TLV2620, TLV2621 TLV2622, TLV2623 TLV2624, TLV2625 www.ti.com SLOS251D – DECEMBER 2000 – REVISED JANUARY 2005 FAMILY OF LOW-POWER WIDE BANDWIDTH SINGLE SUPPLY OPERATIONAL AMPLIFIERS WITH SHUTDOWN FEATURES • • Operational Amplifier + − DIFFERENTIAL VOLTAGE AMPLIFICATION AND PHASE vs FREQUENCY 120 VDD = 2.7 V and 5 V RL= 2 kΩ CL = 10 pF TA = 25° C 110 100 90 80 180 70 150 120 Phase 60 50 90 40 60 30 30 20 0 −30 Gain 10 Phase Margin − ° • • CMOS Rail-To-Rail Output VICR Includes Positive Rail Wide Bandwidth . . . 11 MHz Slew Rate . . . 10 V/µs Supply Current . . . 800 µA/Channel Input Noise Voltage . . . 27 nV/√Hz Ultralow Power-Down Mode: IDD(SHDN) = 4 µA/Channel Supply Voltage Range . . . 2.7 V to 5.5 V Specified Temperature Range: -40°C to 125°C . . . Industrial Grade Ultrasmall Packaging: 5 or 6 Pin SOT-23 (TLV2620/1) 8 or 10 Pin MSOP (TLV2622/3) Universal Opamp EVM (See SLOU060 for More Information) A VD − Differential Voltage Amplification − dB • • • • • • • 0 −60 −10 10 −90 100 1k 10k 100k 1M f − Frequency − Hz 10M DESCRIPTION The TLV262x single supply operational amplifiers provide rail-to-rail output with an input range that includes the positive rail. The TLV262x takes the minimum operating supply voltage down to 2.7 V over the extended industrial temperature range (-40°C to 125°C) while adding the rail-to-rail output swing feature. The TLV262x also provides 11-MHz bandwidth from only 800 µA of supply current. The maximum recommended supply voltage is 5.5 V, which, when coupled with a 2.7-V minimum, allows the devices to be operated from lithium ion cells. The combination of wide bandwidth, low noise, and low distortion makes it ideal for high speed and high resolution data converter applications. The positive input range allows it to directly interface to positive rail referred systems. All members are available in PDIP and SOIC with the singles in the small SOT-23 package, duals in the MSOP, and quads in the TSSOP package. The 2.7-V operation makes it compatible with Li-Ion powered systems and the operating supply voltage range of many micro-power micro-controllers available today including TI's MSP430. AMPLIFIER SELECTION TABLE DEVICE VDD [V] IDD/ch [µA] VIO [µV] IIB [pA] VICR [V] GBW [MHz] SLEW RATE [V/µs] Vn, 1 kHz [nV/√Hz] IO [mA] SHUTDOWN TLV262x 2.7-5.5 750 250 TLV263x 2.7-5.5 750 250 1 1 V to VDD + 0.2 11 10 27 28 Y 1 GND to VDD - 0.8 10 9 27 28 TLV278x 1.8-3.6 650 Y 250 2.5 -0.2 to VDD + 0.2 8 5 9 10 Y TLC07x 4.5 - 16 TLC08x 4.5 - 16 1900 60 1.5 0.5 to VDD - 0.8 10 19 7 55 Y 1900 60 3 GND to VDD - 1 10 19 8.5 55 Y Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2000–2005, Texas Instruments Incorporated TLV2620, TLV2621 TLV2622, TLV2623 TLV2624, TLV2625 www.ti.com