VN808SR Octal channel high side driver Features Type RDS(on) Iout VCC VN808SR 150 mΩ 0.7 A 45 V ■ VCC/2 compatible input ■ Junction over-temperature protection ■ Case over-temperature protection for thermal independence of the channels ■ Current limitation ■ Shorted load protection ■ Undervoltage shut-down ■ Protection against loss of ground ■ Very low stand-by current ■ Compliance to 61000-4-4 IEC test up to 4 kV Description The VN808SR is a monolithic device designed in STMicroelectronics VIPower M0-3 technology, intended for driving any kind of load with one side connected to ground. Figure 1. July 2008 PowerSO-36 Active current limitation combined with thermal shutdown and automatic restart, protect the device against overload. In overload condition, the channel turns OFF and back ON automatically so as to maintain the junction temperature between TTSD and TR. If this condition makes the case temperature reach TCSD, the overloaded channel is turned OFF and restarts only when the case temperature has decreased to TCR (see waveform 3 Figure 7 on page 10). Non overloaded channels continue to operate normally. The device automatically turns OFF in the case of a ground pin disconnection. This device is especially suitable for industrial applications and conforms to IEC 61131. Block diagram Rev 4 1/17 www.st.com 17 Contents VN808SR Contents 1 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3 Pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 4 Current, voltage conventions and internal diagram . . . . . . . . . . . . . . . 8 5 Switching time waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 6 Reverse polarity protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 7 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 8 Order codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 2/17 VN808SR 1 Maximum ratings Maximum ratings Table 1. Absolute maximum rating Symbol Parameter VCC DC supply voltage -IGND DC ground pin reverse current TRAN ground pin reverse current (pulse duration < 1 ms) IOUT DC output current -IOUT Reverse DC output current IIN DC Input current VIN Input voltage range Value Unit 45 V -250 -6 mA A Internally limited A -2 A ± 10 mA -3/+VCC V 2000 V VESD Electrostatic discharge (R = 1.5 kΩ; C = 100 pF) PTOT Power dissipation at Tc = 25 °C 96 W LMAX Max inductive load (VCC = 24 V, RLOAD = 48 Ω, TA = 100 °C) 2 H TJ Junction operating temperature Internally limited °C TC Case operating temperature Internally limited °C -40 to 150 °C Value Unit Max 1.3 °C/W Max 50 °C/W TSTG Table 2. Symbol RthJC RthJA Storage temperature Thermal data Parameter Thermal resistance junction-case Thermal resistance junction-ambient (1) 1. When mounted on FR4 printed circuit board with 0.5 cm2 of copper area (at least 35 µm think) connected to all TAB pins. 3/17 Electrical characteristics 2 VN808SR Electrical characteristics (10.5 V < VCC < 32 V; -40 °C < TJ < 125 °C; unless otherwise specified) Table 3. Symbol Parameter Test conditions VCC Operating supply voltage VUSD Undervoltage shutdown RON On state resistance IOUT = 0.5 A; TJ = 25 °C IOUT = 0.5 A; Supply current OFF state; VCC = 24 V; TCASE = 25 °C ON state (all channels ON); VCC = 24 V, TCASE = 100 °C IS ILGND Output current at turn-off VCC = VSTAT = VIN = VGND = 24 V VOUT = 0 V IL(off) OFF state output current VIN = VOUT = 0 V; Power-on delay time from VCC rising edge Table 7. td(Vccon) Table 4. Symbol 4/17 Power section Min Typ Max Unit 10.5 45 V 7 10.5 V 185 280 mΩ mΩ 150 µA 12 mA 1 mA 5 µA 150 0 1 ms Switching (VCC = 24 V) Parameter Test conditions Min Typ Max Unit tON Turn-on time RL = 48 Ω from 80% VOUT Figure 5. 50 100 µs tOFF Turn-off time RL = 48 Ω to 10% VOUT Figure 5. 75 150 µs dVOUT/dt(on) Turn-on voltage slope RL = 48 Ω from VOUT = 2.4 V to VOUT = 19.2 V Figure 5. 0.7 V/µs dVOUT/dt(off) Turn-off voltage slope RL = 48 Ω from VOUT = 21.6 V to VOUT = 2.4 V Figure 5. 