TEMIC U2532B

U2532B
IR Transmitter and Receiver
Description
The IC U2532B is a complete IR-Transmitter-Receiver
IC according to the new IrDA 1.0 standard.
ASK-modulation is also possible. Only an external
PIN-photodiode and an infrared emitting diode with
current limiting resistor must be connected to the
corresponding pins. The amplifier with Schmitt-Trigger
formed output signal and the IR-driver need no further
external components. The IC allows data rates from
2.4 kbit/s to 115.2 kbit/s and up to 500 kHz for
ASK-modulation. Two different sensitivity modes, which
can be programmed by applying a “High” or “Low”
voltage at pin SC, ensure either an increase in
transmission distance or a bit error rate of 1E-9. An
internal AGC allows proper operation under EMI
conditions.
Features
Applications
D
D
D
D
D
D
D
D
D
D
D
Data rates up to 115.2 kbit/s
Wide supply voltage range (3 to 5.5 V)
AGC for EMI immunity
AGC reset
IR data transmission
Compatible to IrDA
Bidirectional IR data transmission
Ability to receive ASK modulation
High and low sensitivity mode
BER < 1E-9 in the low sensitivity mode
Power-On reset
Case: SO16
V CC
RL
TxD
Driver
Amp
(AGC)
SC
ST
Reset
RxD
95 10210
Figure 1.
TELEFUNKEN Semiconductors
Rev. A1, 27-Sep-96
1 (10)
Preliminary Information
U2532B
Pin Description
1
16
TxD
2
15 IRED
RxD
3
14 O_GND
Reset
4
13
NC
12
NC
P_GND
NC
Pin
1
2
3
4
5
6
7, 8,
10, 12,
13, 16
9
11
14
15
U2532B
VCC
5
SC
6
11
A_GND
NC
7
10
NC
NC
8
9
IN
Symbol
P_GND
TxD
RxD
Reset
VCC
SC
NC
Function
Power ground
Transmitter input
Receiver output
AGC-Reset
Supply voltage
Sensitivity Control
Not connected
IN
A_GND
O_GND
IRED
Photodiode input
Analog ground
Output ground
IR-Emitter
95 10244
Figure 2. Pinning
Block Diagram
5
15
2
DRV
1
COMP
BIAS
3
CGA
9
+
–
14
AGC
TIA
6
4
11
95 10211
Figure 3. Block diagram
2 (10)
Preliminary Information
TELEFUNKEN Semiconductors
Rev. A1, 27-Sep-96
U2532B
Functionality of the Various Circuit Blocks
to a value where a BER < 1E-9 is still guaranteed, but sigTransimpedance Amplifier (TIA)
The input stage provides the necessary bias voltage for the
photodiode and ensures decoupling of the useful signal.
This involves processing the dc and ac portions in separate parts of the circuit, BIAS (Bias voltage) and TIA. The
BIAS circuit separates the dc part (sunlight, incandescent
light) from the input signal. The ac portion of the input
current is fed to an inverting amplifier with a sufficiently
low input impedance (TIA). The TIA prevents the signal
slopes to be negatively affected by the junction capacitance of the photodiode.
Controlled Gain Amplifier (CGA)
The CGA consists of two differential amplifiers. The total
gain is 17 in the high sense mode (Sensitivity Control Input “High”) and can be reduced to 8 if the Sensitivity
Control Input is set to “Low”. In the low sense mode a
BER of 1E-9 is guaranteed. In the high sense mode
eventually generated output pulses must be suppressed by
software handling. The lower and upper cut-off frequencies of the amplifier are 25 kHz and 900 kHz
respectively. Additionally the overall gain can be
attenuated by 30 dB in 2 dB steps. The attenuation is digitally controlled by the AGC (Automatic Gain Control)
circuit.
Comparator (COMP)
The comparator compares the output signal of the CGA
to an internal threshold voltage. The output of that
comparator is directly connected to an collector output
stage. An internal pull up resistor of 20 kW is provided.
