STTH3002 Ultrafast recovery diode Main product characteristics IF(AV) 30 A VRRM 200 V Tj (max) 175° C VF (typ) 0.77 V trr (typ) 22 ns A Features and benefits ■ Very low conduction losses ■ Negligible switching losses ■ Low forward and reverse recovery time ■ High junction temperature K A A K K DO-247 STTH3002W DOP3I STTH3002PI K Description The STTH3002 uses ST's new 200 V planar Pt doping technology, and is specially suited for switching mode base drive and transistor circuits. A NC Packaged in DO-247, DOP3I, and D²PAK, this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection. D2PAK STTH3002G Order codes May 2006 Part Number Marking STTH3002W STTH3002 STTH3002PI STTH3002 STTH3002G STTH3002 STTH3002G-TR STTH3002 Rev 1 1/10 www.st.com Characteristics STTH3002 1 Characteristics Table 1. Absolute ratings (limiting values at Tj = 25° C, unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 200 V IF(RMS) RMS forward current 50 A 30 A 300 A -65 to + 175 °C 175 °C Value Unit DO-247 Tc = 135° C IF(AV) Average forward current, δ = 0.5 DOP3I Tc = 115° C D2 IFSM Surge non repetitive forward current Tstg Storage temperature range Tj Table 2. tp = 10 ms Sinusoidal Maximum operating junction temperature Thermal parameters Symbol Rth(j-c) PAK Tc = 135° C Parameter Junction to case DO-247 1.2 DOP3I 1.8 2PAK 1.2 D Table 3. Symbol IR(1) Static electrical characteristics Parameter Reverse leakage current Test conditions Tj = 25° C Tj = 150° C Tj = 125° C VF (2) Forward voltage drop Tj = 25° C Tj = 150° C Min. Typ Max. Unit 20 VR = VRRM IF = 25 A µA 20 200 0.77 0.85 1.05 IF = 30 A 1. Pulse test: tp = 5 ms, δ < 2 % 2. Pulse test: tp = 380 µs, δ < 2 % To evaluate the conduction losses use the following equation: P = 0.67 x IF(AV) + 0.007 IF2(RMS) 2/10 ° C/W 0.8 0.88 V STTH3002 Characteristics Table 4. Dynamic characteristics Symbol Parameter trr Test conditions Typ Max. IF = 1 A, dIF/dt = -200 A/µs, VR = 30 V, Tj = 25 °C 22 27 IF = 1 A, dIF/dt = -50 A/µs, VR = 30 V, Tj = 25 °C 40 50 Reverse recovery current IF = 30 A, dIF/dt = 200 A/µs, VR = 160 V, Tj = 125 °C 7.6 9.5 Forward recovery time IF = 30 A, dIF/dt = 200 A/µs VFR = 1.1 x VFmax, Tj = 25 °C 140 ns Forward recovery voltage IF = 30 A, dIF/dt = 200 A/µs, VFR = 1.1 x VFmax, Tj = 25 °C 2.5 V Reverse recovery time IRM tfr VFP Figure 1. Peak current versus duty cycle Figure 2. Min. Unit ns A Forward voltage drop versus forward current (typical values) IM(A) 200 200 T IFM(A) IM 180 180 δd=tp/T 160 tp 160 140 140 120 120 P = 20 W 100 100 80 80 P = 10 W 60 Tj=150 °C 60 P=5W Tj=25 °C 40 40 20 20 δ VFM(V) 0 0 0.0 0.0 Figure 3. 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 0.4 0.8 1.2 1.6 2.0 1.0 Forward voltage drop versus forward current (maximum values) Figure 4. Relative variation of thermal impedance, junction to case, versus pulse duration Zth(j-c)/Rth(j-c) IFM(A) 1.0 200 Single pulse D²PAK 180 160 140 120 100 80 Tj=150 °C 60 Tj=25 °C 40 20 VFM(V) tp(s) 0 0.0 0.4 0.8 1.2 1.6 2.0 0.1 1.E-03 1.E-02 1.E-01 1.E+00 3/10 Characteristics Figure 5. STTH3002 Junction capacitance versus reverse voltage applied (typical values) Figure 6. C(pF) QRR(nC) 350 1000 F=1 MHz Vosc=30 mVRMS Tj=25 °C Reverse recovery charges versus dIF/dt (typical values) IF = 30 A VR = 160 V 300 250 200 Tj=125 °C 150 100 Tj=25 °C 50 VR(V) dIF/dt(A/µs) 0 100 1 10 Figure 7. 