LINER LTC2655

LTC2633
Dual 12-/10-/8-Bit I2C
VOUT DACs with
10ppm/°C Reference
Description
Features
Integrated Precision Reference
2.5V Full-Scale 10ppm/°C (LTC2633-L)
4.096V Full-Scale 10ppm/°C (LTC2633-H)
n Maximum INL Error: ±1LSB (LTC2633A-12)
n Low Noise: 0.75mV
P-P 0.1Hz to 200kHz
n Guaranteed Monotonic Over –40°C to 125°C
Temperature Range
n Selectable Internal or External Reference
n 2.7V to 5.5V Supply Range (LTC2633-L)
n Low Power: 0.4mA at 3V
n Power-on-Reset to Zero-Scale/Mid-Scale/Hi-Z
n Double-Buffered Data Latches
n 8-Lead ThinSOT™ Package
The LTC®2633 is a family of dual 12-, 10-, and 8-bit
voltage-output DACs with an integrated, high accuracy,
low drift reference in an 8-lead TSOT-23 package. It has
rail-to-rail output buffers and is guaranteed monotonic.
The LTC2633-L has a full-scale output of 2.5V, and operates
from a single 2.7V to 5.5V supply. The LTC2633-H has a
full-scale output of 4.096V, and operates from a 4.5V to
5.5V supply. Each DAC can also operate with an external
reference, which sets the full-scale output to the external
reference voltage.
n
These DACs communicate via a 2-wire I2C-compatible
serial interface. The LTC2633 operates in both the standard
mode (clock rate of 100kHz) and the fast mode (clock rate
of 400kHz). The LTC2633 incorporates a power-on reset
circuit. Options are available for reset to zero-scale, reset
to mid-scale in internal reference mode, reset to mid-scale
in external reference mode, or reset with all DAC outputs
in a high impedance state after power-up.
Applications
Mobile Communications
Process Control and Industrial Automation
n Power Supply Margining
n Portable Equipment
nAutomotive
n
n
L, LT, LTC, LTM, Linear Technology and the Linear logo are registered trademarks and
ThinSOT is a trademark of Linear Technology Corporation. All other trademarks are the property
of their respective owners. Protected by U.S. Patents including 5396245, 5859606, 6891433,
6937178, 7414561.
Block Diagram
INTERNAL
REFERENCE
GND
SWITCH
REF
Integral Nonlinearity (LTC2633A-LZ12)
INL Curve
VREF
2
POWER-ON
RESET
DAC B
CONTROL
DECODE LOGIC
VCC = 3V
INTERNAL REF.
1
VOUTB
INL (LSB)
REGISTER
REGISTER
DAC A
REGISTER
VOUTA
REGISTER
VCC
0
–1
SCL
CA0
I2C
ADDRESS
DECODE
–2
I2C INTERFACE
SDA
0
1024
2048
CODE
3072
4095
2633 TA01
2633 BD
2633fb
1
LTC2633
Absolute Maximum Ratings
Pin Configuration
(Notes 1, 2)
Supply Voltage (VCC).................................... –0.3V to 6V
SCL, SDA...................................................... –0.3V to 6V
VOUTA , VOUTB....................–0.3V to Min(VCC + 0.3V, 6V)
CA0....................................–0.3V to Min(VCC + 0.3V, 6V)
REF....................................–0.3V to Min(VCC + 0.3V, 6V)
Operating Temperature Range
LTC2633C................................................. 0°C to 70°C
LTC2633H (Note 3)............................. –40°C to 125°C
Maximum Junction Temperature........................... 150°C
Storage Temperature Range.................... –65°C to 150°C
Lead Temperature (Soldering, 10 sec)................... 300°C
TOP VIEW
SCL
CA0
REF
GND
1
2
3
4
8
7
6
5
SDA
VCC
VOUTB
VOUTA
TS8 PACKAGE
8-LEAD PLASTIC TSOT-23
TJMAX = 150°C (NOTE 6), θJA = 195°C/W
Order Information
LTC2633
A
C
TS8
–L
Z
12
#TRM PBF
LEAD FREE DESIGNATOR
TAPE AND REEL
TR = 2,500-Piece Tape and Reel
TRM = 500-Piece Tape and Reel
RESOLUTION
12 = 12-Bit
10 = 10-Bit
8 = 8-Bit
POWER-ON RESET
I = Reset to Mid-Scale in Internal Reference Mode
X = Reset to Mid-Scale in External Reference Mode (2.5V Full-Scale
Voltage, Internal Reference Mode Option Only)
O = Reset to Mid-Scale in Internal Reference Mode, DACs High Z
(2.5V Full-Scale Voltage, Internal Reference Mode Option Only)
Z = Reset to Zero-Scale in Internal Reference Mode
FULL-SCALE VOLTAGE INTERNAL REFERENCE MODE
L = 2.5V
H = 4.096V
PACKAGE TYPE
TS8 = 8-Lead Plastic TSOT-23
TEMPERATURE GRADE
C = Commercial Temperature Range (0°C to 70°C)
H = Automotive Temperature Range (–40°C to 125°C)
ELECTRICAL GRADE (OPTIONAL)
A = ±1LSB Maximum INL (12-Bit)
PRODUCT PART NUMBER
Consult LTC Marketing for information on non-standard lead based finish parts.
For more information on lead free part marking, go to: http://www.linear.com/leadfree/
For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/
2633fb
2
LTC2633
Product Selection Guide
PART
MARKING**
VFS WITH INTERNAL
REFERENCE
POWER-ON RESET
TO CODE
POWER-ON
REFERENCE
MODE
RESOLUTION
VCC
LTC2633A-LI12
LTC2633A-LX12
LTC2633A-LZ12
LTC2633A-LO12*
LTC2633A-HI12
LTC2633A-HZ12
LTFTC
LTFTB
LTFSZ
LTFTV
LTFTF
LTFTD
2.5V • (4095/4096)
2.5V • (4095/4096)
2.5V • (4095/4096)
2.5V • (4095/4096)
4.096V • (4095/4096)
4.096V • (4095/4096)
Mid-Scale
Mid-Scale
Zero-Scale
High Impedance
Mid-Scale
Zero-Scale
Internal
External
Internal
Internal
Internal
Internal
12-Bit
12-Bit
12-Bit
12-Bit
12-Bit
12-Bit
2.7V to 5.5V
2.7V to 5.5V
2.7V to 5.5V
2.7V to 5.5V
4.5V to 5.5V
4.5V to 5.5V
±1LSB
±1LSB
±1LSB
±1LSB
±1LSB
±1LSB
LTC2633-LI12
LTC2633-LI10
LTC2633-LI8
LTFTC
LTFTJ
LTFTQ
2.5V • (4095/4096)
2.5V • (1023/1024)
2.5V • (255/256)
Mid-Scale
Mid-Scale
Mid-Scale
Internal
Internal
Internal
12-Bit
10-Bit
8-Bit
2.7V to 5.5V
2.7V to 5.5V
2.7V to 5.5V
±2.5LSB
±1LSB
±0.5LSB
LTC2633-LX12
LTC2633-LX10
LTC2633-LX8
LTFTB
LTFTH
LTFTP
2.5V • (4095/4096)
2.5V • (1023/1024)
2.5V • (255/256)
Mid-Scale
Mid-Scale
Mid-Scale
External
External
External
12-Bit
10-Bit
8-Bit
2.7V to 5.5V
2.7V to 5.5V
2.7V to 5.5V
±2.5LSB
±1LSB
±0.5LSB
LTC2633-LZ12
LTC2633-LZ10
LTC2633-LZ8
LTFSZ
LTFTG
LTFTN
2.5V • (4095/4096)
2.5V • (1023/1024)
2.5V • (255/256)
Zero-Scale
Zero-Scale
Zero-Scale
Internal
Internal
Internal
12-Bit
10-Bit
8-Bit
2.7V to 5.5V
2.7V to 5.5V
2.7V to 5.5V
±2.5LSB
±1LSB
±0.5LSB
LTC2633-LO12*
LTC2633-LO10*
LTC2633-LO8*
LTFTV
LTFTW
LTFTX
2.5V • (4095/4096)
2.5V • (1023/1024)
2.5V • (255/256)
High Impedance
High Impedance
High Impedance
Internal
Internal
Internal
12-Bit
10-Bit
8-Bit
2.7V to 5.5V
2.7V to 5.5V
2.7V to 5.5V
±2.5LSB
±1LSB
±0.5LSB
LTC2633-HI12
LTC2633-HI10
LTC2633-HI8
LTFTF
LTFTM
LTFTS
4.096V • (4095/4096)
4.096V • (1023/1024)
4.096V • (255/256)
Mid-Scale
Mid-Scale
Mid-Scale
Internal
Internal
Internal
12-Bit
10-Bit
8-Bit
4.5V to 5.5V
4.5V to 5.5V
4.5V to 5.5V
±2.5LSB
±1LSB
±0.5LSB
LTC2633-HZ12
LTC2633-HZ10
LTC2633-HZ8
LTFTD
LTFTK
LTFTR
4.096V • (4095/4096)
4.096V • (1023/1024)
4.096V • (255/256)
Zero-Scale
Zero-Scale
Zero-Scale
Internal
Internal
Internal
12-Bit
10-Bit
8-Bit
4.5V to 5.5V
4.5V to 5.5V
4.5V to 5.5V
±2.5LSB
±1LSB
±0.5LSB
PART NUMBER
MAXIMUM
INL
* Contact Linear Technology for other Hi-Z options.
