STMICROELECTRONICS VNQ860-E

VNQ860-E
VNQ860SP-E
Quad channel high side driver
Features
Type
RDS(on)(1)
Iout
VCC
VNQ860-E
VNQ860SP-E
270 mΩ
0.25 A
36 V
1. Per each channel.
■
CMOS compatible I/Os
■
Undervoltage and overvoltage shut-down
■
Shorted load protection
■
Thermal shut-down
■
Very low stand-by current
■
Protection against loss of ground
Figure 1.
July 2008
SO- 20
PowerSO-10TM
Description
The VNQ860-E, VNQ860SP-E are monolithic
devices made using STMicroelectronics VIPower
M0-3 technology, intended for driving any kind
load with one side connected to ground. Active
current limitation combined with thermal
shut-down and automatic restart protect the
device against overload. Device automatically
turns OFF in case of ground pin disconnection.
This device is especially suitable for industrial
applications in norms conformity with IEC 61131,
(Programmable controllers international
standard).
Block diagram
Rev 3
1/19
www.st.com
19
Contents
VNQ860-E, VNQ860SP-E
Contents
1
Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2
Pin connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4
Truth table and switching characteristics . . . . . . . . . . . . . . . . . . . . . . . . 7
5
Typical application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
6
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
7
PowerSO-10™ thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
8
Reverse polarity protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
9
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
10
Order codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
11
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
2/19
VNQ860-E, VNQ860SP-E
1
Maximum rating
Maximum rating
Table 1.
Absolute maximum rating
Symbol
Parameter
Value
Unit
SO-20
PowerSO-10
VCC
DC supply voltage
41
V
-VCC
Reverse DC supply voltage
-0.3
V
-IGND
DC reverse ground pin
-200
mA
IOUT
DC output current
Internally limited
A
-IOUT
Reverse DC output current
-2
A
± 10
mA
-3/+VCC
V
IIN
DC input current
VIN
Input voltage range
ISTAT
DC status voltage
+ VCC
V
VESD
Electrostatic discharge (R = 1.5 kW; C = 100 pF)
2000
V
Ptot
Power dissipation at Tc <= 25 °C
16
TJ
Junction operating temperature
Internally limited
°C
Tc
Case operating temperature
-40 to 150
°C
Storage temperature
-55 to 150
°C
Tstg
Table 2.
90
W
Thermal data
Value
Symbol
RthJP
Parameter
Unit
Thermal resistance junction-pins
Max
SO-20
PowerSO-10
8
52
RthJA
Thermal resistance junction-ambient
RthJC
Thermal resistance junction-case
Max
58
Max
-
°C/W
(1)
37 (2)
1.4
°C/W
°C/W
2
1. When mounted on FR4 printed circuit board with 0.5 cm of copper area ( at least 35µ thick ) connected to
all VCC pins.
2. When mounted on FR4 printed circuit board with 6 cm2 of copper area ( at least 35µ thick ) connected to all
VCC pins.
3/19
Pin connection
2
VNQ860-E, VNQ860SP-E
Pin connection
Figure 2.
Configuration diagram (top view) and suggested connections for unused
and n.c. pins
Table 3.
Pin connection
Connection / pin
Status
N.C.
Output
Input
Floating
X
X
X
X
To ground
Figure 3.
4/19
X
Current and voltage conventions
Through 10 kΩ resistor
VNQ860-E, VNQ860SP-E
3
Electrical characteristics
Electrical characteristics
(8 V < VCC < 36 V; -40 °C < TJ < 150 °C; unless otherwise specified)
Table 4.
Symbol
Power section
Parameter
Test conditions
Min
Typ
Max
Unit
36
V
VCC
Operating supply
voltage
VUSD
Undervoltage shutdown
3
4
5.5
V
VOV
Overvoltage shut-down
36
42
48
V
RON
On state resistance
(per channel)
IOUT = 0.25 A; TJ = 25 °C;
IOUT = 0.25 A;
270
540
mΩ
IS
Supply current
OFF state; VCC = 24 V;
TC = 25 °C
ON state ( all channels ON )
120
10
µΑ
mA
ILGND
Output current
VCC - VSTAT = VIN =
VGND = 24 V;
VOUT = 0 V
1
mA
IL(OFF)
OFF state output
current
VIN = VOUT = 0 V
10
µΑ
IOUTleak
OFF state output
leakage current
VIN = VGND = 0 V;
VCC = VOUT = 24 V; TA = 25 °C
240
µΑ
IOUTleak
OFF state output
leakage current
VIN = VGND = 0 V; VCC = 24 V;
VOUT = 10 V; TA = 25 °C
100
µΑ
Max
Unit
Table 5.
