SMAJ SERIES Surface Mount Transient Voltage Suppressor Voltage Range 5.0 to 170 Volts 400 Watts Peak Power SMA/DO-214AC Features For surface mounted application Low profile package Built-in strain relief Glass passivated junction Excellent clamping capability Fast response time: Typically less than 1.0ps from 0 volt to BV min. Typical IR less than 1μA above 10V High temperature soldering guaranteed: 260OC / 10 seconds at terminals Plastic material used carries Underwriters Laboratory Flammability Classification 94V-0 400 watts peak pulse power capability with a 10 x 1000 us waveform by 0.01% duty cycle (300W above 78V). .062(1.58) .050(1.27) .111(2.83) .090(2.29) .187(4.75) .160(4.06) .103(2.61) .078(1.99) .012(.31) .006(.15) Mechanical Data .008(.20) .004(.10) .056(1.41) .035(0.90) Case: Molded plastic Terminals: Solder plated Polarity: Indicated by cathode band Standard packaging: 12mm tape (EIA STD RS-481) .210(5.33) .195(4.95) Weight: 0.064 gram Dimensions in inches and (millimeters) Maximum Ratings and Electrical Characteristics Rating at 25℃ambient temperature unless otherwise specified. Type Number O Peak Power Dissipation at TA=25 C, Tp=1ms(Note 1) Steady State Power Dissipation Peak Forward Surge Current, 8.3 ms Single Half Sine-wave Superimposed on Rated Load (JEDEC method) (Note 2, 3) Maximum Instantaneous Forward Voltage at 25.0A for Unidirectional Only Operating and Storage Temperature Range Symbol PPK Pd Value Minimum 400 1 Units Watts Watts IFSM 40.0 Amps VF 3.5 Volts O TJ, TSTG -55 to + 150 C O Notes: 1. Non-repetitive Current Pulse Per Fig. 3 and Derated above TA=25 C Per Fig. 2. 2. Mounted on 0.2 x 0.2" (5 x 5mm) Copper Pads to Each Terminal. 3. 8.3ms Single Half Sine-wave or Equivalent Square Wave, Duty Cycle=4 Pulses Per Minute Maximum. Devices for Bipolar Applications 1. For Bidrectional Use C or CA Suffix forTypes SMAJ5.0 through Types SMAJ170. 2. Electrical Characteristics Apply in Both Directions. - 530 - RATINGS AND CHARACTERISTIC CURVES (SMAJ SERIES) FIG.1- PEAK PULSE POWER RATING CURVE FIG.2- PULSE DERATING CURVE Pppm, PEAK PULSE POWER, KW NON-REPETITIVE PULSE WAVEFORM SHOWN in FIG. 3 TA=250C 10 1.0 0.2" sq 5.0mm2 COPPER PAD AREAS 0.1 10 s 0.1 s 1.0 s 100 s 1.0ms 10ms PEAK PULSE POWER (Pppm) or CURRENT (lpp) DERATING IN PERCENTAGE, % 100 100 75 50 25 0 0 50 75 100 125 150 175 200 TA, AMBIENT TEMPERATURE. C FIG.3- PULSE WAVEFORM FIG.5- MAXIMUM NON-REPETITIVE PEAK FORWARD SURGE CURRENT 150 PEAK FORWARD SURGE CURRENT. (A) 50 PULSE WIDTH (td) is DEFINED tr=10 sec. AS THE POINT WHERE THE PEAK CURRENT DECAYS to 50% of lppm PEAK VALUE lppm 100 HALF VALUE- lpp 2 10/1000 sec. WAVEFORM AS DEFINED BY R.E.A. 50 td 0 0 8.3ms Single Half Sine Wave JEDEC Method TJ=TJ max. 40 30 20 10 0 1.0 2.0 3.0 4.0 