**The temperature grade is identified by a label on the shipping container.
Electrical
Characteristics
The
l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. VCC = 2.7V to 5.5V, VOUT unloaded unless otherwise specified.
LTC2633-LI12/-LI10/-LI8/-LX12/-LX10/-LX8/-LZ12/-LZ10/-LZ8/-LO12/-LO10/-LO8/LTC2633A-LI12/-LX12/-LZ12/-LO12 (VFS = 2.5V)
LTC2633-8
SYMBOL PARAMETER
CONDITIONS
LTC2633-10
LTC2633-12
LTC2633A-12
MIN TYP MAX MIN TYP MAX MIN TYP MAX MIN TYP MAX
UNITS
DC Performance
l
8
10
12
12
Bits
Monotonicity
VCC = 3V, Internal Ref. (Note 4)
l
8
10
12
12
Bits
DNL
Differential
Nonlinearity
VCC = 3V, Internal Ref. (Note 4)
l
±0.5
INL
Integral Nonlinearity VCC = 3V, Internal Ref. (Note 4)
l
±0.05 ±0.5
ZSE
Zero Scale Error
VCC = 3V, Internal Ref., Code = 0 l
0.5
VOS
Offset Error
VCC = 3V, Internal Ref. (Note 5)
±0.5
VOSTC
VOS Temperature
Coefficient
VCC = 3V, Internal Ref.
GE
Gain Error
VCC = 3V, Internal Ref.
Resolution
l
l
±0.5
±1
±1
LSB
±0.2
±1
±1
±2.5
±0.5
±1
LSB
5
0.5
5
0.5
5
0.5
5
mV
±5
±0.5
±5
±0.5
±5
±0.5
±5
mV
±10
±10
±10
±10
µV/°C
±0.2 ±0.8
±0.2 ±0.8
±0.2 ±0.8
±0.2 ±0.8
%FSR
2633fb
3
LTC2633
Electrical
Characteristics
The
l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. VCC = 2.7V to 5.5V, VOUT unloaded unless otherwise specified.
LTC2633-LI12/-LI10/-LI8/-LX12/-LX10/-LX8/-LZ12/-LZ10/-LZ8/-LO12/-LO10/-LO8/LTC2633A-LI12/-LX12/-LZ12/-LO12 (VFS = 2.5V)
LTC2633-8
SYMBOL PARAMETER
GETC
ROUT
CONDITIONS
VCC = 3V, Internal Ref. (Note 10)
C-Grade
H-Grade
Load Regulation
Internal Ref., Mid-Scale,
VCC = 3V ± 10%,
–5mA ≤ IOUT ≤ 5mA
VCC = 5V ± 10%,
–10mA ≤ IOUT ≤ 10mA
Internal Ref., Mid-Scale,
VCC = 3V ± 10%,
–5mA ≤ IOUT ≤ 5mA
VCC = 5V ± 10%,
–10mA ≤ IOUT ≤ 10mA
SYMBOL PARAMETER
LTC2633-12
LTC2633A-12
MIN TYP MAX MIN TYP MAX MIN TYP MAX MIN TYP MAX
Gain Temperature
Coefficient
DC Output
Impedance
LTC2633-10
10
10
10
10
10
10
10
10
UNITS
ppm/°C
ppm/°C
l
0.009 0.016
0.035 0.064
0.14 0.256
0.14 0.256 LSB/mA
l
0.009 0.016
0.035 0.064
0.14 0.256
0.14 0.256 LSB/mA
l
0.09 0.156
0.09 0.156
0.09 0.156
0.09 0.156
Ω
l
0.09 0.156
0.09 0.156
0.09 0.156
0.09 0.156
Ω
CONDITIONS
MIN
TYP
MAX
UNITS
VOUT
DAC Output Span
External Reference
Internal Reference
PSR
Power Supply Rejection
VCC = 3V ± 10% or 5V ± 10%
ISC
Short Circuit Output Current (Note 6)
Sinking
Sourcing
VFS = VCC = 5.5V
Zero Scale; VOUT shorted to VCC
Full Scale; VOUT shorted to GND
l
l
27
–28
48
–48
mA
mA
DAC Output Current in High Impedance
Mode
LO Options Only
l
0.01
±0.5
µA
5.5
V
DAC ISD
0 to VREF
0 to 2.5
V
V
–80
dB
Power Supply
VCC
Positive Supply Voltage
For Specified Performance
l
2.7
ICC
Supply Current (Note 7)
VCC = 3V, VREF = 2.5V, External Reference
VCC = 3V, Internal Reference
VCC = 5V VREF = 2.5V, External Reference
VCC = 5V, Internal Reference
l
l
l
l
0.3
0.4
0.3
0.4
0.5
0.6
0.5
0.6
mA
mA
mA
mA
ISD
Supply Current in Power-Down Mode
(Note 7)
VCC = 5V
l
0.5
2
µA
VCC
V
160
200
kΩ
Reference Input
Input Voltage Range
l
1
Resistance
l
120
Capacitance
IREF
Reference Current, Power Down Mode
12
DAC Powered Down
l
pF
0.005
5
1.25
1.26
µA
Reference Output
Output Voltage
l
1.24
V
Reference Temperature Coefficient
±10
ppm/°C
Output Impedance
0.5
kΩ
Capacitive Load Driving
10
µF
2.5
mA
Short Circuit Current
VCC = 5.5V, REF Shorted to GND
2633fb
4
LTC2633
Electrical
Characteristics
The
l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. VCC = 2.7V to 5.5V, VOUT unloaded unless otherwise specified.
