TDA1170D LOW-NOISE TV VERTICAL DEFLECTION SYSTEM . .. COMPLETE VERTICAL DEFLECTION SYSTEM LOW NOISE SUITABLE FOR HIGH DEFINITION MONITORS DIP16 (Plastic Package) DESCRIPTION The TDA 1170D is a monolithic integrated circuit in a 16-lead dual in-line plastic package. It is intended for use in black and white and colour TV receivers. Low-noise makes this device particularly suitable for use in monitors. The functions incorporated are : synchronization circuit, oscillator and ramp generator, high power gain amplifier, flyback generator, voltage regulator. ORDER CODE : TDA1170D PIN CONNECTIONS RAMP OUTPUT 1 16 RAMP GENERATOR SUPPLY VOLTAGE 2 15 COMPENSATION FLYBACK 3 14 AMPLIFIER INPUT GROUND 4 13 GROUND GROUND 5 12 GROUND POWER AMPLIFIER OUTPUT 6 11 OSCILLATOR POWER AMPLIFIER SUPPLY VOLTAGE 7 10 SYNC. INPUT REGULATED VOLTAGE 8 9 1170D-01.EPS HEIGHT ADJUST December 1992 1/8 TDA1170D BLOCK DIAGRAM + VS FREQ 8 2 3 7 FLYBACK GENERATOR POWER AMPLIFLIER TDA1170D VOLTAGE REGULATOR OSCILLATOR 11 6 YOKE SYNC SYNC CIRCUIT 10 4 5 12 RAMP GENERATOR 13 BUFFER STAGE PREAMPLIFLIER 1 16 LINEARITY 9 15 14 1170D-02.EPS HEIGHT Symbol VS V6, V7 V14 Value Unit Supply Voltage at Pin 2 Parameter 35 V Flyback Peak Voltage 60 V + 10 – 0.5 V V 2 A A Power Amplifier Input Voltage Io Output Peak Current (non repetitive) at t = 2msec Io Output Peak Current at f = 50Hz t ≤ 10µsec 2.5 Io Output Prak Current at f = 50Hz t > 10µsec 1.5 A I3 Pin 3 DC Current at V6 < V2 100 mA I3 Pin 3 Peak to Peak Flyback Current for f = 50Hz, tfly ≤ 1.5msec 1.8 A I10 Pin 10 Current ± 20 mA Ptot Power Dissipation : at Ttab = 90°C at Tamb = 70 ° C (free air) 4.3 1 W W – 40 to 150 °C Tstg, Tj Storage and Junction Temperature 1170D-01.TBL ABSOLUTE MAXIMUM RATINGS Symbol Rth j–case R th j–amb Parameter Thermal Resistance Junction–pins Thermal Resistance Junction-ambient * Obtained with pins 4, 5, 12, 13 soldered to printed circuit with minimized copper area. 2/8 Max Max Value Unit 14 80 °C/W °C/W* 1170D-02.TBL THERMAL DATA TDA1170D Symbol Parameter Test Conditions Min. Typ. Max. Unit Fig. 1b I2 Pin 2 Quiescent Current I3 = 0 7 14 mA I7 Pin 7 Quiescent Current I6 = 0 8 17 mA 1b – I11 Oscillator Bias Current V11 = 1V 0.1 1 µA 1a – I14 Amplifier Input Bias Current V14 = 1V – I16 Ramp Generator Bias Current V16 = 0 – I16 Ramp Generator Current I9 = 20µA, V16 = 0 ∆I16 I16 Ramp Generator Non-linearity ∆V16 = 0 to 12V, I9 = 20µA VS Supply Voltage Range 18.5 1 10 µA 1b 0.02 0.3 µA 1a 20 21.5 µA 1b 0.2 1 % 1b 35 V – 10 V1 Pin 1 Saturation Voltage to Ground I1 = 1mA 1 1.4 V – V3 Pin 3 Saturation Voltage to Ground I3 = 10mA 300 450 mV 1a V6 Quiescent Output Voltage Vs = 10V R1 = 1kΩ, R2 = 1kΩ 4.1 4.4 4.75 V 1a Vs = 35V R1 = 3kΩ, R2 = 1kΩ 8.3 8.8 9.45 V 1a V6L Output Saturation Voltage to Ground – I6 = 0.1A – I6 = 0.8A 0.9 1.9 1.2 2.3 V V 1c 1c V6H Output Saturation Voltage to Supply I6 = 0.1A I6 = 0.8A 1.4 2.8 2.1 3.2 V V 1d 1d V8 Regulated Voltage at Pin 8 6.1 6.5 6.9 V 1b V9 Regulated Voltage at Pin 9 I9 = 20µA 6.2 6.6 7 V 1b Regulated Voltage Drift with Supply Voltage ∆VS = 10 to 35V mV/V 1b ∆V8 ∆V9 , ∆VS ∆VS V14 Amplifier Input Reference Voltage R10 Pin 10 Input Resistance 1 2.07 V10 ≤ 0.4V 1 2.2 2.3 V – MΩ 1a 3/8 1170D-03.TBL ELECTRICAL CHARACTERISTICS (refer to the test circuits, VS = 35V, Tamb = 25oC, unless otherwise specified) DC CHARACTERISTICS TDA1170D Figure 1 : DC Test Circuit Figure 1a Figure 1b + Vs I2 V3 + Vs I3 I7 2 3 2 7 7 10 TDA1170D TDA1170D 11 6 14 11 R1 I10 9 1kΩ 16 - I11 4 5 12 13 14 16 8 4 9 5 V6 - I16 V8 - I16 12 13 - I14 V9 R2 1V 8V 1V Figure 1c 1170D-04.EPS 1170D-03.EPS 100kΩ Figure 1d + Vs 2 + Vs 7 TDA1170D 11 14 4 6 12 13 