STMICROELECTRONICS STPS30H60C

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STPS30H60C
Power Schottky rectifier
Main product characteristics
IF(AV)
2 X 15 A
VRRM
60 V
Tj
175° C
VF (typ)
A1
K
A2
A2
K
A1
0.535 V
TO-220FPAB
STPS30H60CFP
Features and benefits
■
High junction temperature capability
■
Avalanche rated
■
Low leakage current
■
Good trade-off between leakage current and
forward voltage drop
■
A2
A2
K
A1
High frequency operation
TO-220AB
STPS30H60CT
K
A1
I2PAK
STPS30H60CR
Description
K
Dual centre tab Schottky rectifier suited for high
frequency switch mode power supply.
Packaged in TO-220FPAB, TO-220AB, TO-247,
I2PAK, and D2PAK, this device is intended to be
used in notebook and LCD adaptors and desktop
SMPS. In these applications the STPS30H60C
provides a good margin between the remaining
voltages applied on the diode and the voltage
capability of the diode
A2
A1
A2
K
A1
D2PAK
STPS30H60CG
TO-247
STPS30H60CW
Order codes
March 2007
Rev 2
Part Number
Marking
STPS30H60CT
STPS30H60CT
STPS30H60CR
STPS30H60CR
STPS30H60CG-TR
STPS30H60CG
STPS30H60CG
STPS30H60CG
STPS30H60CW
STPS30H60CW
STPS30H60CFP
STPS30H60CFP
1/11
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11
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Characteristics
STPS30H60C
1
Characteristics
Table 1.
Absolute ratings (limiting values per diode)
Symbol
Parameter
Value
Unit
VRRM
Repetitive peak reverse voltage
60
V
IF(RMS)
RMS forward current
30
A
IF(AV)
Average forward current, δ = 0.5
TO-220AB
Tc = 155° C
Per diode
15
Total package
30
TO-220FPAB
Tc = 135° C
Per diode
15
Total package
30
IFSM
Surge non repetitive forward current
tp = 10 ms Sinusoidal
PARM
Releative peak avalanche power
Tj = 25° C
Tstg
Storage temperature range
Maximum operating junction
Tj
dP tot
1
--------------- < -------------------------dT j
R th ( j – a )
1.
Table 2.
Symbol
IR(1)
Parameter
Junction to case
Coupling
175
°C
Per diode
1.5
Total
0.8
Per diode
4.7
Total
3.95
TO-220AB, I2PAK, D2PAK, TO-247
0.1
TO-220FPAB
3.2
Unit
°C/W
Static electrical characteristics
Parameter
Reverse leakage current
Test conditions
Tj = 25° C
Tj = 125° C
Tj = 125° C
Forward voltage drop
Tj = 25° C
Tj = 125° C
Tj = 25° C
Tj = 125° C
VR = VRRM
IF = 7.5 A
IF = 15 A
IF = 30 A
1. Pulse test: tp = 5 ms, δ < 2%
2. Pulse test: tp = 380 µs, δ < 2%
To evaluate the conduction losses use the following equation:
P = 0.45 x IF(AV) + 0.008 x IF2(RMS)
2/11
°C
Value
Tj = 25° C
VF(2)
-65 to + 175
Thermal parameters
TO-220FPAB
Table 3.
A
W
temperature(1)
TO-220AB, I2PAK,
D2PAK, TO-247
Rth(c)
230
10 200
tp = 1 µs
condition to avoid thermal runaway for a diode on its own heatsink
Symbol
Rth(j-c)
A
Min.
Typ
8
Max.
Unit
60
µA
25
mA
550
435
470
660
535
570
820
635
690
mV
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STPS30H60C
Figure 1.
Characteristics
Conduction losses versus
average forward current
Figure 2.
PF(AV)(W)
12
δ=0.1
δ=0.05
18
δ=0.5
δ=0.2
Average forward current versus
ambient temperature
(δ = 0.5, per diode)
IF(AV)(A)
δ=1
Rth(j-a)=Rth(j-c)
16
10
14
TO-220FPAB
12
8
10
6
8
Rth(j-a)=15 °C/W
6
4
T
4
2
2
IF(AV)(A)
δ=tp/T
0
0
0
2
Figure 3.
4
6
8
10
12
14
Tamb(°C)
tp
16
0
18
Normalized avalanche power
derating versus pulse duration
25
Figure 4.
PARM(tp)
PARM(1µs)
50
75
100
125
150
175
Normalized avalanche power
derating versus junction
temperature
PARM(tp)
PARM(25°C)
1.E+00
1.2
1.0
1.E-01
0.8
0.6
1.E-02
0.4
0.2
Tj(°C)
tp(µs)
0.0
1.E-03
1.E-02
1.E-01
Figure 5.