5.5
70
5
0
Switching ( VCC = 24 V)
Symbol
Parameter
Test conditions
Min
Typ
t(ON)
Turn-on delay time of
Output current
RL = 96 from VIN rising edge to
VOUT = 2.4 V
10
µs
t(OFF)
Turn-off delay time of
Output current
RL = 96 from VIN rising edge to
VOUT = 21.6 V
40
µs
(dVOUT/dt)on Turn-on voltage slope
RL = 96 from VOUT = 2.4 V to
19.2 V
0.75
V/µs
(dVOUT/dt)off Turn-off voltage slope
RL = 96 from VOUT = 21.6 V to
2.4 V
0.25
V/µs
5/19
Electrical characteristics
Table 6.
Symbol
Ilim
Protections (per channel)
Parameter
Test conditions
Current limitation
Min
Typ
Max
Unit
0.35
0.7
1.1
A
T(hyst)
Thermal hysteresis
7
15
TTSD
Thermal shut-down
temperature
150
175
TR
Reset temperature
135
Turn-off output clamp
IOUT = 0.25 A, VCC = 24 V
voltage
VCC59
VCC52
VCC47
V
Min
Typ
Max
Unit
1.25
V
Vdemag
Table 7.
Parameter
VIL
Low level input voltage
IIL
Low level input current VIN = 1.25 V
VIH
High level input
voltage
IIH
High level input
current
VI(HYST)
Input hysteresis
voltage
VOL
Table 8.
Symbol
°C
200
°C
°C
Logical input (per channel)
Symbol
IIN
Test conditions
1
µΑ
3.25
V
VIN = 3.25 V
10
0.5
Input current
VIN = VCC = 36 V
I/O output votage
IIN = 5 mA ( Fault condition )
µΑ
V
200
µΑ
1
V
Max
Unit
Status pin
Parameter
Test conditions
Min
Typ
VSTAT
Status low output
voltage
ISTAT = 5 mA ( Fault condition )
1
V
ILSTAT
Status leakage
current
Normal operation;
VSTAT = VCC = 36 V
10
µΑ
CSTAT
Status pin input
capacitance
Normal operation;
VSTAT = 5 V
100
pF
Max
Unit
1
V
Table 9.
Symbol
VF
6/19
VNQ860-E, VNQ860SP-E
VCC - output diode
Parameter
Test conditions
Forwardon voltage -IOUT = 0.3 A; TJ = 150 °C
Min
Typ
VNQ860-E, VNQ860SP-E
4
Truth table and switching characteristics
Truth table and switching characteristics
Table 10.
Truth table
Conditions
MCOUTn
I/On
OUTPUTn
STATUS
Normal operation
L
H
L
H
L
H
H
H
Current limitation
L
H
L
H
L
X
H
H
Overtemperature
L
H
L
Driven low
L
L
X
X
Undervoltage
L
H
L
H
L
L
X
X
Overvoltage
L
H
L
H
L
L
H
H
Figure 4.
Switching characteristics
7/19
Typical application schematic
5
Typical application schematic
Figure 5.
8/19
Typical application schematic
VNQ860-E, VNQ860SP-E
VNQ860-E, VNQ860SP-E
6
Waveforms
Waveforms
Figure 6.
Waveforms
9/19
PowerSO-10™ thermal data
7
10/19
VNQ860-E, VNQ860SP-E
PowerSO-10™ thermal data
Figure 7.
PowerSO-10™ PC board
Figure 8.
RthJA vs PBC copper area in open box free air condition
VNQ860-E, VNQ860SP-E
8
Reverse polarity protection
Reverse polarity protection
A schematic solution to protect the IC against a reverse polarity condition is proposed.
This schematic is effective with any type of load connected to the outputs of the IC.
The RGND resistor value can be selected according to the following conditions to be met:
1.
RGND ≤ 600 mV / (IS in ON state max).
2.
RGND ≥ (-VCC) / (-IGND)
where -IGND is the DC reverse ground pin current and can be found in the absolute
maximum rating section of the device datasheet.
The power dissipation associated to RGNG during reverse polarity condition is:
PD = (-VCC)2/RGND
This resistor can be shared by several different ICs. In such case IS value on formula (1) is
the sum of the maximum ON-state currents of the different devices.
