STMICROELECTRONICS STTH602CFP

STTH602C
Ultrafast recovery diode
Main product characteristics
IF(AV)
2x3A
VRRM
200 V
Tj (max)
175° C
VF (typ)
0.80 V
trr (typ)
14 ns
A1
A2
K
Features and benefits
■
Suited for SMPS
■
Low losses
■
Low forward and reverse recovery time
■
High surge current capability
■
High junction temperature
■
insulated package: TO-220FPAB
A2
A2
A1
A1
TO-220AB
STTH602CT
Description
K
K
TO-220FPAB
STTH602CFP
Dual center tap diode suited for switch mode
power supplies and high frequency DC to DC
converters.
Packaged in TO-220AB and TO-22FPAB, this
device is intended for use in low voltage high
frequency inverters, free wheeling and polarity
protection.
April 2006
Order codes
Part Number
Marking
STTH602CT
STTH602C
STTH602CFP
STTH602C
Rev 1
1/9
www.st.com
Characteristics
STTH602C
1
Characteristics
Table 1.
Absolute ratings (limiting values at Tj = 25° C, unless otherwise specified)
Symbol
Parameter
Value
Unit
VRRM
Repetitive peak reverse voltage
200
V
IF(RMS)
RMS forward current
22
A
TO-220AB
IF(AV)
Average forward current, δ = 0.5
TO-220FPAB
IFSM
Surge non repetitive forward current
Tstg
Storage temperature range
Tj
Table 2.
Per diode Tc = 160° C
3
Per device Tc = 155° C
6
Per diode Tc = 150° C
3
Per device Tc = 140° C
6
A
A
tp = 10 ms Sinusoidal
Maximum operating junction temperature
60
A
-65 to + 175
°C
175
°C
Value
Unit
Thermal parameters
Symbol
Parameter
Per diode
5
Per device
3.0
Per diode
7.5
Per device
5.25
TO-220AB
Per diode
1
TO-220FPAB
Per diode
3
TO-220AB
Rth(j-c)
Junction to case
° C/W
TO-220FPAB
Rth(c)
Coupling
When the two diodes 1 and 2 are used simultaneously:
∆Tj(diode 1) = P (diode 1) X Rth(j-c) (Per diode) + P (diode 2) x Rth(c)
Table 3.
Symbol
IR(1)
Static electrical characteristics
Parameter
Reverse leakage current
Test conditions
Tj = 25° C
Tj = 125° C
Tj = 25° C
VF(2)
Forward voltage drop
Tj = 150° C
Tj = 25° C
Tj = 150° C
Max.
Unit
3
VR = VRRM
IF = 3 A
µA
3
30
0.98
1.1
0.8
0.95
1.1
1.25
0.9
1.05
V
IF = 6 A
1. Pulse test: tp = 5 ms, δ < 2 %
2. Pulse test: tp = 380 µs, δ < 2 %
To evaluate the conduction losses use the following equation:
P = 0.85 x IF(AV) + 0.033 IF2(RMS)
2/9
Typ
STTH602C
Characteristics
Table 4.
Dynamic characteristics
Symbol
Parameter
trr
Test conditions
Typ
Max.
Unit
IF = 1 A, dIF/dt = -100 A/µs,
VR = 30 V, Tj = 25 °C
14
20
ns
IF = 1 A, dIF/dt = -50 A/µs,
VR = 30 V, Tj = 25 °C
21
30
Reverse recovery current
IF = 3 A, dIF/dt = 200 A/µs,
VR = 160 V, Tj = 125 °C
4
5.5
Forward recovery time
IF = 3 A, dIF/dt = 200 A/µs
VFR = 1.1 x VFmax, Tj = 25 °C
24
ns
Forward recovery voltage
IF = 3 A, dIF/dt = 200 A/µs,
Tj = 25 °C
3.7
V
Reverse recovery time
IRM
tfr
VFP
Figure 1.
Peak current versus duty cycle
(per diode)
Figure 2.
Min.
A
Forward voltage drop versus
forward current (typical values per
diode)
IM(A)
IFM(A)
100
100
T
IM
δd=tp/T
80
tp
80
60
60
P = 10 W
40
40
Tj=150°C
P=5W
P=3W
Tj=25°C
20
20
VFM(V)
δ
0
0
0.0
0.0
Figure 3.
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
0.5
1.0
1.5
2.0
2.5
3.0
3.5
1.0
Forward voltage drop versus
forward current (maximum values
per diode)
Figure 4.
Relative variation of thermal
impedance junction to case versus
pulse duration (T0-220AB)
Zth(j-c)/Rth(j-c)
IFM(A)
100
1.0
Single pulse
TO-220AB
90
80
70
60
50
Tj=150°C
40
30
Tj=25°C
20
10
VFM(V)
tp(s)
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0.1
1.E-03
1.E-02
1.E-01
1.E+00
3/9
Characteristics
Figure 5.
