BITECH LR2010

Value
Low
Value
Flat
LowLow
Value
FlatFlat
Resistor
Chip
Resistor
ChipChip
Resistor
Welwyn Components
Welwyn Components
LRC/LRF Series
LRC/LRF Series
LRC/LRF Series
Standard
2512, 2010
and2010
1206
sizes
s Standard
2512,
and
1206 sizes
s Resistance
Standard
2512,
2010
and
1206
sizes
values
down
to
0.003
s Resistance values down toohms
0.003 ohms
Leach
resistant
solder-plated
copper
s Resistance
values
downsolder-plated
to 0.003 ohms
s Leach
resistant
copper
s wrap-around
termination
wrap-around
termination
Leach resistant solder-plated copper
AEC-Q200
Qualified
s Low
inductance
- less than 0.2nH
wrap-around
termination
·
·
·
·
s
s
s AEC-Q200
Qualified
Low inductance
- less
than 0.2nH
AEC-Q200 Qualified
Electrical Data
Electrical
Data
Power rating at 70°C
watts
LR1206
LR2010
LR2512
0.5
1.0
1.5/2.0*
ohms LR1206
0R010 to 1R
Resistance range
CeR
Resistance ranTg
actory1Rfor value belo0w
ohms ppm/°0CR010 to 1R ±100 (Con0taRc0t 0f3
R000.0
35t0o o1hRms)
an
Dielectric withRsetsaisntd
incge vtoolletraagnece
ppm/°C
°C
%
mm2
Resistance tolPad
eranand
ce trace area for max power rating @ 70°C
Temperature*2risWatts
e at ratwith
ed pototal
wer solder pad and trace size of 300 °mm
C
Pad and trace area for max power rating @ 70°C
mm
Physical Data
*2 Watts with total solder pad and trace size of 300 mm
200
2
2
200
1.5/2.0*200
≤R005
205%,
0 >R005 1, 2, 5% 200
% 200
volts
Temperature rise at rated power
TCR
1.0
LR2512
0R003 to 1R
watts
volts
0.5
LR2010
0R003 to 1R
le0c°trCic withstanding voltage
Power rating Daite7
±100 (C4o0ntact factory for valu8e0below 0.050 ohms) 90
30 ≤R005 5%, >R005 1,
302, 5%
100
40
80
90
30
30
100
2
Dimensions (mm)
Physical Data
Size
L
W
LR1206
3.20±0.305
1.63±0.203
0.8
0.48±0.25
0.48±0.25
Dimensions LR2010
(mm)
5.23±0.38
2.64±0.25
0.8
0.48±0.25
0.48±0.25
0.8
D10.48±0.25
0.8
D 0.48±0.25
0.48±0.25
0.48±0.25
0.8
0.48±0.25
0.48±0.25
0.48±0.25
0.48±0.25
Size
LR2512
L
W
6.50±0.38
H (max)
3.25±0.25
LR1206
3.20±0.305
1.63±0.203
LR2010
5.23±0.38
2.64±0.25
LR2512
6.50±0.38
3.25±0.25
H (max)
LR 1206 / 2010 / 2512
W
L0.8
W
D
D
D1
LR 1206 / 2010 / 2512
H
H
D
L
Solder Plating
Nickel Barrier Layer
Copper Wraparound
Termination
Alumina Substrate
Protective Overcoat
Resistive Element
Copper Termination
Protective Overcoat
Resistive Element
Copper Termination
Solder Plating
Nickel Barrier Layer
Copper Wraparound
Termination
Alumina Substrate
General Note
Welwyn Components reserves the right to make changes in product specification without notice or liability.
All information is subject to Welwyn’s own data and is considered accurate at time of going to print.
© Welwyn Components Limited · Bedlington, Northumberland NE22 7AA, UK
A subsidiary of
TT electronics plc
04.10
Telephone: +44 (0) 1670 822181 · Facsimile: +44 (0) 1670 829465 · Email: info@welwyn-tt.com · Website: www.welwyn-tt.com
General
GeneralNote
Note
TT
electronics
reserves the
right the
to make
productinspecification
without notice
or liability.
