SN74LVC139A DUAL 2-LINE TO 4-LINE DECODER/DEMULTIPLEXER www.ti.com SCAS341O – MARCH 1994 – REVISED FEBRUARY 2005 • FEATURES • Latch-Up Performance Exceeds 250 mA Per JESD 17 ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 200-V Machine Model (A115-A) – 1000-V Charged-Device Model (C101) 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 VCC 2G 2A 2B 2Y0 2Y1 2Y2 2Y3 1A 1B 1Y0 1Y1 1Y2 1Y3 1 16 2 15 3 14 4 13 5 12 6 11 10 7 8 9 2Y3 1G 1A 1B 1Y0 1Y1 1Y2 1Y3 GND RGY PACKAGE (TOP VIEW) VCC D, DB, DGV, NS, OR PW PACKAGE (TOP VIEW) 1G • Operates From 1.65 V to 3.6 V Inputs Accept Voltages to 5.5 V Max tpd of 6.2 ns Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25°C Typical VOHV (Output VOH Undershoot) >2 V at VCC = 3.3 V, TA = 25°C GND • • • • 2G 2A 2B 2Y0 2Y1 2Y2 DESCRIPTION/ORDERING INFORMATION This dual 2-line to 4-line decoder/demultiplexer is designed for 1.65-V to 3.6-V VCC operation. The device comprises two individual 2-line to 4-line decoders in a single package. The active-low enable (G) input can be used as a data line in demultiplexing applications. This decoder/demultiplexer features fully buffered inputs, each of which represents only one normalized load to its driving circuit. Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of this device as a translator in a mixed 3.3-V/5-V system environment. ORDERING INFORMATION PACKAGE (1) TA QFN – RGY Tube of 40 SN74LVC139AD Reel of 2500 SN74LVC139ADR Reel of 250 SN74LVC139ADT SOP – NS Reel of 2000 SN74LVC139ANSR LVC139A SSOP – DB Reel of 2000 SN74LVC139ADBR LC139A Tube of 90 SN74LVC139APW Reel of 2000 SN74LVC139APWR Reel of 250 SN74LVC139APWT Reel of 2000 SN74LVC139ADGVR TSSOP – PW TVSOP – DGV VFBGA – GQN VFBGA – ZQN (Pb-free) (1) TOP-SIDE MARKING SN74LVC139ARGYR SOIC – D –40°C to 85°C ORDERABLE PART NUMBER Reel of 1000 Reel of 1000 SN74LVC139AGQNR SN74LVC139AZQNR LC139A LVC139A LC139A LC139A LC139A Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1994–2005, Texas Instruments Incorporated SN74LVC139A DUAL 2-LINE TO 4-LINE DECODER/DEMULTIPLEXER www.ti.com SCAS341O – MARCH 1994 – REVISED FEBRUARY 2005 GQN OR ZQN PACKAGE (TOP VIEW) 1 2 3 TERMINAL ASSIGNMENTS 1 4 2 3 4 A 1A 1G VCC 2G A B 1B NC (1) NC (1) 2A B C 1Y1 1Y0 2Y0 2B C D 1Y2 NC (1) NC (1) 2Y1 D E GND 1Y3 2Y3 2Y2 E (1) NC - No internal connection FUNCTION TABLE (EACH DECODER/DEMULTIPLEXER) INPUTS OUTPUTS SELECT G B A Y3 Y2 Y1 Y0 L L L H H H L L L H H H L H L H L H L H H L H H L H H H H X X H H H H LOGIC DIAGRAM (POSITIVE LOGIC) 4 1G 5 6 1A Select Inputs 1B 1Y0 1 1Y1 1Y2 2 3 7 1Y3 Data Outputs 12 2G 11 10 2A Select Inputs 2B 2Y1 2Y2 14 13 Pin numbers shown are for the D, DB, DGV, NS, PW, and RGY packages. 2 2Y0 15 9 2Y3 SN74LVC139A DUAL 2-LINE TO 4-LINE DECODER/DEMULTIPLEXER www.ti.com SCAS341O – MARCH 1994 – REVISED FEBRUARY 2005 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage range –0.5 6.5 V VI Input voltage range (2) –0.5 6.5 V –0.5 VCC + 0.5 range (2) (3) UNIT VO Output voltage IIK Input clamp current VI < 0 –50 mA IOK Output clamp current VO < 0 –50 mA IO Continuous output current ±50 mA ±100 mA Continuous current through VCC or GND D package (4) 73 DB package (4) 82 DGV package (4) θJA Package thermal impedance 120 GQN/ZQN package (4) 78 NS package (4) 64 PW package (4) 108 RGY package (5) Tstg (1) (2) (3) (4) (5) Storage temperature range V °C/W 39 –65 °C 150 Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed. The value of VCC is provided in the recommended operating conditions table. The package thermal impedance is calculated in accordance with JESD 51-7. The package thermal impedance is calculated in accordance with JESD 51-5. Recommended Operating Conditions (1) VCC