TA31188FNG TA31188FNG : The TA31188FNG is Pb-Free Package 2005-01-24 TA31188FNG 2005-01-24 TA31188FNG 2005-01-24 TA31188FNG 2005-01-24 TA31188FNG 2005-01-24 TA31188FNG 2005-01-24 TA31188FNG 2005-01-24 TA31188FNG 2005-01-24 TA31188FNG 2005-01-24 TA31188FNG TA31188FNG 2005-01-24 TA31188FNG 2005-01-24 TA31188FNG 2005-01-24 TA31188FNG 2005-01-24 TA31188FNG 2005-01-24 TA31188FNG About solderability, following conditions were confirmed ● Solderability (1) Use of Sn-63Pb solder bath ・Solder bath temperature = 230℃ ・Dipping time = 5seconds ・The number of times = once ・Use of R-type flux (2) Use of Sn-3.0Ag-0.5Cu solder bath ・Solder bath temperature = 245℃ ・Dipping time = 5seconds ・The number of times = once ・Use of R-type flux 2005-01-24