A1
0.05
A2
1.35
B
0.17
C
0.09
0.15
0.002
0.006
1.40
1.45
0.053
0.055
0.057
0.22
0.27
0.007
0.009
0.011
0.20
0.003
0.008
22.00
0.866
D1
20.00
0.787
D3
17.50
0.689
e
0.50
0.020
E
22.00
0.866
E1
20.00
0.787
E3
17.50
0.689
L1
K
0.45
0.60
1.00
0.75
OUTLINE AND
MECHANICAL DATA
0.063
D
L
MAX.
0.018
0.024
0.0393
3.5˚ (min.), 7˚(max.)
0.030
LQFP144
TQFP144
(20x20x1.40mm)
Note 1: Exact shape of each corner is optional.
0099183 B
172/176
ST10F272M
26
Ordering information
Ordering information
Table 76.
Device summary
Order code
Package
ST10F272M-4Q3
Packing
Temperature
range (°C)
CPU frequency
range (MHz)
-40 to +125
1 to 40
Tray
PQFP144
ST10F272M-4QR3
Tape and reel
ST10F272M-4T3
Tray
LQFP144
ST10F272M-4TR3
Tape and reel
173/176
Revision history
27
Revision history
Table 77.
174/176
ST10F272M
Document revision history
Date
Revision
09-May-2007
1
Changes
Initial release
ST10F272M
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175/176