Supply voltage VIH High-level input voltage Operating Data retention only VCC = 1.65 V to 1.95 V MIN MAX 1.65 3.6 1.5 Low-level input voltage VI Input voltage VO Output voltage IOH High-level output current IOL Low-level output current ∆t/∆v Input transition rise or fall rate TA Operating free-air temperature (1) V 0.65 × VCC VCC = 2.3 V to 2.7 V 1.7 VCC = 2.7 V to 3.6 V 2 V 0.35 × VCC VCC = 1.65 V to 1.95 V VIL UNIT VCC = 2.3 V to 2.7 V 0.7 VCC = 2.7 V to 3.6 V 0.8 V 0 5.5 V 0 VCC V VCC = 1.65 V –4 VCC = 2.3 V –8 VCC = 2.7 V –12 VCC = 3 V –24 VCC = 1.65 V 4 VCC = 2.3 V 8 VCC = 2.7 V 12 VCC = 3 V 24 –40 mA mA 10 ns/V 85 °C All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. 3 SN74LVC139A DUAL 2-LINE TO 4-LINE DECODER/DEMULTIPLEXER www.ti.com SCAS341O – MARCH 1994 – REVISED FEBRUARY 2005 Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCC IOH = –100 µA VOH 1.65 V to 3.6 V All inputs 1.2 IOH = –8 mA 2.3 V 1.7 2.7 V 2.2 3V 2.4 IOH = –24 mA 3V 2.2 IOL = 100 µA 1.65 V to 3.6 V 0.2 IOL = 4 mA 1.65 V 0.45 IOL = 8 mA 2.3 V 0.7 IOL = 12 mA 2.7 V 0.4 3V 0.55 VI = VCC or GND, IO = 0 One input at VCC – 0.6 V, Other inputs at VCC or GND Ci VI = VCC or GND V µA 3.6 V 10 µA 2.7 V to 3.6 V 500 µA 3.6 V ∆ICC (1) V ±5 VI = 5.5 V or GND ICC UNIT VCC – 0.2 1.65 V IOL = 24 mA II TYP (1) MAX IOH = –4 mA IOH = –12 mA VOL MIN 3.3 V 5 pF All typical values are at VCC = 3.3 V, TA = 25°C. Switching Characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) PARAMETER tpd FROM (INPUT) A or B G TO (OUTPUT) Y VCC = 1.8 V ± 0.15 V VCC = 2.5 V ± 0.2 V VCC = 2.7 V VCC = 3.3 V ± 0.3 V UNIT MIN MAX MIN MAX MIN MAX MIN MAX 1 20.6 1 9.3 1 7.3 1 6.2 1 19.5 1 7.2 1 5.2 1 4.7 tsk(o) 1 ns ns Operating Characteristics TA = 25°C PARAMETER Cpd 4 Power dissipation capacitance TEST CONDITIONS VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V TYP TYP TYP f = 10 MHz 28.5 29.5 30.5 UNIT pF SN74LVC139A DUAL 2-LINE TO 4-LINE DECODER/DEMULTIPLEXER www.ti.com SCAS341O – MARCH 1994 – REVISED FEBRUARY 2005 PARAMETER MEASUREMENT INFORMATION VLOAD S1 RL From Output Under Test CL (see Note A) Open GND RL TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open VLOAD GND LOAD CIRCUIT INPUTS VCC 1.8 V ± 0.15 V 2.5 V ± 0.2 V 2.7 V 3.3 V ± 0.3 V VI tr/tf VCC VCC 2.7 V 2.7 V ≤2 ns ≤2 ns ≤2.5 ns ≤2.5 ns VM VLOAD CL RL V∆ VCC/2 VCC/2 1.5 V 1.5 V 2 × VCC 2 × VCC 6V 6V 30 pF 30 pF 50 pF 50 pF 1 kΩ 500 Ω 500 Ω 500 Ω 0.15 V 0.15 V 0.3 V 0.3 V VI Timing Input VM 0V tw tsu VI Input VM VM th VI Data Input VM VM 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VI VM Input VM 0V tPLH VM VM VOL tPHL VM VM 0V Output Waveform 1 S1 at VLOAD (see Note B) tPLH tPLZ VLOAD/2 VM tPZH VOH Output VM tPZL tPHL VOH Output VI Output Control VM VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS Output Waveform 2 S1 at GND (see Note B) VOL + V∆ VOL tPHZ VM VOH − V∆ VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms 5 PACKAGE OPTION ADDENDUM www.ti.com 4-Jun-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing SN74LVC139AD ACTIVE SOIC D 16 SN74LVC139ADBLE OBSOLETE SSOP DB 16 SN74LVC139ADBR ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC139ADBRE4 ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC139ADBRG4 ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC139ADE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC139ADG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC139ADGVR ACTIVE TVSOP DGV 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC139ADGVRE4 ACTIVE TVSOP DGV 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC139ADGVRG4 ACTIVE TVSOP DGV 