STMICROELECTRONICS USBLC6-2

USBLC6-2
Very low capacitance ESD protection
Features
■
■
■
■
■
■
2 data lines protection
Protects VBUS
Very low capacitance: 3.5 pF max.
Very low leakage current: 150 nA max.
SOT-666 and SOT23-6L packages
RoHS compliant
SOT23-6L
USBLC6-2SC6
Benefits
Applications
■
■
■
■
■
■
■
■
■
Very low capacitance between lines to GND for
optimized data integrity and speed
Low PCB space consumption: 2.9 mm2 max for
SOT-666 and 9mm² max for SOT23-6L
Enhanced ESD protection. IEC 61000-4-2 level
4 compliance guaranteed at device level,
hence greater immunity at system level
ESD protection of VBUS
High reliability offered by monolithic integration
Low leakage current for longer operation of
battery powered devices
Fast response time
Consistent D+ / D- signal balance:
– Very low capacitance matching tolerance
I/O to GND = 0.015 pF
– Compliant with USB 2.0 requirements
Complies with the following standards
■
IEC 61000-4-2 level 4:
– 15 kV (air discharge)
– 8 kV (contact discharge)
March 2008
■
■
■
■
■
SOT-666
USBLC6-2P6
USB 2.0 ports up to 480 Mb/s (high speed)
Compatible with USB 1.1 low and full speed
Ethernet port: 10/100 Mb/s
SIM card protection
Video line protection
Portable electronics
Description
The USBLC6-2SC6 and USBLC6-2P6 are
monolithic application specific devices dedicated
to ESD protection of high speed interfaces, such
as USB 2.0, Ethernet links and video lines.
The very low line capacitance secures a high level
of signal integrity without compromising in
protecting sensitive chips against the most
stringent characterized ESD strikes.
Figure 1.
Rev 3
Functional diagram
I/O1
1
6
I/O1
GND
2
5
VBUS
I/O2
3
4
I/O2
1/14
www.st.com
14
Characteristics
1
USBLC6-2
Characteristics
Table 1.
Absolute ratings
Symbol
Parameter
IEC 61000-4-2 air discharge
IEC 61000-4-2 contact discharge
MIL STD883G-Method 3015-7
Value
Unit
15
15
25
kV
VPP
Peak pulse voltage
Tstg
Storage temperature range
-55 to +150
°C
Tj
Operating junction temperature range
-40 to +125
°C
TL
Lead solder temperature (10 seconds duration)
260
°C
Table 2.
Electrical characteristics (Tamb = 25 °C)
Value
Symbol
Parameter
Test conditions
Unit
Min.
Max.
VRM
Reverse stand-off voltage
IRM
Leakage current
VRM = 5 V
VBR
Breakdown voltage between VBUS
and GND
IR = 1 mA
Forward voltage
IF = 10 mA
1.1
V
IPP = 1 A, 8/20 µs
Any I/O pin to GND
12
V
IPP = 5 A, 8/20 µs
Any I/O pin to GND
17
V
VF
VCL
Ci/o-GND
Ci/o-i/o
ΔCi/o-i/o
10
5
V
150
nA
6
V
Clamping voltage
Capacitance between I/O and GND
VR = 1.65 V
ΔCi/o-GND
2/14
Typ.
2.5
3.5
pF
0.015
Capacitance between I/O
VR = 1.65 V
1.2
1.7
pF
0.04
USBLC6-2
Figure 2.
Characteristics
Capacitance versus voltage
(typical values)
Figure 3.
Line capacitance versus frequency
(typical values)
C(pF)
C(pF)
2.8
3.0
2.6
CO=I/O-GND
2.4
2.5
VOSC=30mVRMS
Tj=25°C
VLINE=0V to 3.3V
2.2
2.0
F=1MHz
VOSC=30mVRMS
Tj=25°C
2.0
1.8
1.6
1.4
1.5
Cj=I/O-I/O
1.2
1.0
1.0
0.8
0.6
0.5
0.4
Data line voltage (V)
0.2
0.0
F(MHz)
0.0
0.0
0.5
Figure 4.
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
Relative variation of leakage
current versus junction
temperature (typical values)
1
Figure 5.
