STPS15L25D/G ® LOW DROP POWER SCHOTTKY RECTIFIER MAIN PRODUCT CHARACTERISTICS IF(AV) 15 A VRRM 25 V Tj (max) 150 °C VF (max) 0.35 V K A FEATURES n n n A NC K VERY LOW FORWARD VOLTAGE DROP FOR LESS POWER DISSIPATION AND REDUCED HEATSINK OPTIMIZED CONDUCTION/REVERSE LOSSES TRADE-OFF WHICH MEANS THE HIGHEST EFFICIENCY IN THE APPLICATIONS AVALANCHE CAPABILITY SPECIFIED TO-220AC STPS15L25D D2PAK STPS15L25G DESCRIPTION Single Schottky rectifier suited for Switched Mode Power Supplies and high frequency DC to DC converters (VRMS). Packaged in TO-220AC or D2PAK, this device is especially intended for use as a Rectifier at the secondary of 3.3V SMPS and DC/DC units. ABSOLUTE RATINGS (limiting values) Symbol Value Unit VRRM Repetitive peak reverse voltage 25 V IF(RMS) RMS forward current 30 A IF(AV) Average forward current Tc = 145°C δ = 0.5 15 A IFSM Surge non repetitive forward current tp = 10ms Sinusoidal 250 A IRRM Repetitive peak reverse current tp = 2µs square F=1kHz 1 A IRSM Non repetitive peak reverse current tp = 100µs square 4 A PARM Repetitive peak avalanche power tp = 1µs 9000 W - 65 to + 150 °C 150 °C 10000 V/µs Tstg Tj dV/dt * : Parameter Tj = 25°C Storage temperature range Maximum operating junction temperature * Critical rate of rise of reverse voltage dPtot 1 thermal runaway condition for a diode on its own heatsink < dTj Rth( j − a ) July 2003 - Ed : 5B 1/5 STPS15L25D/G THERMAL RESISTANCES Symbol Parameter Value Unit 1 °C/W Junction to case Rth(j-c) STATIC ELECTRICAL CHARACTERISTICS Symbol Parameters Test conditions Reverse leakage current IR * Tj = 25°C Tj = 125°C Forward voltage drop VF * Min. Typ. VR = VRRM 225 Tj = 25°C IF = 15A Tj = 125°C IF = 15A Tj = 25°C IF = 30A Tj = 125°C IF = 30A 0.3 Max. Unit 1.3 mA 450 mA 0.46 V 0.35 0.56 0.41 0.46 Pulse test : * tp = 380 µs, δ < 2% To evaluate the maximum conduction losses use the following equation : P = 0.24 x IF(AV) + 0.0073 IF2(RMS) Fig. 1: Average forward power dissipation versus average forward current. Fig. 2: Average forward current versus ambient temperature ( δ = 0.5). IF(av)(A) PF(av)(W) 16 8 δ = 0.1 δ = 0.05 7 δ = 0.2 14 δ = 0.5 6 12 5 10 4 8 δ=1 Rth(j-a)=50°C/W 6 3 T 2 1 0 Rth(j-a)=Rth(j-c) δ=tp/T IF(av) (A) 0 2 4 6 8 10 12 2 tp 14 T 4 16 Fig. 3: Normalized avalanche power derating versus pulse duration. 0 δ=tp/T 0 50 75 100 125 150 Fig. 4: Normalized avalanche power derating versus junction temperature. PARM(tp) PARM(1µs) 1 Tamb(°C) tp 25 1.2 PARM(tp) PARM(25°C) 1 0.1 0.8 0.6 0.4 0.01 0.2 0.001 0.01 2/5 Tj(°C) tp(µs) 0.1 1 0 10 100 1000 0 25 50 75 100 125 150 STPS15L25D/G Fig. 5: Non repetitive surge peak forward current versus overload duration (maximum values). Fig. 6: Relative variation of thermal impedance junction to case versus pulse duration. IM(A) Zth(j-c)/Rth(j-c) 350 1.0 300 0.8 250 200 Tc=25°C 150 Tc=75°C 0.6 0.4 δ = 0.2 100 Tc=100°C IM 50 t T δ = 0.1 0.2 t(s) δ=0.5 0 1E-3 t(s) Single pulse 1E-2 1E-1 1E+0 Fig. 7: Reverse leakage current versus reverse voltage applied (typical values). 1E+3 δ = 0.5 0.0 1.0E-4 1.0E-3 δ=tp/T 1.0E-2 1.0E-1 tp 1.0E+0 Fig. 8: Junction capacitance versus reverse voltage applied (typical values). C(nF) IR(mA) 5.0 Tj=150°C F=1MHz Tj=25°C Tj=125°C 1E+2 1E+1 1.0 1E+0 Tj=25°C 1E-1 VR(V) 1E-2 0 5 10 15 20 25 Fig. 9: Forward voltage drop versus forward current (maximum values). 200.0 100.0 0.1 2 5 10 20 30 Fig. 10: Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board FR4, copper thickness : 35 µm). (STPS15L25G only) IFM(A) Rth(j-a) (°C/W) 80 70 Typical values Tj=150°C 60 10.0 50 Tj=125°C 40 30 Tj=25°C 1.0 20 10 VFM(V) 0.1 0.0 VR(V) 1 0.2 0.4 0.6 0.8 0 1.0 1.2 1.4 S(Cu) (cm²) 0 4 8 12 16 20 24 28 32 36 40 3/5 STPS15L25D/G PACKAGE MECHANICAL DATA D2PAK DIMENSIONS REF. A E C2 L2 D L L3 A1 B2 R C B G A2 2.0 MIN. FLAT ZONE Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.70 0.93 0.027 0.037 B2 1.14 1.70 0.045 0.067 C 0.45 0.60 0.017 0.024 C2 1.23 1.36 0.048 0.054 D 8.95 9.35 0.352 0.368 E 10.00 10.40 0.393 0.409 G 4.88 5.28 0.192 0.208 L 15.00 15.85 0.590 0.624 L2 1.27 1.40 0.050 0.055 L3 1.40 1.75 0.055 0.069 M 2.40 3.20 0.094 0.126 R V2 Millimeters V2 0.40 typ. 0° 0.016 typ. 8° 0° 8° FOOT PRINT DIMENSIONS (in millimeters) n 16.90 10.30 5.08 1.30 3.70 8.90 4/5 COOLING METHOD: (METHOD C) BY CONDUCTION STPS15L25D/G PACKAGE MECHANICAL DATA TO-220AC DIMENSIONS REF. A H2 C L5 L7 ØI L6 L2 D L9 F1 M F E G Max. Min. Max. A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.066 G 4.95 5.15 0.194 0.202 H2 10.00 10.40 0.393 0.409 n n 0.645 typ. 13.00 14.00 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154 Diam. I n 16.40 typ. L4 M n Inches Min. L2 L4 Millimeters 2.6 typ. 3.75 0.102 typ. 3.85 0.147 0.151 COOLING METHOD : C RECOMMENDED TORQUE VALUE : 0.55 M.N MAXIMUM TORQUE VALUE : 0.70 M.N Ordering type Marking Package Weight Base qty Delivery mode STPS15L25D STPS15L25D TO-220AC 1.86g 50 Tube STPS15L25G STPS15L25G D2PAK 1.48g 50 Tube STPS15L25G-TR STPS15L25G D2PAK 1.48g 1000 Tape & reel EPOXY MEETS UL94,V0 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. 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