LTC2633-LI12/-LI10/-LI8/-LX12/-LX10/-LX8/-LZ12/-LZ10/-LZ8/-LO12/-LO10/-LO8/LTC2633A-LI12/-LX12/-LZ12/-LO12 (VFS = 2.5V)
SYMBOL PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
Digital I/O
VIL
Low Level Input Voltage
(SDA and SCL)
(Note 14)
l
–0.5
0.3VCC
V
VIH
High Level Input Voltage
(SDA and SCL)
(Note 11)
l
0.7VCC
VIL(CA0)
Low Level Input Voltage on CA0
See Test Circuit 1
l
VIH(CA0)
High Level Input Voltage on CA0
See Test Circuit 1
l
RINH
Resistance from CA0
to VCC to Set CA0 = VCC
See Test Circuit 2
l
10
kΩ
RINL
Resistance from CA0
to GND to Set CA0 = GND
See Test Circuit 2
l
10
kΩ
RINF
Resistance from CA0 to VCC or GND to
Set CA0 = Float
See Test Circuit 2
l
2
VOL
Low Level Output Voltage
Sink Current = 3mA
l
0
0.4
V
tOF
Output Fall Time
VO = VIH(MIN) to VO = VIL(MAX),
CB = 10pF to 400pF (Note 12)
l
20 + 0.1CB
250
ns
tSP
Pulse Width of Spikes Suppressed by
Input Filter
l
0
50
ns
IIN
Input Leakage
0.1VCC ≤ VIN ≤ 0.9VCC
l
1
µA
CIN
I/O Pin Capacitance
(Note 8)
l
8
pF
CB
Capacitive Load for Each Bus Line
l
400
pF
CCA0
External Capacitive Load on Address Pin
CA0
l
10
pF
V
0.15VCC
0.85VCC
V
V
MΩ
AC Performance
ts
en
Settling Time
VCC = 3V (Note 9)
±0.39% (±1LSB at 8 Bits)
±0.098% (±1LSB at 10 Bits)
±0.024% (±1LSB at 12 Bits)
3.4
4.0
4.5
µs
µs
µs
Voltage Output Slew Rate
1.0
V/µs
Capacitive Load Driving
500
pF
Glitch Impulse
At Mid-Scale Transition
2.8
nV•s
DAC-to-DAC Crosstalk
1 DAC Held at FS, 1 DAC Switch 0-FS
5.2
nV•s
Multiplying Bandwidth
External Reference
320
kHz
Output Voltage Noise Density
At f = 1kHz, External Reference
At f = 10kHz, External Reference
At f = 1kHz, Internal Reference
At f = 10kHz, Internal Reference
180
160
200
180
nV/√Hz
nV/√Hz
nV/√Hz
nV/√Hz
Output Voltage Noise
0.1Hz to 10Hz, External Reference
0.1Hz to 10Hz, Internal Reference
0.1Hz to 200kHz, External Reference
0.1Hz to 200kHz, Internal Reference
CREF = 0.1µF
30
35
680
730
µVP-P
µVP-P
µVP-P
µVP-P
2633fb
5
LTC2633
Timing
Characteristics
The
l denotes the specifications which apply over the full operating temperature
range, otherwise specifications are at TA = 25°C. VCC = 2.7V to 5.5V. (See Figure 1) (Note 13)
LTC2633-LI12/-LI10/-LI8/-LX12/-LX10/-LX8/-LZ12/-LZ10/-LZ8/-LO12/-LO10/-LO8/LTC2633A-LI12/-LX12/-LZ12/-LO12 (VFS = 2.5V)
SYMBOL PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
400
kHz
fSCL
SCL Clock Frequency
l
0
tHD(STA)
Hold Time (Repeated) Start Condition
l
0.6
µs
tLOW
Low Period of the SCL Clock Pin
l
1.3
µs
tHIGH
High Period of the SCL Clock Pin
l
0.6
µs
tSU(STA)
Set-Up Time for a Repeated Start Condition
l
0.6
µs
tHD(DAT)
Data Hold Time
l
0
tSU(DAT)
Data Set-Up Time
l
100
tr
Rise Time of Both SDA and SCL Signals
(Note 12)
l
20 + 0.1CB
300
ns
tf
Fall Time of Both SDA and SCL Signals
(Note 12)
l
20 + 0.1CB
300
ns
tSU(STO)
Set-Up Time for Stop Condition
l
0.6
µs
tBUF
Bus Free Time Between a Stop and Start
Condition
l
1.3
µs
0.9
µs
ns
Electrical
Characteristics
The
l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. VCC = 4.5V to 5.5V, VOUT unloaded unless otherwise specified.
LTC2633-HI12/-HI10/-HI8/-HZ12/-HZ10/-HZ8/LTC2633A-HI12/-HZ12 (VFS = 4.096V)
LTC2633-8
SYMBOL PARAMETER
CONDITIONS
LTC2633-10
LTC2633-12
LTC2633A-12
MIN TYP MAX MIN TYP MAX MIN TYP MAX MIN TYP MAX
UNITS
DC Performance
Resolution
l
8
8
10
12
Monotonicity
VCC = 5V, Internal Ref. (Note 4)
l
Differential
Nonlinearity
VCC = 5V, Internal Ref. (Note 4)
l
±0.5
INL
Integral Nonlinearity VCC = 5V, Internal Ref. (Note 4)
l
±0.05 ±0.5
±0.2
±1
±1
±2.5
ZSE
Zero Scale Error
VCC = 5V, Internal Ref., Code = 0
l
0.5
5
0.5
5
0.5
5
VOS
Offset Error
VCC = 5V, Internal Ref. (Note 5)
l
±0.5
±5
±0.5
±5
±0.5
±5
VOSTC
VOS Temperature
Coefficient
VCC = 5V, Internal Ref.
GE
Gain Error
VCC = 5V, Internal Ref.
GETC
Gain Temperature
Coefficient
VCC = 5V, Internal Ref. (Note 10)
C-Grade
H-Grade
Load Regulation
l
VCC = 5V ± 10%, Internal Ref.
Mid-Scale, –10mA ≤ IOUT ≤ 10mA
0.006 0.01
0.022 0.04
0.09 0.16
0.09 0.16 LSB/mA
DC Output
Impedance
l
VCC = 5V ± 10%, Internal Ref.
Mid-Scale, –10mA ≤ IOUT ≤ 10mA
0.09 0.156
0.09 0.156
0.09 0.156
0.09 0.156
ROUT
12
Bits
DNL
l
10
12
12
±0.5
Bits
±1
±1
LSB
±0.5
±1
LSB
0.5
5
mV
±0.5
±5
mV
±10
±10
±10
±10
µV/°C
±0.2 ±0.8
±0.2 ±0.8
±0.2 ±0.8
±0.2 ±0.8
%FSR
10
10
10
10
10
10
10
10
ppm/°C
ppm/°C
Ω
2633fb
6
LTC2633
Electrical
Characteristics
The
l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. VCC = 4.5V to 5.5V, VOUT unloaded unless otherwise specified.
LTC2633-HI12/-HI10/-HI8/-HZ12/-HZ10/-HZ8/LTC2633A-HI12/-HZ12 (VFS = 4.096V)
SYMBOL PARAMETER
CONDITIONS
MIN
VOUT
DAC Output Span
External Reference
Internal Reference
PSR
Power Supply Rejection
VCC = 5V ± 10%
ISC
Short Circuit Output Current (Note 6)
Sinking
Sourcing
VFS = VCC = 5.5V
Zero Scale; VOUT shorted to VCC
Full Scale; VOUT shorted to GND
l
l
TYP
MAX
UNITS
0 to VREF
0 to 4.096
V
V
–80
dB
27
–28
48
–48
mA
mA
5.5
V
Power Supply
VCC
Positive Supply Voltage
For Specified Performance
l
4.5
ICC
Supply Current (Note 7)
VCC = 5V, VREF =4.096V, External Reference
VCC = 5V, Internal Reference
l
l
0.4
0.5
0.6
0.7
mA
mA
ISD
Supply Current in Power-Down Mode
(Note 7)
VCC = 5V
l
0.5
2
µA
VCC
V
200
kΩ
Reference Input
Input Voltage Range
l
1
Resistance
l
120
Capacitance
IREF
Reference Current, Power Down Mode
160
12
DAC Powered Down
l
pF
0.005
5
µA
2.048
2.064
V
Reference Output
Output Voltage
l
2.032
Reference Temperature Coefficient
±10
ppm/°C
Output Impedance
0.5
kΩ
Capacitive Load Driving
10
µF
4
mA
Short Circuit Current
VCC = 5.5V, REF Shorted to GND
VIL
Low Level Input Voltage
(SDA and SCL)
(Note 14)
l
–0.5
VIH
High Level Input Voltage
(SDA and SCL)
(Note 11)
l
0.7VCC
VIL(CA0)
Low Level Input Voltage on CA0
See Test Circuit 1
l
VIH(CA0)
High Level Input Voltage on CA0
See Test Circuit 1
l
RINH
Resistance from CA0
to VCC to Set CA0 = VCC
See Test Circuit 2
l
10
kΩ
RINL
Resistance from CA0
to GND to Set CA0 = GND
See Test Circuit 2
l
10
kΩ
RINF
Resistance from CA0 to VCC or GND to
Set CA0 = Float
See Test Circuit 2
l
2
VOL
Low Level Output Voltage
Sink Current = 3mA
l
0
0.4
V
tOF
Output Fall Time
VO = VIH(MIN) to VO = VIL(MAX),
CB = 10pF to 400pF (Note 12)
l
20 + 0.1CB
250
ns
tSP
Pulse Width of Spikes Suppressed by
Input Filter
l
0
50
ns
IIN
Input Leakage
1
µA
Digital I/O
0.1VCC ≤ VIN ≤ 0.9VCC
l
0.3VCC
V
V
0.15VCC
0.85VCC
V
V
MΩ
2633fb
7
LTC2633
Electrical
Characteristics
The
l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. VCC = 4.5V to 5.5V, VOUT unloaded unless otherwise specified.
