TI SN74LS688DW

PACKAGE OPTION ADDENDUM
www.ti.com
4-Jun-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
84151012A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE N / A for Pkg Type
84151012A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE N / A for Pkg Type
8415101RA
ACTIVE
CDIP
J
20
1
TBD
A42 SNPB
N / A for Pkg Type
8415101RA
ACTIVE
CDIP
J
20
1
TBD
A42 SNPB
N / A for Pkg Type
8415101SA
ACTIVE
CFP
W
20
1
TBD
A42
N / A for Pkg Type
8415101SA
ACTIVE
CFP
W
20
1
TBD
A42
N / A for Pkg Type
84152012A
ACTIVE
LCCC
FK
20
1
TBD
8415201RA
ACTIVE
CDIP
J
20
1
TBD
8415201SA
ACTIVE
CFP
W
20
1
TBD
84153012A
ACTIVE
LCCC
FK
20
1
TBD
8415301RA
ACTIVE
CDIP
J
20
1
TBD
Lead/Ball Finish
MSL Peak Temp (3)
POST-PLATE N / A for Pkg Type
A42 SNPB
N / A for Pkg Type
A42
N / A for Pkg Type
POST-PLATE N / A for Pkg Type
A42 SNPB
N / A for Pkg Type
8415301SA
ACTIVE
CFP
W
20
1
TBD
A42
N / A for Pkg Type
SN54LS682J
ACTIVE
CDIP
J
20
1
TBD
A42 SNPB
N / A for Pkg Type
SN54LS682J
ACTIVE
CDIP
J
20
1
TBD
A42 SNPB
N / A for Pkg Type
SN54LS684J
ACTIVE
CDIP
J
20
1
TBD
A42 SNPB
N / A for Pkg Type
SN54LS688J
ACTIVE
CDIP
J
20
1
TBD
A42 SNPB
N / A for Pkg Type
SN74LS682DW
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS682DW
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS682DWE4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS682DWE4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS682DWG4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS682DWG4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS682DWR
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS682DWR
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS682DWRE4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS682DWRE4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS682DWRG4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS682DWRG4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS682N
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74LS682N
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74LS682NE4
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74LS682NE4
ACTIVE
PDIP
N
20
20
Pb-Free
CU NIPDAU
N / A for Pkg Type
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
4-Jun-2007
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74LS682NSR
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS682NSR
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS682NSRE4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS682NSRE4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS682NSRG4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS682NSRG4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS684DW
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS684DWE4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS684DWG4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS684DWR
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS684DWRE4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS684DWRG4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS684N
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74LS684NE4
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74LS684NSR
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS684NSRE4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS684NSRG4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS686DW
OBSOLETE
SOIC
DW
24
TBD
Call TI
Call TI
SN74LS686NT
OBSOLETE
PDIP
NT
24
TBD
Call TI
Call TI
SN74LS687NT
OBSOLETE
PDIP
NT
24
TBD
Call TI
Call TI
SN74LS687NT
OBSOLETE
PDIP
NT
24
TBD
Call TI
Call TI
SN74LS688DW
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS688DWE4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS688DWG4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS688DWR
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS688DWRE4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS688DWRG4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(RoHS)
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
4-Jun-2007
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74LS688N
ACTIVE
PDIP
N
20
Lead/Ball Finish
CU NIPDAU
MSL Peak Temp (3)
20
Pb-Free
(RoHS)
N / A for Pkg Type
TBD
Call TI
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74LS688N3
OBSOLETE
PDIP
N
20
SN74LS688NE4
ACTIVE
PDIP
N
20
SN74LS688NSR
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS688NSRE4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS688NSRG4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SNJ54LS682FK
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE N / A for Pkg Type
SNJ54LS682FK
