STPS30L60C Power Schottky rectifier Main product characteristics IF(AV) 2 x 15 A VRRM 60 V Tj (max) 150° C VF (max) 0.56 V A1 K A2 A2 K A1 TO-220FPAB STPS30L60CFP Features and benefits ■ Low forward voltage drop ■ Negligible switching losses ■ Low thermal resistance ■ Avalanche capability specified A2 A2 K A1 TO-220AB STPS30L60CT Description Dual center tap Schottky rectifiers suited for switched mode power supplies and high frequency DC to DC converters. K A1 I2PAK STPS30L60CR K Packaged in TO-220FPAB, TO-220, D2PAK, I2PAK and TO-247, this device is intended for use in high frequency inverters. A2 A1 A2 K A1 D2PAK STPS30L60CG TO-247 STPS30L60CW Order codes March 2007 Rev 7 Part Number Marking STPS30L60CW STPS30L60CW STPS30L60CT STPS30L60CT STPS30L60CG STPS30L60CG STPS30L60CG-TR STPS30L60CG STPS30L60CR STPS30L60CR STPS30L60CFP STPS30L60CFP 1/11 www.st.com 11 Characteristics 1 STPS30L60C Characteristics Table 1. Absolute ratings (limiting values, per diode) Symbol Value Unit VRRM Repetitive peak reverse voltage 60 V IF(RMS) RMS forward current 30 A Average forward current IF(AV) TO-220AB δ = 0.5 TC = 130° C Per diode Per device 15 30 TO-220FPAB δ = 0.5 TC = 110° C Per diode Per device 15 30 IFSM Surge non repetitive forward current tp = 10 ms Sinusoidal IRRM Repetitive peak reverse current tp = 2 µs square F = 1 kHz PARM Repetitive peak avalanche power tp = 1 µs Tj = 25° C Tstg Storage temperature range Maximum operating junction Tj dV/dt 1. Parameter dPtot --------------dTj 230 A 2 A 7800 W -65 to + 175 °C 150 °C 10000 V/µs temperature(1) Critical rate of rise reverse voltage < 1 -------------------------Rth ( j – a ) Table 2. condition to avoid thermal runaway condition for a diode on its own heatsink Thermal resistances Symbol Parameter Value TO-220AB, I2PAK, D2PAK, TO-247 Rth(j-c) Per diode 1.5 Total 0.8 Per diode 4.7 Total 3.95 TO-220AB, I2PAK, D2PAK, TO-247 0.1 TO-220FPAB 3.2 Junction to case TO-220FPAB Rth(c) A Coupling Unit °C/W When the diodes 1 and 2 are used simultaneously : ΔTj(diode 1) = P(diode1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c) Table 3. Static electrical characteristics (per diode) Symbol Parameter IR (1) Reverse leakage current Tests Conditions Tj = 25° C Min. VR = VRRM Tj = 125° C VF (1) Forward voltage drop Tj = 25° C IF = 15 A Tj = 125° C IF = 15 A Tj = 25° C IF = 30 A Tj = 125° C IF = 30 A 1. Pulse test : tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation : P = 0.42 x IF(AV) + 0.009x IF2(RMS) 2/11 Typ. 77 Max. Unit 480 µA 130 mA 0.6 0.5 0.56 V 0.75 0.65 0.7 STPS30L60C Figure 1. 