TI TPD3E001DRSR

TPD3E001
LOW-CAPACITANCE 3-CHANNEL ±15-kV ESD-PROTECTION ARRAY
FOR HIGH-SPEED DATA INTERFACES
www.ti.com
SLLS683D – JULY 2006 – REVISED APRIL 2007
FEATURES
APPLICATIONS
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
ESD Protection Exceeds
– ±15-kV Human-Body Model (HBM)
– ±8-kV IEC 61000-4-2 Contact Discharge
– ±15-kV IEC 61000-4-2 Air-Gap Discharge
Low 1.5-pF Input Capacitance
Low 1-nA (Max) Leakage Current
Low 1-nA Supply Current
0.9-V to 5.5-V Supply-Voltage Range
3-Channel Device
Space-Saving DRL, DRY, and QFN Package
Options
Alternate 2-, 4-, and 6-Channel Options
Available: TPD2E001, TPD4E001, and
TPD6E001
USB 2.0
Ethernet
FireWire™
Video
Cell Phones
SVGA Video Connections
Glucosemeters
DESCRIPTION/ORDERING INFORMATION
The TPD3E001 is a low-capacitance ±15-kV ESD-protection diode array designed to protect sensitive
electronics attached to communication lines. Each channel consists of a pair of diodes that steer ESD current
pulses to VCC or GND. The TPD3E001 protects against ESD pulses up to ±15-kV Human-Body Model (HBM),
±8-kV Contact Discharge, and ±15-kV Air-Gap Discharge, as specified in IEC 61000-4-2. This device has a
1.5-pF capacitance per channel, making it ideal for use in high-speed data IO interfaces.
The TPD3E001 is a triple-ESD structure designed for USB On-the-Go (OTG) and video applications.
The TPD3E001 is available in DRL, DRY, and thin QFN packages and is specified for –40°C to 85°C operation.
ORDERING INFORMATION
PACKAGE (1)
TA
–40°C to 85°C
(1)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
1.6 × 1.6 SOP – DRL
TPD3E001DRLR
2BR
1.45 × 1 SON – DRY
TPD3E001DRYR
2B
3 × 3 QFN – DRS
TPD3E001DRSR
ZWL
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
DRY PACKAGE
(TOP VIEW)
DRL PACKAGE
(TOP VIEW)
IO1
1
6
VCC
IO1
1
IO2
2
5
N.C.
IO2
2
GND
3
4
IO3
GND
3
5
4
QFN PACKAGE
(TOP VIEW)
VCC
IO3
IO1 1
6
VCC
IO2 2
5
N.C.
4
IO3
GND 3
GND
N.C. - Not internally connected
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
FireWire is a trademark of Apple Computer, Inc.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006–2007, Texas Instruments Incorporated
TPD3E001
LOW-CAPACITANCE 3-CHANNEL ±15-kV ESD-PROTECTION ARRAY
FOR HIGH-SPEED DATA INTERFACES
www.ti.com
SLLS683D – JULY 2006 – REVISED APRIL 2007
LOGIC BLOCK DIAGRAM
VCC
IO1
IO3
IO2
GND
PIN DESCRIPTION
DRL
NO.
DRY
NO.
DRS
NO.
NAME
1, 2, 4
1, 2, 4
1, 2, 4
IOx
3
3
3
GND
Ground
5
6
6
VCC
Power-supply input. Bypass VCC to GND with a 0.1-µF ceramic
capacitor.
5
N.C.
No connection. Not internally connected.
EP
EP
5
2
FUNCTION
ESD-protected channel
Exposed pad. Connect to GND.
Submit Documentation Feedback
www.ti.com
TPD3E001
LOW-CAPACITANCE 3-CHANNEL ±15-kV ESD-PROTECTION ARRAY
FOR HIGH-SPEED DATA INTERFACES
SLLS683D – JULY 2006 – REVISED APRIL 2007
Absolute Maximum Ratings
(1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCC
–0.3
7
V
VI/O
–0.3
VCC + 0.3
V
–65
150
°C
150
°C
Tstg
Storage temperature range
TJ
Junction temperature
Bump temperature (soldering)
Infrared (15 s)
220
Vapor phase (60 s)
215
Lead temperature (soldering, 10 s)
(1)
UNIT
°C
°C
300
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the
specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Electrical Characteristics
VCC = 5 V ± 10%, TA = -40°c to 85°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
Supply voltage
ICC
Supply current
VF
Diode forward voltage
IF = 10 mA
VBR
Breakdown Voltage
IBR = 10mA
Channel clamp voltage (2)
VC
TYP (1)
MAX
0.9
0.65
UNIT
5.5
V
100
nA
0.95
V
1
11
TA = 25°C, ±15-kV HBM,
IF = 10 A
Positive transients
TA = 25°C,
±8-kV Contact Discharge
(IEC 61000-4-2), IF = 24 A
Positive transients
TA = 25°C,
±15-kV Air-Gap Discharge
(IEC 61000-4-2), IF = 45 A
Positive transients
Ii/o
Channel leakage current
Vi/o = GND or VCC
Cio
Channel input capacitance
VCC = 5 V, bias of VCC/2
(1)
(2)
MIN
V
VCC + 25
Negative transients
–25
VCC + 60
Negative transients
V
–60
VCC + 100
Negative transients
–100
±1
1.5
nA
pF
Typical values are at VCC = 5 V and TA = 25°C.
