UTC-IC 50N06

UNISONIC TECHNOLOGIES CO., LTD
50N06
MOSFET
50 Amps, 60 Volts
N-CHANNEL POWER MOSFET
1
DESCRIPTION
TO-220
The UTC 50N06 is three-terminal silicon device with current
conduction capability of about 50A, fast switching speed. Low
on-state resistance, breakdown voltage rating of 60V, and max
threshold voltages of 4 volt.
It is mainly suitable electronic ballast, and low power switching
mode power appliances.
FEATURES
1
TO-220F
*Pb-free plating product number: 50N06L
* RDS(ON) = 23mΩ@VGS = 10 V
* Ultra low gate charge ( typical 30 nC )
* Low reverse transfer Capacitance ( CRSS = typical 80 pF )
* Fast switching capability
* 100% avalanche energy specified
* Improved dv/dt capability
SYMBOL
2.Drain
1.Gate
3.Source
ORDERING INFORMATION
Order Number
Normal
Lead Free Plating
50N06-TA3-T
50N06L-x-TA3-T
50N06-TF3-T
50N06L-x-TF3-T
Package
TO-220
TO-220F
Pin Assignment
1
2
3
G
D
S
G
D
S
Packing
Tube
Tube
50N06L-TA3-T
(1)Packing Type
(1) T: Tube
(2)Package Type
(2) TA3: TO-220, TF3: TO-220F
(3)Lead Plating
(3) L: Lead Free Plating, Blank: Pb/Sn
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Copyright © 2005 Unisonic Technologies Co., Ltd
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QW-R502-088,A
50N06
MOSFET
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
VDSS
VGSS
RATINGS
UNIT
60
V
±20
V
TC = 25℃
50
A
Continuous Drain Current
ID
TC = 100℃
35
A
Drain Current Pulsed (Note 1)
IDM
200
A
Single Pulsed Avalanche Energy (Note 2)
EAS
480
mJ
Repetitive Avalanche Energy (Note 1)
EAR
13
mJ
Peak Diode Recovery dv/dt (Note 3)
dv/dt
7
V/ns
Total Power Dissipation (TC = 25℃)
130
W
PD
0.9
W/℃
Derating Factor above 25℃
Operation Junction Temperature
TJ
-55 ~ +150
℃
Storage Temperature
TSTG
-55 ~ +150
℃
Note: Absolute maximum ratings are those values beyond which the device could be permanently damaged.
Absolute maximum ratings are stress ratings only and functional device operation is not implied.
Drain-Source Voltage
Gate to Source Voltage
THERMAL DATA
PARAMETER
Thermal Resistance, Junction-to-Case
Thermal Resistance, Case-to-Sink
Thermal Resistance, Junction-to-Ambient
SYMBOL
θJC
θCS
θJA
MIN
TYP
MAX
1.15
UNIT
°C/W
°C/W
°C/W
0.5
62.5
ELECTRICAL CHARACTERISTICS TC = 25℃ unless otherwise specified
PARAMETER
Off Characteristics
Drain-Source Breakdown Voltage
Breakdown Voltage Temperature
Coefficient
Drain-Source Leakage Current
Gate-Source Leakage Current
Gate-Source Leakage Reverse
On Characteristics
Gate Threshold Voltage
Static Drain-Source On-State
Resistance
Dynamic Characteristics
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Dynamic Characteristics
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge (Miller Charge)
SYMBOL
TEST CONDITIONS
BVDSS
VGS = 0 V, ID = 250 µA
ID = 250 µA,
△BVDSS/△TJ
Referenced to 25℃
VDS = 60 V, VGS = 0 V
IDSS
VDS = 48 V, TC = 125℃
VGS = 20V, VDS = 0 V
IGSS
VGS = -20V, VDS = 0 V
TYP
MAX
60
UNIT
V
0.07
V/℃
100
-100
µA
µA
nA
nA
4.0
V
1
VGS(TH)
VDS = VGS, ID = 250 µA
RDS(ON)
VGS = 10 V, ID = 25 A
18
23
mΩ
CISS
COSS
CRSS
VGS = 0 V, VDS = 25 V
f = 1MHz
900
430
80
1220
550
100
pF
pF
pF
40
100
90
80
30
9.6
10
60
200
180
160
40
ns
ns
ns
ns
nC
nC
nC
tD(ON)
tR
tD(OFF)
tF
QG
QGS
QGD
VDD = 30V, ID =25 A,
RG = 50Ω (Note 4, 5)
VDS = 48V, VGS = 10 V
ID = 50A, (Note 4, 5)
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MIN
2.0
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QW-R502-088,A
50N06
MOSFET
ELECTRICAL CHARACTERISTICS(Cont.)
PARAMETER
SYMBOL
TEST CONDITIONS
Source-Drain Diode Ratings and Characteristics
Diode Forward Voltage
VSD
IS = 50A, VGS = 0 V
Continuous Source Current
IS
MIN
TYP
Integral Reverse p-n Junction Diode in the
MAX
UNIT
1.5
V
50
MOSFET
D
A
Pulsed Source Current
ISM
200
G
S
Reverse Recovery Time
tRR
IS = 50A, VGS = 0 V
dIF / dt = 100 A/µs
Reverse Recovery Charge
QRR
Note 1. Repeativity rating: pulse width limited by junction temperature
2. L=5.6mH, IAS=50A, VDD=25V, RG=0Ω, Starting TJ=25℃
3. ISD≤50A, di/dt≤300A/µs, VDD≤BVDSS, Starting TJ=25℃
4. Pulse Test: Pulse Width≤300µs,Duty Cycle≤2%
5. Essentially independent of operating temperature.
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54
81
ns
µC
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MOSFET
TEST CIRCUITS AND WAVEFORMS
+
D.U.T.