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE N / A for Pkg Type
SNJ54LS682J
ACTIVE
CDIP
J
20
1
TBD
A42 SNPB
N / A for Pkg Type
SNJ54LS682J
ACTIVE
CDIP
J
20
1
TBD
A42 SNPB
N / A for Pkg Type
SNJ54LS682W
ACTIVE
CFP
W
20
1
TBD
A42
N / A for Pkg Type
A42
N / A for Pkg Type
SNJ54LS682W
ACTIVE
CFP
W
20
1
TBD
SNJ54LS684FK
ACTIVE
LCCC
FK
20
1
TBD
SNJ54LS684J
ACTIVE
CDIP
J
20
1
TBD
Call TI
POST-PLATE N / A for Pkg Type
A42 SNPB
N / A for Pkg Type
A42
N / A for Pkg Type
SNJ54LS684W
ACTIVE
CFP
W
20
1
TBD
SNJ54LS688FK
ACTIVE
LCCC
FK
20
1
TBD
SNJ54LS688J
ACTIVE
CDIP
J
20
1
TBD
A42 SNPB
N / A for Pkg Type
SNJ54LS688W
ACTIVE
CFP
W
20
1
TBD
A42
N / A for Pkg Type
POST-PLATE N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
4-Jun-2007
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
19-May-2007
TAPE AND REEL INFORMATION
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
Device
19-May-2007
Package Pins
Site
Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN74LS682DWR
DW
20
MLA
330
24
10.8
13.0
2.7
12
24
Q1
SN74LS682NSR
NS
20
MLA
330
24
8.2
13.0
2.5
12
24
Q1
SN74LS684DWR
DW
20
MLA
330
24
10.8
13.0
2.7
12
24
Q1
SN74LS684NSR
NS
20
MLA
330
24
8.2
13.0
2.5
12
24
Q1
SN74LS688DWR
DW
20
MLA
330
24
10.8
13.0
2.7
12
24
Q1
SN74LS688NSR
NS
20
MLA
330
24
8.2
13.0
2.5
12
24
Q1
TAPE AND REEL BOX INFORMATION
Device
Package
Pins
Site
Length (mm)
Width (mm)
Height (mm)
SN74LS682DWR
DW
20
MLA
333.2
333.2
31.75
SN74LS682NSR
NS
20
MLA
333.2
333.2
31.75
SN74LS684DWR
DW
20
MLA
333.2
333.2
31.75
SN74LS684NSR
NS
20
MLA
333.2
333.2
31.75
SN74LS688DWR
DW
20
MLA
333.2
333.2
31.75
SN74LS688NSR
NS
20
MLA
333.2
333.2
31.75
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
19-May-2007
Pack Materials-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
84151012A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE N / A for Pkg Type
84151012A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE N / A for Pkg Type
8415101RA
ACTIVE
CDIP
J
20
1
TBD
A42 SNPB
N / A for Pkg Type
8415101RA
ACTIVE
CDIP
J
20
1
TBD
A42 SNPB
N / A for Pkg Type
8415101SA
ACTIVE
CFP
W
20
1
TBD
A42
N / A for Pkg Type
8415101SA
ACTIVE
CFP
W
20
1
TBD
A42
N / A for Pkg Type
84152012A
ACTIVE
LCCC
FK
20
1
TBD
8415201RA
ACTIVE
CDIP
J
20
1
TBD
8415201SA
ACTIVE
CFP
W
20
1
TBD
84153012A
ACTIVE
LCCC
FK
20
1
TBD
8415301RA
ACTIVE
CDIP
J
20
1
TBD
Lead/Ball Finish
MSL Peak Temp (3)
POST-PLATE N / A for Pkg Type
A42 SNPB
N / A for Pkg Type
A42
N / A for Pkg Type
POST-PLATE N / A for Pkg Type
A42 SNPB
N / A for Pkg Type
8415301SA
ACTIVE
CFP
W
20
1
TBD
A42
N / A for Pkg Type
SN54LS682J
ACTIVE
CDIP
J
20
1
TBD
A42 SNPB
N / A for Pkg Type
SN54LS682J
ACTIVE
CDIP
J
20
1
TBD
A42 SNPB
N / A for Pkg Type
SN54LS684J
ACTIVE
CDIP
J
20
1
TBD
A42 SNPB
N / A for Pkg Type
SN54LS688J
ACTIVE
CDIP
J
20
1
TBD
A42 SNPB
N / A for Pkg Type
SN74LS682DW
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS682DW
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS682DWE4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS682DWE4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS682DWG4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS682DWG4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS682DWR
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS682DWR
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS682DWRE4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS682DWRE4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS682DWRG4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS682DWRG4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS682N
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74LS682N
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74LS682NE4
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74LS682NE4
ACTIVE
PDIP
N
20
20
Pb-Free
CU NIPDAU
N / A for Pkg Type
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74LS682NSR
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS682NSR
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS682NSRE4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS682NSRE4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS682NSRG4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS682NSRG4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS684DW
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS684DWE4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS684DWG4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS684DWR
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS684DWRE4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS684DWRG4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS684N