1.E+01
1.E+00
1.E+03
1.E+02
Non repetitive surge peak forward
current versus overload duration
(maximum values, per diode)
(TO-220AB, TO-247 D2PAK, I2PAK)
25
Figure 6.
IM(A)
120
200
50
75
100
125
150
Non repetitive surge peak forward
current versus overload duration
(maximum values, per diode)
(TO-220FPAB)
IM(A)
TO-220FPAB
180
100
160
140
TC=50°C
80
TC=50 °C
120
60
100
TC=75°C
80
TC=75 °C
40
60
40
20
0
1.E-03
TC=125°C
20
IM
t
δ =0.5
t(s)
t
δ =0.5
t(s)
1.E-02
TC=125 °C
IM
1.E-01
1.E+00
0
1.E-03
1.E-02
1.E-01
1.E+00
3/11
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Characteristics
STPS30H60C
Figure 8.
Relative variation of thermal
impedance junction to case versus
pulse duration (TO-220AB, TO-247
D2PAK, I2PAK)
Figure 7.
Zth(j-c)/Rth(j-c)
1.0
1.0
0.7
δ=0.5
0.6
0.6
0.5
0.5
0.4
δ=0.2
0.3
δ=0.1
δ=0.5
0.4
δ=0.2
0.3
T
0.2
0.1
TO-220FPAB
0.8
0.8
0.7
Zth(j-c)/Rth(j-c)
0.9
0.9
Relative variation of thermal
impedance junction to case versus
pulse duration (TO-220FPAB)
Single pulse
δ=tp/T
tp(s)
T
δ=0.1
0.2
0.1
tp
δ=tp/T
tp(s)
Single pulse
0.0
tp
0.0
1.E-03
1.E-02
Figure 9.
1.E-01
1.E+00
Reverse leakage current versus
reverse voltage applied
(typical values, per diode)
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
Figure 10. Junction capacitance versus
reverse voltage applied
(typical values, per diode)
IR(mA)
C(nF)
1.E+02
10.0
Tj=150°C
1.E+01
F=1MHz
Vosc=30mVRMS
Tj=25°C
Tj=125°C
Tj=100°C
1.E+00
1.0
Tj=75°C
1.E-01
Tj=50°C
1.E-02
Tj=25°C
VR(V)
VR(V)
1.E-03
0
5
10
15
20
25
30
35
40
45
0.1
50
55
60
Figure 11. Forward voltage drop versus
forward current (per diode)
100
1
10
100
Figure 12. Thermal resistance junction to
ambient versus copper surface
under tab (epoxy printed board
FR4, copper thickness = 35 µm)
(D2PAK)
IFM(A)
Rth(j-a)(°C/W)
80
TJ=125 °C
Maximum values
70
TJ=125 °C
Typical values
60
TJ=25 °C
Maximum values
50
10
40
30
20
10
VFM(V)
S(cm²)
1
0
0.0 0.1
4/11
0.2 0.3 0.4 0.5
0.6 0.7 0.8
0.9 1.0 1.1 1.2
1.3 1.4
0
5
10
15
20
25
30
35
40
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STPS30H60C
2
Package mechanical data
Package mechanical data
●
Epoxy meets UL94, V0
●
Cooling method: by conduction (C)
●
Recommended torque value: 0.8 Nm
●
Maximum torque value: 1.0 Nm
Table 4.
TO-220FPAB dimensions
Dimensions
Ref.
A
B
H
Dia
L6
L7
L2
L3
L5
F1
L4
F
G
Inches
Min.
Max.
Min.
Max.
A
4.4
4.6
0.173
0.181
B
2.5
2.7
0.098
0.106
D
2.5
2.75
0.098
0.108
E
0.45
0.70
0.018
0.027
F
0.75
1
0.030
0.039
F1
1.15
1.70
0.045
0.067
F2
1.15
1.70
0.045
0.067
G
4.95
5.20
0.195
0.205
G1
2.4
2.7
0.094
0.106
H
10
10.4
0.393
0.409
D
F2
G1
Millimeters
L2
E
16 Typ.
0.63 Typ.
L3
28.6
30.6
1.126
1.205
L4
9.8
10.6
0.386
0.417
L5
2.9
3.6
0.114
0.142
L6
15.9
16.4
0.626
0.646
L7
9.00
9.30
0.354
0.366
Dia.
3.00
3.20
0.118
0.126
5/11
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Package mechanical data
Table 5.
STPS30H60C
TO-220AB dimensions
Dimensions
Ref
A
H2
Dia
C
L5
L7
L6
L2
F2
F1
L4
F
Min.
Max.
Min.
Max.