IRM[Tj] / IRM[Tj=25°C]
10
100
1000
Frequency response
0.00
100
S21(dB)
VBUS=5V
-5.00
-10.00
10
-15.00
F(Hz)
Tj(°C)
-20.00
1
25
50
75
100
125
100.0k
1.0M
10.0M
100.0M
1.0G
3/14
Technical information
2
Technical information
2.1
Surge protection
USBLC6-2
The USBLC6-2 is particularly optimized to perform surge protection based on the rail to rail
topology.
The clamping voltage VCL can be calculated as follow :
VCL+ = VTRANSIL + VF for positive surges
VCL- = - VF for negative surges
with: VF = VT + Rd.Ip
(VF forward drop voltage) / (VT forward drop threshold voltage)
and VTRANSIL = VBR + Rd_TRANSIL.IP
Calculation example
We assume that the value of the dynamic resistance of the clamping diode is typically:
Rd = 0.5 Ω and VT = 1.1 V
We assume that the value of the dynamic resistance of the transil diode is typically:
Rd_TRANSIL = 0.5 Ω and VBR = 6.1 V
For an IEC 61000-4-2 surge Level 4 (Contact Discharge: Vg = 8 kV, Rg = 330 Ω),
VBUS = +5 V, and if in first approximation, we assume that :
Ip = Vg / Rg = 24 A.
So, we find:
VCL+ = +31.2 V
VCL- = -13 V
Note:
The calculations do not take into account phenomena due to parasitic inductances.
2.2
Surge protection application example
If we consider that the connections from the pin VBUS to VCC, from I/O to data line and from
GND to PCB GND plane are done by tracks of 10 mm long and 0.5 mm large, we assume
that the parasitic inductances LVBUS, LI/O and LGND of these tracks are about 6 nH. So when
an IEC 61000-4-2 surge occurs on data line, due to the rise time of this spike (tr=1ns), the
voltage VCL has an extra value equal to LI/O.dl/dt+LGND.dI/dt.
The dI/dt is calculated as:
dI/dt = Ip/tr = 24 A/ns
The overvoltage due to the parasitic inductances is:
LI/O.dl/dt = LGND.dI/dt = 6 nH x 24 A/ns = 144 V
By taking into account the effect of these parasitic inductances due to unsuitable layout, the
clamping voltage will be :
VCL+ = +31.2 + 144 + 144 = 319.2 V
VCL- = -13.1 - 144 - 144 = -301.1 V
4/14
USBLC6-2
Technical information
We can significantly reduce this phenomena with simple layout optimization. It is for this
reason that some recommendations have to be followed (see 2.3: How to ensure good ESD
protection).
Figure 6.
ESD behavior: parasitic phenomena due to unsuitable layout
ESD surge on data line
VCL+
VBUS
Data line
LI/O di
dt
LI/O
LI/O di + LGND di
dt
dt
LVBUS
Positive
Surge
VCC pin
VF
VTRANSIL
I/O pin
VTRANSIL + VF
VCL
t
tr = 1 ns
GND pin
tr = 1 ns
LGND
LGND di
dt
t
- VF
VCL+ = VTRANSIL + VF + LI/O di + LGND di
dt
dt
surge > 0
VCL- = -VF - LI/O di - LGND di
dt
dt
surge > 0
Negative
Surge
-LI/O di - LGND di
dt
dt
V TRANSIL = VBR + Rd.Ip
VCL-
2.3
How to ensure good ESD protection
While the USBLC6-2 provides high immunity to ESD surge, efficient protection depends on
the layout of the board. In the same way, with the rail to rail topology, the track from data
lines to I/O pins, from VCC to VBUS pin and from GND plane to GND pin must be as short as
possible to avoid overvoltages due to parasitic phenomena (see Figure 6. and Figure 7. for
layout consideration)
Figure 7.
ESD behavior: layout optimization
1
1
Figure 8.
ESD behavior: measurement
conditions
6
ESD SURGE
2
5
3
4
USBLC6-2SC6
Unsuitable layout
TEST BOARD
IN
OUT
+5 V
1
1
6
2
5
3
4
Optimized layout
5/14
Technical information
Figure 9.