Welwyn
Components
reserves
right changes
to make in
changes
product specification
without
notice or liability.
All
electronics’
is considered
accurate
at time
of going
to print.
Allinformation
informationisissubject
subjecttotoTTWelwyn’s
ownown
datadata
andand
is considered
accurate
at time
of going
to print.
Welwyn
Components
Limited · Bedlington, Northumberland NE22 7AA, UK
©©TT
electronics
plc
23
A subsidiary of
www.bitechnologies.com www.irctt.com www.welwyn-tt.com
TT electronics plc
Telephone: +44 (0) 1670 822181 · Facsimile: +44 (0) 1670 829465 · Email: info@welwyn-tt.com · Website: www.welwyn-tt.com
04.10
03.13
Low
FlatFlat
LowValue
Value
Chip
ChipResistor
Resistor
Welwyn Components
LRC/LRF Series
LRC/LRF
Series
Dimensions (mm)
A
A
B
C
LR1206
2.0
4.0
1.25
LR2010
3.05
6.5
1.5
LR2512
3.7
7.75
1.5
B
C
Typ.
(%)
100
R% 0.5
0.2
80
R% 0.25
0.1
Max.
(add R05)
JESD22 Method JA-104
(@1R0)
4
Temperature Cycling
6
Moisture Resistance MIL-STD-202 Method 106
R% 0.5
0.2
7
Biased Humidity MIL-STD-202 Method 103
R% 0.5
0.2
8 Operational Life (Cyclic Load) MIL-STD-202 Method 108
R%
14
R% 0.5
Vibration MIL-STD-202 Method 204
15 Resistance to Soldering Heat MIL-STD-202 Method 210
16
1
0.5
0.05
R% 0.25 0.05
R% 0.25
Thermal Shock MIL-STD-202 Method 107
J-STD-002
60
40
20
0
25
Solderability
21
Board Flex
AEC-Q200-005
R% 0.5
0.2
22
Terminal Strength
AEC-Q200-006
R% 0.25
0.1
70
150 (°C)
Ambient temperature
0.1
18
>95% coverage
6.25 x Pr for 2s
R% 0.5
Low Temperature Storage
-65°C for 100 hours
R% 0.5
Leach Resistance
Solder dip at 250°C
90s minimum
Short Term Overload
Power Rating
ref
3
AEC-Q200 Table 7
Method
Test
High Temp. Exposure MIL-STD-202 Method 108
LRC 25
12 2
1 watt
LRC 20
10 1
0.w
5 at
wat
t t
LRC 12
06 0.5
25ww
atat
tt
Note:
1. Although 2010 and 2512 sizes have passed temperature cycling and thermal shock, it is in general not recommended that ceramic
chips this large be used on FR4 in a severe temperature cycle environment due to the possibility of solder joint fatigue.
2. Full AEC-Q200 qualification applies to ohmic values
≥R01.
Ordering Procedure
Example: LRF2512 at 10 milliohms (hence flip-chip mounted) and 2% tolerance on a reel of 1800 pieces
LRF2512–R01GW
Type
Mounting
F
Conventional (element up)
Flip-chip (element down)
Values > R025
Values < R025
Size
Value (use IEC62 code)
Tolerance (use IEC62 code)
F
G
J
1%
2%
5%
Packing
W
T1
Tape
1206 or 2010
2512
All sizes
3000/reel
1800/reel
1000/reel
Standard
© Welwyn Components Limited Bedlington, Northumberland NE22 7AA, UK
General Note
Telephone:
+44 (0) 1670 822181 · Facsimile: +44 (0) 1670 829465 · Email: info@welwyn-tt.com · Website: www.welwyn-tt.com
TT electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT electronics’ own data and is considered accurate at time of going to print.
04.10
www.bitechnologies.com www.irctt.com www.welwyn-tt.com
© TT electronics plc
03.13