Channel clamp voltage is not production tested.
ESD Protection
PARAMETER
TYP
UNIT
±15
kV
IEC 61000-4-2 Contact Discharge
±8
kV
IEC 61000-4-2 Air-Gap Discharge
±15
kV
HBM
Submit Documentation Feedback
3
TPD3E001
LOW-CAPACITANCE 3-CHANNEL ±15-kV ESD-PROTECTION ARRAY
FOR HIGH-SPEED DATA INTERFACES
www.ti.com
SLLS683D – JULY 2006 – REVISED APRIL 2007
TYPICAL OPERATING CHARACTERISTICS
IO CAPACITANCE
vs
IO VOLTAGE
(VCC = 5.0 V)
2.20
IO Capacitance (pF)
2.00
1.80
1.60
1.40
1.20
1.00
0.00
1.00
2.00
2.50
3.00
4.00
5.00
IO Voltage (V)
IO LEAKAGE CURRENT
vs
TEMPERATURE
(VCC = 5.5 V)
IO Leakage Current (pA)
1000
100
10
1
–40
25
45
Temperature (°C)
4
Submit Documentation Feedback
65
85
www.ti.com
TPD3E001
LOW-CAPACITANCE 3-CHANNEL ±15-kV ESD-PROTECTION ARRAY
FOR HIGH-SPEED DATA INTERFACES
SLLS683D – JULY 2006 – REVISED APRIL 2007
APPLICATION INFORMATION
0.1 µF
VCC
VBUS
RT
USB
Controller
IO1
RT
IO2
IO3
D+
D–
GND
GND
Detailed Description
When placed near the connector, the TPD3E001 ESD solution offers little or no signal distortion during normal
operation due to low IO capacitance and ultra-low leakage current specifications. The TPD3E001 ensures that
the core circuitry is protected and the system is functioning properly in the event of an ESD strike. For proper
operation, the following layout/ design guidelines should be followed:
1. Place the TPD3E001 solution close to the connector. This allows the TPD3E001 to take away the energy
associated with ESD strike before it reaches the internal circuitry of the system board.
2. Place a 0.1-µF capacitor very close to the VCC pin. This limits any momentary voltage surge at the IO pin
during the ESD strike event.
3. Ensure that there is enough metallization for the VCC and GND loop. During normal operation, the
TPD3E001 consumes nA leakage current. But during the ESD event, VCC and GND may see 15 A to
30 A of current, depending on the ESD level. Sufficient current path enables safe discharge of all the
energy associated with the ESD strike.
4. Leave the unused IO pins floating.
5. The VCC pin can be connected in two different ways:
a. If the VCC pin is connected to the system power supply, the TPD3E001 works as a transient suppressor
for any signal swing above VCC + VF. A 0.1-µF capacitor on the device VCC pin is recommended for ESD
bypass.
b. If the VCC pin is not connected to the system power supply, the TPD3E001 can tolerate higher signal
swing in the range up to 10 V. Please note that a 0.1-µF capacitor is still recommended at the VCC pin for
ESD bypass.
Submit Documentation Feedback
5
PACKAGE OPTION ADDENDUM
www.ti.com
31-Jul-2010
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
TPD3E001DRLR
ACTIVE
SOT
DRL
5
4000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Request Free Samples
TPD3E001DRLRG4
ACTIVE
SOT
DRL
5
4000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Request Free Samples
TPD3E001DRSR
ACTIVE
SON
DRS
6
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
Request Free Samples
TPD3E001DRYR
ACTIVE
SON
DRY
6
5000
TBD
Call TI
Call TI
Request Free Samples
TPD3E001DRYRG4
ACTIVE
SON
DRY
6
5000
TBD
Call TI
Call TI
Request Free Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Jul-2010
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
TPD3E001DRLR
SOT
DRL
5
4000
180.0
9.2
1.78
1.78
0.69
4.0
8.0
Q3
TPD3E001DRSR
SON
DRS
6
1000
330.0
12.4
3.3
3.3
1.1
8.0
12.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Jul-2010
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPD3E001DRLR
SOT
DRL
5
4000
202.0
201.0
28.0
TPD3E001DRSR
SON
DRS
6
1000
346.0
346.0
29.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DLP® Products
www.dlp.com
Communications and
Telecom
www.ti.com/communications
DSP
dsp.ti.com
Computers and
Peripherals
www.ti.com/computers
Clocks and Timers
www.ti.com/clocks
Consumer Electronics
www.ti.com/consumer-apps
Interface
interface.ti.com
Energy
www.ti.com/energy
Logic
logic.ti.com
Industrial
www.ti.com/industrial
Power Mgmt
power.ti.com
Medical
www.ti.com/medical
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
RFID
www.ti-rfid.com
Space, Avionics &
Defense
www.ti.com/space-avionics-defense
RF/IF and ZigBee® Solutions www.ti.com/lprf
Video and Imaging
www.ti.com/video
Wireless
www.ti.com/wireless-apps
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2010, Texas Instruments Incorporated