4/8 7 14 V6L V6H TDA1170D 11 4 1V 1170D-05.EPS 4V 5 2 I6 5 6 12 13 I6 1170D-06.EPS 1V TDA1170D ELECTRICAL CHARACTERISTICS (refer to the AC test circuit, VS = 22V ; f = 50Hz ; Tamb = 25oC, unless otherwise specified) AC CHARACTERISTICS Parameter Test Conditions Is Supply Current I10 Sync. Input Current (positive or negative) V6 Flyback Voltage tfly Min. Iy = 1App Typ. Max. 140 Unit mA µA 500 Iy = 1App 45 Flyback Time Iy = App 0.7 Peak to Peak Output Noise Pin 11 Connected to GND fo Free Running Frequency (P1 = R1) = 260kΩ, C2 = 0.1µF (P1 = R1) = 300kΩ, C2 = 0.1µF ∆f Synchronization Range I8 = 0.5mA Frequency Drift with Supply Voltage Vs = 10 to 35V 0.005 Hz/V Frequency Drift vs. Pins 4, 5, 12 and 13 Temp. Tpins = 40 to 120°C 0.01 Hz/°C VON ∆f ∆VS ∆f ∆Tpins V ms 40 48.5 42.2 mVPP Hz Hz 14 Hz 1170D-04.TBL Symbol Figure 2 : AC Test Circuit VS = 22V 470µF 1N4001 0.1µF 7 100µF 4 5 12 13 3 Sync. Input 2 0.1mF 3.3Ω 6 T D A 1 1 7 0 D 10 VD 220kΩ 100pF 15 5.6kΩ 470pF YOKE Ry = 10Ω Ly = 20mH 5.6kΩ 14 22kΩ 10µF 1000µF 1 11 100kΩ 8 P1 9 16 R1 47kΩ 220kΩ 1.8kΩ 0.1µF VRf 120kΩ 910kΩ 0.1µF Rf 1W 1170D-07.EPS C2 0.1µF 5/8 TDA1170D Figure 3 : Typical Application Circuit for Smal Screen B/W TV SET (Ry = 2.9Ω, Ly = 6mH, Iy = 1.1App) VS = 12V C5 470µF D1 1N4001 C4 4 7 5 12 13 2 3 C2 f sync = 50Hz 6 R5 150kΩ T D A 1 1 7 0 D 0.1µF 10 R1 4.7kΩ 15 C6 470pF 100kΩ C3 0.1µF R13 270Ω YOKE Ry = 2.9Ω Ly = 6mH R10 R6 22kΩ 2.2kΩ C11 100µF C12 2200µF 1 8 9 P3 100kΩ 16 R2 150kΩ C9 100pF R11 1.8kΩ 14 11 P1 C10 0.1µF R8 3.3Ω 100µF P2 220kΩ R3 220kΩ C7 0.1µF R4 910kΩ R7 82kΩ R9 1.8kΩ C8 0.1µF R12 1Ω 1170D-08.EPS C1 0.1µF 1170D-09.TIF Figure 4 : P.C. Board and Components Layout of the Circuit of Fig. 3 (1 : 1 scale) 6/8 TDA1170D Figure 5 : Example of P.C. Board Copper Area which is Used as Heatsink Figure 6 : External Heatsink Mounting Example Figure 7 : Maximum Dissipable Power and Junction-Ambient Thermal Resistance versus Side ”l” 1170D-11.EPS the side ”l” of two equal square copper areas having a thickness of 35 µ (1.4 mils). During soldering the pins temperature must not exceed 260 °C and the soldering time must not be longer than 12 seconds. The external heatsink or printed circuit copper area must be connected to electrical ground. 1170D-10.EPS MOUNTING INSTRUCTION The Rth j-amb of the TDA 1170D can be reduced by soldering the GND pins to a suitable copper area of the printed circuit board (fig. 5) or to an external heatsink (fig. 6). The diagram of figure 7 shows the maximum dissipable power P tot and the Rth j-amb as a function of 1170D-13.EPS Maximum Allowable Power Dissipation versus Ambient Temperature 1170D-12.EPS Figure 8 : 7/8 TDA1170D I b1 L a1 PACKAGE MECHANICAL DATA 16 PINS - PLASTIC PACKAGE b B e E Z e3 D 9 1 8 a1 B b b1 D E e e3 F i L Z Min. 0.51 0.77 Millimeters Typ. Max. 1.65 Min. 0.020 0.030 0.5 0.25 Inches Typ. Max. 0.065 0.020 0.010 20 8.5 2.54 17.78 0.787 0.335 0.100 0.700 7.1 5.1 3.3 0.280 0.201 0.130 1.27 0.050 Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No licence is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without noti ce. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of SGS-THOMSON Microelectronics. 1994 SGS-THOMSON Microelectronics - All Rights Reserved Purchase of I2C Components of SGS-THOMSON Microelectronics, conveys a license under the Philips I2C Patent. Rights to use these components in a I2C system, is granted provided that the system confo rms to the I2C Standard Specifications as defined by Philips. SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - China - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A. 8/8 DIP16.TBL Dimensions PM-DIP16.EPS F 16