LTC2633-HI12/-HI10/-HI8/-HZ12/-HZ10/-HZ8/LTC2633A-HI12/-HZ12 (VFS = 4.096V)
SYMBOL PARAMETER
CONDITIONS
(Note 8)
MIN
TYP
MAX
UNITS
CIN
I/O Pin Capacitance
l
8
pF
CB
Capacitive Load for Each Bus Line
l
400
pF
CCA0
External Capacitive Load on Address Pin
CA0
l
10
pF
AC Performance
ts
en
Settling Time
VCC = 5V (Note 9)
±0.39% (±1LSB at 8 Bits)
±0.098% (±1LSB at 10 Bits)
±0.024% (±1LSB at 12 Bits)
3.7
4.0
4.7
µs
µs
µs
Voltage Output Slew Rate
1.0
V/µs
Capacitive Load Driving
500
pF
Glitch Impulse
At Mid-Scale Transition
3.0
nV•s
DAC-to-DAC Crosstalk
1 DAC Held at FS, 1 DAC Switch 0-FS
6.7
nV•s
Multiplying Bandwidth
External Reference
320
kHz
Output Voltage Noise Density
At f = 1kHz, External Reference
At f = 10kHz, External Reference
At f = 1kHz, Internal Reference
At f = 10kHz, Internal Reference
180
160
250
230
nV/√Hz
nV/√Hz
nV/√Hz
nV/√Hz
Output Voltage Noise
0.1Hz to 10Hz, External Reference
0.1Hz to 10Hz, Internal Reference
0.1Hz to 200kHz, External Reference
0.1Hz to 200kHz, Internal Reference
CREF = 0.1µF
30
40
680
750
µVP-P
µVP-P
µVP-P
µVP-P
2633fb
8
LTC2633
Timing
Characteristics
The
l denotes the specifications which apply over the full operating temperature
range, otherwise specifications are at TA = 25°C. VCC = 4.5V to 5.5V. (See Figure 1) (Note 13)
LTC2633-HI12/-HI10/-HI8/-HZ12/-HZ10/-HZ8/LTC2633A-HI12/-HZ12 (VFS = 4.096V)
SYMBOL PARAMETER
CONDITIONS
MIN
MAX
UNITS
400
kHz
fSCL
SCL Clock Frequency
tHD(STA)
Hold Time (Repeated) Start Condition
l
0.6
µs
tLOW
Low Period of the SCL Clock Pin
l
1.3
µs
tHIGH
High Period of the SCL Clock Pin
l
0.6
µs
tSU(STA)
Set-Up Time for a Repeated Start Condition
l
0.6
µs
tHD(DAT)
Data Hold Time
l
0
tSU(DAT)
Data Set-Up Time
l
100
tr
Rise Time of Both SDA and SCL Signals
(Note 12)
l
20 + 0.1CB
300
ns
tf
Fall Time of Both SDA and SCL Signals
(Note 12)
l
20 + 0.1CB
300
ns
tSU(STO)
Set-Up Time for Stop Condition
l
0.6
µs
tBUF
Bus Free Time Between a Stop and Start
Condition
l
1.3
µs
Note 1. Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2. All voltages are with respect to GND
Note 3. High temperatures degrade operating lifetimes. Operating lifetime
is derated at temperatures greater than 105°C.
Note 4. Linearity and monotonicity are defined from code kL to code
2N–1, where N is the resolution and kL is given by kL = 0.016 • (2N/ VFS),
rounded to the nearest whole code. For VFS = 2.5V and N = 12, kL = 26 and
linearity is defined from code 26 to code 4,095. For VFS = 4.096V and
N = 12, kL = 16 and linearity is defined from code 16 to code 4,095.
Note 5. Inferred from measurement at code 16 (LTC2633-12), code 4
(LTC2633-10) or code 1 (LTC2633-8), and at full scale.
Note 6. This IC includes current limiting that is intended to protect the
device during momentary overload conditions. Junction temperature can
0
TYP
l
0.9
µs
ns
exceed the rated maximum during current limiting. Continuous operation
above the specified maximum operating junction temperature may impair
device reliability.
Note 7. Digital inputs at 0V or VCC.
Note 8. Guaranteed by design and not production tested.
Note 9. Internal reference mode. DAC is stepped 1/4 scale to 3/4 scale and
3/4 scale to 1/4 scale. Load is 2kΩ in parallel with 100pF to GND.
Note 10. Temperature coefficient is calculated by dividing the maximum
change in output voltage by the specified temperature range.
Note 11. Maximum VIH = VCC(MAX) + 0.5V
Note 12. CB = capacitance of one bus line in pF
Note 13. All values refer to VIH = VIH(MIN) and VIL = VIL(MAX) levels.
Note 14. Minimum VIL exceeds the absolute maximum rating. This
condition won’t damage the IC, but could degrade performance.
2633fb
9
LTC2633
Typical Performance Characteristics
TA = 25°C unless otherwise noted.
LTC2633-L12 (Internal Reference, VFS = 2.5V)
Integral Nonlinearity (INL)
1.0
VCC = 3V
1.0
VCC = 3V
–0.5
INL (LSB)
0
0
1024
3072
2048
CODE
4095
–1.0
0
1024
3072
2048
CODE
2633 G01
4095
–1.0
–50 –25
INL (NEG)
0
25 50 75 100 125 150
TEMPERATURE (°C)
2633 G03
Reference Output Voltage vs
Temperature
1.260
VCC = 3V
0.5
VCC = 3V
1.255
DNL (POS)
VREF (V)
DNL (LSB)
0
2633 G02
DNL vs Temperature
1.0
INL (POS)
–0.5
–0.5
0
VCC = 3V
0.5
0.5
DNL (LSB)
INL (LSB)
0.5
–1.0
INL vs Temperature
Differential Nonlinearity (DNL)
1.0
0
DNL (NEG)
–0.5
1.250
1.245
–1.0
–50 –25
0
25 50 75 100 125 150
TEMPERATURE (°C)
1.240
–50 –25
0
2633 G04
2633 G05
Settling to ±1LSB Rising
Settling to ±1LSB Falling
9TH CLOCK OF
3RD DATA BYTE
SCL
5V/DIV
3/4 SCALE TO 1/4 SCALE STEP
VCC = 3V, VFS = 2.5V
RL = 2k, CL = 100pF
AVERAGE OF 256 EVENTS
VOUT
1LSB/DIV
3.6µs
VOUT
1LSB/DIV
25 50 75 100 125 150
TEMPERATURE (°C)
4.5µs
1/4 SCALE TO 3/4 SCALE STEP
VCC = 3V, VFS = 2.5V
RL = 2k, CL = 100pF
AVERAGE OF 256 EVENTS
2µs/DIV
SCL
5V/DIV
9TH CLOCK OF
3RD DATA BYTE
2µs/DIV
2633 G06
2633 G07
2633fb
10
LTC2633
Typical Performance Characteristics
TA = 25°C unless otherwise noted.
LTC2633-H12 (Internal Reference, VFS = 4.096V)
Integral Nonlinearity (INL)
1.0
Differential Nonlinearity (DNL)
1.0
VCC = 5V
–0.5
0
1024
3072
2048
CODE
4095
–1.0
0
1024
3072
2048
CODE
2633 G08
0
INL (NEG)
–1.0
–50 –25
4095
0
25 50 75 100 125 150
TEMPERATURE (°C)
2633 G10
2633 G09
Reference Output Voltage vs
Temperature
DNL vs Temperature
1.0
INL (POS)
–0.5
–0.5
2.068
VCC = 5V
0.5
VCC = 5V
2.058
DNL (POS)
VREF (V)
0
VCC = 5V
0.5
INL (LSB)
DNL (LSB)
0
–1.0
VCC = 5V
0.5
DNL (LSB)
INL (LSB)
0.5
INL vs Temperature
1.0
0
DNL (NEG)
–0.5
2.048
2.038
–1.0
–50 –25
0
25 50 75 100 125 150
TEMPERATURE (°C)
2.028
–50 –25
0
25 50 75 100 125 150
TEMPERATURE (°C)
2633 G11
2633 G12
Settling to ±1LSB Rising
Settling to ±1LSB Falling
SCL
5V/DIV
VOUT
1LSB/DIV
4.7µs
3.8µs
VOUT
1LSB/DIV
3/4 SCALE TO 1/4 SCALE
STEP
VCC = 5V, VFS = 4.095V
RL = 2k, CL = 100pF
AVERAGE OF 256 EVENTS
9TH CLOCK OF
3RD DATA BYTE
1/4 SCALE TO 3/4 SCALE STEP
VCC = 5V, VFS = 4.095V
RL = 2k, CL = 100pF
AVERAGE OF 256 EVENTS
2µs/DIV
SCL
5V/DIV
9TH CLOCK OF
3RD DATA BYTE
2µs/DIV
2633 G13
2633 G14
2633fb
11
LTC2633
Typical Performance Characteristics
TA = 25°C unless otherwise noted.
