TI PTH08T240WAH

PTH08T240W
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SLTS264A – NOVEMBER 2005 – REVISED MARCH 2006
10-A, 4.5-V to 14-V INPUT, NON-ISOLATED,
WIDE-OUTPUT, ADJUSTABLE POWER MODULE WITH TURBOTRANS™
FEATURES
•
•
•
•
•
•
•
•
•
•
•
•
•
Up to 10-A Output Current
4.5-V to 14-V Input Voltage
Wide-Output Voltage Adjust (0.69 V to 5.5 V)
±1.5% Total Output Voltage Variation
Efficiencies up to 96%
Output Overcurrent Protection
(Nonlatching, Auto-Reset)
Operating Temperature: –40°C to 85°C
Safety Agency Approvals:
– UL 1950, CSA 22.2 950, EN60950 VDE
(Pending)
On/Off Inhibit
Differential Output Voltage Remote Sense
Adjustable Undervoltage Lockout
SmartSync Technology
Auto-Track™ Sequencing
•
•
TurboTrans™ Technology
Designed to meet Ultra-Fast Transient
Requirements up to 300 A/µs
APPLICATIONS
•
•
•
Complex Multi-Voltage Systems
Microprocessors
Bus Drivers
DESCRIPTION
The PTH08T240W is a high-performance 10-A rated, non-isolated power module. This module represents the
2nd generation of the PTH series power modules which includes a reduced footprint and additional features.
Operating from an input voltage range of 4.5 V to 14 V, the PTH08T240W requires a single resistor to set the
output voltage to any value over the range, 0.69 V to 5.5 V. The wide input voltage range makes the
PTH08T240W particularly suitable for advanced computing and server applications that utilize a loosely
regulated 8-V to 12-V intermediate distribution bus. Additionally, the wide input voltage range increases design
flexibility by supporting operation with tightly regulated 5-V, 8-V, or 12-V intermediate bus architectures.
The module incorporates a comprehensive list of features. Output over-current and over-temperature shutdown
protects against most load faults. A differential remote sense ensures tight load regulation. An adjustable
under-voltage lockout allows the turn-on voltage threshold to be customized. Auto-Track™sequencing is a
popular feature that greatly simplifies the simultaneous power-up and power-down of multiple modules in a
power system.
The PTH08T240W includes new patent pending technologies, TurboTrans™ and SmartSync. The TurboTrans
feature optimizes the transient response of the regulator while simultaneously reducing the quantity of external
output capacitors required to meet a target voltage deviation specification. Additionally, for a target output
capacitor bank, TurboTrans can be used to significantly improve the regulators transient response by reducing
the peak voltage deviation. SmartSync allows for switching frequency synchronization of multiple modules, thus
simplifying EMI noise suppression tasks and/or reducing input capacitor RMS current requirements.
The module uses double-sided surface mount construction to provide a low profile and compact footprint.
Package options include both through-hole and surface mount configurations that are lead (Pb) - free and RoHS
compatible.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Auto-Track, TurboTrans, TMS320 are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2005–2006, Texas Instruments Incorporated
PTH08T240W
www.ti.com
SLTS264A – NOVEMBER 2005 – REVISED MARCH 2006
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
SmartSync
Track
TurboTranst
10
VI
2
Track
1
SYNC
TT
+Sense
VI
VO
PTH08T240W
Inhibit
11
INH/UVLO
+
RUVLO
1%
0.05 W
(Opional)
CI
220 µF
(Required)
CI2
22 µF
(Optional)
RTT
1%
0.05 W
(Optional)
9
−Sense
GND
GND
VOAdj
3
4
8
6
+Sense
5
VO
7
+
RSET
1%
0.05 W
(Required)
L
O
A
D
CO
220 µF
(Required)
−Sense
GND
GND
UDG−06005
A.
RSET required to set the output voltage to a value higher than 0.69 V. See Electrical Characteristics table.
B.
When VO > 3.3 V the minimum required output capacitance increases to 330 µF.
ORDERING INFORMATION
For the most current package and ordering information, see the Package Option Addendum at the end of this datasheet, or see the TI
website at www.ti.com.
ENVIRONMENTAL AND ABSOLUTE MAXIMUM RATINGS
(Voltages are with respect to GND)
UNIT
VI
Input voltage
TA
Operating temperature range Over VI range
Twave
Wave soldering temperature
Treflow
Solder reflow temperature
Tstg
Storage temperature
Mechanical shock
Mechanical vibration
Track
–0.3 to VI + 0.3
Surace temperature of module body or pins for
5 seconds maximum.
Surface temperature of module body or pins
(1)
2
PTH08T240WAH
235
PTH08T240WAD
260
PTH08T240WAS
235 (1)
PTH08T240WAZ
260 (1)
°C
–40 to 125
Per Mil-STD-883D, Method 2002.3 1 mssec, 1/2 sine, mounted
Mil-STD-883D, Method 2007.2 20-2000 Hz
Weight
Flammability
V
–40 to 85
TBD
Suffix AH and AD
TBD
Suffix AS and AZ
TBD
5
G
grams
Meets UL94V-O
During reflow of surface mount package version do not elevate peak temperature of the module, pins or internal components above the
stated maximum.
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ELECTRICAL CHARACTERISTICS
TA = 25°C, VI = 5 V, VO = 3.3 V, CI = 220 µF, CO = 220 µF, and IO = IO max (unless otherwise stated)
PARAMETER
Output current
IO
TEST CONDITIONS
0.7 V ≤ VO ≤ 3.6 V
VI
Input voltage range
Over IO range
VOADJ
Output voltage adjust range
Over IO range
MIN
25°C, natural convection
0.69 ≤ VO≤ 1.2
4.5
11 ×
VO (1)
1.2 < VO≤ 3.6
4.5
14
3.6 < VO≤ 5.5
VO + 2
14
0.69
5.5
ILIM
±0.5
ttrTT
±0.3
%Vo
±3
mV
Load regulation
Over IO range
±2
Total output variation
Includes set-point, line, load, –40°C ≤ TA ≤ 85°C
IO = 10 A
94%
RSET = 2.38 kΩ, VO = 2.5 V
92%
RSET = 4.78 kΩ, VO = 1.8 V
90%
RSET = 7.09 kΩ, VO = 1.5 V
88%
RSET = 12.1 kΩ, VO = 1.2 V
87%
RSET = 20.8 kΩ, VO = 1.0 V
85%
%Vo
20-MHz bandwidth
10
mVPP
Overcurrent threshold
Reset, followed by auto-recovery
20
A
Transient response
2.5 A/µs load step
50 to 100% IOmax
VO = 2.5 V
w/o Turbotrans
CO = 220 µF, Type C
Recovery time
35
µs
VO over/undershoot
165
mV
w/ TurboTrans
CO = 2000 µF, Type C,
RTT = 0 Ω
Recovery time
130
µs
VO over/undershoot
30
mV
dVtrack/dt
Track slew rate capability
CO ≤ CO (max)
UVLOADJ
VI increasing, RUVLO = OPEN
Adjustable Under-voltage lockout
Vi decreasing, RUVLO = OPEN
(pin 11)
Hysterisis, RUVLO≤ 52.3 kΩ
–130 (3)
1
4.3
4.0
Inhibit control (pin 11)
Input low voltage (VIL)
Input standby current
Inhibit (pin 11) to GND, Track (pin 10) open
fs
Switching frequency
Over VI and IO ranges
fSYNC
Synchronization (SYNC)
frequency
VSYNCH
SYNC High-Level Input Voltage
VSYNCL
SYNC Low-Level Input Voltage
tSYNC
SYNC Minimum Pulse Width
CI
External input capacitance
4.45
4.2
V
VI – 0.5
Open (4)
-0.2
0.8
Input low current (IIL), Pin 11 to GND
Iin
µA
V/ms
0.5
Input high voltage (VIH)
(5)
(2)
VO Ripple (peak-to-peak)
Pin to GND
(4)
mV
±1.5
RSET = 1.21 kΩ, VO = 3.3 V
Track input current (pin 10)
(3)
V
%Vo
Over VI range
IIL
(2)
V
–40°C < TA < 85°C
∆VtrTT
(1)
(2)
A
Line regulaltion
ttr
∆Vtr
±1
UNIT
Temperature variation
Efficiency
η
MAX
10
Set-point voltage tolerance
VO
TYP
0
-235
µA
5
mA
300
kHz
240
400
kHz
2
5.5
V
0.8
200
Nonceramic
Ceramic
V
220
V
nSec
(5)
22
(5)
µF
The maximum input voltage is duty cycle limited to (VO× 11) or 14 volts, whichever is less. The maximum allowable input voltage is a
function of switching frequency, and may increase or decrease when the SmartSync feature is utilized. Please review the SmartSync
section of the Application Information for further guidance.
