STTH8S06 Turbo 2 ultrafast high voltage rectifier Features A K ■ Ultrafast recovery ■ Low reverse recovery current ■ Reduces losses in diode and switching transistor ■ Low thermal resistance ■ Higher frequency operation ■ Insulated TO-220FPAC version – Insulation voltage = 1500 V rms – Package capacitance = 12 pF K A A K K TO-220AC STTH8S06D TO-220FPAC STTH8S06FP Description ST's STTH8S06 is a state of the art ultrafast recovery diode. By the use of 600 V Pt doping planar technology, this diode will out-perform the power factor corrections circuits operating in hardswitching conditions. The extremely low reverse recovery current of the STTH8S06, reduces significantly the switching power losses of the MOSFET and thus increases the efficiency of the application. This leads designers to reduce the size of their heatsinks. Table 1. Device summary IF(AV) 8A VRRM 600 V IRM(typ.) 4.4 A Tj (max) 175 °C VF (typ) 1.5 V trr (typ) 12 ns This device is also intended for applications in power supplies and power conversions systems, motor drive, and other power switching applications. December 2007 Rev 1 1/8 www.st.com 8 Characteristics STTH8S06 1 Characteristics Table 2. Absolute ratings (limiting values) Symbol Parameter VRRM Repetitive peak reverse voltage IF(AV) Average forward current IFSM Surge non repetitive forward current Tstg Storage temperature range Tj 600 V 8 A 60 A -65 to + 175 °C 175 °C tp = 10 ms Thermal parameter Symbol Rth(j-c) Symbol Unit Maximum operating junction temperature Table 3. Table 4. Value Parameter Maximum TO-220AC 3.0 TO220FPAC 5.5 Unit Junction to case °C/W Static electrical characteristics Parameter IR Reverse leakage current VF Forward voltage drop Test conditions Tj = 25 °C Tj= 125 °C Tj = 25 °C Tj = 125 °C Min. Typ Max. Unit 20 VR = 600 V µA 25 200 3.4 IF = 8 A V 1.5 1.9 To evaluate the maximum conduction losses use the following equation: P = 1.20 x IF(AV) + 0.087 IF2(RMS) Table 5. Symbol trr IRM Sfactor Reverse recovery time IF = 1 A, dIF/dt = - 200 A/µs, VR = 30 V Reverse current Softness factor Reverse recovery charges IRM Reverse current Qrr Test conditions Parameter Qrr Sfactor 2/8 Dynamic electrical characteristics Softness factor Reverse recovery charges Tj = 25 °C IF = 8 A, dIF/dt = - 200 A/µs, VR = 200 V Min. Typ Max. Unit 12 18 ns 1.6 2.2 A 1 - 17 nC 4.4 I = 8 A, dIF/dt = - 200 A/µs, Tj = 125 °C F VR = 200 V 6.0 A 0.3 - 90 nC STTH8S06 Figure 1. Characteristics Forward voltage drop versus forward current Figure 2. IFM(A) Relative variation of thermal impedance junction to case versus pulse duration (TO-220AC) Zth(j-c)/Rth(j-c) 80 75 70 65 60 55 50 45 40 35 30 25 20 15 10 5 0 1.0 Tj=150°C (maximum values) 0.9 0.8 0.7 Tj=150°C (typical values) 0.6 0.5 Tj=25°C (maximum values) 0.4 0.3 T 0.2 Single pulse 0.1 VFM(V) δ=tp/T tp(s) tp 0.0 0 1 Figure 3. 1.0 2 3 4 5 6 7 Relative variation of thermal Figure 4. impedance junction to case versus pulse duration(TO-220FPAC) 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 0.8 0.7 δ=0.5 0.5 0.4 0.3 0.2 δ=0.2 T δ=0.1 0.1 tp(s) Single pulse 0.0 1.E-03 1.E-02 1.E-02 1.E-01 1.E+00 Peak reverse recovery current versus dIF/dt (typical values) IRM(A) Zth(j-c)/Rth(j-c) 0.9 0.6 1.E-03 1.E-01 δ=tp/T 1.E+00 tp 1.E+01 VR=200V Tj=125°C IF=2 x IF(AV) IF=IF(AV) IF=0.5 x IF(AV) dIF/dt(A/µs) 0 200 400 600 800 1000 3/8 Characteristics Figure 5. STTH8S06 Reverse recovery time versus dIF/dt Figure 6. (typical values) trr(ns) Reverse recovery charges versus dIF/dt (typical values) Qrr(nC) 240 70 IF=2 x IF(AV) VR=200V Tj=125°C 220 60 VR=200V Tj=125°C 200 IF=IF(AV) 180 50 160 IF=2 x IF(AV) IF=IF(AV) 40 IF=0.5 x IF(AV) 140 IF=0.5 x IF(AV) 120 30 100 80 20 60 40 10 dIF/dt(A/µs) 20 dIF/dt(A/µs) 0 0 0 Figure 7. 200 400 600 800 0 1000 200 400 Junction capacitance versus reverse voltage applied (typical values) C(pF) 100 F=1MHz VOSC=30mVRMS Tj=25°C 10 VR(V) 1 1 4/8 600 10 100 1000 800 1000 STTH8S06 2 Package information Package information ● Epoxy meets UL94, V0 ● Cooling method: by conduction (C) ● Recommended torque value: 0.4 to 0.6 N·m In order to meet environmental requirements, ST (also) offers these devices in ECOPACK® packages. ECOPACK® packages are Lead-free. The category of second level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Table 6. TO-220AC dimensions Dimensions Ref. A H2 ØI C L5 L7 L6 L2 F1 D L9 F M E G Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.066 G 4.95 5.15 0.194 0.202 H2 10.00 10.40 0.393 0.409 L2 L4 Millimeters 16.40 typ. 0.645 typ. L4 13.00 14.00 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154 M Diam. I 2.6 typ. 3.75 3.85 0.102 typ. 0.147 0.151 5/8 Package information Table 7. STTH8S06 TO-220FPAC dimensions Dimensions Ref. A Millimeters Inches Min. Max. Min. Max. A 4.4 4.6 0.173 0.181 B 2.5 2.7 0.098 0.106 D 2.5 2.75 0.098 0.108 E 0.45 0.70 0.018 0.027 F 0.75 1 0.030 0.039 F1 1.15 1.70 0.045 0.067 G 4.95 5.20 0.195 0.205 G1 2.4 2.7 0.094 0.106 H 10 10.4 0.393 0.409 B H Dia L6 L2 L7 L3 L5 F1 D L2 L4 F G1 G 6/8 E 16 Typ. 0.63 Typ. L3 28.6 30.6 1.126 1.205 L4 9.8 10.6 0.386 0.417 L5 2.9 3.6 0.114 0.142 L6 15.9 16.4 0.626 0.646 L7 9.00 9.30 0.354 0.366 Dia. 3.00 3.20 0.118 0.126 STTH8S06 3 Ordering information Ordering information Table 8. 4 Ordering information Order code Marking Package Weight Base qty Delivery mode STTH8S06D STTH8S06D TO-220AC 1.9 g 50 Tube STTH8S06FP STTH8S06FP TO-220FPAC 1.64 g 50 Tube Revision history Table 9. Document revision history Date Revision 18-Dec-2007 1 Description of changes First issue. 7/8 STTH8S06 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2007 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 8/8