LTC2633-10
Integral Nonlinearity (INL)
1.0
Differential Nonlinearity (DNL)
1.0
VCC = 3V
VFS = 2.5V
INTERNAL REF
0.5
DNL (LSB)
INL (LSB)
0.5
0
–0.5
–1.0
VCC = 3V
VFS = 2.5V
INTERNAL REF
0
–0.5
256
0
768
512
CODE
–1.0
1023
256
0
512
CODE
768
2633 G15
1023
2633 G16
LTC2633-8
Integral Nonlinearity (INL)
0.50
Differential Nonlinearity (DNL)
0.50
VCC = 3V
VFS = 2.5V
INTERNAL REF
0.25
DNL (LSB)
INL (LSB)
0.25
0
0
–0.25
–0.25
–0.50
VCC = 3V
VFS = 2.5V
INTERNAL REF
64
0
192
128
CODE
–0.50
255
64
0
128
CODE
192
255
2633 G18
2633 G17
LTC2633
Load Regulation
8
6
Current Limiting
0.20
VCC = 5V (LTC2633-H)
VCC = 5V (LTC2633-L)
VCC = 3V (LTC2633-L)
0.15
2
∆VOUT (V)
∆VOUT (mV)
VCC = 5V (LTC2633-H)
VCC = 5V (LTC2633-L)
VCC = 3V (LTC2633-L)
2
0.10
4
0
–2
0.05
0
–0.05
–4
–0.10
–6
INTERNAL REFERENCE
CODE = MID-SCALE
–8
–10
–30
Offset Error vs Temperature
3
OFFSET ERROR (mV)
10
–20
–10
0
10
IOUT (mA)
20
30
2633 G19
0
–1
–2
–0.15
–0.20
–30
1
INTERNAL REFERENCE
CODE = MID-SCALE
–20
–10
0
10
IOUT (mA)
20
30
2633 G20
–3
–50 –25
0
25 50 75 100 125 150
TEMPERATURE (°C)
2633 G21
2633fb
12
LTC2633
Typical Performance Characteristics
TA = 25°C unless otherwise noted.
LTC2633
Large-Signal Response
Mid-Scale-Glitch Impulse
Power-On Reset Glitch
LTC2633-L
9TH CLOCK OF
3RD DATA BYTE
SCL
5V/DIV
LTC2633-H12, VCC = 5V
3nV•s TYPICAL
VCC
2V/DIV
VOUT
0.5V/DIV
VOUT
2mV/DIV
ZERO-SCALE
VOUT
10mV/DIV
LTC2633-L12, VCC = 3V
2.8nV•s TYPICAL
VFS = VCC = 5V
1/4 SCALE to 3/4 SCALE
2µs/DIV
2µs/DIV
2633 G24
200µs/DIV
2633 G22
2633 G23
Headroom at Rails vs Output
Current
Exiting Power-Down to Mid-Scale
Power-On Reset to Mid-Scale
5.0
5V SOURCING
4.5
9TH CLOCK OF
3RD DATA BYTE
4.0
3V (LTC2633-L) SOURCING
LTC2633-H
2.5
2.0
1.5
DAC B IN
POWER-DOWN
MODE
VOUTA
0.5V/DIV
5V SINKING
LTC2633-H
VCC = 5V
INTERNAL REF.
1.0
3V (LTC2633-L) SINKING
0.5
0
0
1
2
4 5 6
IOUT (mA)
3
7
8
9
1.2
200µs/DIV
2633 G27
2633 G26
2633 G25
Exiting Power-Down for Hi-Z
Option
SWEEP SDA, SCL
BETWEEN
ON AND VCC
1.0
9TH CLOCK OF
3RD DATA BYTE
SCL
5V/DIV
VCC = 5V
0.8
0.6
0.4
0.2
VOUT
500mV/DIV
VCC = 3V
(LTC2633-L)
0
1
LTC2633-L
VOUT
0.5V/DIV
5µs/DIV
10
Supply Current vs Logic Voltage
ICC (mA)
VOUT (V)
3.5
3.0
VCC
2V/DIV
SCL
5V/DIV
2
3
LOGIC VOLTAGE (V)
4
5
2633 G28
LTC2633-LO, VCC = 3V
DAC OUTPUT DRIVEN
BY 1V SOURCE
THROUGH 15k
RESISTOR
DAC OUTPUT SET
TO MID-SCALE
HIGH-IMPEDANCE
(POWER-DOWN) MODE
5µs/DIV
2633 G29
2633fb
13
LTC2633
Typical Performance Characteristics
TA = 25°C unless otherwise noted.
LTC2633
Noise Voltage vs Frequency
500
0
NOISE VOLTAGE (nV/√Hz)
–2
–4
–8
–10
–12
VCC = 5V
VREF(DC) = 2V
VREF(AC) = 0.2VP-P
CODE = FULL-SCALE
–14
–16
–18
1k
10k
100k
FREQUENCY (Hz)
VCC = 5V
CODE = MID-SCALE
INTERNAL REFERENCE
300
LTC2633-H
200
LTC2633-L
100
0.4
0.2
0
–0.2
–0.4
–0.6
1M
0
100
1k
100k
10k
FREQUENCY (Hz)
–0.8
1M
1
1.5
2633 G32
2633 G31
0.1Hz to 10Hz Voltage Noise
2 2.5 3 3.5 4 4.5
REFERENCE VOLTAGE (V)
5
5.5
2633 G33
Gain Error vs Temperature
DAC to DAC Crosstalk (Dynamic)
1.0
VCC = 5V, VFS = 2.5V
CODE = MID-SCALE
INTERNAL REFERENCE
SCL
5V/DIV
9TH CLOCK OF
3RD DATA BYTE
1 DAC
SWITCH 0-FS
2V/DIV
10µV/DIV
VOUT
2mV/DIV
1s/DIV
VCC = 5.5V
GAIN ERROR OF 2 CHANNELS
0.6
2632 G34
LTC2633-H12, VCC = 5V
6.7nV•s TYP
GAIN ERROR (%FSR)
dB
–6
400
Gain Error vs Reference Input
0.8
GAIN ERROR (%FSR)
Multiplying Bandwidth
2
0.5
0
–0.5
–1.0
–50 –25
2µs/DIV
2633 G35
0
25 50 75 100 125 150
TEMPERATURE (°C)
2633 G36
Pin Functions
SCL (Pin 1): Serial Clock Input Pin. Data is shifted into the
SDA pin at the rising edges of the clock. This high impedance
pin requires a pull-up resistor or current source to VCC.
(0.1µF is recommended) and must be buffered when
driving external DC load current.
CA0 (Pin 2): Chip Address Bit 0. Tie this pin to VCC, GND
or leave it floating to select an I2C slave address for the
part (see Table 1).
VOUTA, VOUTB (Pins 5,6): DAC Analog Voltage Output.
REF (Pin 3): Reference Voltage Input or Output. When
external reference mode is selected, REF is an input (1V ≤
VREF ≤ VCC) where the voltage supplied sets the full-scale
DAC output voltage. When internal reference is selected,
the 10ppm/°C 1.25V (LTC2633-L) or 2.048V (LTC2633-H)
internal reference (half full-scale) is available at the pin.
This output may be bypassed to GND with up to 10µF
GND (Pin 4): Ground.
