UTC-IC 70N06T-TF3-L

UNISONIC TECHNOLOGIES CO., LTD
70N06
MOSFET
70 Amps, 60 Volts
N-CHANNEL POWER MOSFET
1
DESCRIPTION
TO-220
The UTC 70N06 is n-channel enhancement mode
power field effect transistors with stable off-state
characteristics, fast switching speed, low thermal
resistance, usually used at telecom and computer
application.
1
TO-220F
FEATURES
*Pb-free plating product number: 70N06L
* RDS(ON) = 15mΩ@VGS = 10 V
* Ultra low gate charge ( typical 90 nC )
* Low reverse transfer Capacitance ( CRSS = typical 80 pF )
* Fast switching capability
* 100% avalanche energy specified
* Improved dv/dt capability
SYMBOL
2.Drain
1.Gate
3.Source
ORDERING INFORMATION
Order Number
Normal
Lead Free Plating
70N06-TA3-T
70N06L-TA3-T
70N06-TF3-T
70N06L-TF3-T
Package
TO-220
TO-220F
Pin Assignment
1
2
3
G
D
S
G
D
S
Packing
Tube
Tube
70N06L-TA3-T
(1)Packing Type
(1) T: Tube
(2)Package Type
(2) TA3: TO-220, TF3: TO-220F
(3)Lead Plating
(3) L: Lead Free Plating, Blank: Pb/Sn
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Copyright © 2005 Unisonic Technologies Co., LTD
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QW-R502-089,A
70N06
MOSFET
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
VDSS
VGSS
RATINGS
UNIT
60
V
±20
V
TC = 25℃
70
A
Continuous Drain Current
ID
TC = 100℃
56
A
Drain Current Pulsed (Note 1)
IDM
280
A
Single Pulsed Avalanche Energy (Note 2)
EAS
600
mJ
Repetitive Avalanche Energy (Note 1)
EAR
20
mJ
Peak Diode Recovery dv/dt (Note 3)
dv/dt
10
V/ns
Total Power Dissipation (TC = 25℃)
200
W
PD
1.4
W/℃
Derating Factor above 25℃
℃
Operation Junction Temperature
TJ
-55 ~ +150
℃
Storage Temperature
TSTG
-55 ~ +150
Note: Absolute maximum ratings are those values beyond which the device could be permanently damaged.
Absolute maximum ratings are stress ratings only and functional device operation is not implied.
Drain-Source Voltage
Gate to Source Voltage
THERMAL DATA
PARAMETER
Thermal Resistance, Junction-to-Case
Thermal Resistance, Case-to-Sink
Thermal Resistance, Junction-to-Ambient
SYMBOL
θJC
θCS
θJA
MIN
TYP
MAX
1.2
UNIT
°C/W
°C/W
°C/W
0.5
62.5
ELECTRICAL CHARACTERISTICS (TC =25℃, unless otherwise specified)
PARAMETER
Off Characteristics
Drain-Source Breakdown Voltage
Breakdown Voltage Temperature
Coefficient
SYMBOL
BVDSS
TEST CONDITIONS
VGS = 0 V, ID = 250 µA
MIN
Gate-Source Leakage Current
Gate-Source Leakage Reverse
On Characteristics
Gate Threshold Voltage
Static Drain-Source On-State
Resistance
Dynamic Characteristics
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Switching Characteristics
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge (Miller Charge)
IDSS
IGSS
V
0.08
VDS = 60 V, VGS = 0 V
VDS = 60 V, VGS = 0 V,
TJ = 150℃
VGS = 20V, VDS = 0 V
VGS = -20V, VDS = 0 V
1
µA
10
µA
100
-100
nA
nA
4.0
V
15
mΩ
VDS = VGS, ID = 250 µA
RDS(ON)
VGS = 10 V, ID = 35 A
12
CISS
COSS
CRSS
VGS = 0 V, VDS = 25 V
f = 1MHz
3300
530
80
pF
pF
pF
12
79
80
52
90
20
30
ns
ns
ns
ns
nC
nC
nC
tD(ON)
tR
tD(OFF)
tF
QG
QGS
QGD
VDD = 30V, ID =70 A,
VGS=10V, (Note 4, 5)
VDS = 60V, VGS = 10 V
ID = 48A, (Note 4, 5)
2.0
V/℃
VGS(TH)
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MAX UNIT
60
△BVDSS/△TJ ID = 1mA, Referenced to 25℃
Drain-Source Leakage Current
TYP
140
35
45
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QW-R502-089,A
70N06
MOSFET
ELECTRICAL CHARACTERISTICS(Cont.)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
Source-Drain Diode Ratings and Characteristics
Diode Forward Voltage
VSD
IS = 70A, VGS = 0 V
Integral Reverse p-n Junction Diode in
the MOSFET
Continuous Source Current
IS
TYP
MAX UNIT
1.4
V
70
D
A
Pulsed Source Current
ISM
280
G
S
Reverse Recovery Time
tRR
IS = 70A, VGS = 0 V
dIF / dt = 100 A/µs
Reverse Recovery Charge
QRR
Note 1. Repeativity rating: pulse width limited by junction temperature
2. L=19.5mH, IAS=70A, RG=20Ω, Starting TJ=25℃
3. ISD≤48A, di/dt≤300A/µs, VDD≤BVDSS, Starting TJ=25℃
4. Pulse Test: Pulse Width≤300µs,Duty Cycle≤2%
5. Essentially independent of operating temperature.
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90
300
ns
µC
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QW-R502-089,A
70N06
MOSFET
TEST CIRCUITS AND WAVEFORMS
+
D.U.T.