The set-point voltage tolerance is affected by the tolerance and stability of RSET. The stated limit is unconditionally met if RSET has a
tolerance of 1% with 100 ppm/°C or better temperature stability.
A low-leakage (<100 nA), open-drain device, such as MOSFET or voltage supervisor IC, is recommended to control pin 10. The
open-circuit voltage is less than 8 Vdc.
This control pin has an internal pull-up. Do not place an external pull-up on this pin. If it is left open-circuit, the module operates when
input power is applied. A small, low-leakage (<100 nA) MOSFET is recommended for control. For additional information, see the related
application note.
A 220 µF electrolytic input capacitor is required for proper operation. The electrolytic capacitor must be rated for a minimum of 500 mA
rms of ripple current.
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ELECTRICAL CHARACTERISTICS (continued)
TA = 25°C, VI = 5 V, VO = 3.3 V, CI = 220 µF, CO = 220 µF, and IO = IO max (unless otherwise stated)
PARAMETER
TEST CONDITIONS
w/o TurboTrans
CO
Capacitance Value
MIN
Nonceramic
w/ TurboTrans
(6)
Ceramic
Equivalent series resistance (non-ceramic)
External output capacitance
220
Capacitance Value
(6)
(7)
(8)
4
Reliability
Per Bellcore TR-332, 50% stress,
TA = 40°C, ground benign
MAX
5000
TBD
µF
mΩ
see table
µF
(6) (8)
10000
TBD
UNIT
(7)
TBD
Capacitance × ESR product (CO× ESR)
MTBF
TYP
(8)
µF×mΩ
106 Hr
For VO≤ 3.3 V, a 220 µF external output capacitor is required for basic operation. When VO > 3.3 V the minimum output capacitance
increase to 330 µF. The minimum output capacitance requirement increases when TurboTrans™ (TT) technology is utilized. See related
Application Information for more guidance.
This is the calculated maximum disregarding TurboTrans™ technology. When the TurboTrans™ feature is utilized, the minimum output
capacitance must be increased.
When using TurboTrans™ technology, a minimum value of output capacitance is required for proper operation. Additionally, low ESR
capacitors are required for proper operation. See the application notes for further guidance.
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TERMINAL FUNCTIONS
TERMINAL
NAME
NO.
DESCRIPTION
VI
2
The positive input voltage power node to the module, which is referenced to common GND.
VO
5
The regulated positive power output with respect to the GND.
GND
Inhibit (1) and
UVLO
Vo Adjust
3, 4
11
This is the common ground connection for the VI and VO power connections. It is also the 0 Vdc reference for the
control inputs.
The Inhibit pin is an open-collector/drain, negative logic input that is referenced to GND. Applying a low level
ground signal to this input disables the module’s output and turns off the output voltage. When the Inhibit control
is active, the input current drawn by the regulator is significantly reduced. If the Inhibit pin is left open-circuit, the
module produces an output whenever a valid input source is applied.
This pin is also used for input undervoltage lockout (UVLO) programming. Connecting a resistor from this pin to
GND (pin 3) allows the ON threshold of the UVLO to be adjusted higher than the default value. For more
information, see the Application Information section.
8
A 0.05 W 1% resistor must be directly connected between this pin and pin 7 (–Sense) to set the output voltage
to a value higher than 0.69 V. The temperature stability of the resistor should be 100 ppm/°C (or better). The
setpoint range for the output voltage is from 0.69 V to 5.5 V. If left open circuit, the output voltage will default to
its lowest value. For further information, on output voltage adjustment see the related application note.
The specification table gives the preferred resistor values for a number of standard output voltages.
+ Sense
6
The sense input allows the regulation circuit to compensate for voltage drop between the module and the load.
For optimal voltage accuracy, +Sense must be connected to VO, very close to the load.
– Sense
7
The sense input allows the regulation circuit to compensate for voltage drop between the module and the load.
For optimal voltage accuracy, –Sense must be connected to GND (pin 4), very close to the load.
10
This is an analog control input that enables the output voltage to follow an external voltage. This pin becomes
active typically 20 ms after the input voltage has been applied, and allows direct control of the output voltage
from 0 V up to the nominal set-point voltage. Within this range the module's output voltage follows the voltage at
the Track pin on a volt-for-volt basis. When the control voltage is raised above this range, the module regulates
at its set-point voltage. The feature allows the output voltage to rise simultaneously with other modules powered
from the same input bus. If unused, this input should be connected to VI.
Track
NOTE: Due to the undervoltage lockout feature, the output of the module cannot follow its own input voltage
during power up. For more information, see the related application note.
TurboTrans™
9
This input pin adjusts the transient response of the regulator. To activate the TurboTrans™ feature, a 1%,
50 mW resistor must be connected between this pin and pin 6 (+Sense) very close to the module. For a given
value of output capacitance, a reduction in peak output voltage deviation is achieved by utililizing this feature. If
unused, this pin must be left open-circuit. The resistance requirement can be selected from the TurboTrans™
resistor table in the Application Information section. External capacitance must never be connected to this pin
unless the TurboTrans resistor value is a short, 0Ω.
SmartSync
1
This input pin sychronizes the switching frequency of the module to an external clock frequency. The SmartSync
feature can be used to sychronize the switching fequency of multiple PTH08T240W modules, aiding EMI noise
suppression efforts. If unused, this pin should be connected to GND (pin 3). For more information, please review
the Application Information section.
(1)
Denotes negative logic: Open = Normal operation, Ground = Function active
11
1
10
2
9
8
7
PTH08T240W
(Top View)
3
4
6
5
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TYPICAL CHARACTERISTICS (1) (2)
CHARACTERISTIC DATA ( VI = 12 V)
EFFICIENCY
vs
LOAD CURRENT
OUTPUT RIPPLE
vs
LOAD CURRENT
100
POWER DISSIPATION
vs
LOAD CURRENT
16
4.0
14
3.5
VO = 2.5 V
VO = 5.0 V
VO = 3.3 V
VO = 1.8 V
70
VO = 2.5 V
VO = 1.2 V
60
50
40
30
VO = 5.0 V
12
10
8
VO = 3.3 V
6
4
VO = 1.8 V
VO = 1.2 V
2
VI = 12 V
20
0
2
4
6
8
VO = 2.5 V
0
10
PD − Power Dissipation − W
80
VO − Output Voltage Ripple − mVPP
η − Efficiency − %
90
IO − Output Current − A
2.5
VO = 5.0 V
2.0
1.5
1.0
2
VO = 1.2 V
0.5
VO = 1.8 V
VI = 12 V
0
0
VO = 3.3 V
3.0
4
6
8
10
IO − Output Current − A
Figure 1.
Figure 2.
0
2
VI = 12 V
4
6
8
IO − Output Current − A
10
Figure 3.
SAFE OPERATING AREA
TA − Ambient Temperature − °C
90
400 LFM
80
Natural
Convection
70
200 LFM
60
50
100 LFM
40
30
VI = 12 V
VO = 3.3 V
20
0
2
4
6
8
10
IO − Output Current − A
Figure 4.
(1)
(2)
6
The electrical characteristic data has been developed from actual products tested at 25°C. This data is considered typical for the
converter. Applies to Figure 1, Figure 2, and Figure 3.
The temperature derating curves represent the conditions at which internal components are at or below the manufacturer's maximum
operating temperatures. Derating limits apply to modules soldered directly to a 100 mm x 100 mm double-sided PCB with 2 oz. copper.
For surface mount packages (AS and AZ suffix), multiple vias must be utilized. Please refer to the mechanical specification for more
information. Applies to Figure 4.
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TYPICAL CHARACTERISTICS (1) (2)
CHARACTERISTIC DATA ( VI = 5 V)
EFFICIENCY
vs
LOAD CURRENT
10
VO = 3.3 V
2.5
VO − Output Voltage Ripple − mVPP
η − Efficiency − %
80
VO = 0.69 V
VO = 2.5 V
VO = 0.9 V
VO = 1.2 V
60
VO = 1.8 V
50
40
VO = 1.8 V
2.0
8
6
VO = 3.3 V
0
2
4
6
8
VO = 0.9 V
4
VO = 1.8 V
VO = 1.2 V
1.0
VO = 0.69 V
VO = 0.69 V
0.5
2
VO = 2.5 V
0
10
IO − Output Current − A
VO = 2.5 V
1.5
VO = 1.2 V
VO = 0.9 V
VI = 5 V
30
VO = 3.3 V
VI = 5 V
90
70
POWER DISSIPATION
vs
LOAD CURRENT
PD − Power Dissipation − W
100
OUTPUT RIPPLE
vs
LOAD CURRENT
VI = 5 V
0
2
4
6
8
IO − Output Current − A
Figure 5.
0
10
Figure 6.