VCC (Pin 7): Supply Voltage Input. 2.7V ≤ VCC ≤ 5.5V
(LTC2633-L) or 4.5V ≤ VCC ≤ 5.5V (LTC2633-H). Bypass
to GND with a 0.1µF capacitor.
SDA (Pin 8): Serial Data Bidirectional Pin. Data is shifted
into the SDA pin and acknowledged by the SDA pin. This
pin is high impedance while data is shifted in. Open drain
N-channel output during acknowledgement. SDA requires
a pull-up resistor or current source to VCC.
2633fb
14
LTC2633
Block Diagram
INTERNAL
REFERENCE
GND
REF
SWITCH
VREF
REGISTER
REGISTER
DAC A
REGISTER
VOUTA
REGISTER
VCC
VOUTB
DAC B
CONTROL
DECODE LOGIC
POWER-ON
RESET
SCL
I2C
ADDRESS
DECODE
CA0
SDA
I2C INTERFACE
2633 BD
Test Circuit
Test circuits for I2C digital I/O (see Electrical Characteristics)
Test Circuit 1
Test Circuit 2
VDD
100Ω
CA0
RINH/RINL/RINF
VIH(CA0)/VIL(CA0)
2633 TC01
CA0
GND
2633 TC02
Timing Diagram
SDA
tLOW
tf
tf
tSU(DAT)
tr
tHD(STA)
tSP
tBUF
tr
SCL
tHD(STA)
tHD(DAT)
tSU(STA)
S
tHIGH
S
tSU(STO)
P
S
2633 F01
ALL VOLTAGE LEVELS REFER TO VIH(MIN) AND VIL(MAX) LEVELS
Figure 1. I2C Timing
SLAVE ADDRESS
1ST DATA BYTE
2ND DATA BYTE
3RD DATA BYTE
START
SDA
A6
A5
A4
A3
A2
A1
A0
W
SCL
1
2
3
4
5
6
7
8
ACK C3
9
1
C2
C1
C0
A3
A2
A1
A0
ACK
2
3
4
5
6
7
8
9
ACK
1
2
3
4
5
6
7
8
9
1
2
3
4
X
X
X
X
ACK
5
6
7
8
9
2633 F02
Figure 2. Typical LTC2633 Write Transaction
2633fb
15
LTC2633
Operation
The LTC2633 is a family of dual voltage output DACs in an
8-lead TSOT package. Each DAC can operate rail-to-rail
using an external reference, or with its full-scale voltage
set by an integrated reference. Eighteen combinations of
accuracy (12-, 10-, and 8-bit), power-on reset value (zeroscale, mid-scale in internal reference mode, or mid-scale
in external reference mode), DAC power-down output load
(high impedance or 200kΩ), and full-scale voltage (2.5V
or 4.096V) are available. The LTC2633 is controlled using
a 2-wire I2C interface.
Power Supply Sequencing
The voltage at REF (Pin 3) must be kept within the range
–0.3V ≤ VREF ≤ VCC + 0.3V (see Absolute Maximum Ratings). Particular care should be taken to observe these
limits during power supply turn-on and turn-off sequences,
when the voltage at VCC is in transition.
Transfer Function
The digital-to-analog transfer function is:
Power-On Reset
The LTC2633-HZ/LTC2633-LZ clear the output to zero-scale
when power is first applied, making system initialization
consistent and repeatable.
For some applications, downstream circuits are active during DAC power-up, and may be sensitive to nonzero outputs
from the DAC during this time. The LTC2633 contains
circuitry to reduce the power-on glitch: the analog output
typically rises less than 10mV above zero scale during
power-on. In general, the glitch amplitude decreases as the
power supply ramp time is increased. See power-on reset
glitch in the Typical Performance Characteristics section.
The LTC2633-HI/LTC2633-LI/LTC2633-LX provide an
alternative reset, setting the output to mid-scale when
power is first applied. The LTC2633-LI/ and LTC2633-HI
power up in internal reference mode, with the output set
to a mid-scale voltage of 1.25V and 2.048V respectively.
The LTC2633-LX power-up in external reference mode, with
the output set to mid-scale of the external reference. The
LTC2633-LO powers up in internal reference mode with
all the DAC channels placed in the high impedance state
(powered down). Input and DAC registers are set to the
mid-scale code, and only the internal reference is powered
up, causing supply current to be typically 180µA upon
power up. Default reference mode selection is described
in the Reference Modes section.
VOUT(IDEAL) =
k
2N
VREF
where k is the decimal equivalent of the binary DAC input
code, N is the resolution, and VREF is either 2.5V (LTC2633-LI/
LTC2633-LX/LTC2633-LO/LTC2633-LZ) or 4.096V
(LTC2633-HI/LTC2633-HZ) when in internal reference
mode, and the voltage at REF when in external reference
mode.
I2C Serial Interface
The LTC2633 communicates with a host using the standard 2-wire I2C interface. The Timing Diagram (Figures
1 and 2) show the timing relationship of the signals on
the bus. The two bus lines, SDA and SCL, must be high
when the bus is not in use. External pull-up resistors or
current sources are required on these lines. The value of
these pull-up resistors is dependent on the power supply
and can be obtained from the I2C specifications. For an
I2C bus operating in the fast mode, an active pull-up will
be necessary if the bus capacitance is greater than 200pF.
The LTC2633 is a receive-only (slave) device. The master
can write to the LTC2633. The LTC2633 will not acknowledge (NAK) a read request from the master.
2633fb
16
LTC2633
Operation
START (S) and STOP (P) Conditions
When the bus is not in use, both SCL and SDA must be
high. A bus master signals the beginning of a communication to a slave device by transmitting a START condition. A
START condition is generated by transitioning SDA from
high to low while SCL is high.
When the master has finished communicating with the
slave, it issues a STOP condition. A STOP condition is
generated by transitioning SDA from low to high while
SCL is high. The bus is then free for communication with
another I2C device.
Acknowledge
The acknowledge (ACK) signal is used for handshaking
between the master and the slave. An ACK generated by the
slave lets the master know that the latest byte of information was properly received. The ACK related clock pulse is
generated by the master. The master releases the SDA line
(HIGH) during the ACK clock pulse. The slave-receiver must
pull down the SDA bus line during the ACK clock pulse
so that it remains a stable LOW during the HIGH period
of this clock pulse. The LTC2633 responds to a write by a
master in this manner but does not acknowledge a read
operation; in that case, SDA is retained HIGH during the
period of the ACK clock pulse.
Chip Address
In addition to the address selected by the address pin,
the part also responds to a global address. This address
allows a common write to all LTC2633 parts to be accomplished using one 3-byte write transaction on the I2C
bus. The global address, listed at the end of Tables 1, is a
7-bit hardwired address not selectable by CA0. If another
address is required, please consult the factory.
The maximum capacitive load allowed on the address pin
(CA0) is 10pF, as these pins are driven during address
detection to determine if they are floating.
Write Word Protocol
The master initiates communication with the LTC2633
with a START condition and a 7-bit slave address followed
by the write bit (W) = 0. The LTC2633 acknowledges by
pulling the SDA pin low at the 9th clock if the 7-bit slave
address matches the address of the part (set by CA0) or
the global address. The master then transmits three bytes
of data. The LTC2633 acknowledges each byte of data
by pulling the SDA line low at the 9th clock of each data
byte transmission. After receiving three complete bytes
of data, the LTC2633 executes the command specified in
the 24-bit input word.
If more than three data bytes are transmitted after a valid
7-bit slave address, the LTC2633 does not acknowledge the
extra bytes of data (SDA is high during the 9th clock).
The state of pin CA0 determines the slave address of the
part. This pin can be set to any one of three states: VCC, GND
or float. This results in 3 selectable addresses for the part.
The slave address assignments is shown in Table 1.
Table 1. Slave Address Map
CA0
A6
A5
A4
A3
A2
A1
A0
GND
0
0
1
0
0
0
0
FLOAT
0
0
1
0
0
0
1
VCC
0
0
1
0
0
1
0
GLOBAL ADDR
1
1
1
0
0
1
1
2633fb
17
LTC2633
Operation
The format of the three data bytes is shown in Figure
3. The first byte of the input word consists of the 4-bit
command, followed by the 4-bit DAC address. The next
two bytes contain the 16-bit data word, which consists
of the 12-, 10- or 8-bit input code, MSB to LSB, followed
by 4, 6 or 8 don’t-care bits (LTC2633-12, LTC2633-10
and LTC2633-8 respectively). A typical LTC2633 write
transaction is shown in Figure 4.