USBLC6-2
ESD response to IEC 61000-4-2
(+15 kV air discharge)
Figure 10. ESD response to IEC 61000-4-2
(-15 kV air discharge)
Vin
Vin
Vout
Vout
Important:
A good precaution to take is to put the protection device as close as possible to the
disturbance source (generally the connector).
2.4
Crosstalk behavior
2.4.1
Crosstalk phenomenon
Figure 11. Crosstalk phenomenon
RG1
Line 1
VG1
RL1
RG2
VG2
Line 2
RL2
DRIVERS
α 1 VG1 + β12VG2
α 2VG2 + β21VG1
RECEIVERS
The crosstalk phenomenon is due to the coupling between 2 lines. The coupling factor (β12
or β21) increases when the gap across lines decreases, particularly in silicon dice. In the
above example the expected signal on load RL2 is α2VG2, in fact the real voltage at this point
has got an extra value β21VG1. This part of the VG1 signal represents the effect of the
crosstalk phenomenon of the line 1 on the line 2. This phenomenon has to be taken into
account when the drivers impose fast digital data or high frequency analog signals in the
disturbing line. The perturbed line will be more affected if it works with low voltage signal or
high load impedance (few kΩ).
6/14
USBLC6-2
Technical information
Figure 12. Analog crosstalk measurements
TEST BOARD
USBLC6-2SC6
NETWORK ANALYSER
PORT 2
NETWORK ANALYSER
PORT 1
Vbus
Figure 12. shows the measurement circuit for the analog application. In usual frequency
range of analog signals (up to 240 MHz) the effect on disturbed line is less than -55 db ( see
Figure 13.).
Figure 13. Analog crosstalk results
dB
0.00
- 30.00
- 60.00
- 90.00
F (Hz)
- 120.00
100.0k
1.0M
10.0M
100.0M
1.0G
As the USBLC6-2 is designed to protect high speed data lines, it must ensure a good
transmission of operating signals. The frequency response (Figure 5.) gives attenuation
information and shows that the USBLC6-2 is well suitable for data line transmission up to
480 Mbit/s while it works as a filter for undesirable signals like GSM (900 MHz) frequencies,
for instance.
7/14
Technical information
2.5
USBLC6-2
Application examples
Figure 14. USB 2.0 port application diagram using USBLC6-2
+ 3.3V
DEVICEUPSTREAM
RPU
TRANSCEIVER
SW2
+ 5V
USB
connector
SW1
VBUS
RX LS/FS +
RX HS +
TX HS +
RX LS/FS RX HS TX HS GND
TX LS/FS +
TX LS/FS -
Protecting
Bus Switch
VBUS
RX LS/FS +
RX HS +
TX HS +
RX LS/FS RX HS TX HS -
VBUS
D+
DGND
RS
RS
RS
USBLC6-2SC6
RS
RPD
+ 3.3V
DEVICEUPSTREAM
RPU
TRANSCEIVER
SW2
GND
TX LS/FS -
TX LS/FS -
RX LS/FS +
RX HS +
TX HS +
RX LS/FS RX HS TX HS -
D+
DGND
RS
RS
USBLC6-2P6
Mode
SW1
SW2
Low Speed LS
Open
Closed
Full Speed FS
Closed
Open
High Speed HS
Closed then open Open
RS
RPD
+VCC
100nF
USBLC6-2SC6
Figure 15. T1/E1/Ethernet protection
Tx
SMP75-8
DATA
+VCC
100nF
SMP75-8
USBLC6-2SC6
TRANSCEIVER
Rx
GND
TX LS/FS +
USBLC6-4SC6
RPD
8/14
TX LS/FS +
RPD
VBUS
RS
GND
USB
connector
SW1
VBUS
RX LS/FS +
RX HS +
TX HS +
RX LS/FS RX HS TX HS -
TX LS/FS +
HUBDOWNSTREAM
TRANSCEIVER
TX LS/FS -
USBLC6-2
2.6
Technical information
PSpice model
Figure 16. shows the PSpice model of one USBLC6-2 cell. In this model, the diodes are
defined by the PSpice parameters given in Figure 17.
Figure 16. PSpice model
LI/O
RI/O
RI/O
LI/O
D+out
D+in
MODEL = Dlow
LGND
RGND
MODEL = Dhigh
RI/O
MODEL = Dzener
LI/O
GND
VBUS
MODEL = Dlow
LI/O
MODEL = Dhigh
RI/O
RI/O
LI/O
D-in
D-out
Note:
This simulation model is available only for an ambient temperature of 27 °C.
