Freescale Semiconductor Document Number: MPXA6115A Rev 7.1, 05/2012 Data Sheet: Technical Data High Temperature Accuracy Integrated Silicon Pressure Sensor for Measuring Absolute Pressure, On-Chip Signal Conditioned, Temperature Compensated and Calibrated The MPXxx6115A series sensor integrates on-chip, bipolar op amp circuitry and thin film resistor networks to provide a high output signal and temperature compensation. The small form factor and high reliability of onchip integration make the pressure sensor a logical and economical choice for the system designer. The MPXxx6115A series piezoresistive transducer is a state-of-the-art, monolithic, signal conditioned, silicon pressure sensor. This sensor combines advanced micromachining techniques, thin film metallization, and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. MPXA6115A MPXAZ6115A MPXH6115A MPXHZ6115A Series 15 to 115 kPa (2.2 to 16.7 psi) 0.2 to 4.8 V Output Application Examples • Aviation Altimeters • Industrial Controls • Engine Control/Manifold Absolute Pressure (MAP) • Weather Station and Weather Reporting Device Barometers Features • • • • • • • Resistant to High Humidity and Common Automotive Media Improved Accuracy at High Temperature Available in Small and Super Small Outline Packages 1.5% Maximum Error over 0° to 85°C Ideally suited for Microprocessor or Microcontroller-Based Systems Temperature Compensated from -40° to +125°C Durable Thermoplastic (PPS) Surface Mount Package ORDERING INFORMATION Package Device Name Case No. Option Small Outline Package (MPXA6115A Series) None # of Ports Single Dual Gauge Pressure Type Differential Absolute Device Marking MPXA6115A6U Rails 482 • MPXA6115A6T1 Tape and Reel 482 • MPXA6115AC6U Rails 482A • MPXA6115AC6T1 Tape and Reel 482A • MPXA6115AC7U Rails 482C • Small Outline Package (Media Resistant Gel) (MPXAZ6115A Series) • • • • • MPXA6115A MPXA6115A MPXA6115A MPXA6115A MPXA6115A MPXAZ6115A6U Rails 482 MPXAZ6115AC6U Rails 482A MPXAZ6115AC6T1 Tape and Reel 482A MPXAZ6115AP Trays 1369 MPXAZ6115APT1 Tape and Reel 1369 Super Small Outline Package (MPXH6115A Series) • • • • • • • • • • MPXAZ6115A MPXAZ6115A MPXAZ6115A MPXAZ6115A MPXAZ6115A MPXH6115A6U MPXH6115A6T1 MPXH6115AC6U MPXH6115AC6T1 • • • • • • • • MPXH6115A MPXH6115A MPXH6115A MPXH6115A Rails Tape and Reel Rails Tape and Reel 1317 1317 1317A 1317A © 2007-2012 Freescale Semiconductor, Inc. All rights reserved. ORDERING INFORMATION Small Outline Package (Media Resistant Gel) (MPXHZ6115A Series) MPXHZ6115A6U MPXHZ6115A6T1 MPXHZ6115AC6U MPXHZ6115AC6T1 Rails Tape and Reel Rails Tape and Reel 1317 1317 1317A 1317A • • • • • • • • MPXHZ6115A MPXHZ6115A MPXHZ6115A MPXHZ6115A SMALL OUTLINE PACKAGES MPXA6115A6U/T1 MPXAZ6115A6U CASE 482 MPXA6115AC6U/T1 MPXAZ6115AC6U/T1 CASE 482A MPXA6115AC7U CASE 482C MPXAZ6115AP/T1 CASE 1369 SUPER SMALL OUTLINE PACKAGES MPXH6115A6U/T1 MPXHZ6115A6U/T1 CASE 1317 MPXH6115AC6U/T1 MPXHZ6115AC6U/T1 CASE 1317A MPXA6115A 2 Sensors Freescale Semiconductor Operating Characteristics Table 1. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2) Characteristic Symbol Min Typ Max Unit Pressure Range POP 15 — 115 kPa Supply Voltage(1) VS 4.75 5.0 5.25 Vdc Supply Current Io — 6.0 10 mAdc Voff 0.133 0.200 0.268 Vdc Full Scale Output(3)(0 to 85°C) @ VS = 5.0 Volts VFSO 4.633 4.700 4.768 Vdc Full Scale Span(4)(0 to 85°C) @ VS = 5.0 Volts VFSS 4.433 4.500 4.568 Vdc — — — ±1.5 %VFSS Minimum Pressure Offset(2)(0 to 85°C) @ VS = 5.0 Volts Accuracy(5)(0 to 85°C) Sensitivity V/P — 45.0 — mV/kPa (6) tR — 1.0 — ms Warm-Up Time(7) — — 20 — ms Offset Stability(8) — — ±0.25 — %VFSS Response Time 1.Device is ratiometric within this specified excitation range. 2.Offset (Voff) is defined as the output voltage at the minimum rated pressure. 3.Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. 4. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 5.Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span at 25°C due to all sources of error including the following: Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25°C. TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C. TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative to 25°C. 6.Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7.Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. 8.Offset Stability is the product's output deviation when subjected to 1000 cycles of Pulsed Pressure, Temperature Cycling with Bias Test. Maximum Ratings Table 2. Maximum Ratings(1) Symbol Value Units Maximum Pressure (P1 > P2) Rating Pmax 400 kPa Storage Temperature Tstg -40° to +125° °C TA -40° to +125° °C Output Source Current @ Full Scale Output I o+ 0.5 mAdc Output Sink Current @ Minimum Pressure Offset(2) Io - -0.5 mAdc Operating Temperature (2) 1.Exposure beyond the specified limits may cause permanent damage or degradation to the device. 2. Maximum Output Current is controlled by effective impedance from Vout to Gnd or Vout to VS in the application circuit. MPXA6115A Sensors Freescale Semiconductor, Inc. 3 Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. VS 2 Thin Film Temperature Compensation and Gain Stage #1 Sensing Element 3 Gain Stage #2 and Ground Reference Shift Circuitry 4 VOUT Pins 1, 5, 6, 7, and 8 are NO CONNECTS GND Figure 1. Fully Integrated Pressure Sensor Schematic On-chip Temperature Compensation and Calibration Figure 2 illustrates the absolute sensing chip in the basic Super Small Outline chip carrier (Case 1317). Figure 3 shows a typical application circuit (output source current operation). Figure 4 shows the sensor output signal relative to pressure input. Typical minimum and maximum output curves are shown for operation over 0° to 85°C temperature range. The output will saturate outside of the rated pressure range. A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPXxx6115A series pressure sensor operating characteristics, internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. Fluorosilicone Gel Die Coat Stainless Steel Cap Die P1 Wire Bond Thermoplastic Case Lead Frame Absolute Element Die Bond Sealed Vacuum Reference Figure 2. Cross Sectional Diagram SSOP/SOP (not to scale) +5.0 V VS Pin 2 100 nF MPXxx6115A to ADC Vout Pin 4 GND Pin 3 47 pF 51 K Figure 3. Typical Application Circuit (Output Source Current Operation) MPXA6115A 4 Sensors Freescale Semiconductor 5.0 4.5 4.0 Output (Volts) 3.5 Transfer Function: Vout = Vs* (.009*P-.095) ± Error VS = 5.0 Vdc TEMP = 0 to 85ºC MAX TYP 3.0 2.5 2.0 1.5 MIN 1.0 0.5 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 105 110 115 120 0 Pressure (ref: to sealed vacuum) in kPa Figure 4. Output vs. Absolute Pressure Transfer Function (MPXxx6115A) Nominal Transfer Value: Vout = VS x (0.009 x P - 0.095) ± (Pressure Error x Temp. Factor x 0.009 x VS) VS = 5.0 ± 0.25 Vdc Temperature Error Band MPXxxA6115A SERIES 4.0 Break Points 3.0 Temperature Error Factor 2.0 Temp Multiplier - 40 0 to 85 125 3 1 1.75 1.0 0.0 -40 -20 0 20 40 60 80 100 120 140 Temperature in Cº NOTE: The Temperature Multiplier is a linear response from 0ºC to -40ºC and from 85ºC to 125ºC Pressure Error Band Error Limits for Pressure 3.0 Pressure Error (kPa) 2.0 1.0 0.0 20 40 60 80 100 120 Pressure (in kPa) -1.0 -2.0 Pressure 15 to 115 (kPa) Error (Max) ±1.5 (kPa) -3.0 MPXA6115A Sensors Freescale Semiconductor, Inc. 5 MINIMUM RECOMMENDED FOOTPRINT FOR SMALL AND SUPER SMALL PACKAGES Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor package must be the correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self-align when subjected to a solder reflow process. It is always recommended to fabricate boards