STE101P 10/100 Fast ethernet 3.3V transceiver Data Brief Feature summary ■ IEEE802.3u 100Base-TX and IEEE802.3 10Base-T transceiver ■ Support for IEEE802.3x flow control ■ MII /RMII / SMII interface ■ Auto MDIX supported ■ Provides Full-duplex operation on both 100Mbps and 10Mbps modes ■ Provides MLT-3 transceiver with DC restoration for Base-line wander compensation ■ Provides loop-back modes for diagnostics ■ Supports external transformer with turn ratio 1.414:1 on Tx/Rx side. ■ Five LED display for operating mode and functionaliity signalling ■ Operation from single 3.3V supply ■ High Cable ESD tolerance ■ Standard 64-pin QFP package pinout ■ Industrial temperature compliant ■ Self termination transceiver for external components and power saving ■ Power dissipation < 200mW TQFP64 (10x10x1.4mm) Description The STE101P is a high performance Fast Ethernet physical layer interface for 10Base-T and 100Base-TX applications. It was designed with advanced CMOS technology to provide MII, RMII and SMII interfaces for easy attachment to 10/100 Media Access Controllers (MAC) and a physical media interface for 100Base-TX of IEEE802.3u and 10Base-T of IEEE802.3. The STE101P supports both half-duplex and fullduplex operation at 10 and 100 Mbps operation. Its operating mode can be set using autonegotiation, parallel detection or manual control. It also allows for the support of auto-negotiation functions for speed and duplex detection. The Automatic MDI / MDIX feature compensates for using a cross over cable. With Auto MDIX, the STE101P automatically detects what is on the other end of the network cable and switches the TX & RX pins accordingly. Applications ■ Switches/Routers/Hubs ■ Nic adapters ■ Game consoles ■ VoIP gateways/phones ■ Network Printers ■ DTVs/DVD-Rs Order codes Part number Temp range, °C Package Packing E-STE101P(1) -40 to 85 TQFP64 (14x14x1.4mm) Tube (1) E-: ECOPACK® (see Chapter 2) February 2006 Rev 1 For further information contact your local STMicroelectronics sales office. 1/5 www.st.com 5 System diagram of the STE101P application System diagram of the STE101P application Figure 1. System diagram of the STE101P application PCI Interface Serial EEPROM MA C Device Boot ROM 2/5 LEDs STE101P 25 MHz Crystal Transformer 1 STE101P RJ-45 STE101P Package information In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. TQFP64 (10 x 10 x 1.4mm) Mechanical Data & Package Dimensions mm inch DIM. MIN. TYP. MAX. A MIN. TYP. 1.60 A1 0.05 0.15 0.063 0.002 0.006 A2 1.35 1.40 1.45 0.053 B 0.17 0.22 0.27 0.0066 0.0086 0.0106 C 0.09 D 11.80 12.00 12.20 0.464 0.472 0.480 D1 9.80 10.00 10.20 0.386 0.394 0.401 0.055 0.057 0.0035 D3 7.50 e 0.295 0.50 0.0197 E 11.80 12.00 12.20 0.464 0.472 0.480 E1 9.80 10.00 10.20 0.386 0.394 0.401 E3 7.50 L OUTLINE AND MECHANICAL DATA MAX. 0.45 0.295 0.60 0.75 0.0177 0.0236 0.0295 L1 1.00 K 0˚ (min.), 3.5˚ (min.), 7˚(max.) 0.0393 ccc 0.080 TQFP64 (10 x 10 x 1.4mm) 0.0031 D D1 A D3 A2 A1 48 33 49 32 0.08mm ccc B Seating Plane E E1 E3 17 64 1 16 C L1 e L Figure 2. B 2 Package information K TQFP64 0051434 E 3/5 Revision history 3 STE101P Revision history Table 1. 4/5 Document revision history Date Revision 10-Feb-2006 1 Changes Initial release. STE101P Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. 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