SLOS251D – DECEMBER 2000 – REVISED JANUARY 2005 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. TLV2620 AND TLV2621 AVAILABLE OPTIONS (1) PACKAGED DEVICES VIOmax AT 25°C TA -40°C to 125°C (1) (2) (3) 3500 µV SOT-23 SMALL OUTLINE (D) (2) (DBV) (3) SYMBOL TLV2620ID TLV2621ID TLV2620IDBV TLV2621IDBV VBAI VBBI PLASTIC DIP (P) TLV2620IP TLV2621IP For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLV2620IDR). The SOT23 package devices are only available taped and reeled. The R Suffix denotes quantities (3,000 pieces per reel). For smaller quantities (250 pieces per mini-reel), add a T suffix to the part number (e.g. TLV2620IDBVT). TLV2622 AND TLV2623 AVAILABLE OPTIONS (1) PACKAGED DEVICES TA VIOmax AT 25°C -40°C to 125°C (1) (2) 3500 µV SMALL OUTLINE (2) (D) (DGK) (2) MSOP TLV2622ID TLV2623ID TLV2622IDGK — SYMBOL (DGS) (2) xxTIAKM — — TLV2623IDGS SYMBOL PLASTIC DIP (N) PLASTIC DIP (P) — xxTIALC — TLV2623IN TLV2622IP — For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLV2622IDR). TLV2624 AND TLV2625 AVAILABLE OPTIONS (1) (1) (2) 2 TA VIOmax AT 25°C -40°C to 125°C 3500 µV PACKAGED DEVICES SMALL OUTLINE (D) (2) PLASTIC DIP (N) TSSOP (PW) TLV2624ID TLV2625ID TLV2624IN TLV2625IN TLV2624IPW TLV2625IPW For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLV2624IDR). TLV2620, TLV2621 TLV2622, TLV2623 TLV2624, TLV2625 www.ti.com SLOS251D – DECEMBER 2000 – REVISED JANUARY 2005 TLV262X PACKAGE PINOUTS(1) TLV2620 D OR P PACKAGE (TOP VIEW) TLV2620 DBV PACKAGE (TOP VIEW) OUT 1 6 VDD GND 2 5 SHDN IN+ 3 4 IN − TLV2621 D OR P PACKAGE (TOP VIEW) NC IN− IN+ GND 1 8 2 7 3 6 4 5 NC VDD OUT NC 1 14 2 13 3 12 4 11 5 10 6 9 7 8 1 8 2 7 3 6 4 5 SHDN VDD OUT NC OUT 1 GND 2 IN+ 3 1OUT 1IN− 1IN+ GND 1 8 2 7 3 6 4 5 1OUT 1IN− 1IN+ GND 1SHDN VDD 2OUT 2IN− 2IN+ TLV2624 D, N, OR PW PACKAGE (TOP VIEW) VDD 2OUT 2IN− 2IN+ NC 2SHDN NC 1OUT 1IN− 1IN+ VDD 2IN+ 2IN− 2OUT 1 14 2 13 3 12 4 11 5 10 6 9 7 8 5 VDD 4 IN − TLV2623 DGS PACKAGE (TOP VIEW) TLV2622 D, DGK, OR P PACKAGE (TOP VIEW) TLV2623 D OR N PACKAGE (TOP VIEW) 1OUT 1IN− 1IN+ GND NC 1SHDN NC NC IN− IN+ GND TLV2621 DBV PACKAGE (TOP VIEW) 1 2 3 4 5 10 9 8 7 6 VDD 2OUT 2IN− 2IN+ 2SHDN TLV2625 D, N, OR PW PACKAGE (TOP VIEW) 1OUT 1IN− 1IN+ VDD 2IN+ 2IN− 2OUT 1/2SHDN 4OUT 4IN− 4IN+ GND 3IN+ 3IN− 3OUT NC − No internal connection 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 4OUT 4IN− 4IN+ GND 3IN+ 3IN− 3OUT 3/4SHDN 1/2SHDN Pin (8) controls amplifiers 1 and 2. 3/4SHDN Pin (9) controls amplifiers 3 and 4. (1) SOT-23 may or may not be indicated. TYPICAL PIN 1 INDICATORS Pin 1 Printed or Molded Dot Pin 1 Stripe Pin 1 Bevel Edges Pin 1 Molded ”U” Shape NOTE: If there is not a Pin 1 indicator, turn device to enable reading the symbol from left to right. Pin 1 is at the lower left corner of the device. 