0
2
4
6
8
IO − Output Current − A
10
Figure 7.
SAFE OPERATING AREA
TA − Ambient Temperature − °C
90
80
Natural
Convection
70
60
50
40
30
VI = 5 V
VO = 3.3 V
20
0
2
4
6
8
10
IO − Output Current − A
Figure 8.
(1)
(2)
The electrical characteristic data has been developed from actual products tested at 25°C. This data is considered typical for the
converter. Applies to Figure 5, Figure 6, and Figure 7.
The temperature derating curves represent the conditions at which internal components are at or below the manufacturer's maximum
operating temperatures. Derating limits apply to modules soldered directly to a 100 mm x 100 mm double-sided PCB with 2 oz. copper.
For surface mount packages (AS and AZ suffix), multiple vias must be utilized. Please refer to the mechanical specification for more
information. Applies to Figure 8.
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APPLICATION INFORMATION
CAPACITOR RECOMMENDATIONS FOR THE PTH08T240W POWER MODULE
Input Capacitor (Required)
The required input capacitance is 220-µF of electrolytic type. When VO > 3V , the 220 µF electrolytic capacitor
must be rated for 700 mArms ripple current capability. For VO ≤ 3 V, the ripple current rating must be at least 450
mArms. The size, type and value of input capacitor is determined by the converter’s transient performance
capability. This minimum value assumes that the converter is supplied with a responsive, low inductance input
source. This source should have ample capacitive decoupling, and be distributed to the converter via PCB power
and ground planes.
For high-performance applications, or wherever the input source performance is degraded, 470 µF of input
capacitance is recommended. The additional input capacitance above the minimum level insures an optimized
performance.
Ripple current (rms) rating, less than 100 mΩ of equivalent series resistance (ESR), and temperature are the
main considerations when selecting input capacitors. The ripple current reflected from the input of the
PTH08T240W module is moderate to low. Therefore any good quality, computer-grade electrolytic capacitor will
have an adequate ripple current rating.
Regular tantalum capacitors are not recommended for the input bus. These capacitors require a recommended
minimum voltage rating of 2 × (maximum dc voltage + ac ripple). This is standard practice to ensure reliability. No
tantalum capacitors were found with a sufficient voltage rating to meet this requirement. When the operating
temperature is below 0°C, the ESR of aluminum electrolytic capacitors increases. For these applications,
Os-Con, poly-aluminum, and polymer-tantalum types should be considered. Adding one or two ceramic
capacitors to the input attenuates high-frequency reflected ripple current.
TurboTrans Output Capacitor
The PTH08T240W requires a minimum output capacitance of 220 µF. The required capacitance above 220 µF
will be determined by actual transient deviation requirements.
TurboTrans allows the designer to optimize the capacitance load according to the system transient design
requirement. High quality, ultra-low ESR capacitors are required to maximize TurboTrans effectiveness.
Capacitors with a capacitance (µF) × ESR (mΩ) product of ≤ 10,000 mΩ×µF are required.
Working Example:
A bank of 6 identical capacitors, each with a capacitance of 330 µF and 5 mΩ ESR, has a C × ESR product of
1650 µFxmΩ (330 µF × 5 mΩ).
Using TurboTrans in conjunction with the high quality capacitors (capacitance (µF) × ESR (mΩ)) reduces the
overall capacitance requirement while meeting the minimum transient amplitude level.
Table 1 includes a preferred list of capacitors by type and vendor. See the Output Bus / TurboTrans column.
Note: See the TurboTrans Technology Application Notes within this document for selection of specific
capacitance.
Non-TurboTrans Output Capacitor
The PTH08T240W requires a minimum output capacitance of 220 µF. Non-TurboTrans applications must
observe minimum output capacitance ESR limits.
A combination of 200 µF of ceramic capacitors plus low ESR (15 mΩ to 30 mΩ) Os-Con electrolytic/tantalum
type capacitors can be used. When using Polymer tantalum types, tantalum type, or Oscon types only, the
capacitor ESR bank limit is 3 mΩ to 5 mΩ. (Note: no ceramic capacitors are required). This is necessary for the
stable operation of the regulator. Additional capacitance can be added to improve the module's performance to
load transients. High quality computer-grade electrolytic capacitors are recommended. Aluminum electrolytic
capacitors provide adequate decoupling over the frequency range, 2 kHz to 150 kHz, and are suitable when
ambient temperatures are above -20°C. For operation below -20°C, tantalum, ceramic, or Os-Con type
capacitors are necessary.
8
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APPLICATION INFORMATION (continued)
When using a combination of one or more non-ceramic capacitors, the calculated equivalent ESR should be no
lower than 2 mΩ (4 mΩ when calculating using the manufacturer’s maximum ESR values). A list of preferred
low-ESR type capacitors, are identified in Table 1.
Ceramic Capacitors
Above 150 kHz the performance of aluminum electrolytic capacitors is less effective. Multilayer ceramic
capacitors have very low ESR and a resonant frequency higher than the bandwidth of the regulator. They can be
used to reduce the reflected ripple current at the input as well as improve the transient response of the output.
When used on the output their combined ESR is not critical as long as the total value of ceramic capacitors, with
values between 10 µF and 100 µF, does not exceed 3000 µF (non-TurboTrans). In TurboTrans applications,
when ceramic capacitors are used on the output bus, total capacitance including bulk and ceramic types is not to
exceed 14,000 µF.
Tantalum, Polymer-Tantalum Capacitors
Tantalum type capacitors are only used on the output bus, and are recommended for applications where the
ambient operating temperature is less than 0°C. The AVX TPS series and Kemet capacitor series are suggested
over many other tantalum types due to their higher rated surge, power dissipation, and ripple current capability.
As a caution, many general-purpose tantalum capacitors have higher ESR, reduced power dissipation, and lower
ripple current capability. These capacitors are also less reliable due to their reduced power dissipation and surge
current ratings. Tantalum capacitors that have no stated ESR or surge current rating are not recommended for
power applications.
Capacitor Table
Table 1 identifies the characteristics of capacitors from a number of vendors with acceptable ESR and ripple
current (rms) ratings. The recommended number of capacitors required at both the input and output buses is
identified for each capacitor type.
This is not an extensive capacitor list. Capacitors from other vendors are available with comparable
specifications. Those listed are for guidance. The RMS ripple current rating and ESR (at 100 kHz) are critical
parameters necessary to ensure both optimum regulator performance and long capacitor life.
Designing for Fast Load Transients
The transient response of the dc/dc converter has been characterized using a load transient with a di/dt of
2.5 A/µs. The typical voltage deviation for this load transient is given in the Electrical Characteristics table using
the minimum required value of output capacitance. As the di/dt of a transient is increased, the response of a
converter’s regulation circuit ultimately depends on its output capacitor decoupling network. This is an inherent
limitation with any dc/dc converter once the speed of the transient exceeds its bandwidth capability.
If the target application specifies a higher di/dt or lower voltage deviation, the requirement can only be met with
additional low ESR ceramic capacitor decoupling. Generally, with 50% load steps at > 100 A/µs, adding multiple
10 µF ceramic capacitors, 3225 case size, plus 10 × 1 µF, including numerous high frequency ceramics
(≤ 0.1 µF) are all that is required to soften the transient higher frequency edges. Special attention is essential
with regards to location, types, and position of higher frequency ceramic and lower ESR bulk capacitors. DSP,
FPGA and ASIC vendors identify types, location and capacitance required for optimum performance of the high
frequency devices. The details regarding the PCB layout and capacitor/component placement are important at
these high frequencies. Low impedance buses and unbroken PCB copper planes with components located as
close to the high frequency processor are essential for optimizing transient performance. In many instances
additional capacitors may be required to insure and minimize transient aberrations.
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APPLICATION INFORMATION (continued)
Table 1. Input/Output Capacitors (1)
Capacitor Characteristics
Capacitor Vendor,
Type Series (Style)
Working Value
Voltage
(µF)
Max.
ESR
at 100
kHz
Quantity
Max
Ripple
Physical
Current at
Size (mm)
85°C
(Irms)
Output Bus
Input
Bus
No
TurboTrans
TurboTrans
(Cap
Type) (2)
Vendor Part No.