Figure 17. PSpice parameters
Dlow
Dhigh
Figure 18. USBLC6-2 PCB layout
considerations
Dzener
LI/O
750p
RI/O
110m
BV
50
50
7.3
CJ0
0.9p
2.0p
40p
LGND
550p
IBV
1m
1m
1m
RGND
60m
M
0.3333
0.3333
0.3333
RS
0.2
0.52
0.84
VJ
0.6
0.6
0.6
TT
0.1u
0.1u
0.1u
D+in
D+out
1
VBUS
GND
CBUS = 100nF
D-in
USBLC6-2
D-out
9/14
Ordering information scheme
3
USBLC6-2
Ordering information scheme
Figure 19. Ordering information scheme
USB
Product Designation
Low capacitance
Breakdown Voltage
6 = 6 Volts
Number of lines protected
2 = 2 lines
Packages
SC6 = SOT23-6L
P6 = SOT-666
10/14
LC
6 - 2
xxx
USBLC6-2
4
Package information
Package information
●
Epoxy meets UL94, V0
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at www.st.com.
Table 3.
SOT-666 dimensions
Dimensions
b1
L1
Ref.
Millimeters
Min.
L3
b
D
E1
A
L2
E
A3
Min.
Typ.
Max.
0.45
0.60 0.018
0.024
A3
0.08
0.18 0.003
0.007
b
0.17
0.34 0.007
0.013
b1
0.19
D
1.50
1.70 0.059
0.067
E
1.50
1.70 0.059
0.067
E1
1.10
1.30 0.043
0.051
0.27
0.34 0.007 0.011 0.013
e
0.50
0.020
L1
0.19
0.007
L3
Figure 20. SOT-666 footprint
Max.
A
L2
e
Typ.
Inches
0.10
0.30 0.004
0.10
0.012
0.004
Figure 21. SOT-666 marking
0.50
e3
0.62
2.60
x x x
z y ww
e3: ECOPACK (Leadfree)
XXX: Marking
Z: Manufacturing location
Y: Year
WW: week
0.99
0.30
11/14
Package information
USBLC6-2
Table 4.
SOT23-6L dimensions
Dimensions
Ref.
A
Min.
E
e
b
D
e
A2
θ
Typ.
Max.
Inches
Min.
Typ.
Max.
A
0.90
A1
0
A2
0.90
1.30 0.035
0.051
b
0.35
0.50 0.014
0.020
c
0.09
0.20 0.004
0.008
D
2.80
3.05
0.11
0.118
E
1.50
1.75 0.059
0.069
e
A1
c
Millimeters
1.45 0.035
0.057
0.10
0.004
0
0.95
0.037
L
H
Figure 22. SOT23-6L footprint
H
2.60
3.00 0.102
0.118
L
0.10
0.60 0.004
0.024
θ
0°
10°
0°
10°
Figure 23. SOT23-6L marking
0.60
1.20
e3
3.50
12/14
2.30
0.95
1.10
x x x
z y ww
e3: ECOPACK (Leadfree)
XXX: Marking
Z: Manufacturing location
Y: Year
WW: week
USBLC6-2
5
Ordering information
Ordering information
Table 5.
6
Ordering information
Ordering code
Marking
Package
Weight
Base qty
Delivery mode
USBLC6-2SC6
UL26
SOT23-6L
16.7 mg
3000
Tape and reel
USBLC6-2P6
F
SOT-666
2.9 mg
3000
Tape and reel
Revision history
Table 6.
Document revision history
Date
Revision
14-Mar-2005
1
First issue.
07-Jun-2005
2
Format change to figure 3; no content changed.
3
Added marking illustrations - Figures 21 and 23. Added
ECOPACK statement. Updated operating junction
temperature range in absolute ratings, page 2. Technical
information section updated. Reformatted to current
standards.
20-Mar-2008
Description of changes
13/14
USBLC6-2
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZE REPRESENTATIVE OF ST, ST PRODUCTS ARE NOT DESIGNED,
AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS,
NOR IN PRODUCTS OR SYSTEMS, WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR
SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2008 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
14/14