3 TLV2620, TLV2621 TLV2622, TLV2623 TLV2624, TLV2625 www.ti.com SLOS251D – DECEMBER 2000 – REVISED JANUARY 2005 ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) (2) VDD Supply voltage VID Differential input voltage 6V VI Input voltage range II Input current (any input) IO Output current ±VDD (2) +1 to VDD + 0.2 V ± 10 mA ±40 mA Continuous total power dissipation See Dissipation Rating Table TA Operating free-air temperature range: I-suffix TJ Maximum junction temperature Tstg Storage temperature range -40°C to 125°C 150°C -65°C to 150°C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds (1) (2) 260°C Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values, except differential voltages, are with respect to GND. DISSIPATION RATING TABLE PACKAGE θJC (°C/W) θJA (°C/W) TA ≤ 25°C POWER RATING TA = 125°C POWER RATING D (8) 38.3 176 710 mW 142 mW D (14) 26.9 122.3 1022 mW 204.4 mW D (16) 25.7 114.7 1090 mW 218 mW DBV (5) 55 324.1 385 mW 77.1 mW DBV (6) 55 294.3 425 mW 85 mW DGK (8) 54.2 259.9 481 mW 96.1 mW DGS (10) 54.1 259.7 485 mW 97 mW N (14, 16) 32 78 1600 mW 320.5 mW P (8) 41 104 1200 mW 240.4 mW PW (14) 29.3 173.6 720 mW 144 mW PW (16) 28.7 161.4 774 mW 154.9 mW RECOMMENDED OPERATING CONDITIONS VDD Supply voltage VICR Common-mode input voltage range TA Operating free-air temperature Shutdown on/off voltage level (1) (1) 4 Relative to GND. Single supply Split supply I-suffix MIN MAX 2.7 5.5 ±1.35 ±2.75 1 VDD+0.2 V -40 125 °C VIL VIH 0.4 2 UNIT V V TLV2620, TLV2621 TLV2622, TLV2623 TLV2624, TLV2625 www.ti.com SLOS251D – DECEMBER 2000 – REVISED JANUARY 2005 ELECTRICAL CHARACTERISTICS at specified free-air temperature, VDD = 2.7 V, 5 V (unless otherwise noted) PARAMETER TEST CONDITIONS TA (1) MIN TYP MAX 250 3500 UNIT DC PERFORMANCE VIO Input offset voltage αVIO Temperature coefficient of input offset voltage CMRR AVD Common-mode rejection ratio Large-signal differential voltage amplification 25°C VIC = VDD/2, VO = VDD/2, RS = 50 Ω VIC = 1 to VDD, RS = 50 Ω Full range 4500 25°C VDD = 2.7 V VDD = 5 V VDD = 2.7 V, RL = 2 kΩ, VO(PP) = 1.7 V VDD = 5 V, RL = 2 kΩ, VO(PP) = 4 V 3 25°C 77 Full range 63 25°C 78 Full range 75 25°C 90 Full range 82 25°C 95 Full range 90 µV µV/°C 98 dB 99 100 dB 100 INPUT CHARACTERISTICS IIO 25°C Input offset current IIB Input bias current ri(d) Differential input resistance Ci(c) Common-mode input capacitance 2 Full Range VIC = VDD/2, VO = VDD/2, RS = 50Ω 100 25°C 2 Full Range f = 1 kHz 50 50 pA 200 25°C 100 GΩ 25°C 8 pF OUTPUT CHARACTERISTICS VIC = VDD/2, IOH = -1 mA VOH VIC = VDD/2, IOL = 1 mA VDD = 2.7 V VDD = 5 V Output current VDD = 2.7 V VDD = 5 V VDD = 2.7 V, VO = 0.5 V from rail VDD = 5 V, VO = 0.5 V from rail Sourcing Short-circuit output current Sinking (1) VDD = 5 V Sourcing Sourcing IOS VDD = 2.7 V Low-level output voltage VIC = VDD/2, IOL = 10 mA IO VDD = 5 V High-level output voltage VIC = VDD/2, IOH = -10 mA VOL VDD = 2.7 V Sinking 25°C 2.6 Full range 2.55 25°C 4.95 Full range 4.9 25°C 2.3 Full range 2.2 25°C 4.7 Full range 4.6 25°C 2.67 4.98 4.8 0.03 Full range 25°C 0.025 Full range 0.25 0.35 25°C 19 28 VDD = 2.7 V 50 VDD = 5 V V 14 28 VDD = 2.7 V 0.4 0.45 0.2 Sinking VDD = 5 V 0.05 0.1 0.26 Full range 25°C 0.1 0.15 Full range 25°C V 2.43 25°C 95 50 mA mA 95 Full range is -40°C to 125°C for the I-suffix. 5 TLV2620, TLV2621 TLV2622, TLV2623 TLV2624, TLV2625 www.ti.com SLOS251D – DECEMBER 2000 – REVISED JANUARY 2005 ELECTRICAL CHARACTERISTICS (continued) at specified free-air temperature, VDD = 2.7 V, 5 V (unless otherwise noted) PARAMETER TEST CONDITIONS TA (1) MIN TYP MAX 800 1000 UNIT POWER SUPPLY IDD Supply current (per channel) PSRR Supply voltage rejection ratio (∆VDD/∆VIO) VO = VDD/2, VDD = 2.7 V to 3.3 V, VIC = VDD/2 SHDN = VDD No load VDD = 2.7 V to 5 V, VIC = VDD/2 25°C Full range 1300 25°C 80 Full range 75 25°C 75 Full range 70 µA 98 dB 90 DYNAMIC PERFORMANCE UGBW SR+ SR- Unity gain bandwidth Positive slew rate at unity gain RL = 2 kΩ, CL = 10 pF RL = 2 kΩ, CL = 50 pF Negative slew rate at unity gain RL = 2 kΩ, CL = 50 pF φm Phase margin Gain margin 25°C VDD = 2.7 V, VO(PP) = 1.7 V VDD = 5 V, VO(PP) = 3.5 V VDD = 2.7 V, VO(PP) = 1.7 V VDD = 5 V, VO(PP) = 3.5 V RL = 2 kΩ, CL = 10 pF 11 25°C 3.5 Full range 2.7 25°C 5.4 Full range 3.4 25°C 2.7 Full range 2.3 25°C 4.5 Full range 3.2 25°C MHz 4.5 V/µs 7 5 V/µs 6 63° 8 dB NOISE/DISTORTION PERFORMANCE THD + N Total harmonic distortion plus noise Vn Equivalent input noise voltage In Equivalent input noise current VO(PP) = VDD/2, RL = 2 kΩ, f = 10 kHz AV = 1 0.002% AV = 10 0.019% AV = 100 f = 1 kHz 25°C 0.095% 53 f = 10 kHz 27 f = 1 kHz 0.9 nV/√Hz fA/√Hz SHUTDOWN CHARACTERISTICS Supply current, per channel in IDD(SHDN) shutdown mode (TLV2620, TLV2623, TLV2625) 25°C SHDN = 0.4 V t(on) Amplifier turnon time (2) RL = 2 kΩ t(off) Amplifier turnoff time (2) RL = 2 kΩ (2) 6 4 Full range VDD = 2.7 V VDD = 5 V 13 4.5 25°C 11 1.5 200 µA µs ns Disable time and enable time are defined as the interval between application of the logic signal to SHDN and the point at which the supply current has reached half its final value. TLV2620, TLV2621 TLV2622, TLV2623 TLV2624, TLV2625 www.ti.com SLOS251D – DECEMBER 2000 – REVISED JANUARY 2005 TYPICAL CHARACTERISTICS TABLE OF GRAPHS FIGURE VIO Input offset voltage vs Common-mode input voltage CMRR Common-mode rejection ratio vs Frequency 1, 2 VOH High-level output voltage vs High-level