Table 3. Command Codes
COMMAND*
The command bit assignments (C3-C0) and address (A3A0) assignments are shown in Tables 3 and 4. The first
four commands in the table consist of write and update
operations. A write operation loads a 16-bit data word
from the 32-bit shift register into the input register. In an
update operation, the data word is copied from the input
register to the DAC register. Once copied into the DAC
register, the data word becomes the active 12-, 10-, or
8-bit input code, and is converted to an analog voltage at
the DAC output. Write to and update combines the first
two commands. The update operation also powers up the
DAC if it had been in power-down mode. The data path
and registers are shown in the Block Diagram.
C3
C2
C1
C0
0
0
0
0
Write to Input Register n
0
0
0
1
Update (Power-Up) DAC Register n
0
0
1
0
Write to Input Register n, Update (Power-Up) All
0
0
1
1
Write to and Update (Power-Up) DAC Register n
0
1
0
0
Power-Down n
0
1
0
1
Power-Down Chip (All DAC’s and Reference)
0
1
1
0
Select Internal Reference (Power-Up Reference)
0
1
1
1
Select External Reference (Power-Down Internal
Reference)
1
1
1
1
No Operation
*Command codes not shown are reserved and should not be used.
Table 4. Address Codes
ADDRESS (n)*
A3
A2
A1
A0
0
0
0
0
DAC A
0
0
0
1
DAC B
1
1
1
1
All DACs
* Address codes not shown are reserved and should not be used.
WRITE WORD PROTOCOL LTC2633
S
W
SLAVE ADDRESS
A
1ST DATA BYTE
A
2ND DATA BYTE
A
3RD DATA BYTE
A
P
D5
D4
D1
D0
INPUT WORD
INPUT WORD (LTC2633-12)
C3
C2
C1
C0
A3
A2
A1
A0
D11
D10
D9
1ST DATA BYTE
D8
D7
D6
D3
D2
X
X
X
X
X
X
X
X
X
X
3RD DATA BYTE
2ND DATA BYTE
INPUT WORD (LTC2633-10)
C3
C2
C1
C0
A3
A2
A1
A0
D9
D8
D7
1ST DATA BYTE
D6
D5
D4
D3
D2
D1
D0
X
2ND DATA BYTE
X
X
3RD DATA BYTE
INPUT WORD (LTC2633-8)
C3
C2
C1
C0
A3
1ST DATA BYTE
A2
A1
A0
D7
D6
D5
D4
D3
D2
D1
D0
2ND DATA BYTE
X
X
X
X
X
3RD DATA BYTE
2633 F03
Figure 3. Command and Data Input Format
2633fb
18
X = DON’T CARE
2
1
SCL
VOUT
A5
A6
A5
SDA
START
A6
3
A4
4
A3
A3
5
A2
A2
6
A1
A1
SLAVE ADDRESS
A4
7
A0
8
9
1
ACK C3
C3
2
C2
C2
3
C1
C1
4
C0
C0
5
A3
A3
COMMAND
6
A2
A2
7
A1
A1
8
A0
A0
9
ACK
1
2
3
D11 D10 D9
4
D8
5
D7
MS DATA
6
D6
7
D5
8
D4
9
ACK
1
D3
2
D2
3
D1
Figure 4. Typical LTC2633 Input Waveform—Programming DAC Output for Full Scale
A0 WR
4
D0
5
X
LS DATA
6
X
7
X
8
X
9
ACK
2633 F04
ZERO-SCALE
VOLTAGE
FULL-SCALE
VOLTAGE
STOP
LTC2633
Operation
2633fb
19
LTC2633
Operation
Reference Modes
For applications where an accurate external reference is
either not available, or not desirable due to limited space,
the LTC2633 has a user-selectable, integrated reference.
The integrated reference voltage is internally amplified
by 2x to provide the full-scale DAC output voltage range.
The LTC2633-LI/LTC2633-LX/LTC2633-LO/LTC2633-LZ
provides a full-scale output of 2.5V. The LTC2633-HI/
LTC2633-HZ provides a full-scale output of 4.096V. The
internal reference can be useful in applications where
the supply voltage is poorly regulated. Internal reference
mode can be selected by using command 0110b, and is
the power-on default for LTC2633-HZ/LTC2633-LZ, as well
as for LTC2633-HI/LTC2633-LI/LTC2633-LO.
The 10ppm/°C, 1.25V (LTC2633-LI/LTC2633-LX/LTC2633LO/LTC2633-LZ) or 2.048V (LTC2633-HI/LTC2633-HZ)
internal reference is available at the REF pin. Adding
bypass capacitance to the REF pin will improve noise
performance; 0.1µF is recommended and up to 10µF can
be driven without oscillation. This output must be buffered
when driving an external DC load current.
Alternatively, the DAC can operate in external reference
mode using command 0111b. In this mode, an input voltage
supplied externally to the REF pin provides the reference
(1V ≤ VREF ≤ VCC) and the supply current is reduced. The
external reference voltage supplied sets the full-scale DAC
output voltage. External reference mode is the power-on
default for LTC2633-LX.
The reference mode of LTC2633-HZ/LTC2633-LZ/
LTC2633-HI/LTC2633-LI/LTC2633-LO (internal reference
power-on default), can be changed by software command
after power up. The same is true for LTC2633-LX (external
reference power-on default).
Power-Down Mode
For power-constrained applications, power-down mode can
be used to reduce the supply current whenever less than
two DAC outputs are needed. When in power-down, the
buffer amplifiers, bias circuits, and integrated reference
circuits are disabled, and draw essentially zero current.
The DAC outputs are put into a high impedance state, and
the output pins are passively pulled to ground through
individual 200kΩ resistors (LTC2633-LI/LTC2633-LX/
LTC2633-LO/LTC2633-LZ/LTC2633-HI/LTC2633-HZ). For
the LTC2633-LO options, the output pins are not passively
pulled to ground, but are also placed in a high impedance
state (open-circuited state) during power-down, typically
drawing less than 0.1µA. The LTC2633-LO options powerup with all DAC outputs in this high impedance state. They
remain that way until given a software update command.
For all LTC2633 options, Input- and DAC-register contents
are not disturbed during power-down.
Any channel or combination of channels can be put into
power-down mode by using command 0100b in combination with the appropriate DAC address, (n). The supply
current is reduced approximately 30% for each DAC
powered down. The integrated reference is automatically
powered down when external reference is selected using
command 0111b. In addition, all the DAC channels and the
integrated reference together can be put into power-down
mode using Power Down Chip command 0101b. When
the integrated reference is in power-down mode, the REF
pin becomes high impedance (typically > 1GΩ). For all
power-down commands the 16-bit data word is ignored.
Normal operation resumes after executing any command
that includes a DAC update, (as shown in Table 1). The
selected DAC is powered up as its voltage output is updated. When a DAC which is in a powered-down state is
powered up and updated, normal settling is delayed. If
less than two DACs are in a powered-down state prior to
the update command, the power-up delay time is 10µs.
However, if both DACs and the integrated reference are
powered down, then the main bias generation circuit block
has been automatically shut down in addition to the DAC
amplifiers and reference buffers. In this case, the power up
delay time is 12µs. The power-up of the integrated reference depends on the command that powered it down. If
the reference is powered down using the select external
reference command (0111b), then it can only be powered
back up using select internal reference command (0110b).
However, if the reference was powered down using power
down chip command (0101b), then in addition to select
2633fb
20
LTC2633
Operation
internal reference command (0110b), any command in
software that powers up the DACs will also power up the
integrated reference.
50Ω • 1mA, or 50mV). See the graph Headroom at Rails
vs Output Current in the Typical Performance Characteristics section.
Voltage Output
The amplifier is stable driving capacitive loads of up to
500pF.
The LTC2633’s integrated rail-to-rail amplifier has guaranteed load regulation when sourcing or sinking up to 10mA
at 5V, and 5mA at 3V.
Rail-to-Rail Output Considerations
In any rail-to-rail voltage output device, the output is limited
to voltages within the supply range.
Load regulation is a measure of the amplifier’s ability to
maintain the rated voltage accuracy over a wide range of
load current. The measured change in output voltage per
change in forced load current is expressed in LSB/mA.