Please note that if the microprocessor ground and the device ground are separated then the
voltage drop across the RGND (given by IS in ON state max * RGND) produce a difference
between the generated input level and the IC input signal level. This voltage drop will vary
depending on how many devices are ON in the case of several high side switches sharing
the same RGND.
Figure 9.
Reverse polarity protection
+ Vcc
Statusi
Outputi
Inputi
RGND
GND
Load
(Optional)
11/19
Package mechanical data
9
VNQ860-E, VNQ860SP-E
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Table 11.
PowerSO-10™ mechanical data
mm
inch
Dim.
Min
Max
Min
Typ
Max
A
3.35
3.65
0.132
0.144
A1
0.00
0.10
0.000
0.004
B
0.40
0.60
0.016
0.024
c
0.35
0.55
0.013
0.022
D
9.40
9.60
0.370
0.378
D1
7.40
7.60
0.291
0.300
E
9.30
9.50
0.366
0.374
E1
7.20
7.40
0.283
0.291
E2
7.20
7.60
0.283
0.300
E3
6.10
6.35
0.240
0.250
E4
5.90
6.10
0.232
0.240
e
1.27
0.050
F
1.25
1.35
0.049
0.053
H
13.80
14.40
0.543
0.567
h
L
0.50
1.20
q
a
12/19
Typ
0.002
1.80
1.70
0°
0.047
0.071
0.067
8°
VNQ860-E, VNQ860SP-E
Package mechanical data
Figure 10. PowerSO-10™ package dimensions
Figure 11. PowerSO-10™ suggested pad and tube shipment (no suffix)
13/19
Package mechanical data
Figure 12. Tape and reel shipment (suffix “TR“)
14/19
VNQ860-E, VNQ860SP-E
VNQ860-E, VNQ860SP-E
Package mechanical data
Figure 13. PowerSO-20 mechanical data and package dimensions
DIM.
mm
MIN.
TYP.
A
a1
inch
MAX.
MIN.
TYP.
3.6
0.1
0.3
a2
0.142
0.004
0.012
3.3
0.130
a3
0
0.1
0.000
0.004
b
0.4
0.53
0.016
0.021
c
0.23
0.32
0.009
0.013
D (1)
15.8
16
0.622
0.630
D1 (2)
9.4
9.8
0.370
0.386
E
13.9
14.5
0.547
e
1.27
e3
E1 (1)
0.570
0.450
11.1
E2
0.429
0.437
2.9
0.114
E3
5.8
6.2
0.228
G
0
0.1
0.000
0.004
H
15.5
15.9
0.610
0.626
0.031
0.043
h
L
0.244
1.1
0.8
1.1
0.043
N
8˚(typ.)
S
8˚(max. )
T
Weight: 1.9gr
0.050
11.43
10.9
OUTLINE AND
MECHANICAL DATA
MAX.
10
JEDEC MO-166
0.394
PowerSO-20
(1) “D and E1” do not include mold flash or protusions.
- Mold flash or protusions shall not exceed 0.15mm (0.006”)
- Critical dimensions: “E”, “G” and “a3”.
(2) For subcontractors, the limit is the one quoted in jedec MO-166
N
R
N
a2
b
A
e
DETAIL A
c
a1
DETAIL B
E
e3
H
DETAIL A
lead
D
slug
a3
DETAIL B
20
11
0.35
Gage Plane
-C-
S
SEATING PLANE
L
G
E2
E1
BOTTOM VIEW
C
(COPLANARITY)
T
E3
1
h x 45˚
1
0
PSO20MEC
D1
0056635 I
15/19
Package mechanical data
Figure 14. SO-20 tube shipment ( no suffix )
Figure 15. Tape and reel shipment ( suffix “13TR“)
16/19
VNQ860-E, VNQ860SP-E
VNQ860-E, VNQ860SP-E
10
Order codes
Order codes
Table 12.
Order codes
Order codes
Package
VNQ860
SO-20
VNQ860SP
PowerSO-10™
VNQ86013TR-E
SO-20
VNQ860SP13TR-E
PowerSO-10™
Packaging
Tube
Tape and reel
17/19
Revision history
11
VNQ860-E, VNQ860SP-E
Revision history
Table 13.
18/19
Document revision history
Date
Revision
Changes
14-Jul-2005
1
Updates , new template
7-Nov-2005
2
Few updates
07-Jul-2008
3
Added Section 8 on page 11
VNQ860-E, VNQ860SP-E
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19/19