VDS
+
-
L
RG
Driver
* dv/dt controlled by RG
* I SD controlled by pulse period
* D.U.T.-Device Under Test
Same Type
as D.U.T.
VGS
VDD
Fig. 1A Peak Diode Recovery dv/dt Test Circuit
VGS
(Driver)
P.W.
Period
D=
P. W.
Period
VGS= 10V
I FM, Body Diode Forward Current
ISD
(D.U.T.)
di/dt
IRM
Body Diode Reverse Current
Body Diode Recovery dv/dt
VDS
(D.U.T.)
VDD
Body Diode
Forward Voltage Drop
Fig. 1B Peak Diode Recovery dv/dt Waveforms
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50N06
MOSFET
TEST CIRCUITS AND WAVEFORMS (Cont.)
RL
VDS
VDS
90%
VDD
VGS
RG
VGS
D.U.T.
10V
10%
t D(ON )
Pulse Width ≤ 1μs
tD (OFF)
tF
tR
Duty Factor ≤0.1%
Fig. 2A Switching Test Circuit
Same Type
as D.U.T.
50kΩ
12V
0.2μF
Fig. 2B Switching Waveforms
QG
10V
0.3μF
VDS
QGS
QGD
VGS
DUT
VG
1mA
Charge
Fig. 3A Gate Charge Test Circuit
Fig. 3B Gate Charge Waveform
L
VDS
BVDSS
RG
10V
VDD
D.U.T.
tp
Fig. 4A Unclamped Inductive Switching Test Circuit
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IAS
tp
Time
Fig. 4B Unclamped Inductive Switching Waveforms
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TYPICAL CHARACTERISTICS
Transfer Characteristics
10-1
101
10 0
Drain-Source Voltage, VDS (V)
℃
1 50
Note:
1. VDS=50V
2. 250µs Pulse Test
100
2.0
1.5
1.0
VGS=10V
V GS=20V
0.5
0.0
0 20 40 60 80 100 120 140160180 200
3000
2500
2000
Capacitance Characteristics
(Non-Repetitive)
CISS=CGS +CGD (C DS=shorted)
COSS =C DS+C GD
CRSS =CGD
C ISS
1500
1000
500
0
COSS
*Note:
1. VGS=0V
2. f = 1MHz
CRSS
4 5
6 7
8 9 10
3
Gate-Source Voltage, VGS (V)
2
On State Current vs. Allowable Case
Temperature
On-Resistance Variation vs. Drain Current
and Gate Voltage
2.5
Drain Current, I D (A)
Capacitance (pF)
10 1
Reverse Drain Current, ISD (A)
Drain-Source On-Resistance, RDS(ON) (mΩ)
100
4.5V
25
℃
101
Drain Current, ID (A)
102
102
150℃
10 1
*Note:
1. VGS=0V
2. 250µs Test
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1.6
Gate Charge Characteristics
12
10
VDS=30V
8
6
VDS=48V
4
2
0
15 20 25 30 35
10
5
Drain-Source Voltage, VDC (V)
25℃
10 0
0.2 0.4 0.6 0.8 1.0 1.2 1.4
Source-Drain Voltage, VSD (V)
Gate-to-Source Voltage, VGS (V)
Drain Current, ID (A)
On-State Characteristics
V GS
Top: 15V
2
10
V
10
8 V
7 V
6 V
5 .5V
5V
Bottorm : 4.5V
0
*Note: ID=50A
5 10 15 20 25 30 35 40 45
Total Gate Charge, QG (nC)
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MOSFET
Breakdown Voltage Variation vs. Junction
Temperature
1.2
1.1
1.0
*Note:
1. VGS=0V
2. ID=250µA
0.9
0.8
-100 -50
0
50
150 200
100
Drain-Source On-Resistance, RDS(ON),
(Normalized)
Drain-Source Breakdown Voltage,
BVDSS(Normalized)
TYPICAL CHARACTERISTICS(Cont.)
3.0
2.5
2.0
1.5
1.0
0.0
50
100µs
1ms
10ms
10
10ms
*Note:
0
10 1. T =25℃
c
2. T J=150℃
-1 3. Single Pulse
10
1
0
1
2
10
10
10
10
Drain-Source Voltage, VDS (V)
Drain Current, ID (A)
Drain Current , ID,(A)
10 Operation in This
Area by RDS (on)
1
-50
0
50
100
150
Junction Temperature, T J (℃)
Maximum Drain Current vs. Case Temperature
Maximum Safe Operating
3
2
*Note:
1. VGS=10V
2. I D=25A
0.5
Junction Temperature, T J (℃)
10
On-Resistance Variation vs.
Junction Temperature
40
30
20
10
0
25
50
75
100
125
150
Case Temperature, T C (℃)
Thermal Response, ZθJC (t)
Transient Thermal
Response Curve
100 D=0.5
0.2
0.1
0.05
10-1
0.02
0.01
Single pulse
*Note:
1. ZθJ C (t ) = 1.42℃/W Max.
2. Duty Factor , D=t1/ t2
3. TJ -TC =PDM×ZθJ C (t)
-2
10 -5
0
101
10
10 -4 10-3 10-2 10-1 10
Square Wave Pulse Duration, t1 (sec)
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QW-R502-088,A
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MOSFET
UTC assumes no responsibility for equipment failures that result from using products at values that
exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or
other parameters) listed in products specifications of any and all UTC products described or contained
herein. UTC products are not designed for use in life support appliances, devices or systems where
malfunction of these products can be reasonably expected to result in personal injury. Reproduction in
whole or in part is prohibited without the prior written consent of the copyright owner. The information
presented in this document does not form part of any quotation or contract, is believed to be accurate
and reliable and may be changed without notice.
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