Pressure Freescale Semiconductor Document Number: MPXH6300A Rev 5.1, 05/2012 Data Sheet: Technical Data High Temperature Accuracy Integrated Silicon Pressure Sensor for Measuring Absolute Pressure, On-Chip Signal Conditioned, Temperature Compensated and Calibrated MPXH6300A Series 20 to 304 kPa (3.0 to 42 psi) 0.3 to 4.9 V Output The Freescale MPXH6300A series sensor integrates on-chip, bipolar op amp circuitry and thin film resistor networks to provide a high output signal and temperature compensation. The small form factor and high reliability of on-chip integration make the Freescale pressure sensor a logical and economical choice for the system designer. The MPXH6300A series piezoresistive transducer is a state-of-the-art, monolithic, signal conditioned, silicon pressure sensor. This sensor combines advanced micromachining techniques, thin film metallization, and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. Application Examples • Industrial Controls • Engine Control/Manifold Absolute Pressure (MAP) Features • • • • • • Improved Accuracy at High Temperature Available in Super Small Outline Packages 1.5% Maximum Error over 0° to 85°C Ideally suited for Microprocessor or Microcontroller-Based Systems Temperature Compensated from –40° to +125°C Durable Thermoplastic (PPS) Surface Mount Package ORDERING INFORMATION Package Case Device Name Options No. Super Small Outline Package (MPXH6300A Series) MPXH6300A6U Rail 1317 MPXH6300A6T1 Tape & Reel 1317 MPXH6300AC6U Rail 1317A MPXH6300AC6T1 Tape & Reel 1317A None # of Ports Single Dual Gauge Pressure Type Differential Absolute • • • • • • • • SUPER SMALL OUTLINE PACKAGES MPXH6300A6U/6T1 CASE 1317 MPXH6300AC6U/6T1 CASE 1317A © 2007, 2010, 2012 Freescale Semiconductor, Inc. All rights reserved. Device Marking MPXH6300A MPXH6300A MPXH6300A MPXH6300A Pressure Operating Characteristics Table 1. Operating Characteristics (VS = 5.1 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Characteristic Symbol Min Typ Max Unit Pressure Range POP 20 — 304 kPa Supply Voltage(1) VS 4.74 5.1 5.46 Vdc Supply Current Io — 6.0 10 mAdc Minimum Pressure Offset @ VS = 5.1 Volts(2) (0 to 85°C) Voff 0.241 0.306 0.371 Vdc Full Scale Output @ VS = 5.1 Volts(3) (0 to 85°C) VFSO 4.847 4.912 4.977 Vdc Full Scale Span @ VS = 5.1 Volts(4) (0 to 85°C) VFSS 4.476 4.606 4.736 Vdc Accuracy(5) (0 to 85°C) — — — ±1.5 %VFSS V/P — 16.2 — mV/kPa Response Time(6) tR — 1.0 — ms (7) — — 20 — ms — — ±0.25 — %VFSS Sensitivity Warm-Up Time Offset Stability (8) 1. Device is ratiometric within this specified excitation range. 2. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 3. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. 4. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 5. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span at 25°C due to all sources of error including the following: Linearity: Temperature Hysteresis: Pressure Hysteresis: TcSpan: TcOffset: Variation from Nominal: Output deviation from a straight line relationship with pressure over the specified pressure range. Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C. Output deviation over the temperature range of 0 to 85°C, relative to 25°C. Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C. The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. 8. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MPXH6300A 2 Sensors Freescale Semiconductor, Inc. Pressure Maximum Ratings Table 2. Maximum Ratings(1) Rating Symbol Value Units Maximum Pressure (P1 > P2) Pmax 1200 kPa Storage Temperature Tstg -40° to +125° °C Operating Temperature TA -40° to +125° °C Output Source Current @ Full Scale Output(2) I o+ 0.5 mAdc Output Sink Current @ Minimum Pressure Offset(2) Io - -0.5 mAdc 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. 2. Maximum Output Current is controlled by effective impedance from VOUT to Gnd or VOUT to VS in the application circuit. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. VS 2 Thin Film Temperature Compensation and Gain Stage #1 Sensing Element GND 3 Gain Stage #2 and Ground Reference Shift Circuitry 4 VOUT Pins 1, 5, 6, 7, and 8 are NO CONNECTS Figure 1. Fully Integrated Pressure Sensor Schematic MPXH6300A Sensors Freescale Semiconductor, Inc. 3 Pressure On-chip Temperature Compensation and Calibration Figure 2 illustrates the absolute sensing chip in the basic Super Small Outline chip carrier (Case 1317). Figure 3 illustrates a typical application circuit (output source current operation). Figure 4 shows the sensor output signal relative to pressure input. Typical minimum and maximum output curves are shown for operation over 0 to 85°C temperature range. The output will saturate outside of the rated pressure range. Fluoro Silicone Gel Die Coat Die Wire Bond P1 A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPXH6300A series pressure sensor operating characteristics, internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. +5.1 V Stainless Steel Cap Thermoplastic Case Lead Frame VS Pin 2 MPXH6300A 100 nF to ADC Vout Pin 4 GND Pin 3 47 pF 51 K Die Bond Absolute Element Sealed Vacuum Reference Figure 2. Cross Sectional Diagram SSOP (not to scale) 5.0 4.5 4.0 Output (Volts) 3.5 Figure 3. Typical Application Circuit (Output Source Current Operation) Transfer Function: Vout = Vs*(.00318*P-.00353) ± Error VS = 5.1 Vdc Temperature = 0 to 85°C 3.0 2.5 MAX TYP 2.0 1.5 0.5 0 MIN 20 35 50 65 80 95 110 125 140 155 170 185 200 215 230 245 260 275 290 304 1.0 Pressure (Reference to Sealed Vacuum) in kPa Figure 4. Output vs. Absolute Pressure MPXH6300A 4 Sensors Freescale Semiconductor, Inc. Pressure Transfer Function (MPXH6300A) Nominal Transfer Value: Vout = VS x (0.00318 x P - 0.00353) ± (Pressure Error x Temp Factor x 0.00318 x VS) VS = 5.1 ± 0.36 Vdc Temperature Error Band MPXH6300A Series 4.0 Break Points 3.0 Temperature Error Factor 2.0 Temp Multiplier -40 0 to 85 125 3 1 3 1.0 0.0 -40 -20 0 20 40 60 80 100 120 140 Temperature in °C NOTE: The Temperature Multiplier is a linear response from 0°C to -40°C and from 85°C to 125°C. Pressure Error Band Error Limits for Pressure 4.0 Pressure Error (kPa) 3.0 2.0 1.0 0.0 -1.0 20 60 100 140 180 220 260 300 Pressure (in kPa) -2.0 -3.0 Pressure Error (Max) -4.0 20 to 304 (kPa) ±4.0 (kPa) MPXH6300A Sensors Freescale Semiconductor, Inc. 5 Pressure MINIMUM RECOMMENDED FOOTPRINT FOR SUPER SMALL PACKAGES Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor package must be the correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self-align when subjected to a 0.050 1.27 TYP solder reflow process. It is always recommended to fabricate boards with a solder mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts. 0.387 9.83 0.150 3.81 0.027 TYP 8X 0.69 0.053 TYP 8X 1.35 inch mm Figure 5. SSOP Footprint (Case 1317 and 1317A) MPXH6300A 6 Sensors Freescale Semiconductor, Inc. Pressure PACKAGE DIMENSIONS PAGE 1 OF 3 CASE 1317-04 ISSUE H SUPER SMALL OUTLINE PACKAGE MPXH6300A Sensors Freescale Semiconductor, Inc. 7 Pressure PACKAGE DIMENSIONS PAGE 2 OF 3 CASE 1317-04 ISSUE H SUPER SMALL OUTLINE PACKAGE MPXH6300A 8 Sensors Freescale Semiconductor, Inc. Pressure PACKAGE DIMENSIONS PAGE 3 OF 3 CASE 1317-04 ISSUE H SUPER SMALL OUTLINE PACKAGE MPXH6300A Sensors Freescale Semiconductor, Inc. 9 Pressure PACKAGE DIMENSIONS CASE 1317A-04 ISSUE D SUPER SMALL OUTLINE PACKAGE MPXH6300A 10 Sensors Freescale Semiconductor, Inc. Pressure PACKAGE DIMENSIONS CASE 1317A-04 ISSUE D SUPER SMALL OUTLINE PACKAGE MPXH6300A Sensors Freescale Semiconductor, Inc. 11 Pressure Table 3. Revision History Revision number Revision date 5.1 05/2012 Description of changes • Updated Package Drawing 98ARH99066A was Rev. F, updated to Rev. H. MPXH6300A 12 Sensors Freescale Semiconductor, Inc. How to Reach Us: Information in this document is provided solely to enable system and software Home Page: www.freescale.com implementers to use Freescale products. There are no express or implied copyright Web Support: http://www.freescale.com/support information in this document. licenses granted hereunder to design or fabricate any integrated circuits based on the Freescale reserves the right to make changes without further notice to any products herein. Freescale makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including “typicals,” must be validated for each customer application by customer’s technical experts. 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