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC139ADR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC139ADRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC139ADRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC139ADT ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC139ADTE4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC139ADTG4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC139AGQNR NRND GQN 20 1000 TBD SNPB Level-1-240C-UNLIM SN74LVC139ANSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC139ANSRE4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC139ANSRG4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC139APW ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC139APWE4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC139APWG4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC139APWLE OBSOLETE TSSOP PW 16 SN74LVC139APWR ACTIVE TSSOP PW 16 BGA MI CROSTA R JUNI OR Pins Package Eco Plan (2) Qty 40 Green (RoHS & no Sb/Br) TBD TBD 2000 Green (RoHS & no Sb/Br) Addendum-Page 1 Lead/Ball Finish CU NIPDAU Call TI Call TI CU NIPDAU MSL Peak Temp (3) Level-1-260C-UNLIM Call TI Call TI Level-1-260C-UNLIM PACKAGE OPTION ADDENDUM www.ti.com 4-Jun-2007 Orderable Device Status (1) Package Type Package Drawing SN74LVC139APWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC139APWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC139APWT ACTIVE TSSOP PW 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC139APWTE4 ACTIVE TSSOP PW 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC139APWTG4 ACTIVE TSSOP PW 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC139ARGYR ACTIVE QFN RGY 16 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR SN74LVC139ARGYRG4 ACTIVE QFN RGY 16 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR SN74LVC139AZQNR ACTIVE ZQN 20 1000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM BGA MI CROSTA R JUNI OR Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 12-Jan-2008 TAPE AND REEL BOX INFORMATION Device Package Pins Site Reel Diameter (mm) Reel Width (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74LVC139ADBR DB 16 SITE 41 330 16 8.2 6.6 2.5 12 16 Q1 SN74LVC139ADGVR DGV 16 SITE 41 330 12 6.8 4.0 1.6 8 16 Q1 SN74LVC139ADR D 16 SITE 27 330 16 6.5 10.3 2.1 8 16 Q1 SN74LVC139AGQNR GQN 20 SITE 32 330 12 3.3 4.3 1.5 8 12 Q1 SN74LVC139AGQNR GQN 20 SITE 60 330 12 3.3 4.3 1.6 8 12 Q1 SN74LVC139ANSR NS 16 SITE 41 330 16 8.2 10.5 2.5 12 16 Q1 SN74LVC139APWR PW 16 SITE 41 330 12 7.0 5.6 1.6 8 12 Q1 SN74LVC139ARGYR RGY 16 SITE 41 180 12 3.8 4.3 1.5 8 12 Q1 SN74LVC139AZQNR ZQN 20 SITE 32 330 12 3.3 4.3 1.5 8 12 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com Device 12-Jan-2008 Package Pins Site Length (mm) Width (mm) Height (mm) SN74LVC139ADBR DB 16 SITE 41 346.0 346.0 33.0 SN74LVC139ADGVR DGV 16 SITE 41 346.0 346.0 29.0 28.58 SN74LVC139ADR D 16 SITE 27 342.9 345.9 SN74LVC139AGQNR GQN 20 SITE 32 346.0 346.0 29.0 SN74LVC139AGQNR GQN 20 SITE 60 342.9 338.1 20.64 SN74LVC139ANSR NS 16 SITE 41 346.0 346.0 33.0 SN74LVC139APWR PW 16 SITE 41 346.0 346.0 29.0 SN74LVC139ARGYR RGY 16 SITE 41 190.5 212.7 31.75 SN74LVC139AZQNR ZQN 20 SITE 32 346.0 346.0 29.0 Pack Materials-Page 2 MECHANICAL DATA MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,40 0,23 0,13 24 13 0,07 M 0,16 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 0°–8° 1 0,75 0,50 12 A Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,08 14 16 20 24 38 48 56 A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 DIM 4073251/E 08/00 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. Falls within JEDEC: 24/48 Pins – MO-153 14/16/20/56 Pins – MO-194 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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