1.5 V/µs VN808SR Electrical characteristics Table 5. Symbol Input pin Parameter VINL Input low level IINL Low level input current VINH Input high level IINH High level input current VI(HYST) Input hysteresis voltage IIN Table 6. Symbol Input current Parameter Case shut-down temperature TCR Case reset temperature TCHYST Case thermal hysteresis TR VCC /2-1 V VCC /2+1 V VIN = VCC / 2 + 1 V 150 260 0.6 VIN = VCC = 32 V Test conditions µΑ V 300 µΑ Min Typ Max Unit 125 130 135 °C 110 °C 150 175 Junction reset temperature 135 DC Short circuit current VCC = 24 V; RLOAD = 10 mΩ Turn-off output clamp IOUT = 0.5 A; L = 6mH voltage °C 200 °C °C 7 15 °C 0.7 1.7 VCC-57 VCC-52 VCC-47 A V Status pin Parameter Test conditions IHSTAT High level output current VCC = 18...32 V; RSTAT = 1 kΩ (Fault condition) ILSTAT Leakage current Normal operation; VCC = 32 V Clamp voltage ISTAT = 1 mA ISTAT = -1 mA VCLSTAT Unit µΑ Junction shutdown temperature Ilim Symbol Max 80 VIN = VCC / 2 - 1 V 15 Junction thermal hysteresis Table 7. Typ 7 THYST Vdemag Min Protections TCSD TTSD Test conditions Min Typ Max Unit 2 3 4 mA 0.1 µA 8.0 V V 6.0 6.8 -0.7 5/17 Pin connections 3 6/17 VN808SR Pin connections Figure 2. Connection diagram (top view) Table 8. Pin functions Pin N° Symbol TAB VCC Positive power supply voltage 1 VCC Positive power supply voltage 2,3,4,5 NC Not connected 6 Input 1 Input of channel 1 7 Input 2 Input of channel 2 8 Input 3 Input of channel 3 9 Input 4 Input of channel 4 10 Input 5 Input of channel 5 11 Input 6 Input of channel 6 12 Input 7 Input of channel 7 13 Input 8 Input of channel 8 14,15,16,17,18 NC 19 GND 20 STATUS Common open source diagnostic for over-temperature 21,22 Output 8 High-side output of channel 8 23,24 Output 7 High-side output of channel 7 Function Not connected Logic ground VN808SR Pin connections Table 8. Pin functions (continued) Pin N° Symbol 25,26 Output 6 High-side output of channel 6 27.28 Output 5 High-side output of channel 5 29,30 Output 4 High-side output of channel 4 31,32 Output 3 High-side output of channel 3 33,34 Output 2 High-side output of channel 2 35,36 Output 1 High-side output of channel 1 Function 7/17 Current, voltage conventions and internal diagram 4 Current, voltage conventions and internal diagram Figure 3. Current and voltage conventions Figure 4. Equivalent internal block diagram (same structure for all channel) Table 9. Truth table Conditions 8/17 VN808SR INPUTn OUTPUTn STATUS Normal operation L H L H L L Current limitation L H L X L L Overtemperature (see waveforms 3, 4 Figure 7) -> TJ > TTSD L H L L L H Undervoltage L H L L X X VN808SR 5 Switching time waveforms Switching time waveforms Figure 5. Turn-ON and turn-OFF Figure 6. VCC turn-ON 9/17 Switching time waveforms Figure 7. 10/17 Waveforms VN808SR VN808SR Switching time waveforms Figure 7. Waveforms (continued) 11/17 Reverse polarity protection 6 VN808SR Reverse polarity protection A schematic solution to protect the IC against a reverse polarity condition is proposed. This schematic is effective with any type of load connected to the outputs of the IC. The RGND resistor value can be selected according to the following conditions to be met: 1. RGND ≤ 600 mV / (IS in ON state max). 2. RGND ≥ (-VCC) / (-IGND) where -IGND is the DC reverse ground pin current and can be found in the absolute maximum rating section of the device datasheet. The power dissipation associated to RGNG during reverse polarity condition is: PD = (-VCC)2/RGND This resistor can be shared by several different ICs. In such case IS value on formula (1) is the sum of the maximum ON-state currents of the different devices. Please note that if the microprocessor ground and the device ground are separated then the voltage drop across the RGND (given by IS in ON state max * RGND) produce a difference between the generated input level and the IC input signal level. This voltage drop will vary depending on how many devices are ON in the case of several high side switches sharing the same RGND. Figure 8. Reverse polarity protection + Vcc Statusi Outputi Inputi RGND (Optional) 12/17 GND Load VN808SR 7 Package mechanical data Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Table 10. PowerSO-36 mechanical data mm inch Dim. Min Typ A a1 Max Min Typ 3.60 0.10 0.30 a2 Max 0.1417 0.003 0.0118 3.30 0.1299 a3 0 0.10 0 0.0039 b 0.22 0.38 0.008 0.0150 c 0.23 0.32 0.009 0.0126 D (1) 15.80 16.00 0.622 0.6299 D1 9.40 9.80 0.370 0.3858 E 13.90 14.50 0.547 0.5709 E1 (1) 10.90 11.10 0.429 0.4370 E2 E3 2.90 5.8 6.2 0.1142 0.228 0.2441 e 0.65 0.025 e3 11.05 0.435 G 0 0.10 0.000 0.0039 H 15.50 15.90 0.610 0.6260 h L 1.10 0.80 N S 1.10 0.0433 0.031 10° 0° 8° 0.0433 10° 0° 8° 13/17 Package mechanical data Figure 9. 14/17 PowerSO-36 drawings VN808SR VN808SR 8 Order codes Order codes Table 11. Order codes Order codes Package Packaging VN808SR PowerSO-36 Tube VN808SR13TR PowerSO-36 Tape and reel 15/17 Revision history 9 VN808SR Revision history Table 12. 16/17 Document revision history Date Revision Changes 13-Sep-2005 1 Initial release 01-Mar-2007 2 Document reformatted 26-Mar-2007 3 Typo in Figure 3. 07-Jul-2008 4 Added Section 4 on page 8 VN808SR Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2008 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 17/17