DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT µPC393 LOW POWER DUAL COMPARATORS DESCRIPTION FEATURES The µPC393 is a dual comparator which is designed to operate from a single power supply over a wide range • Common-mode input voltage range includes V– • Wide supply voltage range of voltage. Operation from split power supplies is also 2 V to 32 V (Single) possible and the power supply current drain is very low. ±1 V to ±16 V (Split) Further advantage, the input common-mode voltage in- • Low supply current cludes ground, even though operated from a single power • Open collector output supply voltage. EQUIVALENT CIRCUIT (1/2 Circuit) PIN CONFIGURATION (Top View) µ PC393C, 393G2 8 V+ OUT1 1 V 100 µ A + I I1 2 100 µ A 7 OUT2 1 2 – + IN + Q1 Q2 Q3 – 6 I I2 V– 4 5 I N2 Q7 Q5 – OUT Q4 Q8 II + I N1 3 µ PC393HA Q6 1 – + 1 2 3 4 5 6 7 8 9 OUT1 I I1 I N1 V– I N2 I I2 OUT 2 V+ 2 + – V+ V– ORDERING INFORAMTION Part Number Package µPC393C 8-pin plastic DIP (300 mil) µPC393G2 8-pin plastic SOP (225 mil) µPC393HA 9-pin plastic slim SIP The information in this document is subject to change without notice. Document No. G11766EJ3V0DS00 (3rd edition) (Previous No. IC-1971) Date Published April 1997 N Printed in Japan The mark shows major revised points. © 1989 µPC393 ABSOLUTE MAXIMUM RATINGS (TA = 25 °C) Parameter Voltage between V+ and V– Note 1 Differential Input Voltage Symbol Ratings Unit V+ –V– –0.3 to +36 V VID ±36 V Input Voltage Note 2 VI V– –0.3 to V– +36 V Output Voltage Note 3 VO V– –0.3 to V– +36 V Note 4 PT 350 mW G2 Package Note 5 440 mW HA Package Note 4 350 mW Indefinite sec Power Dissipation C Package Output Short Circuit Duration Note 6 Operating Ambient Temperature TA –20 to +80 °C Storage Temperature Tstg –55 to + 125 °C Notes 1. Reverse connection of supply voltage can cause destruction. 2. The input voltage should be allowed to input without damage or destruction independent of the magnitude of V+. Either input signal should not be allowed to go negative by more than 0.3 V. The normal operation will establish when any input is within the Common Mode Input Voltage Range of electrical characteristics. 3. This specification is the voltage which should be allowed to supply to the output terminal from external without damage or destruction independent of the magnitude of V+. Even during the transition period of supply voltage, power on/off etc., this specification should be kept. 4. Thermal derating factor is –5.0 mW/°C when operating ambient temperature is higher than 55 °C. 5. Thermal derating factor is –4.4 mW/°C when operating ambient temperature is higher than 25 °C. 6. Short circuits from the output to V+ can cause destruction. Pay careful attention to the total power dissipation not to exceed the absolute maximum ratings, Note 4 and Note 5. RECOMMENDED OPERATING CONDITIONS Parameter Supply Voltage (Split) – Supply Voltage (V = GND) 2 Symbol V V ± + MIN. TYP. MAX. Unit ±1 ±16 V +2 +32 V µPC393 ELECTRICAL CHARACTERISTICS (TA = 25 °C, V+ = 5 V, V– = GND) Parameter Symbol Conditions