VDS
+
-
L
RG
Driver
* dv/dt controlled by RG
* I SD controlled by pulse period
* D.U.T.-Device Under Test
Same Type
as D.U.T.
VGS
VDD
Fig. 1A Peak Diode Recovery dv/dt Test Circuit
VGS
(Driver)
P.W.
Period
D=
P. W.
Period
VGS= 10V
I FM, Body Diode Forward Current
ISD
(D.U.T.)
di/dt
IRM
Body Diode Reverse Current
Body Diode Recovery dv/dt
VDS
(D.U.T.)
VDD
Body Diode
Forward Voltage Drop
Fig. 1B Peak Diode Recovery dv/dt Waveforms
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QW-R502-089,A
70N06
MOSFET
TEST CIRCUITS AND WAVEFORMS (Cont.)
RL
VDS
VDS
90%
VDD
VGS
RG
VGS
D.U.T.
10V
10%
t D(ON )
Pulse Width ≤ 1μs
tD (OFF)
tF
tR
Duty Factor ≤0.1%
Fig. 2A Switching Test Circuit
Same Type
as D.U.T.
50kΩ
12V
0.2μF
Fig. 2B Switching Waveforms
QG
10V
0.3μF
VDS
QGS
QGD
VGS
DUT
VG
1mA
Charge
Fig. 3A Gate Charge Test Circuit
Fig. 3B Gate Charge Waveform
L
VDS
BVDSS
RG
10V
VDD
D.U.T.
tp
Fig. 4A Unclamped Inductive Switching Test Circuit
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IAS
tp
Time
Fig. 4B Unclamped Inductive Switching Waveforms
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QW-R502-089,A
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MOSFET
TYPICAL CHARACTERISTICS
Transfer Characteristics
14
VGS=10V
13
12
0
10 20 30 40 50 60 70 80 90 100
Drain Current, I D (A)
6000
Capacitance (pF)
1 50
°С
25
°С
Note :
1 . VDS =25 V
2. 20µs Pulse Test
2
On-Resistance Variation vs. Drain
Current and Gate Voltage
15
11
101
100
101
100
Drain-Source Voltage , VDS (V)
5000
4000
Capacitance Characteristics
(Non-Repetitive)
C ISS=C GS+CGD (CDS=shorted)
C OSS =CDS+CGD
C RSS=C GD
C ISS
3000
2000
1000
COSS
0
CRSS
*Note:
1. VGS=0V
2. f = 1MHz
102
150℃
10 1
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25℃
*Note:
1. VGS=0V
2. 250µs Test
10 0
0.2 0.4 0.6 0.8 1.0 1.2 1.4
Source-Drain Voltage, VSD (V)
1.6
Gate Charge Characteristics
12
10
8
VDS=38V
6
VDS=60V
4
2
0
5
10 15 20 25 30 35
Drain-Source Voltage, VDC (V)
3
5
7
9 10
4
6
8
Gate -Source Voltage , VGS (V)
Reverse Drain Current vs. Allowable
Case Temperature
Reverse Drain Current, ISD (A)
Drain-Source On-Resistance, RDS(ON) (mΩ)
100 -1
10
Drain Current, ID (A)
4 .5V
101
102
Gate-to-Source Voltage, VGS (V)
Drain Current, ID (A)
On -State Characteristics
V GS
Top : 15V
10 V
8 V
7 V
2
10
6 V
5 .5V
5V
Bottorm : 4.5V
0
*Note: ID=48A
5 10 15 20 25 30 35 40 45
Total Gate Charge, Q G (nC)
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QW-R502-089,A
70N06
MOSFET
Breakdown Voltage Variation vs. Junction
Temperature
1.2
1.1
1.0
*Note:
1. VGS=0V
2. ID=250µA
0.9
0.8
-100
-50
0
50
100
150 200
Drain-Source On-Resistance, RDS(ON),
(Normalized)
Drain-Source Breakdown Voltage,
BVDSS(Normalized)
TYPICAL CHARACTERISTICS
3.0
2.5
2.0
1.5
1.0
0.5
0.0
Junction Temperature, T J (℃)
10ms
1ms
DC
*Note:
1. T c=25℃
2. T J=150℃
3. Single Pulse
1
10
100
1000
Drain-Source Voltage, VD (V)
Drain Current, ID (A)
Drain Current , ID,(A)
60
100µs
0.1
-50
0
50
100
150
Junction Temperature, T J (℃)
70
100 Operation in This
Area by RDS (on)
1
*Note:
1. VGS=10V
2. I D=35A
Maximum Drain Current vs. Case
Temperature
Maximum Safe Operating
10
On-Resistance Variation vs.
Junction Temperature
50
40
30
20
10
0
25
50
100
125
75
Case Temperature, T C (℃)
150
Thermal Response, ZθJC (t)
Transient Thermal Response Curve
1
D=0.5
0.2
0.1
0.1
0.05
0.02
0.01
0.01
Single pulse
*Note:
1. ZθJ C (t) = 0.88℃/W Max.
2. Duty Factor , D=t1/t2
3. TJ -TC =PDM×ZθJ C (t)
10
1
1E-5 1E-4 1E-3 0.01
0.1
Square Wave Pulse Duration, t 1 (sec)
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QW-R502-089,A
70N06
MOSFET
UTC assumes no responsibility for equipment failures that result from using products at values that
exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or
other parameters) listed in products specifications of any and all UTC products described or contained
herein. UTC products are not designed for use in life support appliances, devices or systems where
malfunction of these products can be reasonably expected to result in personal injury. Reproduction in
whole or in part is prohibited without the prior written consent of the copyright owner. The information
presented in this document does not form part of any quotation or contract, is believed to be accurate
and reliable and may be changed without notice.
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