Panasonic (Radial)
25 V
270
0.090Ω
>755mA
10 × 12,5
≥1 (3)
≥ 1 (4)
N/R (5)
EEUFC1E271
FC (Radial)
25 V
560
0.065Ω
1205 mA
12,5 × 15
≥1 (3)
≥ 1 (4)
N/R (5)
EEUFC1E561S
FC(SMD)
25 V
470
0.065Ω
>1200 mA
12,5 ×
16,5
≥1 (3)
≥ 1 (4)
N/R (5)
EEVFC1E471LQ
FK(SMD)
25 V
470
0.080Ω
850 mA
10 ×10,2
≥1 (3)
≥ 1 (6)
N/R (5)
EEVFK1E471P
PTB(SMD) Polymer
Tantalum
6.3 V
330
0.025Ω
2600 mA
7,3x 4,3x
2.8
N/R (7) (8
≥ 1 ~ ≤ 4 (4)
C ≥ 2 (2)
LXZ, Aluminum (Radial)
25 V
330
0.09Ω
760 mA
10 × 12,5
≥1 (3)
PS,
Poly-Aluminum(Radial)
16 V
330
0.014Ω
5060 mA
10 × 12,5
≥1 (3)
≥1~≤3
B ≥ 2 (2)
16PS330MJ12
PXA, Poly-Aluminum
(SMD)
16 V
330
0.014Ω
5050 mA
10 × 12,2
≥1 (3)
≥1~≤3
B ≥ 2 (2)
PXA16VC331MJ12TP
PS,
Poly-Aluminum(Radial)
10 V
270
0.014Ω
4420 mA
8 × 11,5
N/R (7) (8
≥ 1 ~≤ 2
B ≥ 2 (2)
10PS270MH11(VI:VO≥5.5V) (7)
PXA,
Poly-Aluminum(Radial)
10 V
330
0.014Ω
4420 mA
8 × 12
N/R (7) (8
≥1~≤2
B ≥ 2 (2)
PXA10VC331MH12
(VI:VO≥5.5V) (7)
Nichicon, Aluminum
25 V
330
0.095Ω
750 mA
10 × 15
≥1 (3)
≥ 1 (4)
N/R (5)
UPM1E331MPH6
HD (Radial)
25 V
220
0.072Ω
760 mA
8 × 11,5
≥1 (3)
≥
1 (4)
N/R (5)
UHD1E221MPR
PM (Radial)
35 V
560
0.048Ω
1360 mA
16 × 15
≥1 (3)
≥ 2 (4)
N/R (5)
UPM1V561MHH6
4000 mA
7,3 L×4,3
W ×4,2H
N/R (7) (8
N/R (8)
B ≥ 2 (2)
United Chemi-Con
Panasonic,
Poly-Aluminum:
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(9)
10
2.0 V
390
0.005Ω
)
)
)
)
≥1
(4)
N/R (5)
4PTB337MD6TER
(VI:VO≥5.1V) (7)
LXZ25VB331M10X12LL
EEFSE0J391R(VO≤1.6V) (9)
Capacitor Supplier Verification
Please verify availability of capacitors identified in this table. Capacitor suppliers may recommend alternative part numbers because of
limited availability or obsolete products. In some instances, the capacitor product life cycle may be in decline and have short-term
consideration for obsolescence.
RoHS, Lead-free and Material Details
See the capacitor suppliers regarding material composition, RoHS status, lead-free status, and manufacturing process requirements.
Component designators or part number deviations can occur when material composition or soldering requirements are updated.
Required capacitors with TurboTrans. See the TransTrans Application information for Capacitor Selection
Capacitor Type Groups by ESR (Equivalent Series Resistance) :
•
Type A = (100 < capacitance × ESR ≤ 1000)
•
Type B = (1,000 < capacitance × ESR ≤ 5,000)
•
Type C = (5,001 < capacitance × ESR ≤ 10,000)
In addition to the required input electrolytic capacitance , ≥ 20 µF ceramic capacitors are required to reduce the high-frequency reflected
ripple current.
Total bulk nonceramic capacitors on the output bus with ESR of ≥ 15mΩ to ≤ 30mΩ requires an additional ≥ 200 µF of ceramic
capacitor.
Aluminum Electrolytic capacitor not recommended for the TurboTrans due to higher ESR × capacitance products. Aluminum and higher
ESR capacitors can be used in conjunction with lower ESR capacitance.
Output bulk capacitor's maximum ESR is ≥ 30 mΩ. Additional ceramic capacitance of ≥ 200 µF is required.
The voltage rating and derating of this capacitor only allows it to be used for voltages that are equal or less than 5.1 V.
N/R – Not recommended. The voltage rating does not meet the minimum operating limits.
The voltage rating of this capacitor only allows it to be used for output voltage that is equal to or less than 80% of the working voltage.
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APPLICATION INFORMATION (continued)
Table 1. Input/Output Capacitors (continued)
Capacitor Characteristics
Capacitor Vendor,
Type Series (Style)
Working Value
Voltage
(µF)
Max.
ESR
at 100
kHz
Quantity
Max
Ripple
Physical
Current at
Size (mm)
85°C
(Irms)
Output Bus
Input
Bus
No
TurboTrans
TurboTrans
(Cap
Type) (2)
Vendor Part No.
Sanyo
TPE, Poscap (SMD)
10 V
330
0.025Ω
3000 mA
7,3 × 4,3
N/R (10) (
≥1~≤3
C ≥ 2 (12)
10TPE330MF (VI:VO ≤ 5.1 V) (13)
TPE Poscap(SMD)
2.5 V
470
0.007Ω
4400 mA
7,3 × 4,3
N/R (11)
≥1≤2
B ≥ 2 (12)
2R5TPE470M7(VO ≤ 1.8 V) (13)
11)
TPD Poscap (SMD)
2.5 V
1000
0.005Ω
6100 mA
7,3 × 4,3
N/R (11)
SEP, Os-Con (Radial)
16 V
330
0.016Ω
>4700 mA
10 ×13
≥1 (14)
≥1~≤3
B≥
SP Oscon ( Radial)
16 V
270
0.018
>4400 mA
10 × 11,5
≥1 (14)
≥1~≤3
B ≥ 2 (12)
16SP270M
SEPC, Os-Con (Radial)
16 V
270
0.011Ω
>5000 mA
8 × 13
≥1 (14)
≥1~≤2
B ≥ 2 (12)
16SEPC270M
SVP, Os-Con (SMD)
16 V
330
0.016Ω
4700mA
10 × 12,6
≥1 (14)
≥ 1 ~ ≤ 3 (15)
B ≥ 2 (12) (15)
16SVP330M
AVX, Tantalum, Series III
TPM Multianode
10 V
10 V
330
330
0.040Ω
0.023Ω
>1828 mA
>3000 mA
7,3L×4,3W
× 4,1 H
N/R (11)
N/R (11)
≥ 1 ~ ≤ 6 (15)
≥ 1 ~ ≤ 3 (15)
N/R (16)
C ≥ 2 (12) (15)
TPSE337M010R0040(VO≥5V) (10)
TPME337M010#0023(VO≥5V) (10)
TPS Series III (SMD)
4V
1000
0.035Ω
2405
7,3L ×
5,7W
N/R (11)
≥ 1 ~ ≤ 5 (15)
N/R (16)
Kemet, Poly-Tantalum
10 V
330
0.025Ω
2600 mA
4,3 W
N/R (11)
≥ 1~ ≤ 4 (15)
C ≥ 2 (12)
T520X337M010ASE025
(VI:VO≥5.5V) (10)
T520 (SMD)
6.3 V
330
0.015Ω
>3800 mA
× 7,3 L
N/R (10) (
≥2~≤3
B ≥ 2 (12)
T530X337M006ASE015
(VI:VO≥5.1V) (10)
T530 (SMD)
4V
680
0.005Ω
7300 mA
×4H
N/R (11)
≤1
B ≥ 1 (12)
T530X687M004ASE005 (VO ≤
3.5 V) (13)
T530 (SMD)
2.5 V
1000
0.005Ω
7300 mA
4,3 w ×
7,3 L
N/R (11)
≤1
B ≥ 1 (12)
T530X108M2R5ASE005 (VO ≤
2.0 V) (13)
597D, Tantalum (SMD)
16 V
220
0.04Ω
2300 mA
7,2L×5,7W
×4,1H
N/R (11)
≥1~≤5
C ≥ 2 (12)
597D227X16E2T (VI:VO≥5.5V) (10)
94SP, Os-con (Radial)
16 V
270
0.018Ω
4400mA
10 × 10,5
≥1 (14)
≥1~≤3
C ≥ 2 (12)
94SP277X0016FBP
94SVP Os-Con(SMD)
16 V
330
0.017Ω
>4500 mA
10 × 12,7
≥1 (14)
≥1~≤3
B ≥ 2 (12)
94SVP337X016F12
Kemet, Ceramic X5R
16 V
10
0.002Ω
–
3225
≥2 (14)
≥ 1 (17)
A (12)
C1210C106M4PAC
11)
≤1
B≥
1 (12)
2R5TPD1000M5(VO ≤ 1.8 V) (13)
2 (12)
16SEP330M
TPSV108K004R0035 (VO ≤ 2.1
V) (13)
Vishay-Sprague
N/R (11)
≥
1 (17)
A (12)
C1210C476K9PAC
N/R (11)
≥ 1 (17)
A (12)
GRM32ER60J107M
(SMD)
6.3 V
47
0.002Ω
Murata, Ceramic X5R
6.3 V
100
0.002Ω
(SMD)
6.3 V
47
N/R (11)
≥ 1 (17)
A (12)
GRM32ER60J476M
25 V
22
≥ 1 (14)
≥ 1 (17)
A (12)
GRM32ER61E226K
16 V
10
≥2 (14)
≥ 1 (17)
A (12)
GRM32DR61C106K
TDK, Ceramic X5R
6.3 V
100
N/R (11)
≥ 1 (17)
A (12)
C3225X5R0J107MT
(SMD)
6.3 V
47
N/R (11)
≥ 1 (17)
A (12)
C3225X5R0J476MT
16 V
10
≥2 (14)
≥ 1 (17)
A (12)
C3225X5R1C106MT0
16 V
22
≥1 (14)
≥ 1 (17)
A (12)
C3225X5R1C226MT
0.002Ω
–
–
3225
3225
(10) The voltage rating and derating of this capacitor only allows it to be used for voltages that are equal or less than 5.1 V.
