STMICROELECTRONICS STTH3R02Q

STTH3R02
Ultrafast recovery diode
Main product characteristics
IF(AV)
3A
VRRM
200 V
Tj (max)
175° C
VF (typ)
0.7 V
trr (typ)
16 ns
A
K
■
Very low conduction losses
■
Negligible switching losses
■
Low forward and reverse recovery times
■
High junction temperature
A
A
Features and benefits
K
DO-201AD
STTH3R02
K
DO-15
STTH3R02Q
A
Description
The STTH3R02 uses ST's new 200 V planar Pt
doping technology, and it is specially suited for
switching mode base drive and transistor circuits.
K
SMC
STTH3R02S
Packaged in DO-201AD, DO-15, and SMC, this
device is intended for use in low voltage, high
frequency inverters, free wheeling and polarity
protection.
Order codes
October 2006
Part Number
Marking
STTH3R02
STTH3R02
STTH3R02RL
STTH3R02
STTH3R02Q
STTH3R02
STTH3R02QRL
STTH3R02
STTH3R02S
3R2S
Rev 2
1/9
www.st.com
Characteristics
STTH3R02
1
Characteristics
Table 1.
Absolute ratings (limiting values at Tj = 25° C, unless otherwise specified)
Symbol
VRRM
IFRM
IF(RMS)
Parameter
Value
Unit
200
V
tp = 5 µs, F = 5 kHz
110
A
DO-201AD / DO-15
70
SMC
70
Repetitive peak reverse voltage
Repetitive peak forward
current(1)
RMS forward current
A
DO-15 Tlead = 50° C
IF(AV)
Average forward current, δ = 0.5
DO-201AD Tlead = 90° C
3
A
75
A
-65 to + 175
°C
SMC Tc = 110° C
IFSM
Surge non repetitive forward current
Tstg
Storage temperature range
tp = 10 ms Sinusoidal
Tj
Maximum operating junction temperature(1)
175
°C
TL
Maximum lead temperature for soldering during 10 s at 4 mm from case
230
°C
Value
Unit
1. On infinite heatsink with 10 mm lead length
Table 2.
Thermal parameters
Symbol
Parameter
Rth(j-l)
Junction to lead
Rth(j-c)
Junction to case
Table 3.
Symbol
IR(1)
45
DO-201AD
30
SMC
20
Parameter
Reverse leakage current
Test conditions
Tj = 25° C
Tj = 125° C
Forward voltage drop
Typ
Max.
Unit
µA
3
IF = 9 A
Tj = 25° C
Tj = 100° C
Min.
3
VR = VRRM
30
1.20
0.89
1.0
0.76
0.85
0.70
0.80
V
IF = 3 A
Tj = 150° C
1. Pulse test: tp = 5 ms, δ < 2 %
2. Pulse test: tp = 380 µs, δ < 2 %
To evaluate the conduction losses use the following equation:
P = 0.68 x IF(AV) + 0.04 IF2(RMS)
2/9
° C/W
Static electrical characteristics
Tj = 25° C
VF(2)
DO-15
Lead Length = 10 mm on infinite heatsink
STTH3R02
Characteristics
Table 4.
Dynamic characteristics
Symbol
Parameter
trr
Test conditions
Typ
Max.
IF = 1 A, dIF/dt = -50 A/µs,
VR = 30 V, Tj = 25° C
24
30
IF = 1 A, dIF/dt = -100 A/µs,
VR = 30 V, Tj = 25° C
16
20
Reverse recovery current
IF = 3 A, dIF/dt = -200 A/µs,
VR = 160 V, Tj = 125° C
3.5
4.5
Forward recovery time
IF = 3 A, dIF/dt = 100 A/µs
VFR = 1.1 x VFmax, Tj = 25° C
40
ns
Forward recovery voltage
IF = 3 A, dIF/dt = 100 A/µs,
Tj = 25° C
1.9
V
Reverse recovery time
IRM
tfr
VFP
Figure 1.
peak current versus duty cycle
Figure 2.
Min.
Unit
ns
A
Forward voltage drop versus
forward current (typical values)
IM(A)
IFM(A)
100
50
T
IM
δd=tp/T
80
tp
40
60
30
P = 10 W
40
20
P=5W
P=3W
Tj=150°C
10
20
Tj=25°C
δ
0
0.0
Figure 3.
0.1
VFM(V)
0
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
0.0
1.0
Forward voltage drop versus
forward current (maximum values)
0.5
Figure 4.
IFM(A)
1.0
1.5
2.0
Relative variation of thermal
impedance junction to ambient
versus pulse duration - DO-201AD
(Epoxy printed circuit board FR4,
eCU = 35 µm)
Zth(j-a) /Rth(j-a)
50
1.0
0.9
40
DO-201AD
Lleads=10mm
0.8
0.7
30
0.6
0.5
0.4
20
Tj=150°C
0.3
Tj=25°C
10
0.2
0.1
VFM(V)
0
0.0
0.5
1.0
1.5
2.0
0.0
1.E-01
Single pulse
tP(s)
1.E+00
1.E+01
1.E+02
1.E+03
3/9
Characteristics
Figure 5.
STTH3R02
Relative variation of thermal
impedance junction to ambient
versus pulse duration - DO-15
(Epoxy printed circuit board FR4,
eCU = 35 µm)
Figure 6.
