ST2329 2-bit dual supply level translator without control pin Data Brief Features ■ 100 Mbps (typ.) data rate when driven by a totem pole driver ■ 4 Mbps (typ.) data rate when driven by a Open Drain pole driver ■ Bidirectional level translation, without direction pin QFN10L (1.8mm x 1.4mm) ■ Wide VL voltage range of 1.65V to 3.6V ■ Wide VCC voltage range of 1.80V to 5.5V ■ Power down mode feature – when either supply is off, all I/Os are in High Impedance. ■ Low quiescent current (max 10µA) ■ Suitable to be driven by Totem Pole and Open Drain driver. ■ 5.5V tolerant enable pin ■ ESD Performance on all Pins : ±2kv HBM ■ Small package and footprint QFN10 ( 1.8 x 1.4 mm ) package Description ST2329 is a level translator providing level shifting necessary to allow data transfer in a multi-voltage system. Externally applied voltages, VCC and VL, set the logic levels on either side of the device. It utilizes transmission gate based design that allows bidirectional level translation without control pin. The ST2329 accepts VL from 1.65V to 3.6V and VCC from 1.80V to 5.5V, making it ideal for data transfer between low-voltage ASICs /PLD and higher voltage system. This device has threestate output mode that disables all I/Os. Application ■ Low voltage system level translation ■ Mobile phone ■ Other mobile devices ■ I2C level translation ■ UART level translation Table 1. May 2007 ST2329 supports power-down mode at either of its supply (VL or VCC) where it will disable all I/Os when one of the supply is off. This feature will protect the device from current backflow through the device. Device summary Part number Package Packaging ST2329QTR QFN10L (1.8mm x 1.4mm) Tape and Reel (3000 parts per reel) Rev 1 For further information contact your local STMicroelectronics sales office. 1/8 www.st.com 8 Package mechanical data ST2329 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com 2/8 ST2329 Package mechanical data Table 2. QFN10L(1.8x1.4) Mechical data ref. mm inch Nom Min Max Nom Min Max 0.50 0.45 0.55 0.020 0.017 0.021 A1 0.02 0 0.05 0.001 0 0.002 A3 0.127 0.005 0 0 b 0.20 0.007 0.006 0.010 A 0.15 0.25 D 1.80 1.70 1.90 0.070 0.066 0.074 E 1.40 1.30 1.50 0.055 0.051 0.059 e 0.40 L 0.40 0.011 0.020 Figure 1. 0.015 0.30 0.50 0.015 Package dimension 3/8 Package mechanical data 4/8 Figure 2. QFN10L(1.8x1.4) Foot print recommendation Figure 3. QFN10L(1.8x1.4) carrier type ST2329 ST2329 Package mechanical data Figure 4. QFN10L(1.8x1.4) Reel information 5/8 Package mechanical data Figure 5. 6/8 QFN10L(1.8x1.4) Reel information ST2329 ST2329 1 Revision history Revision history Table 2. Revision history Date Revision 05-May-2007 1 Changes First release 7/8 ST2329 Please Read Carefully: Information in this document is provided solely in connection with ST products. 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