Value Low Value Flat LowLow Value FlatFlat Resistor Chip Resistor ChipChip Resistor Welwyn Components Welwyn Components LRC/LRF Series LRC/LRF Series LRC/LRF Series Standard 2512, 2010 and2010 1206 sizes s Standard 2512, and 1206 sizes s Resistance Standard 2512, 2010 and 1206 sizes values down to 0.003 s Resistance values down toohms 0.003 ohms Leach resistant solder-plated copper s Resistance values downsolder-plated to 0.003 ohms s Leach resistant copper s wrap-around termination wrap-around termination Leach resistant solder-plated copper AEC-Q200 Qualified s Low inductance - less than 0.2nH wrap-around termination · · · · s s s AEC-Q200 Qualified Low inductance - less than 0.2nH AEC-Q200 Qualified Electrical Data Electrical Data Power rating at 70°C watts LR1206 LR2010 LR2512 0.5 1.0 1.5/2.0* ohms LR1206 0R010 to 1R Resistance range CeR Resistance ranTg actory1Rfor value belo0w ohms ppm/°0CR010 to 1R ±100 (Con0taRc0t 0f3 R000.0 35t0o o1hRms) an Dielectric withRsetsaisntd incge vtoolletraagnece ppm/°C °C % mm2 Resistance tolPad eranand ce trace area for max power rating @ 70°C Temperature*2risWatts e at ratwith ed pototal wer solder pad and trace size of 300 °mm C Pad and trace area for max power rating @ 70°C mm Physical Data *2 Watts with total solder pad and trace size of 300 mm 200 2 2 200 1.5/2.0*200 ≤R005 205%, 0 >R005 1, 2, 5% 200 % 200 volts Temperature rise at rated power TCR 1.0 LR2512 0R003 to 1R watts volts 0.5 LR2010 0R003 to 1R le0c°trCic withstanding voltage Power rating Daite7 ±100 (C4o0ntact factory for valu8e0below 0.050 ohms) 90 30 ≤R005 5%, >R005 1, 302, 5% 100 40 80 90 30 30 100 2 Dimensions (mm) Physical Data Size L W LR1206 3.20±0.305 1.63±0.203 0.8 0.48±0.25 0.48±0.25 Dimensions LR2010 (mm) 5.23±0.38 2.64±0.25 0.8 0.48±0.25 0.48±0.25 0.8 D10.48±0.25 0.8 D 0.48±0.25 0.48±0.25 0.48±0.25 0.8 0.48±0.25 0.48±0.25 0.48±0.25 0.48±0.25 Size LR2512 L W 6.50±0.38 H (max) 3.25±0.25 LR1206 3.20±0.305 1.63±0.203 LR2010 5.23±0.38 2.64±0.25 LR2512 6.50±0.38 3.25±0.25 H (max) LR 1206 / 2010 / 2512 W L0.8 W D D D1 LR 1206 / 2010 / 2512 H H D L Solder Plating Nickel Barrier Layer Copper Wraparound Termination Alumina Substrate Protective Overcoat Resistive Element Copper Termination Protective Overcoat Resistive Element Copper Termination Solder Plating Nickel Barrier Layer Copper Wraparound Termination Alumina Substrate General Note Welwyn Components reserves the right to make changes in product specification without notice or liability. All information is subject to Welwyn’s own data and is considered accurate at time of going to print. © Welwyn Components Limited · Bedlington, Northumberland NE22 7AA, UK A subsidiary of TT electronics plc 04.10 Telephone: +44 (0) 1670 822181 · Facsimile: +44 (0) 1670 829465 · Email: [email protected] · Website: www.welwyn-tt.com General GeneralNote Note TT electronics reserves the right the to make productinspecification without notice or liability. Welwyn Components reserves right changes to make in changes product specification without notice or liability. All electronics’ is considered accurate at time of going to print. Allinformation informationisissubject subjecttotoTTWelwyn’s ownown datadata andand is considered accurate at time of going to print. Welwyn Components Limited · Bedlington, Northumberland NE22 7AA, UK ©©TT electronics plc 23 A subsidiary of www.bitechnologies.com www.irctt.com www.welwyn-tt.com TT electronics plc Telephone: +44 (0) 1670 822181 · Facsimile: +44 (0) 1670 829465 · Email: [email protected] · Website: www.welwyn-tt.com 04.10 03.13 Low FlatFlat LowValue Value Chip ChipResistor Resistor Welwyn Components LRC/LRF Series LRC/LRF Series Dimensions (mm) A A B C LR1206 2.0 4.0 1.25 LR2010 3.05 6.5 1.5 LR2512 3.7 7.75 1.5 B C Typ. (%) 100 R% 0.5 0.2 80 R% 0.25 0.1 Max. (add R05) JESD22 Method JA-104 (@1R0) 4 Temperature Cycling 6 Moisture Resistance MIL-STD-202 Method 106 R% 0.5 0.2 7 Biased Humidity MIL-STD-202 Method 103 R% 0.5 0.2 8 Operational Life (Cyclic Load) MIL-STD-202 Method 108 R% 14 R% 0.5 Vibration MIL-STD-202 Method 204 15 Resistance to Soldering Heat MIL-STD-202 Method 210 16 1 0.5 0.05 R% 0.25 0.05 R% 0.25 Thermal Shock MIL-STD-202 Method 107 J-STD-002 60 40 20 0 25 Solderability 21 Board Flex AEC-Q200-005 R% 0.5 0.2 22 Terminal Strength AEC-Q200-006 R% 0.25 0.1 70 150 (°C) Ambient temperature 0.1 18 >95% coverage 6.25 x Pr for 2s R% 0.5 Low Temperature Storage -65°C for 100 hours R% 0.5 Leach Resistance Solder dip at 250°C 90s minimum Short Term Overload Power Rating ref 3 AEC-Q200 Table 7 Method Test High Temp. Exposure MIL-STD-202 Method 108 LRC 25 12 2 1 watt LRC 20 10 1 0.w 5 at wat t t LRC 12 06 0.5 25ww atat tt Note: 1. Although 2010 and 2512 sizes have passed temperature cycling and thermal shock, it is in general not recommended that ceramic chips this large be used on FR4 in a severe temperature cycle environment due to the possibility of solder joint fatigue. 2. Full AEC-Q200 qualification applies to ohmic values ≥R01. Ordering Procedure Example: LRF2512 at 10 milliohms (hence flip-chip mounted) and 2% tolerance on a reel of 1800 pieces LRF2512–R01GW Type Mounting F Conventional (element up) Flip-chip (element down) Values > R025 Values < R025 Size Value (use IEC62 code) Tolerance (use IEC62 code) F G J 1% 2% 5% Packing W T1 Tape 1206 or 2010 2512 All sizes 3000/reel 1800/reel 1000/reel Standard © Welwyn Components Limited Bedlington, Northumberland NE22 7AA, UK General Note Telephone: +44 (0) 1670 822181 · Facsimile: +44 (0) 1670 829465 · Email: [email protected] · Website: www.welwyn-tt.com TT electronics reserves the right to make changes in product specification without notice or liability. All information is subject to TT electronics’ own data and is considered accurate at time of going to print. 04.10 www.bitechnologies.com www.irctt.com www.welwyn-tt.com © TT electronics plc 03.13