Automatic Gain Control (AGC)
The AGC adjusts the sensitivity of the receiver according
to the strength of the incoming signals. When the input
signal increases, the amplification of the CGA is reduced
TELEFUNKEN Semiconductors
Rev. A1, 27-Sep-96
nals from disturbers can be effectively suppressed. With
this feature a proper data transmission can be maintained
also in the presence of energy saving lamps and ceiling
lamps that are common in offices. The dynamic range of
the AGC is max. 30 dB. This provides the ability to suppress also strong disturbers. As the AGC acts when the
input signal increases, the transmission distance is reduced if disturbances have to be suppressed. The AGC is
digitally controlled and therefore not dependent on any
time constant. The amplification of the CGA is set at every input pulse or input burst for ASK-modulation and is
maintained until the next input signal is detected. The signal strength determines whether to reduce, increase or
maintain the gain. If no input signal is detected in 18 ms,
the AGC considers the data transmission to be finished
and increases the gain by a 2 dB step. Within every 18 ms
the gain is increased by an additional 2 dB step, until the
maximum gain of the CGA is reached. If a “High” signal
is applied at the reset (Pin 4), the AGC is set to maximum
sensitivity. Incoming signals don‘t influence the AGC.
Under this biasing condition it is possible to get maximum
transmission distance also in the presence of a known
strong disturber, if of course the signals of the disturber
can be succesfully suppressed by software handling in the
microprocessor. During “Power-On” the AGC is set to
maximum sensitivity. The gain of the AGC is maintained
while the transceiver is transmitting.
Transmitter
IRED Driver (DRV)
The IRED driver DRV is also monolithically integrated
on the transceiver chip providing a high impedance input
to drive a fast IR emitter diode. The “active high” input
signal drives the output stage. This stage mainly consists
of an input amplifier and an open collector NPN transistor
that is saturation controlled. The output transistor is capable of driving a lood current up to 1 A.
3 (10)
Preliminary Information
U2532B
Absolute Maximum Ratings
All voltages are referred to A_GND (Pin 11).
Parameters
Test Conditions / Pins
Supply voltage
Pin 5
Transmitter input voltage
Pin 2
Sensitivity control voltage
Pin 6
Reset voltage
Pin 4
Receiver output voltage
Pin 3
LED driver
Pin 15
Input currents
Pins 2, 4, 6 and 15
Receiver sinking current
Pin 3
Photodiode input
Pin 9
Power dissipation
Junction temperature
Ambient temperature range
Storage temperature range
Soldering temperature
Average driver current
Pin 15
Repeated pulsed driver c.
< 90 ms, ton < 20%, Pin 15
Peak driver current
< 2 ms, ton < 10%, Pin 15
Symbol
VCC
VIN(TxD)
VSC
V(Reset)
VO(RxD)
V(TxD)
IL(RxD)
VIN
Ptot
Tj
Tamb
Tstg
Min.
–0.5
–0.5
–0.5
–0.5
–0.5
–0.5
Typ.
–0.5
–40
–40
Id(DC)
Id(RP)
Id(PK)
Max.