with a solder mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts. 0.100 TYP 2.54 0.660 16.76 0.060 TYP 8X 1.52 0.300 7.62 inch mm 0.100 TYP 8X 2.54 Figure 5. SOP Footprint (Case 482) 0.050 1.27 TYP 0.387 9.83 0.150 3.81 0.027 TYP 8X 0.69 0.053 TYP 8X 1.35 inch mm Figure 6. SSOP Footprint (Case 1317 and 1317A) MPXA6115A 6 Sensors Freescale Semiconductor PACKAGE DIMENSIONS -A- D 8 PL 0.25 (0.010) 4 5 M T B A S S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. -BG 8 1 S N H C J -TSEATING PLANE PIN 1 IDENTIFIER K M DIM A B C D G H J K M N S INCHES MIN MAX 0.415 0.425 0.415 0.425 0.212 0.230 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0˚ 7˚ 0.405 0.415 0.709 0.725 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 5.38 5.84 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0˚ 7˚ 10.29 10.54 18.01 18.41 CASE 482-01 ISSUE O SMALL OUTLINE PACKAGE -A- D 4 0.25 (0.010) 5 N 8 PL M T B S A S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. -BG 8 1 S W V C H J -TK M PIN 1 IDENTIFIER DIM A B C D G H J K M N S V W INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0˚ 7˚ 0.444 0.448 0.709 0.725 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0˚ 7˚ 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17 SEATING PLANE CASE 482A-01 ISSUE A SMALL OUTLINE PACKAGE MPXA6115A Sensors Freescale Semiconductor, Inc. 7 PACKAGE DIMENSIONS NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. 6. DIMENSION S TO CENTER OF LEAD WHEN FORMED PARALLEL. –A– 4 5 N –B– G 0.25 (0.010) 8 M T B D 8 PL S A S 1 DIM A B C D G J K M N S V W DETAIL X S W V PIN 1 IDENTIFIER C –T– INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.026 0.034 0.100 BSC 0.009 0.011 0.100 0.120 0 15 0.444 0.448 0.540 0.560 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.66 0.864 2.54 BSC 0.23 0.28 2.54 3.05 0 15 11.28 11.38 13.72 14.22 6.22 6.48 2.92 3.17 SEATING PLANE K M J DETAIL X CASE 482C-03 ISSUE B SMALL OUTLINE PACKAGE MPXA6115A 8 Sensors Freescale Semiconductor PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MPXA6115A Sensors Freescale Semiconductor, Inc. 9 PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MPXA6115A 10 Sensors Freescale Semiconductor PACKAGE DIMENSIONS PAGE 1 OF 3 CASE 1317-04 ISSUE H SUPER SMALL OUTLINE PACKAGE MPXA6115A Sensors Freescale Semiconductor, Inc. 11 PACKAGE DIMENSIONS PAGE 2 OF 3 CASE 1317-04 ISSUE H SUPER SMALL OUTLINE PACKAGE MPXA6115A 12 Sensors Freescale Semiconductor PACKAGE DIMENSIONS PAGE 3 OF 3 CASE 1317-04 ISSUE H SUPER SMALL OUTLINE PACKAGE MPXA6115A Sensors Freescale Semiconductor, Inc. 13 PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 1317A-04 ISSUE D SUPER SMALL OUTLINE PACKAGE MPXA6115A 14 Sensors Freescale Semiconductor PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 1317A-04 ISSUE D SUPER SMALL OUTLINE PACKAGE MPXA6115A Sensors Freescale Semiconductor, Inc. 15 Table 3. Revision History Revision number Revision date 7.1 05/2012 Description of changes • Updated Package Drawing 98ARH99066A was Rev. F, updated to Rev. H, MPXA6115A 16 Sensors Freescale Semiconductor How to Reach Us: Information in this document is provided solely to enable system and software Home Page: www.freescale.com implementers to use Freescale products. There are no express or implied copyright Web Support: http://www.freescale.com/support information in this document. licenses granted hereunder to design or fabricate any integrated circuits based on the Freescale reserves the right to make changes without further notice to any products herein. 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Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. All other product or service names are the property of their respective owners. © 2012 Freescale Semiconductor, Inc. All rights reserved. MPXA6115A Rev. 7.1 05/2012