12 Characteristics Average forward power dissipation Figure 2. versus average forward current (per diode) PF(av)(W) 10 IF(av)(A) 18 δ = 0.1 δ=1 δ = 0.5 δ = 0.2 Average forward current versus ambient temperature (δ = 0.5, per diode) Rth(j-a)=Rth(j-c) 16 δ = 0.05 14 12 8 TO-220FPAB 10 6 8 4 T T 4 2 IF(av) (A) 0 Rth(j-a)=15 °C/W 6 0 2 4 6 8 10 δ=tp/T 12 14 16 2 tp 18 20 δ=tp/T 0 Figure 3. Normalized avalanche power derating versus pulse duration 25 50 Figure 4. PARM(tp) PARM(1µs) 1 Tamb(°C) tp 0 1.2 75 100 125 150 Normalized avalanche power derating versus junction temperature PARM(tp) PARM(25°C) 1 0.1 0.8 0.6 0.4 0.01 0.2 0.001 0.01 0.1 1 0 10 100 1000 0 25 Non repetitive surge peak forward Figure 6. current versus overload duration (maximum values, per diode) (TO-220AB, TO-247, D2PAK, I2PAK) Figure 5. 250 Tj(°C) tp(µs) 120 IM(A) 50 75 100 125 150 Non repetitive surge peak forward current versus overload duration (maximum values, per diode) (TO-220FPAB) IM(A) TO-220FPAB 100 200 80 150 TC=50 °C Tc=25°C 100 60 Tc=75°C 40 50 20 t 0 1E-3 TC=75 °C Tc=125°C IM t(s) δ=0.5 IM 1E-2 1E-1 1E+0 TC=125 °C t(s) t δ =0.5 0 1.E-03 1.E-02 1.E-01 1.E+00 3/11 Characteristics STPS30L60C Figure 8. Relative variation of thermal impedance junction to case versus pulse duration (TO-220AB, TO-247, D2PAK, I2PAK) Figure 7. Relative variation of thermal impedance junction to case versus pulse duration (TO-220FPAB) Zth(j-c)/Rth(j-c) 1.0 Zth(j-c)/Rth(j-c) 1.0 TO-220FPAB 0.9 0.8 0.8 0.7 0.6 δ = 0.5 δ=0.5 0.6 0.5 0.4 δ = 0.2 0.4 δ = 0.1 0.3 0.2 δ=0.2 0.2 Single pulse tp(s) 0.0 1E-4 1E-3 1E-2 T δ=0.1 0.1 1E-1 1E+0 1.E-03 Figure 9. 5E+2 Reverse leakage current versus reverse voltage applied (typical values, per diode) tp(s) Single pulse δ=tp/T tp 0.0 1.E-02 1.E-01 1.E+00 1.E+01 Figure 10. Junction capacitance versus reverse voltage applied (typical values, per diode) C(nF) IR(mA) 2.0 F=1MHz Tj=25°C Tj=150°C 1E+2 Tj=125°C 1E+1 1.0 Tj=100°C 0.5 Tj=75°C 1E+0 Tj=50°C 1E-1 1E-2 0.2 Tj=25°C VR(V) 0 5 10 15 20 25 30 35 40 45 50 55 60 Figure 11. Forward voltage drop versus forward current (maximum values, per diode) VR(V) 0.1 1 10 100 Figure 12. Thermal resistance junction to ambient versus copper surface under tab for D2PAK (Epoxy printed circuit board FR4, copper thickness: 35 µm) Rth(j-a)(°C/W) 200 100 IFM(A) 80 Typical values Tj=150°C 70 Tj=25°C 60 50 40 10 30 Tj=125°C 20 VFM(V) 1 0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25 2.50 10 S(cm²) 0 0 4/11 5 10 15 20 25 30 35 40 STPS30L60C 2 Package information Package information ● Epoxy meets UL94, V0 ● Cooling method: by conduction (C) ● Recommended torque value: 0.8 Nm ● Maximum torque value: 1.0 Nm Table 4. TO-220FPAB dimensions Dimensions Ref. A B H Dia L6 L7 L2 L3 L5 F1 L4 F G Inches Min. Max. Min. Max. A 4.4 4.6 0.173 0.181 B 2.5 2.7 0.098 0.106 D 2.5 2.75 0.098 0.108 E 0.45 0.70 0.018 0.027 F 0.75 1 0.030 0.039 F1 1.15 1.70 0.045 0.067 F2 1.15 1.70 0.045 0.067 G 4.95 5.20 0.195 0.205 G1 2.4 2.7 0.094 0.106 H 10 10.4 0.393 0.409 D F2 G1 Millimeters L2 E 16 Typ. 0.63 Typ. L3 28.6 30.6 1.126 1.205 L4 9.8 10.6 0.386 0.417 L5 2.9 3.6 0.114 0.142 L6 15.9 16.4 0.626 0.646 L7 9.00 9.30 0.354 0.366 Dia. 3.00 3.20 0.118 0.126 5/11 Package information Table 5. STPS30L60C TO-220AB dimensions Dimensions Ref A H2 Dia C L5 L7 L6 L2 F2 F1 L4 F Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.066 F2 1.14 1.70 0.044 0.066 G 4.95 5.15 0.194 0.202 G1 2.40 2.70 0.094 0.106 H2 10 10.40 0.393 0.409 L2 M E G 16.4 typ. 0.645 typ. L4 13 14 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154 M Diam. 6/11 Inches D L9 G1 Millimeters 2.6 typ. 3.75 3.85 0.102 typ. 0.147 0.151 STPS30L60C Package information Table 6. D2PAK dimensions DIMENSIONS REF. Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.70 0.93 0.027 0.037 B2 1.14 1.70 0.045 0.067 C 0.45 0.60 0.017 0.024 C2 1.23 1.36 0.048 0.054 D 8.95 9.35 0.352 0.368 E 10.00 10.40 0.393 0.409 G 4.88 5.28 0.192 0.208 L 15.00 15.85 0.590 0.624 L2 1.27 1.40 0.050 0.055 L3 1.40 1.75 0.055 0.069 M 2.40 3.20 0.094 0.126 A E C2 L2 D L L3 A1 B2 R C B G A2 M * V2 * FLAT ZONE NO LESS THAN 2mm R 0.40 typ. V2 0° 0.016 typ. 8° 0° 8° Figure 13. Footprint (dimensions in millimeters) 16.90 10.30 5.08 1.30 8.90 3.70 7/11 Package information STPS30L60C I2PAK dimensions Table 7. Dimensions Ref. A E c2 L2 D L1 A1 b1 L b c Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 A1 2.40 2.72 0.094 0.107 b 0.61 0.88 0.024 0.035 b1 1.14 1.70 0.044 0.067 c 0.49 0.70 0.019 0.028 c2 1.23 1.32 0.048 0.052 D 8.95 9.35 0.352 0.368 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.195 0.203 E 10 10.40 0.394 0.409 L 13 14 0.512 0.551 L1 3.50 3.93 0.138 0.155 L2 1.27 1.40 0.050 0.055 e e1 8/11 STPS30L60C Package information Table 8. TO-247 dimensions DIMENSIONS REF. Millimeters Min. V V Dia A H L5 L2 Max. Min. Typ. Max. A 4.85 5.15 0.191 0.203 D 2.20 2.60 0.086 0.102 E 0.40 0.80 0.015 0.031 F 1.00 1.40 0.039 0.055 F1 3.00 0.118 F2 2.00 0.078 F3 2.00 2.40 0.078 0.094 F4 3.00 3.40 0.118 0.133 G L Typ. Inches 10.90 0.429 H 15.45 15.75 0.608 0.620 L 19.85 20.15 0.781 0.793 L1 3.70 4.30 0.169 L4 F2 F1 L1 F3 V2 F4 D L3 L2 F(x3) M G E L3 0.145 18.50 14.20 0.728 14.80 0.559 0.582 L4 34.60 1.362 L5 5.50 0.216 M 2.00 3.00 0.078 0.118 V 5° 5° V2 60° 60° Dia. 3.55 3.65 0.139 0.143 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 9/11 Ordering information 3 Ordering information Ordering code Marking Package Weight Base qty Delivery mode STPS30L60CW STPS30L60CW TO-247 4.4 g 50 Tube STPS30L60CT STPS30L60CT TO-220AB 2.3 g 50 Tube STPS30L60CG STPS30L60CG D2PAK STPS30L60CG-TR 4 10/11 STPS30L60C 1.5 g 50 Tube 2 1.5 g 1000 Tape and reel 2 D PAK STPS30L60CG STPS30L60CR STPS30L60CR I PAK 1.49 g 50 Tube STPS30L60CFP STPS30L60CFP TO-220FPAB 2.0 g 50 Tube Revision history Date Revision Description of Changes July-2003 3B 16-Oct-2006 4 Reformatted to current standards. Corrected dimensions for I2PAK in Table 5. 28-Nov-2006 5 Added TO-220FPAB package. Added STPS30L60CG-TR to ordering information. 07-Mar-2007 6 Updated thermal parameters in Table 2. 31-Mar-2007 7 Updated TC = 110° C in Table 1. Initial release STPS30L60C Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2007 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 11/11