Zth(j-a) /Rth(j-a)
Relative variation of thermal
impedance junction to ambient
versus pulse duration - SMC
(Epoxy printed circuit board FR4,
eCU = 35 µm)
Zth(j-a) /Rth(j-a)
1.0
1.0
DO-15
Lleads=10mm
0.9
SMC
Scu=1cm²
0.9
0.8
0.8
0.7
0.7
0.6
0.6
0.5
0.5
0.4
0.4
0.3
0.3
0.2
0.2
Single pulse
0.1
0.0
1.E-01
Figure 7.
Single pulse
0.1
tP(s)
tP(s)
0.0
1.E+00
1.E+01
1.E+02
1.E-03
1.E+03
Junction capacitance versus
reverse applied voltage (typical
values)
1.E-02
Figure 8.
C(pF)
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
Reverse recovery charges versus
dIF/dt (typical values)
QRR(nC)
80
100
F=1MHz
Vosc=30mVRMS
Tj=25°C
IF=3A
VR=160V
70
60
50
Tj=125°C
40
10
30
20
Tj=25°C
10
dIF/dt(A/µs)
VR(V)
1
0
1
Figure 9.
10
100
1000
10
100
1000
Reverse recovery time versus dIF/dt Figure 10. Peak reverse recovery current
(typical values)
versus dIF/dt (typical values)
IRM(A)
tRR(ns)
60
8
IF=3A
VR=160V
IF=3A
VR=160V
7
50
6
40
5
Tj=125°C
30
4
Tj=125°C
3
Tj=25°C
20
2
10
Tj=25°C
1
dIF/dt(A/µs)
dIF/dt(A/µs)
0
0
10
4/9
100
1000
10
100
1000
STTH3R02
Ordering information scheme
Figure 11. Dynamic parameters versus
junction temperature
Figure 12. Thermal resistance junction to
ambient versus copper surface
under each lead for DO-15 and
DO-201AD (Epoxy printed circuit
board FR4, eCU = 35µm)
QRR; IRM [T j] / Q RR; IRM [T j=125°C]
Rth(j-a) (°C/W)
100
1.4
IF=3A
VR=160V
1.2
90
80
1.0
70
0.8
DO-15
60
IRM
50
DO-201AD
0.6
40
QRR
30
0.4
20
0.2
10
Tj(°C)
SCu(cm²)
0
0.0
25
50
75
100
125
0.0
150
Figure 13. Thermal resistance versus copper
surface under each lead for SMC
(Epoxy printed circuit board FR4,
eCU = 35µm)
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
Figure 14. Thermal resistance versus lead
length for DO-201AD package
Rth(°C/W)
Rth(j-a) (°C/W)
100
100
SMC
DO-201AD
90
80
Rth(j-a)
80
70
60
60
50
40
40
Rth(j-l)
30
20
20
10
SCU(cm²)
0
0.0
2
Lleads(mm)
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5
10
15
20
25
Ordering information scheme
STTH
3 R
02 XXX
Ultrafast switching diode
Average forward current
3=3A
Model R
Repetitive peak reverse voltage
02 = 200 V
Package
Blank = DO-201 in Ammopack
RL = DO-201 in Tape and reel
Q = DO-15 in Ammopack
QRL = DO-15 in Tape and reel
S= SMC in Tape and reel
5/9
Package information
3
STTH3R02
Package information
●
Epoxy meets UL94, V0
●
Cooling method: by conduction (C)
Table 5.
DO-201AD Dimensions
Dimensions
Ref.
Millimeters
Min.
B
E
Min.
Max.
B
A
Note 1
Max.
Inches
E
A
Note 1
B
9.50
25.40
0.374
1.000
ØD
Note 2
ØC
C
5.30
0.209
D
1.30
0.051
E
1.25
0.049
Notes
Table 6.
1 - The lead diameter ø D is not
controlled over zone E
2 - The minimum length which must stay
straight between the right angles after
bending is 0.59"(15mm)
DO-15 dimensions
Dimensions
C
C
A
D
B
6/9
Ref.
Millimeters
Inches
Min.
Max.
Min.
Max.
A
6.05
6.75
0.238
0.266
B
2.95
3.53
0.116
0.139
C
26
31
1.024
1.220
D
0.71
0.88
0.028
0.035
STTH3R02
Package information
Table 7.
SMC dimensions
Dimensions
Ref.
Millimeters
E1
D
E
A1
A2
C
E2
L
b
Inches
Min.
Max.
Min.
Max.
A1
1.90
2.45
0.075
0.096
A2
0.05
0.20
0.002
0.008
b
2.90
3.2
0.114
0.126
c
0.15
0.41
0.006
0.016
E
7.75
8.15
0.305
0.321
E1
6.60
7.15
0.260
0.281
E2
4.40
4.70
0.173
0.185
D
5.55
6.25
0.218
0.246
L
0.75
1.60
0.030
0.063
Figure 15. SMC footprint (dimensions in mm)
2.20
4.25
2.20
3.30
8.65
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
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Ordering information
4
5
8/9
STTH3R02
Ordering information
Part Number
Marking
Package
Weight
Base qty
Delivery mode
STTH3R02
STTH3R02
DO-201AD
1.16 g
600
Ammopack
STTH3R02RL
STTH3R02
DO-201AD
1.16 g
1900
Tape and reel
STTH3R02Q
STTH3R02
DO-15
0.4 g
1000
Ammopack
STTH3R02QRL
STTH3R02
DO-15
0.4 g
6000
Tape and reel
STTH3R02S
3R2S
SMC
0.243 g
2500
Tape and reel
Revision history
Date
Revision
Description of Changes
03-May-2006
1
First issue
10-Oct-2006
2
Added SMC package
STTH3R02
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