(11) N/R – Not recommended. The voltage rating does not meet the minimum operating limits.
(12) Required capacitors with TurboTrans. See the TransTrans Application information for Capacitor Selection
Capacitor Type Groups by ESR (Equivalent Series Resistance) :
•
Type A = (100 < capacitance × ESR ≤ 1000)
•
Type B = (1,000 < capacitance × ESR ≤ 5,000)
•
Type C = (5,001 < capacitance × ESR ≤ 10,000)
(13) The voltage rating of this capacitor only allows it to be used for output voltage that is equal to or less than 80% of the working voltage.
(14) In addition to the required input electrolytic capacitance , ≥ 20 µF ceramic capacitors are required to reduce the high-frequency reflected
ripple current.
(15) Total bulk nonceramic capacitors on the output bus with ESR of ≥ 15mΩ to ≤ 30mΩ requires an additional ≥ 200 µF of ceramic
capacitor.
(16) Aluminum Electrolytic capacitor not recommended for the TurboTrans due to higher ESR × capacitance products. Aluminum and higher
ESR capacitors can be used in conjunction with lower ESR capacitance.
(17) Maximum ceramic capacitance on the output bus is ≤ tbd µF. Any combination of the ceramic capacitor values is limited to tbd µF for
non-TurboTrans applications. The total capacitance is limited to tbd µF which includes all ceramic and non-ceramic types.
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TurboTrans™ Technology
TurboTrans technology is a feature introduced in the T2 generation of the PTH/PTV family of power modules.
TurboTrans optimizes the transient response of the regulator with added external capacitance using a single
external resistor. Benefits of this technology include reduced output capacitance, minimized output voltage
deviation following a load transient, and enhanced stability when using ultra-low ESR output capacitors. The
amount of output capacitance required to meet a target output voltage deviation will be reduced with TurboTrans
activated. Likewise, for a given amount of output capacitance, with TurboTrans engaged, the amplitude of the
voltage deviation following a load transient will be reduced. Applications requiring tight transient voltage
tolerances and minimized capacitor footprint area will benefit greatly from this technology.
TurboTrans™ Selection
Utilizing TurboTrans requires connecting a resistor, RTT, between the +Sense pin (pin 6) and the TurboTrans pin
(pin 9). The value of the resistor directly corresponds to the amount of output capacitance required. All T2
products require a minimum value of output capacitance whether or not TurboTrans is utilized. For the
PTH08T240W, the minimum required capacitance is 220 µF. When using TurboTrans, capacitors with a
capacitance × ESR product below 10,000 µF×mΩ are required. (Multiply the capacitance (in µF) by the ESR (in
mΩ) to determine the capacitance × ESR product.) See the Capacitor Selection section of the datasheet for a
variety of capacitors that meet this criteria.
Figure 9 thru Figure 13 show the amount of output capacitance required to meet a desired transient voltage
deviation with and without TurboTrans for several capacitor types; Type A (e.g. ceramic), Type B (e.g.
polymer-tantalum), and Type C (e.g. OS-CON). To calculate the proper value of RTT, first determine your
required transient voltage deviation limits and magnitude of your transient load step. Next, determine what type
of output capacitors will be used. (If more than one type of output capacitor is used, select the capacitor type that
makes up the majority of your total output capacitance.) Knowing this information, use the chart in Figure 9 thru
Figure 13 that corresponds to the capacitor type selected. To use the chart, begin by dividing the maximum
voltage deviation limit (in mV) by the magnitude of your load step (in Amps). This gives a mV/A value. Find this
value on the Y-axis of the appropriate chart. Read across the graph to the 'With TurboTrans' plot. From this
point, read down to the X-axis which lists the minimum required capacitance, CO, to meet that transient voltage
deviation. The required RTT resistor value can then be calculated using the equation or selected from the
TurboTrans table. The TurboTrans tables include both the required output capacitance and the corresponding
RTT values to meet several values of transient voltage deviation for 25% (2.5 A), 50% (5 A), and 75% (7.5 A)
output load steps.
The chart can also be used to determine the achievable transient voltage deviation for a given amount of output
capacitance. By selecting the amount of output capacitance along the X-axis, reading up to the desired 'With
TurboTrans'' curve, and then over to the Y-axis, gives the transient voltage deviation limit for that value of output
capacitance. The required RTT resistor value can be calculated using the equation or selected from the
TurboTrans table.
As an example, let's look at a 12-V application requiring a 50 mV deviation during an 5 A, 50% load transient. A
majority of 330 µF, 10 mA ouput capacitors will be used. Use the 12-V, Type B capacitor chart, Figure 10.
Dividing 50 mV by 5 A gives 10 mV/A transient voltage deviation per amp of transient load step. Select 10 mV/A
on the Y-axis and read across to the 'With TurboTrans'' plot. Following this point down to the X-axis gives a
minimum required output capacitance of approximately 680 µF. The required RTT resistor value for 680 µF can
then be calculated or selected from Table 3. The required RTT resistor is approximately 7.32 kΩ.
To see the benefit of TurboTrans, follow the 10 mV/A marking across to the 'Without TurboTrans' plot. Following
that point down shows that you would need a minimum of 3000 µF of output capacitance to meet the same
transient deviation limit. This is the benefit of TurboTrans.
12
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6
5
Transient - mV/A
4
3
2
6000
7000
8000
9000
10000
4000
5000
3000
2000
600
700
800
900
1000
1
C - Capacitance - mF
Figure 9. Capacitor Type A, 100 ≤ C(µF)xESR(mΩ) ≤ 1000
(e.g. Ceramic)
Table 2. Type A TurboTrans CO Values and Required RTT Selection Table
Transient Voltage Deviation (mV)
CO
Minimum Required Output
Capacitance (µF)
RTT
Required TurboTrans
Resistor (Ω)
tbd
tbd
open
tbd
tbd
tbd
tbd
tbd
tbd
tbd
tbd
tbd
tbd
tbd
tbd
tbd
tbd
tbd
tbd
tbd
tbd
tbd
tbd
tbd
tbd
tbd
tbd
tbd
tbd
tbd
tbd
tbd
tbd
short
25% load step
(2.5 A)
50% load step
(5 A)
75% load step
(7.5 A)
tbd
tbd
tbd
tbd
tbd
tbd
RTT Resistor Selection
The TurboTrans resistor value, RTT can be determined from the TurboTrans programming, see Equation 1
R TT + TBD
(1)
Where CO is the total output capacitance in µF. CO values greater than or equal to TBD µF require RTT to be a
short, 0Ω.
To ensure stability, a minimum amount of output capacitance is required for a given RTT resistor value. The value
of RTT must be calculated using the minimum required output capacitance determined from the capacitor
transient response charts above.
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Type B Capacitor
12-V Input
Type B Capacitor
5-V Input
30
30
WIth TurboTrans
Without TurboTrans
VO − Output Voltage Ripple − mVPP
10
9
8
7
6
5
4
3
WIth TurboTrans
Without TurboTrans
20
10
9
8
7
6
5
4
4000
5000
6000
3000
2000
1000
200
400
500
2
10000
4000
5000
6000
3000
2000
1000
400
500
300
200
2
10000
3
300
Transient − mV/A
20
IO − Output Current − A
C − Capacitance − µF
Figure 10. Cap Type B, 1000 < C(µF)xESR(mΩ) ≤ 5000
(e.g. Polymer-Tantalum)
Figure 11. Cap Type B, 1000 < C(µF)xESR(mΩ) ≤ 5000
(e.g. Polymer-Tantalum)
Table 3. Type B TurboTrans CO Values and Required RTT Selection Table
Transient Voltage Deviation (mV)
12-V Input
5-V Input
25% load step
(2.5 A)
50% load step
(5 A)
75% load step
(7.5 A)
CO
Minimum
Required Output
Capacitance (µF)
RTT
Required
TurboTrans
Resistor (kΩ)
CO
Minimum
Required Output
Capacitance (µF)
RTT
Required
TurboTrans
Resistor (kΩ)
55
110
165
220
open
220
open
40
80
120
330
57.6
360
42.2
35
70
105
400
30.9
450
23.7
30
60
90
510
16.2
560
12.7
25
50
75
680
7.32
750
5.49
20
40
60
1000
1.58
1050
0.536
15
30
45
2100
short
2600
short
10
20
30
10500
short
exceeds limit
—
RTT Resistor Selection
The TurboTrans resistor value, RTT can be determined from the TurboTrans programming, see Equation 2. For
VO > 3.3 V please contact TI for CO and RTT values.