A
4.40
4.60
0.173
0.181
C
1.23
1.32
0.048
0.051
D
2.40
2.72
0.094
0.107
E
0.49
0.70
0.019
0.027
F
0.61
0.88
0.024
0.034
F1
1.14
1.70
0.044
0.066
F2
1.14
1.70
0.044
0.066
G
4.95
5.15
0.194
0.202
G1
2.40
2.70
0.094
0.106
H2
10
10.40
0.393
0.409
L2
M
E
G
16.4 typ.
0.645 typ.
L4
13
14
0.511
0.551
L5
2.65
2.95
0.104
0.116
L6
15.25
15.75
0.600
0.620
L7
6.20
6.60
0.244
0.259
L9
3.50
3.93
0.137
0.154
M
Diam.
6/11
Inches
D
L9
G1
Millimeters
2.6 typ.
3.75
3.85
0.102 typ.
0.147
0.151
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STPS30H60C
Package mechanical data
Table 6.
TO-247 dimensions
DIMENSIONS
REF
Millimeters
Min.
V
V
Dia
A
H
L5
L2
Max.
Min.
Typ.
Max.
A
4.85
5.15
0.191
0.203
D
2.20
2.60
0.086
0.102
E
0.40
0.80
0.015
0.031
F
1.00
1.40
0.039
0.055
F1
3.00
0.118
F2
2.00
0.078
F3
2.00
2.40
0.078
0.094
F4
3.00
3.40
0.118
0.133
G
L
Typ.
Inches
10.90
0.429
H
15.45
15.75 0.608
0.620
L
19.85
20.15 0.781
0.793
L1
3.70
4.30
0.169
L4
F2
F1
L1
F3
V2
F4
D
L3
L2
F(x3)
M
G
E
L3
0.145
18.50
14.20
0.728
14.80 0.559
0.582
L4
34.60
1.362
L5
5.50
0.216
M
2.00
3.00
0.078
0.118
V
5°
5°
V2
60°
60°
Dia.
3.55
3.65
0.139
0.143
7/11
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Package mechanical data
Table 7.
STPS30H60C
I2PAK dimensions
DIMENSIONS
REF.
A
E
c2
L2
D
L1
A1
b1
L
b
c
Millimeters
Inches
Min.
Max.
Min.
Max.
A
4.40
4.60
0.173
0.181
A1
2.40
2.72
0.094
0.107
b
0.61
0.88
0.024
0.035
b1
1.14
1.70
0.044
0.067
c
0.49
0.70
0.019
0.028
c2
1.23
1.32
0.048
0.052
D
8.95
9.35
0.352
0.368
e
2.40
2.70
0.094
0.106
e1
4.95
5.15
0.195
0.203
E
10
10.40
0.394
0.409
L
13
14
0.512
0.551
L1
3.50
3.93
0.138
0.155
L2
1.27
1.40
0.050
0.055
e
e1
8/11
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STPS30H60C
Package mechanical data
Table 8.
D2PAK dimensions
DIMENSIONS
REF.
Millimeters
Inches
Min.
Max
Min.
Max.
A
4.40
4.60
0.173
0.181
A1
2.49
2.69
0.098
0.106
A2
0.03
0.23
0.001
0.009
B
0.70
0.93
0.027
0.037
B2
1.14
1.70
0.045
0.067
C
0.45
0.60
0.017
0.024
C2
1.23
1.36
0.048
0.054
D
8.95
9.35
0.352
0.368
E
10.00
10.40
0.393
0.409
G
4.88
5.28
0.192
0.208
L
15.00
15.85
0.590
0.624
L2
1.27
1.40
0.050
0.055
L3
1.40
1.75
0.055
0.069
M
2.40
3.20
0.094
0.126
A
E
C2
L2
D
L
L3
A1
B2
R
C
B
G
A2
M
*
V2
* FLAT ZONE NO LESS THAN 2mm
R
V2
0.40 typ.
0°
8°
0.016 typ.
0°
8°
Figure 13. Footprint (dimensions in millimeters)
16.90
10.30
5.08
1.30
8.90
3.70
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect . The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
9/11
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Ordering information
3
Ordering information
Part Number
STPS30H60CT
4
10/11
STPS30H60C
Marking
STPS30H60CT
Package
Weight
Base qty
Delivery mode
TO-220AB
2.23 g
50
Tube
2
STPS30H60CR
STPS30H60CR
I PAK
1.49 g
50
Tube
STPS30H60CG
STPS30H60CG
D2PAK
1.48 g
50
Tube
2
STPS30H60CG-TR STPS30H60CG-TR
D PAK
1.48 g
1000
Tape & reel
STPS30H60CW
STPS30H60W
TO-247
4.46 g
30
Tube
STPS30H60CFP
STPS30H60CFP
TO-220FPAB
2.00 g
50
Tube
Revision history
Date
Revision
Description of Changes
27-Feb-2006
1
First issue
31-Mar-2007
2
Added TO-220FPAB package. Updated thermal
parameters in Table 2.
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STPS30H60C
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