Since the analog output of the DAC cannot go below ground,
it may limit for the lowest codes as shown in Figure 5b.
Similarly, limiting can occur near full scale when the REF
pin is tied to VCC. If VREF = VCC and the DAC full-scale error
(FSE) is positive, the output for the highest codes limits
at VCC, as shown in Figure 5c. No full-scale limiting can
occur if VREF is less than VCC–FSE.
DC output impedance is equivalent to load regulation, and
may be derived from it by simply calculating a change
in units from LSB/mA to Ω. The amplifier’s DC output
impedance is 0.1Ω when driving a load well away from
the rails.
Offset and linearity are defined and tested over the region
of the DAC transfer function where no output limiting can
occur.
When drawing a load current from either rail, the output
voltage headroom with respect to that rail is limited by
the 50Ω typical channel resistance of the output devices
(e.g., when sinking 1mA, the minimum output voltage is
VREF = VCC
POSITIVE
FSE
VREF = VCC
OUTPUT
VOLTAGE
OUTPUT
VOLTAGE
INPUT CODE
(c)
OUTPUT
VOLTAGE
0V
NEGATIVE
OFFSET
0
2,048
INPUT CODE
2633 F05
4,095
(a)
0V
INPUT CODE
(b)
Figure 5. Effects of Rail-to-Rail Operation on a DAC Transfer Curve (Shown for 12 Bits).
(a) Overall Transfer Function
(b) Effect of Negative Offset for Codes Near Zero
(c) Effect of Positive Full-Scale Error for Codes Near Full Scale
2633fb
21
LTC2633
Operation
Board Layout
The PC board should have separate areas for the analog and
digital sections of the circuit. A single, solid ground plane
should be used, with analog and digital signals carefully
routed over separate areas of the plane. This keeps digital
signals away from sensitive analog signals and minimizes
the interaction between digital ground currents and the
analog section of the ground plane. The resistance from
the LTC2633 GND pin to the ground plane should be as
low as possible. Resistance here will add directly to the
effective DC output impedance of the device (typically
0.1Ω). Note that the LTC2633 is no more susceptible to
this effect than any other parts of this type; on the contrary, it allows layout-based performance improvements
to shine rather than limiting attainable performance with
excessive internal resistance.
Another technique for minimizing errors is to use a separate power ground return trace on another board layer.
The trace should run between the point where the power
supply is connected to the board and the DAC ground pin.
Thus the DAC ground pin becomes the common point for
analog ground, digital ground, and power ground. When
the LTC2633 is sinking large currents, this current flows
out the ground pin and directly to the power ground trace
without affecting the analog ground plane voltage.
It is sometimes necessary to interrupt the ground plane
to confine digital ground currents to the digital portion of
the plane. When doing this, make the gap in the plane only
as long as it needs to be to serve its purpose and ensure
that no traces cross over the gap.
Package Description
TS8 Package
8-Lead Plastic TSOT-23
(Reference LTC DWG # 05-08-1637 Rev A)
0.40
MAX
2.90 BSC
(NOTE 4)
0.65
REF
1.22 REF
1.4 MIN
3.85 MAX 2.62 REF
2.80 BSC
1.50 – 1.75
(NOTE 4)
PIN ONE ID
RECOMMENDED SOLDER PAD LAYOUT
PER IPC CALCULATOR
0.22 – 0.36
8 PLCS (NOTE 3)
0.65 BSC
0.80 – 0.90
0.20 BSC
0.01 – 0.10
1.00 MAX
DATUM ‘A’
0.30 – 0.50 REF
0.09 – 0.20
(NOTE 3)
1.95 BSC
TS8 TSOT-23 0710 REV A
NOTE:
1. DIMENSIONS ARE IN MILLIMETERS
2. DRAWING NOT TO SCALE
3. DIMENSIONS ARE INCLUSIVE OF PLATING
4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR
5. MOLD FLASH SHALL NOT EXCEED 0.254mm
6. JEDEC PACKAGE REFERENCE IS MO-193
2633fb
22
LTC2633
Revision History
REV
DATE
DESCRIPTION
PAGE NUMBER
A
3/11
Revised part numbering.
2 to 9, 13, 16,
20, 26
B
3/11
Revised title of Typical Application.
24
2633fb
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
23
LTC2633
Typical Application
Voltage Margining Application with LTC3850 (1.2V ±5%) LTC2633-LO Option Only
0.1µF
4.7µF
5V
3
REF
0.1µF
TO I2C
BUS
1
8
2.2k
0.1µF
DAC A
DAC B
6 10k
ILM
15k
FREQ
0.1µF
2.2µH
0.008k
VOUT
1.2V ±5%
SW1
4
1nF
RJK0305DPB
TG1
BOOST1
CA0
GND
PGOOD INTVCC
LTC3850EUF
10k
0.22µF
SCL
VIN
CMDSH-3
100k
7
LTC2633CTS8-L012
5
2
VCC
VIN
6.5V
TO 14V
RJK0301DPB
BG1
3.32k
PGND
SDA
1nF
10k
500kHz
100pF
10k
SENSE1+
ITH1
MODE/PLLIN
TKSS1
RUN1
SENSE1
10nF
1nF
–
10k
VFB1
SGND
15pF
63.4k
2633 TA02
20k
Related Parts
PART NUMBER
DESCRIPTION
COMMENTS
LTC2632
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Internal Reference
2.7V to 5.5V Supply Range, 10ppm/°C Reference, External REF Mode, Rail-to-Rail
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LTC2607/LTC2617/ Dual 16-/14-/12-Bit, I2C VOUT DACs with
External Reference
LTC2627
260μA per DAC, 2.7V to 5.5V Supply Range, Rail-to-Rail Output, 16-Lead SSOP Package
LTC2602/LTC2612/ Dual 16-/14-/12-Bit SPI VOUT DACs with
External Reference
LTC2622
300μA per DAC, 2.5V to 5.5V Supply Range, Rail-to-Rail Output, 8-Lead MSOP Package
LTC1662
Dual 10-Bit, SPI VOUT DAC with External
Reference
1.5μA per DAC, 2.7V to 5.5V Supply Range, Rail-to-Rail Output, 8-Lead MSOP Package
LTC2630/LTC2631
Single 12-/10-/8-Bit, SPI/ I2C VOUT DACs
with 10ppm/°C Reference
180μA per DAC, 2.7V to 5.5V Supply Range, 10ppm/°C Reference, Rail-to-Rail Output,
in SC70 (LTC2630)/ ThinSOT (LTC2631)
LTC2640
Single 12-/10-/8-Bit, SPI VOUT DACs with
10ppm/°C Reference
180μA per DAC, 2.7V to 5.5V Supply Range, 10ppm/°C Reference, External REF Mode,
Rail-to-Rail Output, in ThinSOT
LTC2634/LTC2635
Quad 12-/10-/8-Bit SPI/I2C VOUT DACs with ±2.5LSB INL, 2.7V to 5.5V Supply Range, 10ppm/°C Reference, External REF Mode,
10ppm/°C Reference
16-Pin 3mm × 3mm QFN and 10-Lead MSOP Packages
LTC2636/LTC2637
Octal 12-/10-/8-Bit, SPI/I2C VOUT DACs with 125μA per DAC, 2.7V to 5.5V Supply Range, 10ppm/°C Reference, External REF Mode,
10ppm/°C Reference
Rail-to-Rail Output, 14-Lead 4mm × 3mm DFN and 16-Lead MSOP Packages
LTC2654/LTC2655
Quad 16-/12 Bit, SPI/I2C VOUT DACs with
10ppm/°C Max Reference
±4LSB INL Max at 16-Bits and ±2mV Offset Error, Rail-to-Rail Output,
20-Lead 4mm × 4mm QFN and 16-Lead Narrow SSOP Packages
LTC2656/LTC2657
Octal 16-/12 Bit, SPI/I2C VOUT DACs with
10ppm/°C Max Reference
±4LSB INL Max at 16-Bits and ±2mV Offset Error, Rail-to-Rail Output,
20-Lead 4mm × 5mm QFN and 16-Lead TSSOP Packages
2633fb
24 Linear Technology Corporation
LT 0311 REV B • PRINTED IN USA
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900 ● FAX: (408) 434-0507
●
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