R TT +
40
ƪ1 * ǒCOń1100Ǔƫ
ƪǒC Oń220Ǔ * 1ƫ
(kW)
For V O v 3.3 V, CO(min) + 220 mF
(2)
Where CO is the total output capacitance in µF. CO values greater than or equal to 1100 µF require RTT to be a
short, 0Ω. (RTT results in a negative value when CO > 1100 µF).
To ensure stability, a minimum amount of output capacitance is required for a given RTT resistor value. The value
of RTT must be calculated using the minimum required output capacitance determined from the capacitor
transient response charts above.
14
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Type C Capacitor
12-V Input
Type C Capacitor
5-V Input
30
10000
200
4000
5000
6000
500
IO − Output Current − A
2000
2
10000
2
3000
3
2000
3
1000
4
300
4
1000
5
500
5
10
9
8
7
6
300
Transient − mV/A
20
10
9
8
7
6
200
VO − Output Voltage Ripple − mVPP
20
WIth TurboTrans
Without TurboTrans
3000
WIth TurboTrans
Without TurboTrans
4000
5000
6000
30
C − Capacitance − µF
Figure 12. Cap Type C, 5000 < C(µF)xESR(mΩ) ≤ 10,000
(e.g. Os-Con)
Figure 13. Cap Type C, 5000 < C(µF)xESR(mΩ) ≤ 10,000
(e.g. Os-Con)
Table 4. Type C TurboTrans CO Values and Required RTT Selection Table
Transient Voltage Deviation (mV)
12-V Input
5-V Input
25% load step
(2.5 A)
50% load step
(5 A)
75% load step
(7.5 A)
CO
Minimum
Required Output
Capacitance (µF)
RTT
Required
TurboTrans
Resistor (kΩ)
CO
Minimum
Required Output
Capacitance (µF)
RTT
Required
TurboTrans
Resistor (kΩ)
75
150
225
220
open
250
1300
60
120
180
270
294
330
133
45
90
135
400
68.1
480
45.3
35
70
105
580
31.6
700
21.5
30
60
90
720
20.0
860
13.7
25
50
75
950
11.8
1150
7.68
20
40
60
1300
5.23
1550
2.61
15
30
45
2000
short
2800
short
10
20
30
7400
short
exceeds limit
—
RTT Resistor Selection
The TurboTrans resistor value, RTT can be determined from the TurboTrans programming, see Equation 3 . For
VO > 3.3 V please contact TI for CO and RTT values.
R TT +
40
ƪǒǒǒ5
ƪ1 * ǒCOń1980Ǔƫ
ƫ
C OǓ ) 880Ǔń1980Ǔ * 1
(kW)
For VO v 3.3 V
(3)
Where CO is the total output capacitance in µF. CO values greater than or equal to 1980 µF require RTT to be a
short, 0Ω. (RTT results in a negative value when CO > 1980 µF).
To ensure stability, the value of RTT must be calculated using the minimum required output capacitance
determined from the capacitor transient response charts above.
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TurboTrans
10
1
VI
AutoTrack
TurboTrans
+Sense
Smart
Sync
2
PTH08T240W
VI
11 Inhibit/
Prog UVLO
3
4
6
+Sense
5
VO
VO
−Sense
GND
CI
220 mF
(Required)
RTT
0 kW
9
7
VOAdj
8
RSET
1%
0.05 W
L
O
A
D
COTT
1320 mF
Type B
(Required)
−Sense
GND
GND
Figure 14. TurboTrans™ with Minimum Capacitance Requirement
Without TurboTrans
100 mV/div
With TurboTrans
100 mV/div
2.5 A/ms
50% Load Step
Figure 15. TurboTrans Waveform
16
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ADJUSTING THE OUTPUT VOLTAGE OF THE PTH08T240W WIDE-OUTPUT ADJUST POWER
MODULE
The Vo Adjust control (pin 8) sets the output voltage of the PTH08T240W. The adjustment range of the
PTH08T240W is 0.69 V to 5.5 V. The adjustment method requires the addition of a single external resistor, RSET,
that must be connected directly between the Vo Adjust and – Sense pins. Table 5 gives the standard value of the
external resistor for a number of standard voltages, along with the actual output voltage that this resistance value
provides.
For other output voltages, the value of the required resistor can either be calculated using the following formula,
or simply selected from the range of values given in Table 6. Figure 16 shows the placement of the required
resistor.
RSET = 10 kW x
0.69
- 1.43 kW
VO - 0.69
(4)
Table 5. Standard Values of RSET for Standard Output Voltages
VO (Standard)
RSET (Standard Value)
VO (Actual)
169 Ω
5.01 V
3.3 V
1.21 kΩ
3.30 V
2.5 V
2.37 kΩ
2.51 V
1.8 V
4.75 kΩ
1.81 V
1.5 V
7.15 kΩ
1.49 V
12.1 kΩ
1.20 V
20.5 kΩ
1.00 V
681 kΩ
0.700 V
5.0 V
1.2 V
1V
(2)
(2)
0.7 V
(1)
(2)
(1)
(2)
The minimum input voltage is (VO + 2) V.
The maximum input voltage is (VO× 11) or 14 V, whichever is less. The maximum allowable input
voltage is a function of switching frequency and may increase or decrease when the Smart Sync
feature is utilized. Please review the Smart Sync application section for further guidance.
+Sense
PTH08T240W
VO
−Sense
GND
3
GND
4
6
+Sense
5
VO
7
VOAdj
8
RSET
1%
0.05 W
CO
−Sense
GND
(1)
Use a 0.05 W resistor. The tolerance should be 1%, with temperature stability of 100 ppm/°C (or better). Place the
resistor as close to the regulator as possible. Connect the resistor directly between pins 8 and 7 using dedicated PCB
traces.
(2)
Never connect capacitors from VO Adjust to either + Sense, GND, or VO. Any capacitance added to the VO Adjust
pin affects the stability of the regulator.
Figure 16. Vo Adjust Resistor Placement
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Table 6. Output Voltage Set-Point Resistor Values
VO Required
RSET
VO Required
RSET
0.700
(1)
681 kΩ
1.950
4.05 kΩ
0.750
(1)
113 kΩ
2.100
3.46 kΩ
0.800
(1)
61.3 kΩ
2.250
2.99 kΩ
0.850
(1)
41.7 kΩ
2.400
2.61 kΩ
0.900
(1)
31.4 kΩ
2.500
2.38 kΩ
0.950
(1)
25.1 kΩ
2.700
2.00 kΩ
1.000
(1)
20.8 kΩ
2.850
1.76 kΩ
1.050
(1)
17.8 kΩ
3.000
1.56 kΩ
1.100
(1)
15.4 kΩ
3.150
1.38 kΩ
1.150
(1)
13.6 kΩ
3.300
1.21 kΩ
1.200
(1)
12.1 kΩ
3.450
1.07 kΩ
10.9 kΩ
3.600
941 Ω
1.250
(1)
(2)
1.300
9.88 kΩ
3.750
(2)
1.350
9.03 kΩ
3.900
(2)
720 Ω
1.400
8.29 kΩ
4.100
(2)
593 Ω
1.450
7.65 kΩ
4.200
(2)
536 Ω
455 Ω
825 Ω
1.500
7.09 kΩ
4.350
(2)
1.550
6.59 kΩ
4.500
(2)
381 Ω
1.600
6.15 kΩ
4.650
(2)
312 Ω
249 Ω
1.650
5.76 kΩ
4.800
(2)
1.700
5.40 kΩ
5.000
(2)
171 Ω
1.750
5.08 kΩ
5.100
(2)
135 Ω
83 Ω
1.800
4.78 kΩ
5.250
(2)
1.850
4.52 kΩ
5.400
(2)
35 Ω
1.900
4.27 kΩ
5.500
(2)
5Ω
The maximum input voltage is (VO× 11) or 14 V, whichever is less. The maximum allowable input
voltage is a function of switching frequency and may increase or decrease when the Smart Sync
feature is utilized. Please review the Smart Sync application section for further guidance.
