STTH4R02 Ultrafast recovery diode Main product characteristics IF(AV) 4A VRRM 200 V Tj (max) 175° C VF (typ) 0.76 V trr (typ) 16 ns A K K A A K K TO-220FPAC STTH4R02FP TO-220AC STTH4R02D Features and benefits ■ Very low conduction losses ■ Negligible switching losses ■ Low forward and reverse recovery times ■ High junction temperature K A A K NC DPAK STTH4R02B Description The STTH4R02 uses ST's new 200 V planar Pt doping technology, and it is specially suited for switching mode base drive and transistor circuits. SMB STTH4R02U A A K Packaged in TO-220AC, TO-220FPAC, DPAK, SMB, SMC, and DO-201AB, this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection. K DO-201AB STTH4R02 SMC STTH4R02S Order codes October 2006 Part Number Marking STTH4R02D STTH4R02 STTH4R02FP STTH4R02 STTH4R02B STTH4R02 STTH4R02B-TR STTH4R02 STTH4R02U 4R2U STTH4R02 STTH4R02 STTH4R02RL STTH4R02 STTH4R02S 4R2S Rev 2 1/13 www.st.com 13 Characteristics STTH4R02 1 Characteristics Table 1. Absolute ratings (limiting values at Tj = 25° C, unless otherwise specified) Symbol VRRM Parameter Repetitive peak reverse voltage Value Unit 200 V 70 A 4 A 70 A -65 to + 175 °C 175 °C TO-220AC DPAK IF(RMS) RMS forward current SMB / SMC TO-220FPAC DO-201AB IF(AV) Average forward current, δ = 0.5 IFSM Surge non repetitive forward current Tstg Storage temperature range Tj Table 2. 2/13 Tc = 160° C DPAK Tc = 160° C SMB Tc = 95° C SMC Tc = 95° C TO-220FPAC Tc = 150° C DO-201AB Tlead = 95° C tp = 10 ms Sinusoidal Maximum operating junction temperature Thermal parameters Symbol Rth(j-c) TO-220AC Parameter Junction to case Value TO-220AC / DPAK 3.5 SMB 20 TO-220FPAC 6.5 DO-201AB 20 SMC 20 Unit °C/W STTH4R02 Table 3. Characteristics Static electrical characteristics Symbol Parameter IR(1) Test conditions Tj = 25° C Reverse leakage current Tj = 125° C Tj = 25° C VF(2) Tj = 25° C Forward voltage drop Tj = 150° C Min. Typ Max. Unit 3 VR = VRRM µA IF = 12 A IF = 4 A 2 20 1.15 1.25 0.95 1.05 0.76 0.83 V 1. Pulse test: tp = 5 ms, δ < 2 % 2. Pulse test: tp = 380 µs, δ < 2 % To evaluate the conduction losses use the following equation: P = 0.67 x IF(AV) + 0.04 IF2(RMS) Table 4. Dynamic characteristics Symbol Parameter trr Test conditions Typ Max. IF = 1 A, dIF/dt = -50 A/µs, VR = 30 V, Tj = 25° C 24 30 IF = 1 A, dIF/dt = -100 A/µs, VR = 30 V, Tj = 25° C 16 20 Reverse recovery current IF = 4 A, dIF/dt = -200 A/µs, VR = 160 V, Tj = 125° C 4.4 5.5 Forward recovery time IF = 4 A, dIF/dt = 50 A/µs VFR = 1.1 x VFmax, Tj = 25° C 80 ns Forward recovery voltage IF = 4 A, dIF/dt = 50 A/µs, Tj = 25° C 1.6 V Reverse recovery time IRM tfr VFP Figure 1. peak current versus duty cycle Figure 2. IM(A) Min. Unit ns A Forward voltage drop versus forward current (typical values) IFM(A) 50 100 T IM 45 δ=tp/T d 40 tp 75 35 30 P=5W Tj=150°C 50 25 20 P=2W Tj=25°C 15 25 P=1W 10 δ VFM(V) 5 0 0 0.0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 0.5 1.0 1.5 2.0 2.5 3.0 3.5 1.0 3/13 Characteristics Figure 3. STTH4R02 Forward voltage drop versus forward current (maximum values) Figure 4. Relative variation of thermal impedance, junction to case, versus pulse duration (T0-220AC, DPAK) Zth(j-c)/Rth(j-c) IFM(A) 1.0 100 Single pulse TO-220AC DPAK 90 80 70 60 Tj=150°C 50 Tj=25°C 40 30 20 10 VFM(V) tp(s) 0 0.1 0.0 0.5 Figure 5. 