output current 4, 6 VOL Low-level output voltage vs Low-level output current 5, 7 IDD Supply current vs Supply voltage IDD Supply current vs Free-air temperature 9 PSRR Power supply rejection ratio vs Frequency 10 AVD Differential voltage amplification & phase vs Frequency 11 Gain-bandwidth product vs Free-air temperature 12 vs Supply voltage 13 3 8 SR Slew rate φm Phase margin vs Load capacitance 16 Vn Equivalent input noise voltage vs Frequency 17 vs Free-air temperature 14, 15 Voltage-follower large-signal pulse response 18 Voltage-follower small-signal pulse response 19 Crosstalk vs Frequency 20 IDD(SHDN) Shutdown supply current vs Free-air temperature 21 IDD(SHDN) Shutdown supply current vs Supply voltage 22 IDD(SHDN) Shutdown supply current/output voltage vs Time 23 INPUT OFFSET VOLTAGE vs COMMON-MODE INPUT VOLTAGE 500 500 VIO − Input Offset Voltage − µ V 400 350 300 250 200 150 100 50 0 VDD = 5 V TA = 25° C 450 VIO − Input Offset Voltage − µ V VDD = 2.7 V TA = 25° C 450 400 350 300 250 200 150 100 50 0 −50 −50 −100 0.0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 VICR − Common-Mode Input Voltage − V Figure 1. −100 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 VICR − Common-Mode Input Voltage − V Figure 2. COMMON-MODE REJECTION RATIO vs FREQUENCY CMRR − Common-Mode Rejection Ratio − dB INPUT OFFSET VOLTAGE vs COMMON-MODE INPUT VOLTAGE 120 VDD = 2.7 V and 5 V TA = 25° C 110 100 90 80 70 60 50 40 30 20 10 0 10 100 1k 10k 100k f − Frequency − Hz 1M Figure 3. 7 TLV2620, TLV2621 TLV2622, TLV2623 TLV2624, TLV2625 www.ti.com SLOS251D – DECEMBER 2000 – REVISED JANUARY 2005 HIGH-LEVEL OUTPUT VOLTAGE vs HIGH-LEVEL OUTPUT CURRENT LOW-LEVEL OUTPUT VOLTAGE vs LOW-LEVEL OUTPUT CURRENT 2.7 2.1 1.8 1.5 TA = 125°C 1.2 TA = 70°C 0.9 TA = 25°C TA = 0°C TA = −40°C 0.6 0.3 2.1 TA = 125°C 1.8 TA = 70°C 1.5 0 0.9 0.6 0.3 5 10 15 20 25 30 35 40 VDD = 5 V 4.5 4.0 3.5 TA = 125°C 3.0 TA = 70°C 2.5 2.0 TA = 25°C TA = 0°C TA = −40°C 1.5 1.0 0.5 0.0 0 45 IOH − High-Level Output Current − mA 5 10 15 20 25 30 35 40 IOL − Low-Level Output Current − mA 45 0 10 20 30 40 50 60 70 80 90 100 IOH − High-Level Output Current − mA Figure 4. Figure 5. Figure 6. LOW-LEVEL OUTPUT VOLTAGE vs LOW-LEVEL OUTPUT CURRENT SUPPLY CURRENT vs SUPPLY VOLTAGE SUPPLY CURRENT vs FREE-AIR TEMPERATURE 5.0 1000 1100 4.0 TA = 125°C 3.5 TA = 70°C 3.0 TA = 25°C TA = 0°C TA = −40°C 2.5 2.0 TA = 125°C 1000 1.5 1.0 0.5 900 900 I DD − Supply Current − µ A/ch VDD = 5 V 4.5 I DD − Supply Current − µ A/ch TA = 70°C 800 TA = 25°C 700 600 TA = 0°C 500 TA = −40°C 400 300 200 A V= 1 VIC = VDD/2 100 0.0 10 20 30 40 50 60 70 80 90 100 IOL − Low-Level Output Current − mA VDD = 5 V 700 VDD = 2.7 V 600 500 400 300 200 A V= 1 VIC = VDD/2 