STTH602C
Relative variation of thermal
Figure 6.
impedance junction to case versus
pulse duration (TO-220FPAB)
Zth(j-c)/Rth(j-c)
Junction capacitance versus
reverse applied voltage (typical
values per diode)
C(pF)
1.0
100
Single pulse
TO-220FPAB
F=1MHz
Vosc=30mVRMS
Tj=25°C
0.1
10
VR(V)
tp(s)
1
0.0
1.E-03
1.E-02
Figure 7.
1.E-01
1.E+00
1
1.E+01
Reverse recovery charges versus
dIF/dt (typical values)
10
1000
Reverse recovery time versus dIF/dt
(typical values)
Figure 8.
QRR(nC)
100
tRR(ns)
100
80
IF=3A
VR=160V
IF=3A
VR=160V
70
80
60
Tj=125°C
50
60
40
Tj=125°C
40
30
Tj=25°C
20
20
Tj=25°C
10
dIF/dt(A/µs)
dIF/dt(A/µs)
0
0
50
Figure 9.
100
150
200
250
0
300
350
400
450
500
Peak reverse recovery current
versus dIF/dt (typical values)
10
100
1000
Figure 10. Dynamic parameters versus
junction temperature
IRM(A)
QRR; IRM [T j] / Q RR; IRM [T j=125°C]
1.4
10
IF=3A
VR=160V
IF=3A
VR=160V
1.2
8
1.0
Tj=125°C
6
IRM
0.8
0.6
4
QRR
0.4
Tj=25°C
2
0.2
Tj(°C)
dIF/dt(A/µs)
0.0
0
0
4/9
50
100
150
200
250
300
350
400
450
500
25
50
75
100
125
150
STTH602C
2
Ordering information scheme
Ordering information scheme
STTH
6 02 Cxx
Ultrafast switching diode
Average forward current
6=6A
Repetitive peak reverse voltage
02 = 200 V
Package
CT = TO-220AB
CFP = TO-220FPAB
5/9
Package information
3
STTH602C
Package information
Epoxy meets UL94, V0
Cooling method: by conduction (C)
Recommended torque value: 0.8 Nm
Maximum torque value: 1.0 Nm
Table 5.
TO-220AB Dimensions
DIMENSIONS
REF.
Millimeters
Min.
A
15.20
a1
C
B
ØI
Typ
Max.
Inches
Min.
Typ
15.90 0.598
3.75
Max.
0.625
0.147
a2
13.00
14.00 0.511
0.551
B
10.00
10.40 0.393
0.409
b1
0.61
0.88
0.024
0.034
b2
1.23
1.32
0.048
0.051
C
4.40
4.60
0.173
0.181
c1
0.49
0.70
0.019
0.027
c2
2.40
2.72
0.094
0.107
e
2.40
2.70
0.094
0.106
F
6.20
6.60
0.244
0.259
ØI
3.75
3.85
0.147
0.151
I4
15.80 16.40 16.80 0.622 0.646 0.661
L
2.65
2.95
0.104
0.116
l2
1.14
1.70
0.044
0.066
l3
1.14
1.70
0.044
0.066
b2
L
F
A
I4
l3
c2
a1
l2
a2
M
b1
e
c1
M
6/9
2.60
0.102
STTH602C
Package information
Table 6.
TO-220FPAB Dimensions
DIMENSIONS
REF.
Millimeters
Inches
Min.
Max.
Min.
Max.
A
4.4
4.6
0.173
0.181
B
2.5
2.7
0.098
0.106
D
2.5
2.75
0.098
0.108
E
0.45
0.70
0.018
0.027
F
0.75
1
0.030
0.039
F1
1.15
1.70
0.045
0.067
F2
1.15
1.70
0.045
0.067
G
4.95
5.20
0.195
0.205
G1
2.4
2.7
0.094
0.106
H
10
10.4
0.393
0.409
A
B
H
Dia
L6
L2
L7
L3
L5
F1
L4
D
F2
L2
F
G1
G
16 Typ.
0.63 Typ.
E
L3
28.6
30.6
1.126
1.205
L4
9.8
10.6
0.386
0.417
L5
2.9
3.6
0.114
0.142
L6
15.9
16.4
0.626
0.646
L7
9.00
9.30
0.354
0.366
Dia.
3.00
3.20
0.118
0.126
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
7/9
Ordering information
4
5
8/9
STTH602C
Ordering information
Part Number
Marking
Package
Weight
Base qty
Delivery mode
STTH602CT
STTH602C
TO-220AB
2.23 g
50
Tube
STTH602CFP
STTH602C
TO-220FPAB
2g
50
Tube
Revision history
Date
Revision
05-Apr-2006
1
Description of Changes
First issue
STTH602C
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZE REPRESENTATIVE OF ST, ST PRODUCTS ARE NOT DESIGNED,
AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS,
NOR IN PRODUCTS OR SYSTEMS, WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR
SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2006 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
9/9