100 10 1 t, TIME, ms NUMBER OF CYCLES AT 60Hz FIG.4- TYPICAL JUNCTION CAPACITANCE 10,000 Tj=25 0C f=1.0MHz Vsig=50mVp-p Cj, JUNCTION CAPACITANCE, pF lppm, PEAK PULSE CURRENT % 25 O td. PULSE WIDTH, sec. 1,000 MEASURED AT ZERO BIAS 100 MEASURED AT STAND-OFF VOLTAGE,VWM 10 1 10 V(BR), BREAKDOWN VOLTAGE. (V) - 531 - 100 200 ELECTRICAL CHARACTERISTICS (TA=25OC unless otherwise noted) Device SMAJ5.0 SMAJ5.0A SMAJ6.0 SMAJ6.0A SMAJ6.5 SMAJ6.5A SMAJ7.0 SMAJ7.0A SMAJ7.5 SMAJ7.5A SMAJ8.0 SMAJ8.0A SMAJ8.5 SMAJ8.5A SMAJ9.0 SMAJ9.0A SMAJ10 SMAJ10A SMAJ11 SMAJ11A SMAJ12 SMAJ12A SMAJ13 SMAJ13A SMAJ14 SMAJ14A SMAJ15 SMAJ15A SMAJ16 SMAJ16A SMAJ17 SMAJ17A SMAJ18 SMAJ18A SMAJ20 SMAJ20A SMAJ22 SMAJ22A SMAJ24 SMAJ24A SMAJ26 SMAJ26A SMAJ28 SMAJ28A SMAJ30 SMAJ30A SMAJ33 SMAJ33A SMAJ36 SMAJ36A SMAJ40 SMAJ40A SMAJ43 SMAJ43A Device Marking Code AD AE AF AG AH AK AL AM AN AP AQ AR AS AT AU AV AW AX AY AZ BD BE BF BG BH BK BL BM BN BP BQ BR BS BT BU BV BW BX BY BZ CD CE CF CG CH CK CL CM CN CP CQ CR CS CT Working Peak Reverse Voltage VWM(Volts) 5.0 5.0 6.0 6.0 6.5 6.5 7.0 7.0 7.5 7.5 8.0 8.0 8.5 8.5 9.0 9.0 10 10 11 11 12 12 13 13 14 14 15 15 16 16 17 17 18 18 20 20 22 22 24 24 26 26 28 28 30 30 33 33 36 36 40 40 43 43 Breakdown Voltage V(BR) (Volts) at IT Min. Max. 6.40 7.30 6.40 7.00 6.67 8.15 6.67 7.37 7.22 8.82 7.22 7.98 7.78 9.51 7.78 8.60 8.33 10.3 8.33 9.21 8.89 10.9 8.89 9.83 9.44 11.5 9.44 10.4 10.0 12.2 10.0 11.1 11.1 13.6 11.1 12.3 12.2 14.9 12.2 13.5 13.3 16.3 13.3 14.7 14.4 17.6 14.4 15.9 15.6 19.1 15.6 17.2 16.7 20.4 16.7 18.5 17.8 21.8 17.8 19.7 18.9 23.1 18.9 20.9 20.0 24.4 20.0 22.1 22.2 27.1 22.2 24.5 24.4 29.8 24.4 26.9 26.7 32.6 26.7 29.5 28.9 35.3 28.9 31.9 31.1 38.0 31.1 34.4 33.3 40.7 33.3 36.8 36.7 44.9 36.7 40.6 40.0 48.9 40.0 44.2 44.4 54.3 44.4 49.1 47.8 58.4 47.8 52.8 Test Current IT (mA) 10 10 10 10 10 10 10 10 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 - 532 - Maximum Clamping Voltage at IPPM VC(Volts) (Note 5) 9.6 9.2 11.4 10.3 12.3 11.2 13.3 12.0 14.3 12.9 15.0 13.6 15.9 14.4 16.9 15.4 18.8 17.0 20.1 18.2 22.0 19.9 23.8 21.5 25.8 23.2 26.9 24.4 28.8 26.0 30.5 27.6 32.2 29.2 35.8 32.4 39.4 35.5 43.0 38.9 46.6 42.1 50.0 45.4 53.5 48.4 59.0 53.3 64.3 58.1 71.4 64.5 76.7 69.4 Maximum Peak Pulse Surge Current IPPM (Note 5)(Amps) 41.7 43.5 35.1 38.8 32.5 35.7 30.1 33.3 28.0 31.0 26.7 29.4 25.2 27.8 23.7 26.0 21.3 23.5 19.9 22.0 18.2 20.1 16.8 18.6 15.5 17.2 14.9 16.4 13.9 15.4 13.1 14.5 12.4 13.7 11.2 12.3 10.2 11.3 9.3 10.3 8.6 9.5 8.0 8.8 7.5 8.3 6.8 7.5 6.2 6.9 5.6 6.2 5.2 5.8 Maximum Reverse Leakage at VWM ID (uA) 800 800 800 800 500 500 200 200 100 100 50.0 50.0 10.0 10.