For VO > 3.6 V, the minimum input voltage is (VO + 2) V.
ADJUSTING THE UNDERVOLTAGE LOCKOUT (UVLO) OF THE PTH08T240W POWER MODULES
The PTH08T240W power modules incorporate an input undervoltage lockout (UVLO). The UVLO feature
prevents the operation of the module until there is sufficient input voltage to produce a valid output voltage. This
enables the module to provide a clean, monotonic powerup for the load circuit, and also limits the magnitude of
current drawn from the regulator’s input source during the power-up sequence.
The UVLO characteristic is defined by the ON threshold (VTHD) voltage. Below the ON threshold, the Inhibit
control is overridden, and the module does not produce an output. The hysterisis voltage, which is the difference
between the ON and OFF threshold voltages, is set at 500 mV. The hysterisis prevents start-up oscillations,
which can occur if the input voltage droops slightly when the module begins drawing current from the input
source.
UVLO Adjustment
The UVLO feature of the PTH08T240W module allows for limited adjustment of the ON threshold voltage. The
adjustment is made via the Inhbit/UVLO Prog control pin (pin 11). When pin 11 is left open circuit, the ON
threshold voltage is internally set to its default value, which is 4.3 volts. When the ON threshold is adjusted
higher than 5 volts, the default hysterisis setting is 500 mV. This ensures that the module produces a regulated
output when the minimum input voltage is applied (see specifications).
The ON threshold might need to be raised if the module is powered from a tightly regulated 12-V bus. This
prevents it from operating if the input bus fails to completely rise to its specified regulation voltage.
18
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VI
2
VI
PTH08T240W
11 Inhibit/
UVLO Prog
GND
3
4
RUVLO
CI
GND
Figure 17. Undervoltage Lockout Adjustment Resistor Placement
Equation 5 determines the value of RTHD required to adjust VTHD to a new value. The default value is 4.3 V, and it
may only be adjusted to a higher value.
R UVLO +
9690 * ǒ137
ǒ137
VIǓ
VIǓ * 585
(kW)
(5)
Calculated Values
Table 7 shows a chart of standard resistor values for RUVLO for different options of the on-threshold (VTHD)
voltage. For most applications, only the on-threshold voltage should need to be adjusted. In this case select only
a value for RUVLO from right-hand column.
Table 7. Calculated Values of RUVLO for Various Values of VTHD
VTHD
RUVLO
7.0 V
23.2 kΩ
7.5 V
19.6 kΩ
8.0 V
16.9 kΩ
8.5 V
14.7 kΩ
9.0 V
13.0 kΩ
9.5 V
11.8 kΩ
10.0 V
10.5 kΩ
10.5 V
9.76 kΩ
11.0 V
8.87 kΩ
FEATURES OF THE PTH/PTV FAMILY OF NONISOLATED WIDE OUTPUT ADJUST POWER
MODULES
Soft-Start Power Up
The Auto-Track feature allows the power-up of multiple PTH/PTV modules to be directly controlled from the
Track pin. However in a stand-alone configuration, or when the Auto-Track feature is not being used, the Track
pin should be directly connected to the input voltage, VI (see Figure 18).
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14
Track
VI
2
VI
PTH08T240W
GND
3,4
CI
GND
Figure 18. Track Pin Connection
When the Track pin is connected to the input voltage the Auto-Track function is permanently disengaged. This
allows the module to power up entirely under the control of its internal soft-start circuitry. When power up is
under soft-start control, the output voltage rises to the set-point at a quicker and more linear rate.
From the moment a valid input voltage is applied, the soft-start control introduces a short time delay (typically
2 ms–10 ms) before allowing the output voltage to rise.
VI (5 V/div)
VO (2 V/div)
II (2 A/div)
t − Time − 4 ms/div
Figure 19. Power-Up Waveform
The output then progressively rises to the module’s setpoint voltage. Figure 19 shows the soft-start power-up
characteristic of the PTH08T240W operating from a 12-V input bus and configured for a 3.3-V output. The
waveforms were measured with a 10-A constant current load and the Auto-Track feature disabled. The initial rise
in input current when the input voltage first starts to rise is the charge current drawn by the input capacitors.
Power-up is complete within 15 ms.
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Overcurrent Protection
For protection against load faults, all modules incorporate output overcurrent protection. Applying a load that
exceeds the regulator's overcurrent threshold causes the regulated output to shut down. Following shutdown, the
module periodically attempts to recover by initiating a soft-start power-up. This is described as a hiccup mode of
operation, whereby the module continues in a cycle of successive shutdown and power up until the load fault is
removed. During this period, the average current flowing into the fault is significantly reduced. Once the fault is
removed, the module automatically recovers and returns to normal operation.
Overtemperature Protection (OTP)
A thermal shutdown mechanism protects the module’s internal circuitry against excessively high temperatures. A
rise in the internal temperature may be the result of a drop in airflow, or a high ambient temperature. If the
internal temperature exceeds the OTP threshold, the module’s Inhibit control is internally pulled low. This turns
the output off. The output voltage drops as the external output capacitors are discharged by the load circuit. The
recovery is automatic, and begins with a soft-start power up. It occurs when the sensed temperature decreases
by about 10°C below the trip point.
The overtemperature protection is a last resort mechanism to prevent thermal stress to the regulator.
Operation at or close to the thermal shutdown temperature is not recommended and reduces the long-term
reliability of the module. Always operate the regulator within the specified safe operating area (SOA) limits for
the worst-case conditions of ambient temperature and airflow.
On/Off Inhibit
For applications requiring output voltage on/off control, the PTH08T240W incorporates an Inhibit control pin. The
inhibit feature can be used wherever there is a requirement for the output voltage from the regulator to be turned
off.
The power modules function normally when the Inhibit pin is left open-circuit, providing a regulated output
whenever a valid source voltage is connected to VI with respect to GND.
Figure 20 shows the typical application of the inhibit function. Note the discrete transistor (Q1). The Inhibit input
has its own internal pull-up. An external pull-up resistor should never be used with the inhibit pin. The input is not
compatible with TTL logic devices. An open-collector (or open-drain) discrete transistor is recommended for
control.
VI
2, 6
VI
PTH08T240W
11
Inhibit/
UVLO
CI
1 = Inhibit
GND
3,4
Q1
BSS 138
GND
Figure 20. On/Off Inhibit Control Circuit
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Turning Q1 on applies a low voltage to the Inhibit control pin and disables the output of the module. If Q1 is then
turned off, the module executes a soft-start power-up sequence. A regulated output voltage is produced within 15
ms. Figure 21 shows the typical rise in both the output voltage and input current, following the turn-off of Q1. The
turn off of Q1 corresponds to the rise in the waveform, Q1 VDS. The waveforms were measured with a 16-A
constant current load.
VO (2 V/div)
II (2 A/div)
VINH (2 V/div)
t − Time − 4 ms/div
Figure 21. Power-Up Response from Inhibit Control
Remote Sense
Products with this feature incorporate one or two remote sense pins. Remote sensing improves the load
regulation performance of the module by allowing it to compensate for any IR voltage drop between its output
and the load. An IR drop is caused by the high output current flowing through the small amount of pin and trace
resistance.
To use this feature simply connect the Sense pins to the corresponding output voltage node, close to the load
circuit. If a sense pin is left open-circuit, an internal low-value resistor (15-Ω or less) connected between the pin
and the output node, ensures the output remains in regulation.
With the sense pin connected, the difference between the voltage measured directly between the VO and GND
pins, and that measured at the Sense pins, is the amount of IR drop being compensated by the regulator. This
should be limited to a maximum of 0.3 V.
The remote sense feature is not designed to compensate for the forward drop of nonlinear or frequency
dependent components that may be placed in series with the converter output. Examples include OR-ing
diodes, filter inductors, ferrite beads, and fuses. When these components are enclosed by the remote sense
connection they are effectively placed inside the regulation control loop, which can adversely affect the
stability of the regulator.
22
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Smart Sync
Smart Sync is a feature that allows multiple power modules to be synchronized to a common frequency. Driving
the Smart Sync pins with an external oscillator set to the desired frequency, synchronizes all connected modules
to the selected frequency. The synchronization frequency can be higher or lower than the nominal switching
frequency of the modules within the range of 240 kHz to 400 kHz (see Electrical Specifications table for
frequency limits). Synchronizing modules powered from the same bus, eliminates beat frequencies reflected back
to the input supply, and also reduces EMI filtering requirements. These are the benefits of Smart Sync. Power
modules can also be synchronized out of phase to minimize source current loading and minimize input
capacitance requirements. Figure 22 shows a standard circuit with two modules syncronized 180° out of phase
using a D flip-flop.