1.0 1.5 2.0 2.5 3.0 3.5 Relative variation of thermal impedance, junction to case, versus pulse duration (TO-220FPAC) 1.E-03 Figure 6. Zth(j-c)/Rth(j-c) 1.E-02 1.E-01 1.E+00 Relative variation of thermal impedance, junction to ambient, versus pulse duration (SMB) Zth(j-a) /Rth(j-a) 1.0 1.0 Single pulse TO-220FPAC 0.9 SMB SCu=1cm² 0.8 0.7 0.6 0.1 0.5 0.4 0.3 0.2 0.1 tp(s) tp(s) 0.0 1.E-03 1.E-02 Figure 7. 1.E-01 1.E+00 1.E+01 Relative variation of thermal impedance, junction to ambient, versus pulse duration (DO-201AB) 0.0 1.E-01 Figure 8. Zth(j-a) (°C/W) 1.E+00 1.E+01 1.E+02 1.E+03 Relative variation of thermal impedance, junction to ambient, versus pulse duration (SMC) Zth(j-a) /Rth(j-a) 100 1.0 Single pulse DO201AB 0.9 SMC SCu=1cm² 0.8 0.7 0.6 10 0.5 0.4 0.3 0.2 4/13 tp(s) 0.1 tp(s) 1 1.E-03 0.0 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 STTH4R02 Figure 9. Characteristics Junction capacitance versus reverse applied voltage (typical values) Figure 10. Reverse recovery charges versus dIF/dt (typical values) C(pF) QRR(nC) 120 100 F=1MHz Vosc=30mVRMS Tj=25°C IF=4A VR=160V 100 Tj=125°C 80 60 40 Tj=25°C 20 VR(V) dIF/dt(A/µs) 10 0 1 10 100 1000 0 50 100 150 200 250 300 350 400 450 500 Figure 11. Reverse recovery time versus dIF/dt Figure 12. Peak reverse recovery current (typical values) versus dIF/dt (typical values) tRR(ns) IRM(A) 80 10 IF=4A VR=160V 70 IF=4A VR=160V 8 60 50 6 Tj=125°C 40 Tj=125°C 4 30 Tj=25°C 20 2 Tj=25°C 10 dIF/dt(A/µs) dIF/dt(A/µs) 0 0 10 100 1000 Figure 13. Dynamic parameters versus junction temperature 0 50 100 150 200 250 300 350 400 450 500 Figure 14. Thermal resistance, junction to ambient, versus copper surface under tab - DPAK (Epoxy printed circuit board FR4, eCU = 35 µm) QRR; IRM [T j] / Q RR; IRM [T j=125°C] Rth(j-a) (°C/W) 1.4 100 IF=4A VR=160V 1.2 DPAK 90 80 1.0 70 IRM 0.8 60 50 0.6 40 QRR 30 0.4 20 0.2 10 Tj(°C) SCU(cm²) 0 0.0 25 50 75 100 125 150 0 5 10 15 20 25 30 35 40 5/13 Ordering information scheme STTH4R02 Figure 15. Thermal resistance, junction to ambient, versus copper surface under tab - SMB (Epoxy printed circuit board FR4, eCU = 35 µm) Figure 16. Thermal resistance, junction to ambient, versus copper surface under tab - SMC (Epoxy printed circuit board FR4, eCU = 35 µm) Rth(j-a) (°C/W) Rth(j-a) (°C/W) 110 100 SMB 100 SMC 90 90 80 80 70 70 60 60 50 50 40 40 30 30 20 20 10 10 SCU(cm²) SCU(cm²) 0 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 0.0 5.0 0.5 1.0 1.5 Figure 17. Thermal resistance versus lead length - DO-201AB 90 Rth(°C/W) DO201AB Rth(j-a) 80 70 60 50 Rth(j-l) 40 30 20 10 LLEADS(mm) 0 5 2 10 15 20 25 Ordering information scheme STTH Ultrafast switching diode Average forward current 4=4A Model R Repetitive peak reverse voltage 02 = 200 V Package Blank = DO-201 in Ammopack RL = DO201 in Tape and reel D = TO220AC in Tube FP = TO-220FPAC in Tube B = DPAK in Tube B-TR = DPAK in Tape and reel U = SMB in Tape and reel S = SMC in Tape and reel 6/13 4 R 02 XXX 2.0 2.5 3.0 3.5 4.0 4.5 5.0 STTH4R02 3 Package information Package information Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque value: 0.8 Nm Maximum torque value: 1.0 Nm Table 