MIN. TYP. MAX. Unit Input Offset Voltage VIO VO = 1.4 V, VREF = 1.4 V, RS = 0 Ω ±2 ±5 mV Input Offset Current IIO ±5 ±50 nA Input Bias Current IB VO ·=· 1.4 V VO ·=· 1.4 V 25 250 nA Voltage Gain AV RL = 15 kΩ 200 Supply Current ICC RL = ∞, IO = 0 A, Both Comparators 0.6 Common Mode lnput Voltage Range VICM Output Saturation Voltage VOL VIN (–) = 1 V, VIN (+) = 0 V, IO SINK = 4 mA Output Sink Current IO SINK VIN (–) = 1 V, VIN (+) = 0 V, VO ≤ 1.5 V Output Leakage Current IO LEAK Response Time 0 0.2 6 V/mV 1 mA + V –1.5 V 0.4 V 16 mA VIN (+) = 1 V, VIN (–) = 0 V, VO = 5 V 0.1 nA RL = 5.1 kΩ, VRL = 5 V 1.3 µs 3 µPC393 APPLICATION CIRCUIT EXAMPLE V+ VIN 2, 6 RL – 8 OUT 1, 7 3, 5 4 + VREF VREF: V– to V+ –1.5 (V) COMPARATOR with HYSTERESIS CIRCUIT V+ VRL RL – VIN OUT + R2 R1 VREF • Threshold voltage · VREF + VTH (High) = · R1 (VRL – VREF) RL + R2 + R1 · VREF – VTH (Low) = · R1 (VREF – VOL) R1 + R2 (VRL > VREF > VOL) 4 µPC393 TYPICAL PERFORMANCE CHARACTERISTICS (TA = 25 °C, TYP.) SUPPLY CURRENT POWER DISSIPATION 1.0 393G2 ICC - Supply Current - mA PT - Total Dissipation - mW 500 400 393C, 393HA 300 200 100 0 RL = ∞ IO = 0A TA = 0 °C 0.8 TA = 25 °C 0.6 TA = 70 °C 0.4 20 40 60 80 100 0 10 20 + TA - Operating Ambient Temperature - °C 30 40 – V - Supply Voltage - V (V = GND) INPUT BIAS CURRENT INPUT OFFSET VOLTAGE 50 3 2 IB - Input Bias Current - nA VIO - Input Offset Voltage - mV V+ = +5 V V– = GND 1 0 –1 TA = 0 °C 40 30 TA = 25 °C 20 TA = 70 °C –2 –3 –40 –20 0 20 40 60 80 10 0 10 V+ TA - Operating Ambient Temperature - °C 20 - Supply Voltage - V 30 (V– 40 = GND) OUTPUT SATURATION VOLTAGE VOL - Output Saturation Voltage - V 10 1 0.1 TA = 70 °C 0.01 TA = 25 °C TA = 0 °C 0.001 0.01 0.1 1 10 100 IO SINK - Output Sink Current - mA 5 µPC393 20 mV +5 V 3 2 VIN VO + 1 0 0 TA = 25 °C –50 –100 0 0.5 1.0 t - Time - µ s 6 5.1 kΩ – 100 mV 1.5 2.0 100 mV Input Overdrive 5 4 5 mV 3 2 20 mV 1 +5 V 5.1 kΩ 4 VO - Output Voltage - V 5.0 mV Input Overdrive 5 RESPONSE TIME FOR VARIOUS INPUT OVERDRIVES II VIN - Input Voltage - mV VIN - Input Voltage - mV VO - Output Voltage - V RESPONSE TIME FOR VARIOUS INPUT OVERDRIVES I 0 VIN – 100 TA = 25 °C + 50 VO 0 0 0.5 1.0 t - Time - µ s 1.5 2.0 µPC393 PACKAGE DRAWINGS 8PIN PLASTIC DIP (300 mil) 8 5 1 4 A K I L P J C H G B M R F D N M NOTES 1) Each lead centerline is located within 0.25 mm (0.01 inch) of its true position (T.P.) at maximum material condition. 2) ltem "K" to center of leads when formed parallel. ITEM MILLIMETERS INCHES A B 10.16 MAX. 1.27 MAX. 0.400 MAX. 0.050 MAX. C 2.54 (T.P.) 0.100 (T.P.) D 0.50±0.10 0.020 +0.004 –0.005 F 1.4 MIN. 0.055 MIN. G H 3.2±0.3 0.51 MIN. 0.126±0.012 0.020 MIN. I J 4.31 MAX. 5.08 MAX. 0.170 MAX. 0.200 MAX. K 7.62 (T.P.) 0.300 (T.P.) L 6.4 0.252 M 0.25 +0.10 –0.05 0.010 +0.004 –0.003 N 0.25 0.01 P 0.9 MIN. 0.035 MIN. R 0~15° 0~15° P8C-100-300B,C-1 7 µPC393 8 PIN PLASTIC SOP (225 mil) 8 5 P detail of lead end 4 1 A H J E K F G I B L N C D M M NOTE Each lead centerline is located within 0.12 mm (0.005 inch) of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS INCHES A 5.37 MAX. 0.212 MAX. B 0.78 MAX. 0.031 MAX. C 1.27 (T.P.) 0.050 (T.P.) D 0.40 +0.10 –0.05 0.016 +0.004 –0.003 E 0.1±0.1 0.004±0.004 F 1.8 MAX. 0.071 MAX. G 1.49 0.059 H 6.5±0.3 0.256±0.012 I 4.4 0.173 J 1.1 0.043 K 0.15 +0.10 –0.05 0.006 +0.004 –0.002 L 0.6±0.2 0.024 +0.008 –0.009 M 0.12 0.005 N 0.10 0.004 P 3° +7° –3° 3° +7° –3° S8GM-50-225B-4 8 µPC393 9 PIN PLASTIC SLIM SIP A N M 1 9 Y C F Q K V H G M J U Z NOTE Each lead centerline is located within 0.25 mm (0.01 inch) of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS INCHES A 22.86 MAX. 0.900 MAX. C 1.1 MIN. 0.043 MIN. F 0.5±0.1 0.02 +0.004 –0.005 G 0.25 0.010 H 2.54 0.100 J 1.27 MAX. 0.050 MAX. K 0.51 MIN. 0.020 MIN. M 5.08 MAX. 0.200 MAX. N 2.8±0.2 0.11+0.009 –0.008 Q 5.75 MAX. 0.227 MAX. U 1.5 MAX. 0.059 MAX. V 0.25 +0.10 –0.05 0.01+0.004 –0.003 Y 3.2±0.5 0.126±0.02 Z 1.1 MIN. 0.043 MIN. P9HA-254B-1 9 µPC393 RECOMMENDED SOLDERING CONDITIONS When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering processes are used, or if the soldering is performed under different conditions, please make sure to consult with our sales offices. For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL” (C10535E). Type of surface mount device µPC393G2: 8-pin plastic SOP (225 mil) Process Conditions Symbol Infrared Ray Reflow Peak temperature: 230 °C or below (Package surface temperature), Reflow time: 30 seconds or less (at 210 °C or higher), Maximum number of reflow processes: 1 time. IR30-00-1 Vapor Phase Soldering Peak temperature: 215 °C or below (Package surface temperature), Reflow time: 40 seconds or less (at 200 °C or higher), Maximum number of reflow processes: 1 time. VP15-00-1 Wave Soldering Solder temperature: 260 °C or below, Flow time: 10 seconds or less, Maximum number of flow processes: 1 time, Pre-heating temperature: 120 °C or below (Package surface temperature). WS60-00-1 Partial Heating Method Pin temperature: 300 °C or below, Heat time: 3 seconds or less (Per each side of the device). – Caution Apply only one kind of soldering condition to a device, except for “partial heating method”, or the device will be damaged by heat stress. Type of through-hold device µPC393C : 8-pin plastic DIP (300 mil) µPD393HA : 9-pin plastic slim SIP Process Conditions Wave Soldering (only to leads) Solder temperature: 260 °C or below, Flow time: 10 seconds or less. Partial Heating Method Pin temperature: 300 °C or below, Heat time: 3 seconds or less (per each lead.) Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure that the package body does not get jet soldered. 10 µPC393 REFERENCE DOCUMENTS QUALITY GRADES ON NEC SEMICONDUCTOR DEVICES C11531E SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL C10535E IC PACKAGE MANUAL C10943X GUIDE TO QUALITY ASSUARANCE FOR SEMICONDUCTOR DEVICES MEI-1202 SEMICONDUCTORS SELECTION GUIDE X10679E NEC SEMICONDUCTOR DEVICE RELIABILITY/ IEI-1212 QUALITY CONTROL SYSTEM - STANDARD LINEAR IC 11 µPC393 [MEMO] The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product. M4 96.5 2