0
o
Track SYNC
VI = 5 V
TT
+Sense
VI
VO1
VO
PTH08T220W
SN74LVC2G74
–Sense
INH / UVLO
GND
VOAdj
Vcc
CLR
PRE
CLK
Q
Ci1
330 mF
RSET1
Co1
220 mF
fclock = 2 X fmodules
Q
D
GND
GND
180
o
Track SYNC
TT
+Sense
VI
VO2
VO
PTH08T240W
–Sense
INH / UVLO
GND
VOAdj
Ci2
220 mF
RSET2
Co2
220 mF
GND
Figure 22. Smart Sync Schematic
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The maximum input voltage allowed for proper synchronization is duty cycle limited. When using Smart Sync, the
maximum allowable input voltage varies as a function of output voltage and switching frequency. Operationally,
the maximum input voltage is inversely proportional to switching frequency. Synchronizing to a higher frequency
causes greater restrictions on the input voltage range. For a given switching frequency, Figure 23 shows how the
maximum input voltage varies with output voltage.
For example, for a module operating at 400 kHz and an output voltage of 1.2 V, the maximum input voltage is
10 V. Exceeding the maximum input voltage may cause in an increase in output ripple voltage and increased
output voltage variation.
As shown in Figure 23, input voltages below 6 V can operate down to the minimum output voltage over the entire
synchronization frequency range. See the Electrical Characteristics table for the synchronization frequency range
limits.
INPUT VOLTAGE
vs
OUTPUT VOLTAGE
15
14
VI − Input Voltage − V
13
12
11
fSW = 400 kHz
10
9
fSW = 350 kHz
fSW = 300 kHz
8
7
fSW = 240 kHz
6
5
0.7
0.9
1.1
1.3
1.5
1.7
1.9
2.1
2.3
2.5
VO − Output Voltage − V
Figure 23.
Auto-Track™ Function
The Auto-Track function is unique to the PTH/PTV family, and is available with all POLA products. Auto-Track
was designed to simplify the amount of circuitry required to make the output voltage from each module power up
and power down in sequence. The sequencing of two or more supply voltages during power up is a common
requirement for complex mixed-signal applications that use dual-voltage VLSI ICs such as the TMS320™ DSP
family, microprocessors, and ASICs.
How Auto-Track™ Works
Auto-Track works by forcing the module output voltage to follow a voltage presented at the Track control pin (1).
This control range is limited to between 0 V and the module set-point voltage. Once the track-pin voltage is
raised above the set-point voltage, the module output remains at its set-point (2). As an example, if the Track pin
of a 2.5-V regulator is at 1 V, the regulated output is 1 V. If the voltage at the Track pin rises to 3 V, the regulated
output does not go higher than 2.5 V.
When under Auto-Track control, the regulated output from the module follows the voltage at its Track pin on a
volt-for-volt basis. By connecting the Track pin of a number of these modules together, the output voltages follow
a common signal during power up and power down. The control signal can be an externally generated master
ramp waveform, or the output voltage from another power supply circuit (3). For convenience, the Track input
incorporates an internal RC-charge circuit. This operates off the module input voltage to produce a suitable rising
waveform at power up.
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Typical Application
The basic implementation of Auto-Track allows for simultaneous voltage sequencing of a number of Auto-Track
compliant modules. Connecting the Track inputs of two or more modules forces their track input to follow the
same collective RC-ramp waveform, and allows their power-up sequence to be coordinated from a common
Track control signal. This can be an open-collector (or open-drain) device, such as a power-up reset voltage
supervisor IC. See U3 in Figure 24.
To coordinate a power-up sequence, the Track control must first be pulled to ground potential. This should be
done at or before input power is applied to the modules. The ground signal should be maintained for at least
20 ms after input power has been applied. This brief period gives the modules time to complete their internal
soft-start initialization (4), enabling them to produce an output voltage. A low-cost supply voltage supervisor IC,
that includes a built-in time delay, is an ideal component for automatically controlling the Track inputs at power
up.
Figure 24 shows how the TL7712A supply voltage supervisor IC (U3) can be used to coordinate the sequenced
power up of PTH08T240W modules. The output of the TL7712A supervisor becomes active above an input
voltage of 3.6 V, enabling it to assert a ground signal to the common track control well before the input voltage
has reached the module's undervoltage lockout threshold. The ground signal is maintained until approximately 28
ms after the input voltage has risen above U3's voltage threshold, which is 4.3 V. The 28-ms time period is
controlled by the capacitor CT. The value of 2.2 µF provides sufficient time delay for the modules to complete
their internal soft-start initialization. The output voltage of each module remains at zero until the track control
voltage is allowed to rise. When U3 removes the ground signal, the track control voltage automatically rises. This
causes the output voltage of each module to rise simultaneously with the other modules, until each reaches its
respective set-point voltage.
Figure 25 shows the output voltage waveforms after input voltage is applied to the circuit. The waveforms, VO1
and VO2, represent the output voltages from the two power modules, U1 (3.3 V) and U2 (1.8 V), respectively.
VTRK, VO1, and VO2 are shown rising together to produce the desired simultaneous power-up characteristic.
The same circuit also provides a power-down sequence. When the input voltage falls below U3's voltage
threshold, the ground signal is re-applied to the common track control. This pulls the track inputs to zero volts,
forcing the output of each module to follow, as shown in Figure 26. Power down is normally complete before the
input voltage has fallen below the modules' undervoltage lockout. This is an important constraint. Once the
modules recognize that an input voltage is no longer present, their outputs can no longer follow the voltage
applied at their track input. During a power-down sequence, the fall in the output voltage from the modules is
limited by the Auto-Track slew rate capability.
Notes on Use of Auto-Track™
1. The Track pin voltage must be allowed to rise above the module set-point voltage before the module
regulates at its adjusted set-point voltage.
2. The Auto-Track function tracks almost any voltage ramp during power up, and is compatible with ramp
speeds of up to 1 V/ms.
3. The absolute maximum voltage that may be applied to the Track pin is the input voltage VI.
4. The module cannot follow a voltage at its track control input until it has completed its soft-start initialization.
This takes about 20 ms from the time that a valid voltage has been applied to its input. During this period, it
is recommended that the Track pin be held at ground potential.
5. The Auto-Track function is disabled by connecting the Track pin to the input voltage (VI). When Auto-Track is
disabled, the output voltage rises according to its softstart rate after input power has been applied.
6. The Auto-Track pin should never be used to regulate the module's output voltage for long-term, steady-state
operation.
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RTT
U1
AutoTrack TurboTrans
Smart
+Sense
Sync
VI = 12 V
VI
VO
PTH08T240W
VO1 = 3.3 V
Inhibit/
UVLO Prog
−Sense
VOAdj
GND
+
CO1
CI1
U3
7
2
1
3
RSET1
1.62 kW
8
V CC
SENSE
RESET
5
RESIN
TL7712A
REF
RESET
6
AutoTrack TurboTrans
Smart
+Sense
Sync
GND
4
CREF
0.1 mF
CT
2.2 mF
RTT
U2
CT
RRST
10 kW
VI
VO
PTH08T220W
VO2 = 1.8 V
Inhibit/
UVLO Prog
−Sense
VOAdj
GND
+
CO2
CI2
RSET2
4.75 kW
Figure 24. Sequenced Power Up and Power Down Using Auto-Track
VTRK (1 V/div)
VTRK (1 V/div)
VO1 (1 V/div)
VO1 (1 V/div)
VO2 (1 V/div)
VO2 (1 V/div)
t − Time − 20 ms/div
t − Time − 400 ms/div
Figure 25. Simultaneous Power Up
With Auto-Track Control
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Figure 26. Simultaneous Power Down
With Auto-Track Control
PACKAGE OPTION ADDENDUM
www.ti.com
7-Feb-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
PTH08T240WAD
ACTIVE
DIP MOD
ULE
EBS
11
49
Pb-Free
(RoHS)
Call TI
N / A for Pkg Type
PTH08T240WAH
ACTIVE
DIP MOD
ULE
EBS
11
49
TBD
Call TI
N / A for Pkg Type
PTH08T240WAS
ACTIVE
DIP MOD
ULE
EBT
11
49
TBD
Call TI
N / A for Pkg Type
PTH08T240WAST
ACTIVE
DIP MOD
ULE
EBT
11
250
TBD
Call TI
N / A for Pkg Type
PTH08T240WAZ
ACTIVE
DIP MOD
ULE
EBT
11
49
Pb-Free
(RoHS)
Call TI
Level-3-260C-168 HR
PTH08T240WAZT
ACTIVE
DIP MOD
ULE
EBT
11
250
Pb-Free
(RoHS)
Call TI
Level-3-260C-168 HR
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
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Applications
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amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Mailing Address:
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
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