6
VCC+0.5
VCC+0.5
VCC+0.5
VCC+0.5
6
1
10
VCC
75
150
125
150
230
100
500
1
Unit
V
V
V
V
V
V
mA
mA
V
mW
°C
°C
°C
°C
mA
mA
A
Thermal Resistance
Parameters
Junction ambient
Symbol
RthJA
4 (10)
Preliminary Information
Value
180
Unit
K/W
TELEFUNKEN Semiconductors
Rev. A1, 27-Sep-96
U2532B
Electrical Characteristics
Test conditions: VCC = 5 V, Tamb = 25°C, unless otherwise specified
Parameters
Receiver
Supported data rates
Supply voltage range
Supply current
Sensitivity control voltage
“Low”
Sensitivity control voltage
“High”
Input threshold
current
Input threshold
current
Input threshold current
for ASK modulation
Input threshold current
for ASK modulation
Max. signal pulse input
current
DC input current
Output voltage RxD
Output voltage RxD
Rise time
Fall time
Output pulse width
Output pulse width
Output delay time
Jitter
AGC dynamic range
AGC single step
Max. reset time
Test Conditions / Pins
Symbol
Low sense mode
Pin 5
Pin 5
Pin 6
VCC
IS
VSC
High sense mode
Pin 6
VSC
SC > 0.5 V
Pin 9
VCC = 3 V
SC > 2.4 V, VCC = 3 V
Pin 9
SC < 0.5 V or open
Pin 9
VCC = 3 V
SC < 2.4 V or open
Pin 9
VCC = 5 V
Sensitivity independent
Pin 9
VIN > 0 V
Pin 9
Non active
Pin 3
Active; IL = 4 mA Pin 3
C = 15 pF,R = 2.2 k Pin 3
C = 15 pF,R = 2.2 k Pin 3
2.4 kbit/s,
78 s pulse width Pin 3
115.2 kbit/s,
1.6 s pulse width Pin 3
115.2 kbit/s,
1.6 s pulse width
– Output level 0.5 VCC
– Leading edges of signals
– Related to optical input
Pin 3
115.2 kbit/s,
1.6 s pulse width
– Period of 10 bits, all
“ones”
– Leading edges of signals
Pin 3
Pin 3
Pin 3
15 steps, covering full dynamic range of AGC
Pin 3
TELEFUNKEN Semiconductors
Rev. A1, 27-Sep-96
Min.
2.4
3
2.0
Typ.
Max.
Unit
5
1.3
0.2
115.2
5.5
2.5
0.5
kbit/s
V
mA
V
VCC
V
ilNmin
60
90
nA
ilNmin
30
45
nA
ilNmin
(ASK)
ilNmin
(ASK)
ilNmax
200
400
nA
120
250
nA
6
mA
200
mA
IIN
VOH
VOL
tr
tf
tp
VCC–0.5
0.2
0.5
0.3
7
0.5
15
V
V
s
s
s
tp
2.5
4
s
td
1
2
s
2
s
400
dB
dB
ms
tj
treset
30
2
270
5 (10)
Preliminary Information
U2532B
Parameters
Transmitter
Output voltage IRED
“Low”
Logic “Low” transmitter
input voltage
Logic “High” transmitter
input voltage
Output leakage current
Output rise time
Output fall time
Output pulse width
Overshoot over final
current
Jitter
Test Conditions / Pins
Symbol
Id = 300mA with appropriate current limiting resistor
Pin 15
Pin 2
VO(TxD) = 6 V
Id = 300 mA
Id = 300 mA
115.2 kbit/s
1.6 ms pulse width
Typ.
Max.
Unit
VOL(TxD)
0.3
0.5
V
VIN (TxD)
0.4
0.8
V
Pin 2
VIN (TxD)
Pin 15
Pin 15
Pin 15
Id0
tr
tf
tp
Pin 15
Pin 15
115.2 kbit/s,
1.6 ms pulse width
–Period of 10 bits, all
“ones”
– Leading edges of signals
Pin 15
Min.