0 −40 −25 −10 5 0 0 800 100 0 0.5 1.0 1 1.5 2.0 2 2.5 3.0 3 3.5 4.0 4 4.5 5.0 5 5.5 6.0 6 0.0 20 35 50 65 80 95 110 125 VDD − Supply Voltage − V TA − Free-Air Temperature − °C Figure 7. Figure 8. Figure 9. POWER SUPPLY REJECTION RATIO vs FREQUENCY DIFFERENTIAL VOLTAGE AMPLIFICATION AND PHASE vs FREQUENCY GAIN-BANDWIDTH PRODUCT vs FREE-AIR TEMPERATURE PSSR + VDD = 2.7 V and 5 V TA = 25° C 80 PSSR− 70 60 50 40 30 20 10 0 10 100 1k 10k 100k f − Frequency − Hz Figure 10. 1M 10M 120 100 90 80 11 180 70 60 12 VDD = 2.7 V and 5 V RL= 2 kΩ CL = 10 pF TA = 25° C 110 150 120 Phase 50 90 40 60 30 30 20 0 −30 Gain 10 0 −60 −10 10 −90 100 1k 10k 100k 1M f − Frequency − Hz 10M Gain-Bandwidth Product − MHz 90 A VD − Differential Voltage Amplification − dB 100 Phase Margin − ° VOL − Low-Level Output Voltage − V TA = 25°C TA = 0°C TA = −40°C 1.2 0.0 0.0 PSRR − Power Supply Rejection Ratio − dB 5.0 VDD = 2.7 V 2.4 V OH − High-Level Output Voltage − V VDD = 2.7 V 2.4 VOL − Low-Level Output Voltage − V V OH − High-Level Output Voltage − V 2.7 8 HIGH-LEVEL OUTPUT VOLTAGE vs HIGH-LEVEL OUTPUT CURRENT VDD = 5 V VDD = 2.7 V 10 9 8 7 6 5 4 3 2 1 RL = 2 kΩ CL = 10 pF f = 10 kHz 0 −40 −25 −10 5 20 35 50 65 80 95 110 125 TA − Free-Air Temperature − °C Figure 11. Figure 12. TLV2620, TLV2621 TLV2622, TLV2623 TLV2624, TLV2625 www.ti.com SLOS251D – DECEMBER 2000 – REVISED JANUARY 2005 SLEW RATE vs SUPPLY VOLTAGE SLEW RATE vs FREE-AIR TEMPERATURE SR+ SR − Slew Rate − V/µs 9 SR− 8 7 6 5 4 3 0 2.7 3.0 3.3 3.6 3.9 4.2 4.5 4.8 5.1 5.4 5.7 6.0 15 14 13 12 11 10 SR+ 9 SR− 8 7 6 5 4 3 VDD = 5 V 2 AV = 1 1 V(step) = 1 V to 4.5 V 0 −40 −25 −10 5 20 35 50 65 80 95 110 125 VDD − Supply Voltage − V TA − Free-Air Temperature − °C TA − Free-Air Temperature − °C Figure 13. Figure 14. Figure 15. EQUIVALENT INPUT NOISE VOLTAGE vs FREQUENCY φ m − Phase Margin − ° 70 65 60 55 50 45 40 35 30 25 20 15 10 5 0 10 Hz PHASE MARGIN vs LOAD CAPACITANCE Rnull = 100 Ω Rnull = 20 Ω Rnull = 0 Ω VDD = 2.7 V and 5 V RL = 2 kΩ AV = 1 TA = 25°C 100 CL − Load Capacitance − pF 300 V n − Equivalent Input Noise Voltage − nV/ 500 VDD = 2.7 V and 5 V TA = 25° C 450 400 350 300 250 200 150 100 50 0 10 100 Figure 16. VOLTAGE-FOLLOWER LARGE-SIGNAL PULSE RESPONSE 9 5 8 4 7 3 6 2 VIC 5 4 3 2 1 1 VO VDD = 5 V VIC = 3.5 V RL = 2 kΩ CL = 10 pF AV = 1 TA = 25°C 0 0 −0.10.00.10.20.30.40.50.60.70.80.91.01.11.21.31.4 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 t − Time − µs Figure 18. 