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 ELECTRICAL CHARACTERISTICS (TA=25OC unless otherwise noted) Device Device Marking Code Working Peak Reverse Voltage VWM(Volts) 45 45 48 48 51 51 54 54 58 58 60 60 64 64 70 70 75 75 78 78 85 85 90 90 100 100 110 110 120 120 130 130 150 150 160 160 170 170 Breakdown Voltage V(BR) (Volts) at IT Min. Max. 50.0 61.1 50.0 55.3 53.3 65.1 53.3 58.9 56.7 69.3 56.7 62.7 60.0 73.3 60.0 66.3 64.4 78.7 64.4 71.2 66.7 81.5 66.7 73.7 71.1 86.9 71.1 78.6 77.8 95.1 77.8 86.0 83.3 102 83.3 92.1 86.7 106 86.7 95.8 94.4 115 94.4 104 100 122 100 111 111 136 111 123 122 149 122 135 133 163 133 147 144 176 144 159 167 204 167 185 178 218 178 197 189 231 189 209 Test Current IT (mA) 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 SMAJ45 CU SMAJ45A CV SMAJ48 CW SMAJ48A CX SMAJ51 CY SMAJ51A CZ SMAJ54 RD SMAJ54A RE SMAJ58 RF SMAJ58A RG SMAJ60 RH SMAJ60A RK SMAJ64 RL SMAJ64A RM SMAJ70 RN SMAJ70A RP SMAJ75 RQ SMAJ75A RR SMAJ78 RS SMAJ78A RT SMAJ85 RU SMAJ85A RV SMAJ90 RW SMAJ90A RX SMAJ100 RY SMAJ100A RZ SMAJ110 SD SMAJ110A SE SMAJ120 SF SMAJ120A SG SMAJ130 SH SMAJ130A SK SMAJ150 SL SMAJ150A SM SMAJ160 SN SMAJ160A SP SMAJ170 SQ SMAJ170A SR Notes: O 1. Non-repetitive current pulse, per Fig. 3 and derated above TA=25 C per Fig. 2 2 2. Mounted on 5.0mm copper pads to each terminal O 3. Lead temperature at TL=75 C 4. Measured on 8.3ms single half sine-wave duty cycle=4 pulses per minutes maximum 5. Peak pulse power waveform is 10/1000 us 6. For BI-Directional devices having VR of 10 volts and under, the IR limit is double. - 533 - Maximum Clamping Voltage at IPPM VC(Volts) (Note 5) 80.3 72.7 85.5 77.4 91.1 82.4 96.3 87.1 103 93.6 107 96.8 114 103 125 113 134 121 139 126 151 137 160 146 179 162 196 177 214 193 231 209 266 243 287 259 304 275 Maximum Peak Pulse Surge Current IPPM (Note 5)(Amps) 5.0 5.5 4.7 5.2 4.4 4.9 4.2 4.6 3.9 4.3 3.7 4.1 3.5 3.9 3.2 3.5 3.0 3.3 2.9 3.2 2.0 2.2 1.9 2.1 1.7 1.9 1.6 1.7 1.4 1.6 1.3 1.5 1.1 1.3 1.0 1.2 1.0 1.1 Maximum Reverse Leakage at VWM ID (uA) 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 This device is designed specifically for APPLICATION NOTES: Recommended Pad Layout transiient voltage suppression from threats generated by ESD for board levelload switching components. The pad dimensions should be 0.010" longer than the contact size in the lead axis. This allows a solder fillet to form, see figure below. Contact factory for soldering methods. The wide leads assure a large surface contact for good heat disipation, and a low resistance path for surge current flow to ground. This series is designed to optimize board space and for use with surface mount technology automated assembly equipment. They can be easily mounted on printed circuit boards and ceramic substrates to protect sensitive components from transient voltage damage. Dimensions in inches and (millimeters) - 534 -