Pressure Freescale Semiconductor Data Sheet: Technical Data MPXC2011DT1 Rev 9, 10/2012 High Volume Sensor for Low Pressure Applications MPXC2011DT1 Freescale Semiconductor has developed a low cost, high volume, miniature pressure sensor package which is ideal as a sub-module component or a disposable unit. The unique concept of the Chip Pak allows great flexibility in system design while allowing an economic solution for the designer. This new chip carrier package uses Freescale Semiconductor's unique sensor die with its piezoresistive technology, along with the added feature of on-chip, thin-film temperature compensation and calibration. NOTE:Freescale Semiconductor is also offering the Chip Pak package in application-specific configurations, which will have an “SPX” prefix, followed by a four-digit number, unique to the specific customer Features • • • • • Low Cost Integrated Temperature Compensation and Calibration Ratiometric to Supply Voltage Polysulfone Case Material (ISO 10993) Provided in Easy-to-Use Tape and Reel Pressure Sensors 0 to 75 mmHg (0 to 10 kPa) Application Examples • • • • Respiratory Diagnostics Air Movement Control Controllers Pressure Switching ORDERING INFORMATION Device Name MPXC2011DTI Package Options Tape and Reel Case No. 423A Gauge Pressure Type Differential • Absolute Device Marking Date Code, Lot ID CHIP PAK PACKAGE MPXC2011DT1 CASE 423A-03 NOTE: The die and wire bonds are exposed on the front side of the Chip Pak (pressure is applied to the backside of the device). Front side die and wire protection must be provided in the customer's housing. Use caution when handling the devices during all processes. © 2006, 2008-2010, 2012 Freescale Semiconductor, Inc. All rights reserved. Pressure Freescale Semiconductor's MPXC2011DT1 Pressure Sensor has been designed for medical usage by combining the performance of Freescale Semiconductor's shear stress pressure sensor design and the use of biomedically approved materials. Materials with a proven history in medical situations have been chosen to provide a sensor that can be used with confidence in applications, such as invasive blood pressure monitoring. It can be sterilized using ethylene oxide. The portions of the pressure sensor that are required to be biomedically approved are the rigid housing and the gel coating. The rigid housing is molded from a white, medical grade polysulfone that has passed extensive biological testing including: 10993-5:1999, 10993-10:2002, and 1099311:1993. The MPXC2011DT1 contains a silicone dielectric gel which covers the silicon piezoresistive sensing element. The gel is a nontoxic, nonallergenic elastomer system which meets all USP XX Biological Testing Class V requirements. The properties of the gel allow it to transmit pressure uniformly to the diaphragm surface, while isolating the internal electrical connections from the corrosive effects of fluids, such as saline solution. The gel provides electrical isolation sufficient to withstand defibrillation testing, as specified in the proposed Association for the Advancement of Medical Instrumentation (AAMI) Standard for blood pressure transducers. A biomedically approved opaque filler in the gel prevents bright operating room lights from affecting the performance of the sensor. MPXC2011DT1 2 Sensors Freescale Semiconductor, Inc. Pressure MAXIMUM RATINGS Table 1. Maximum Ratings(1) Rating Symbol Value Unit Maximum Pressure (Backside) Pmax 75 kPa Storage Temperature Tstg -25 to +85 C Operating Temperature TA +15 to +40 C 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. OPERATING CHARACTERISTICS Table 2. Operating Characteristics (VS = 10 Vdc, TA = 25C unless otherwise noted, P1 > P2) Characteristic Symbol Min Typ Max Unit Pressure Range(1) POP 0 — 10 kPa Supply Voltage(2) VS — 3 10 Vdc Supply Current Io — 6.0 — mAdc VFSS 24 25 26 mV Voff -1.0 — 1.0 mV Sensitivity V/P — 2.5 — mV/kPa Linearity(5) — -1.0 — 1.0 %VFSS Pressure Hysteresis(5) (0 to 10 kPa) — — 0.1 — %VFSS Temperature Hysteresis(5) (+15C to +40C) — — 0.1 — %VFSS TCVFSS -1.0 — 1.0 %VFSS TCVoff -1.0 — 1.0 mV Input Impedance Zin 1300 — 2550 Output Impedance Zout 1400 — 3000 Response Time(6) (10% to 90%) tR — 1.0 — ms Warm-Up — — 20 v ms Offset Stability(7) — — 0.5 — %VFSS Full Scale Span(3) Offset(4) Temperature Effect on Full Scale Span(5) Temperature Effect on Offset(5) 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self-heating. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following: Linearity: Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range. Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25C. TcSpan: Output deviation at full rated pressure over the temperature range of 0 to 85C, relative to 25C. TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85C, relative to 25C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Offset stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MPXC2011DT1 Sensors Freescale Semiconductor, Inc. 3 Pressure PACKAGE DIMENSIONS A M C L F N B 1 2 3 4 V K DETAIL A –T– D1 G J H FRONT VIEW E END VIEW AC NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI 3. Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 4. F AA AB AD D2 DETAIL A BACK VIEW DIM A B C D1 D2 E F G H J K L M N V AA AB AC AD INCHES MIN MAX 0.240 0.260 0.350 0.370 0.140 0.150 0.012 0.020 0.014 0.022 0.088 0.102 0.123 0.128 0.045 0.055 0.037 0.047 0.007 0.011 0.120 0.140 0.095 0.105 0.165 0.175 0.223 0.239 0.105 0.115 0.095 0.107 0.015 0.035 0.120 0.175 0.100 0.115 MILLIMETERS MIN MAX 6.10 6.60 8.89 9.40 3.56 3.81 0.30 0.51 0.36 0.56 2.24 2.59 3.12 3.25 1.14 1.40 0.94 1.19 0.18 0.28 3.05 3.56 2.41 2.67 4.19 4.45 5.66 6.07 2.67 2.92 2.41 2.72 0.38 0.89 3.05 4.45 2.54 2.92 STYLE 2: 1: STYLE PINPIN 1. 1. GND VCC 2. 2.S++OUT 3. 3.Vs–OUT 4. 4.S-GROUND CASE 423A-03 ISSUE C CHIP PAK PACKAGE MPXC2011DT1 4 Sensors Freescale Semiconductor, Inc. Pressure Table 3. Revision History Revision number Revision date Description of changes 9 10/2012 • Deleted references to device number MPXC2012DT (a no-gel option) throughout the document MPXC2011DT1 5 Sensors Freescale Semiconductor, Inc. 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