5. T0-220AC dimensions DIMENSIONS REF. A H2 ØI C L5 L7 L6 L2 F1 D L9 F M Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.066 G 4.95 5.15 0.194 0.202 H2 10.00 10.40 0.393 0.409 L2 L4 Millimeters 16.40 typ. 0.645 typ. L4 13.00 14.00 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154 E G M Diam. I 2.6 typ. 3.75 3.85 0.102 typ. 0.147 0.151 7/13 Package information Table 6. STTH4R02 DPAK dimensions DIMENSIONS REF . E C2 L2 Max Min. Max. A 2.20 2.40 0.086 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009 B 0.64 0.90 0.025 0.035 D B2 5.20 5.40 0.204 0.212 C 0.45 0.60 0.017 0.023 C2 0.48 0.60 0.018 0.023 D 6.00 6.20 0.236 0.244 E 6.40 6.60 0.251 0.259 G 4.40 4.60 0.173 0.181 H 9.35 10.10 0.368 0.397 R H L4 A1 B R G Inches Min. A B2 Millimeters C A2 0.60 MIN. L2 V2 0.80 typ. 0.031 typ. L4 0.60 1.00 0.023 0.039 V2 0° 8° 0° 8° Figure 18. DPAK footprint 6.7 3 3 1.6 2.3 6.7 2.3 1.6 8/13 Dimensions in mm STTH4R02 Package information Table 7. T0-220FPAC dimensions DIMENSIONS REF A B H Dia L6 L2 L7 L3 L5 F1 D F E Inches Min. Max. Min. Max. A 4.4 4.6 0.173 0.181 B 2.5 2.7 0.098 0.106 D 2.5 2.75 0.098 0.108 E 0.45 0.70 0.018 0.027 F 0.75 1 0.030 0.039 F1 1.15 1.70 0.045 0.067 G 4.95 5.20 0.195 0.205 G1 2.4 2.7 0.094 0.106 H 10 10.4 0.393 0.409 L2 L4 Millimeters 16 Typ. 0.63 Typ. L3 28.6 30.6 1.126 1.205 L4 9.8 10.6 0.386 0.417 L5 2.9 3.6 0.114 0.142 L6 15.9 16.4 0.626 0.646 L7 9.00 9.30 0.354 0.366 Dia. 3.00 3.20 0.118 0.126 G1 G 9/13 Package information Table 8. STTH4R02 SMB dimensions DIMENSIONS E1 REF. Millimeters Inches Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 2.90 3.2 0.114 0.126 c 0.15 0.41 0.006 0.016 E 7.75 8.15 0.305 0.321 E1 6.60 7.15 0.260 0.281 E2 4.40 4.70 0.173 0.185 D 5.55 6.25 0.218 0.246 L 0.75 1.60 0.030 0.063 D E c A1 A2 L b Figure 19. SMB footprint (dimensions in mm) 5.25 2.22 1.75 10/13 1.75 1.75 STTH4R02 Package information Table 9. SMC dimensions Dimensions Ref. Millimeters E1 D E A1 A2 C E2 L b Inches Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 2.90 3.2 0.114 0.126 c 0.15 0.41 0.006 0.016 E 7.75 8.15 0.305 0.321 E1 6.60 7.15 0.260 0.281 E2 4.40 4.70 0.173 0.185 D 5.55 6.25 0.218 0.246 L 0.75 1.60 0.030 0.063 Figure 20. SMC footprint (dimensions in mm) 2.20 4.25 2.20 3.30 8.65 Table 10. DO-201AB Dimensions DIMENSIONS B A ØD ØC B REF. Millimeters Inches Min. Max. Min. Max. A 8.5 9.5 0.335 0.374 B 25.4 ØC 4.8 5.3 0.189 0.209 ØD 0.96 1.06 0.038 0.042 1 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 11/13 Ordering information 4 5 12/13 STTH4R02 Ordering information Part Number Marking Package Weight Base qty Delivery mode STTH4R02D STTH4R02 TO-220AC 1.86 g 50 Tube STTH4R02FP STTH4R02 TO-220FPAC 2.2 g 50 Tube STTH4R02B STTH4R02 DPAK 0.30 g 75 Tube STTH4R02B-TR STTH4R02 DPAK 0.30 g 2500 Tape and reel STTH4R02U 4R2U SMB 0.107 g 2500 Tape and reel STTH4R02 STTH4R02 DO-201AB 0.876 g 600 Ammopack STTH4R02RL STTH4R02 DO-201AB 0.876 g 1900 Tape and reel STTH4R02S 4R2S SMC 0.243 g 2500 Tape and reel Revision history Date Revision Description of Changes 03-May-2006 1 First issue. 10-Oct-2006 2 Added SMC package STTH4R02 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2006 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 13/13