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74LS684NE4
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74LS684NSR
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS684NSRE4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS684NSRG4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS686DW
OBSOLETE
SOIC
DW
24
TBD
Call TI
Call TI
SN74LS686NT
OBSOLETE
PDIP
NT
24
TBD
Call TI
Call TI
SN74LS687NT
OBSOLETE
PDIP
NT
24
TBD
Call TI
Call TI
SN74LS687NT
OBSOLETE
PDIP
NT
24
TBD
Call TI
Call TI
SN74LS688DW
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS688DWE4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS688DWG4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS688DWR
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS688DWRE4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS688DWRG4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(RoHS)
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74LS688N
ACTIVE
PDIP
N
20
Lead/Ball Finish
CU NIPDAU
MSL Peak Temp (3)
20
Pb-Free
(RoHS)
N / A for Pkg Type
TBD
Call TI
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74LS688N3
OBSOLETE
PDIP
N
20
SN74LS688NE4
ACTIVE
PDIP
N
20
SN74LS688NSR
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS688NSRE4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS688NSRG4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SNJ54LS682FK
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE N / A for Pkg Type
SNJ54LS682FK
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE N / A for Pkg Type
SNJ54LS682J
ACTIVE
CDIP
J
20
1
TBD
A42 SNPB
N / A for Pkg Type
SNJ54LS682J
ACTIVE
CDIP
J
20
1
TBD
A42 SNPB
N / A for Pkg Type
SNJ54LS682W
ACTIVE
CFP
W
20
1
TBD
A42
N / A for Pkg Type
A42
N / A for Pkg Type
SNJ54LS682W
ACTIVE
CFP
W
20
1
TBD
SNJ54LS684FK
ACTIVE
LCCC
FK
20
1
TBD
SNJ54LS684J
ACTIVE
CDIP
J
20
1
TBD
Call TI
POST-PLATE N / A for Pkg Type
A42 SNPB
N / A for Pkg Type
A42
N / A for Pkg Type
SNJ54LS684W
ACTIVE
CFP
W
20
1
TBD
SNJ54LS688FK
ACTIVE
LCCC
FK
20
1
TBD
SNJ54LS688J
ACTIVE
CDIP
J
20
1
TBD
A42 SNPB
N / A for Pkg Type
SNJ54LS688W
ACTIVE
CFP
W
20
1
TBD
A42
N / A for Pkg Type
POST-PLATE N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Oct-2007
TAPE AND REEL BOX INFORMATION
Device
Package Pins
Site
Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN74LS682DWR
DW
20
SITE 41
330
24
10.8
13.0
2.7
12
24
Q1
SN74LS682NSR
NS
20
SITE 41
330
24
8.2
13.0
2.5
12
24
Q1
SN74LS684DWR
DW
20
SITE 41
330
24
10.8
13.0
2.7
12
24
Q1
SN74LS684NSR
NS
20
SITE 41
330
24
8.2
13.0
2.5
12
24
Q1
SN74LS688DWR
DW
20
SITE 41
330
24
10.8
13.0
2.7
12
24
Q1
SN74LS688NSR
NS
20
SITE 41
330
24
8.2
13.0
2.5
12
24
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Oct-2007
Device
Package
Pins
Site
Length (mm)
Width (mm)
Height (mm)
SN74LS682DWR
DW
20
SITE 41
346.0
346.0
41.0
SN74LS682NSR
NS
20
SITE 41
346.0
346.0
41.0
SN74LS684DWR
DW
20
SITE 41
346.0
346.0
41.0
SN74LS684NSR
NS
20
SITE 41
346.0
346.0
41.0
SN74LS688DWR
DW
20
SITE 41
346.0
346.0
41.0
SN74LS688NSR
NS
20
SITE 41
346.0
346.0
41.0
Pack Materials-Page 2
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
18
17
16
15
14
13
NO. OF
TERMINALS
**
12
19
11
20
10
A
B
MIN
MAX
MIN
MAX
20
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
28
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
9
22
8
44
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
23
7
52
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
24
6
68
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
84
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
B SQ
A SQ
25
5
26
27
28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140 / D 10/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a metal lid.
The terminals are gold plated.
Falls within JEDEC MS-004
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MPDI004 – OCTOBER 1994
NT (R-PDIP-T**)
PLASTIC DUAL-IN-LINE PACKAGE
24 PINS SHOWN
PINS **
A
24
28
A MAX
1.260
(32,04)
1.425
(36,20)
A MIN
1.230
(31,24)
1.385
(35,18)
B MAX
0.310
(7,87)
0.315
(8,00)
B MIN
0.290
(7,37)
0.295
(7,49)
DIM
24
13
0.280 (7,11)
0.250 (6,35)
1
12
0.070 (1,78) MAX
B
0.020 (0,51) MIN
0.200 (5,08) MAX
Seating Plane
0.125 (3,18) MIN
0.100 (2,54)
0.021 (0,53)
0.015 (0,38)
0°– 15°
0.010 (0,25) M
0.010 (0,25) NOM
4040050 / B 04/95
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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www.ti.com/digitalcontrol
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www.ti.com/military
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