1k 10k f − Frequency − Hz 100k Figure 17. VOLTAGE-FOLLOWER SMALL-SIGNAL PULSE RESPONSE 2.80 2.60 2.75 2.55 2.70 2.65 V O − Output Voltage − V 1 AV = 1 V(step) = 1 V to 2 V TA = 25° C V IC − Common-Mode Input Voltage − V 2 V O − Output Voltage − V SR − Slew Rate − V/µs 10 15 14 13 12 11 10 SR+ 9 SR− 8 7 6 5 4 3 VDD = 2.7 V 2 AV = 1 1 V(step) = 1 V to 2.2 V 0 −40 −25 −10 5 20 35 50 65 80 95 110 125 VIC 2.60 VDD = 5 V VIC = 100 mV RL = 2 kΩ CL = 10 pF AV = 1 TA = 25°C 2.50 2.45 2.40 2.55 2.50 VO V IC − Common-Mode Input Voltage − V 11 SR − Slew Rate − V/µs 12 SLEW RATE vs FREE-AIR TEMPERATURE 2.45 2.40 −0.10.0 0.0 0.1 0.2 0.3 0.4 0.40.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.2 t − Time − µs Figure 19. 9 TLV2620, TLV2621 TLV2622, TLV2623 TLV2624, TLV2625 www.ti.com SLOS251D – DECEMBER 2000 – REVISED JANUARY 2005 0 −20 Crosstalk − dB −40 −60 VDD = 2.7 V and 5 V RL = 2 kΩ CL = 10 pF AV = 1 VO(PP) = VDD/2 TA = 25°C All Channels −80 −100 Shutdown Crosstalk −120 −140 10 Crosstalk 100 1k 10k f − Frequency − Hz 100k 4.0 Shutdown = 0 V AV = 1 VIC = VDD/2 VDD = 5 V 3.5 3.0 2.5 2.0 1.5 VDD = 3.6 V 1.0 VDD = 2.7 V 0.5 0.0 −40 −25 −10 5 SHUTDOWN SUPPLY CURRENT vs SUPPLY VOLTAGE I DD(SD) − Shutdown Supply Current − µ A/ch SHUTDOWN SUPPLY CURRENT vs FREE-AIR TEMPERATURE I DD(SD) − Shutdown Supply Current − µ A/ch CROSSTALK vs FREQUENCY 5.0 4.5 4.0 3.5 2.0 1.0 0.0 20 35 50 65 80 95 110 125 Figure 21. Figure 22. SD − Shutdown Pulse − V I DD(SD) − Shutdown Supply Current − µ A V O − Output Voltage − mV VDD = 5 V AV = 1 RL = 2 kΩ CL = 10 pF VIC = VDD/2 TA = 25° C 0.5 IDD(SD) 1.5 2.0 2 3 4 5 t − Time − µs Figure 23. 10 TA = 125°C 0.0 0 0.5 1.0 1 1.5 2.0 2 2.5 3.0 3 3.5 4.0 4 4.5 5.0 5 5.5 6.0 6 VDD − Supply Voltage − V VO 1 TA = −40°C 0.5 SD 0 TA = 0°C 1.5 0.0 1.0 TA = 25°C 2.5 SHUTDOWN SUPPLY CURRENT/OUTPUT VOLTAGE vs TIME 2.5 2.0 1.5 1.0 0.5 0.0 TA = 70°C 3.0 TA − Free-Air Temperature − °C Figure 20. 5.0 4.0 3.0 2.0 1.0 0.0 Shutdown = 0 V AV = 1 VIC = VDD/2 6 7 8 9 PACKAGE OPTION ADDENDUM www.ti.com 22-Feb-2005 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TLV2620ID ACTIVE SOIC D 8 TLV2620IDBVR ACTIVE SOT-23 DBV 6 TLV2620IDBVT ACTIVE SOT-23 DBV TLV2620IDR ACTIVE SOIC TLV2620IP ACTIVE TLV2621ID 75 Pb-Free (RoHS) Lead/Ball Finish MSL Peak Temp (3) CU NIPDAU Level-2-260C-1YEAR/ Level-1-220C-UNLIM 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM D 8 2500 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1YEAR/ Level-1-220C-UNLIM PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC ACTIVE SOIC D 8 75 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1YEAR/ Level-1-220C-UNLIM TLV2621IDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2621IDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV2621IDR ACTIVE SOIC D 8 2500 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1YEAR/ Level-1-220C-UNLIM TLV2621IP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC TLV2622ID ACTIVE SOIC D 8 75 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1YEAR/ Level-1-220C-UNLIM TLV2622IDGK ACTIVE MSOP DGK 8 80 None CU NIPDAU Level-1-220C-UNLIM TLV2622IDGKR ACTIVE MSOP DGK 8 2500 None CU NIPDAU Level-1-220C-UNLIM TLV2622IDR ACTIVE SOIC D 8 2500 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1YEAR/ Level-1-220C-UNLIM TLV2622IP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC TLV2623ID ACTIVE SOIC D 14 50 Pb-Free (RoHS) CU NIPD Level-2-260C-1YEAR/ Level-1-220C-UNLIM TLV2623IDGS ACTIVE MSOP DGS 10 80 None CU SNPB Level-1-220C-UNLIM TLV2623IDGSR ACTIVE MSOP DGS 10 2500 None CU SNPB Level-1-220C-UNLIM TLV2623IDR ACTIVE SOIC D 14 2500 Pb-Free (RoHS) CU NIPD Level-2-260C-1YEAR/ Level-1-220C-UNLIM TLV2623IN ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC TLV2624ID ACTIVE SOIC D 14 50 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1YEAR/ Level-1-220C-UNLIM TLV2624IDR ACTIVE SOIC D 14 2500 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1YEAR/ Level-1-220C-UNLIM TLV2624IN ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPD TLV2624IPW ACTIVE TSSOP PW 14 90 None CU NIPDAU Level-1-220C-UNLIM None CU NIPDAU Level-1-220C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-2-260C-1YEAR/ Level-1-220C-UNLIM TLV2624IPWR ACTIVE TSSOP PW 14 2000 TLV2624IPWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) TLV2625ID ACTIVE SOIC D 16 40 Addendum-Page 1 Pb-Free (RoHS) Level-NC-NC-NC PACKAGE OPTION ADDENDUM www.ti.com 22-Feb-2005 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TLV2625IDR ACTIVE SOIC D 16 2500 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1YEAR/ Level-1-220C-UNLIM TLV2625IN ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC TLV2625IPW ACTIVE TSSOP PW 16 90 None CU NIPDAU Level-1-220C-UNLIM TLV2625IPWR ACTIVE TSSOP PW 16 2000 None CU NIPDAU Level-1-220C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. None: Not yet available Lead (Pb-Free). Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens, including bromine (Br) or antimony (Sb) above 0.1% of total product weight. (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 MECHANICAL DATA MPDI001A – JANUARY 1995 – REVISED JUNE 1999 P (R-PDIP-T8) PLASTIC DUAL-IN-LINE 0.400 (10,60) 0.355 (9,02) 8 5 0.260 (6,60) 0.240 (6,10) 1 4 0.070 (1,78) MAX 0.325 (8,26) 0.300 (7,62) 0.020 (0,51) MIN 0.015 (0,38) Gage Plane 0.200 (5,08) MAX Seating Plane 0.010 (0,25) NOM 0.125 (3,18) MIN 0.100 (2,54) 0.021 (0,53) 0.015 (0,38) 0.430 (10,92) MAX 0.010 (0,25) M 4040082/D 05/98 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Falls within JEDEC MS-001 For the latest package information, go to http://www.ti.com/sc/docs/package/pkg_info.htm POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. 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