100 10 1000 Reverse recovery time versus dIF/dt (typical values) Figure 8. 1000 Peak reverse recovery current versus dIF/dt (typical values) IRM(A) tRR(ns) 80 100 16 IF=30 A VR=160 V 70 IF= 30 A VR= 160 V 14 60 12 Tj = 125 °C 50 10 40 8 Tj = 25 °C 30 Tj=125 °C 6 20 4 10 2 dIF/dt(A/µs) Tj=25 °C 0 dIF/dt(A/µs) 0 10 100 Figure 9. 1000 Dynamic parameters versus junction temperature 10 100 1000 Figure 10. Thermal resistance, junction to ambient, versus copper surface under tab (Epoxy printed circuit board FR4, ecu = 35 µm) QRR; IRM [T j] / Q RR; IRM [T j=125°C] Rth(j-a) (°C/W) 80 1.4 D²PAK IF=30 A VR= 160 V 1.2 70 60 1.0 50 IRM 0.8 40 0.6 QRR 30 0.4 20 0.2 10 SCU(cm²) Tj(°C) 0 0.0 25 4/10 50 75 100 125 150 0 5 10 15 20 25 30 35 40 STTH3002 2 Ordering information scheme Ordering information scheme STTH 30 02 XXX Ultrafast switching diode Average forward current 30 = 30 A Repetitive peak reverse voltage 02 = 200 V Package W = DO-247 in Tube PI = DOP3I in Tube G = D2PAK in Tube G-TR = D2PAK in Tape and reel 5/10 Package information 3 STTH3002 Package information Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque value: 0.8 Nm Maximum torque value: 1.0 Nm Table 5. DO-247 dimensions DIMENSIONS REF. Millimeters Min. Typ. Inches Max. Min. Typ. Max. A 4.85 5.15 0.191 0.203 D 2.20 2.60 0.086 0.102 E 0.40 0.80 0.015 0.031 F 1.00 1.40 0.039 0.055 V Dia V F2 A H F3 2.00 2.00 G L5 0.078 2.40 0.078 10.90 0.094 0.429 H 15.45 15.75 0.608 0.620 L 19.85 20.15 0.781 0.793 L1 3.70 4.30 0.169 L L2 L4 F2 L3 L1 F3 L2 D V2 L3 F G M E 18.50 14.20 0.728 14.80 0.559 0.582 L4 34.60 1.362 L5 5.50 0.216 M 2.00 3.00 0.078 0.118 V 5° 5° V2 60° 60° Dia. 6/10 0.145 3.55 3.65 0.139 0.143 STTH3002 Package information Table 6. DOP3I dimensions DIMENSIONS REF E E1 c ØP G Y D L c1 b Q e Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 b 1.20 1.40 0.047 0.055 c 1.45 1.55 0.057 0.061 c1 0.50 0.70 0.020 0.028 D 12.15 13.10 0.474 0.516 E 15.10 15.50 0.594 0.610 E1 7.55 7.75 0.297 0.305 e 10.80 11.30 0.425 0.445 G 20.4 21.10 0.815 0.831 L 14.35 15.60 0.565 0.614 P 4.08 4.17 0.161 0.164 Q 2.70 2.90 0.106 0.114 A R Millimeters R Y 4.60 typ. 15.80 16.50 0.181 typ. 0.622 0.650 7/10 Package information Table 7. STTH3002 D2PAK dimensions DIMENSIONS REF. A E C2 L2 D Millimeters Inches Min. Max Min. Max. A 4.40 4.60 0.173 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.70 0.93 0.027 0.037 B2 1.14 1.70 0.045 0.067 C 0.45 0.60 0.017 0.024 C2 1.23 1.36 0.048 0.054 D 8.95 9.35 0.352 0.368 E 10.00 10.40 0.393 0.409 G 4.88 5.28 0.192 0.208 L 15.00 15.85 0.590 0.624 L2 1.27 1.40 0.050 0.055 L3 1.40 1.75 0.055 0.069 M 2.40 3.20 0.094 0.126 L L3 A1 B2 R C B G A2 2mm min. FLAT ZONE V2 R V2 0.40 typ. 0° 0.016 typ. 8° 0° 8° Figure 11. D2PAK footprint (dimensions in mm) 16.90 10.30 5.08 1.30 8.90 3.70 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 8/10 STTH3002 4 Ordering information Ordering information Part Number Marking Package Weight Base qty Delivery mode STTH3002W STTH3002 DO-247 4.4 g 30 Tube STTH3002PI STTH3002 DOP3I 4.46 g 30 Tube STTH3002G STTH3002 D2PAK 1.48 g 50 Tube STTH3002 D2 1.48 g 1000 Tape and reel STTH3002G-TR 5 PAK Revision history Date Revision 03-May-2006 1 Description of Changes First issue 9/10 STTH3002 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. 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