2
VCC
V
10
300
300
2.7
mA
dId
25
%
tj
0.2
ms
1.4
6 (10)
Preliminary Information
1.6
ns
ns
ms
TELEFUNKEN Semiconductors
Rev. A1, 27-Sep-96
U2532B
Typical Performance Characteristics
1.4
1.4
1.2
1.2
Rel Output Low Voltage
Rel Supply Current
Test condition: Vcc = 5 V
1.0
0.8
0.6
0.4
0.2
0
–40 –20
0
20
40
60
0.6
0.4
0
–40 –20
80 100 120 140
Tj Temperature ( °C )
Figure 4. Supply current vs. temperature
1.2
1.2
1.0
1.0
0.2
0.2
20
40
60
Figure 5. Input threshold current vs. temperature (receiver)
TELEFUNKEN Semiconductors
Rev. A1, 27-Sep-96
0
–40 –20
80 100 120 140
Tj Temperature ( °C )
80 100 120 140
0.6
0.4
0
60
0.8
0.4
0
–40 –20
40
Figure 6. Output voltage IRED “LOW” vs. temperature
(transmitter)
1.4
0.6
20
Tj Temperature ( °C )
1.4
0.8
0
12473
Rel Pulse Width
Rel Input Threshold Current
0.8
0.2
12471
12472
1.0
0
20
40
60
80 100 120 140
Tj Temperature ( °C )
12474
Figure 7. Output pulse width vs. temperature
(receiver, 115 kbit/s)
7 (10)
Preliminary Information
U2532B
Application Circuit
The diagram below shows the typical application for the
IC U2532B. The detector diode and IR emitter can also
be obtained from TEMIC. As emitter a high speed infrared emitting diode like TSHF5400 is recommended.
For improving output power two diodes can be connected
in series. An external current limiting resistor is used to
adjust the appropriate forward current. The resulting current of the emitter, with the settings RL = 5 W and
VCC = 5 V, is Id = 300 mA and the corresponding typical
radiant intensity of a single diode is IE = 120 mW/sr.
The IR radiation detector BPV22NF is a high speed and
high sensitive PIN photodiode in a plastic package with
a spherical side view lens. Because of a large radiant sensitive area of A = 7.5 mm2 a typical output current of
Ira = 85 mA with Ee = 1 mW/cm2 and l = 870 nm is
achieved. A transmitting distance of approximately 3.5 m
is possible. Rs and C are the low pass filter network to suppress power supply noise and other disturbances. At
pin RxD the output signal can be received. Optionally an
external load resistor can be connected from pin 3 to VCC,
if a smaller pull up resistor than 20 kW is desired.
VCC
RS
100
C
W
(5 V)
470 nF
16
1
TxD
RL
15
2
TSHF
5400
RxD
mC
Reset
3
14
4
13
5W
U2532B
SC
5
12
6
11
7
10
8
9
BPV22NF
95 10212
Figure 8.
8 (10)
Preliminary Information
TELEFUNKEN Semiconductors
Rev. A1, 27-Sep-96
U2532B
Dimensions in mm
94 8875
Figure 9.
TELEFUNKEN Semiconductors
Rev. A1, 27-Sep-96
9 (10)
Preliminary Information
U2532B
Ozone Depleting Substances Policy Statement
It is the policy of TEMIC TELEFUNKEN microelectronic GmbH to
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems
with respect to their impact on the health and safety of our employees and the public, as well as their impact on
the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as
ozone depleting substances ( ODSs).
The Montreal Protocol ( 1987) and its London Amendments ( 1990) intend to severely restrict the use of ODSs and
forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban
on these substances.
TEMIC TELEFUNKEN microelectronic GmbH semiconductor division has been able to use its policy of
continuous improvements to eliminate the use of ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively
2 . Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental
Protection Agency ( EPA) in the USA
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C ( transitional substances ) respectively.
TEMIC can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain
such substances.
We reserve the right to make changes to improve technical design and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each customer
application by the customer. Should the buyer use TEMIC products for any unintended or unauthorized
application, the buyer shall indemnify TEMIC against all claims, costs, damages, and expenses, arising out of,
directly or indirectly, any claim of personal damage, injury or death associated with such unintended or
unauthorized use.
TEMIC TELEFUNKEN microelectronic GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
Telephone: 49 ( 0 ) 7131 67 2831, Fax number: 49 ( 0 ) 7131 67 2423
10 (10)
Preliminary Information
TELEFUNKEN Semiconductors
Rev. A1, 27-Sep-96