MMQA, SZMMQA Quad Common Anode Series SC-74 Quad Monolithic Common Anode Transient Voltage Suppressors for ESD Protection This quad monolithic silicon voltage suppressor is designed for applications requiring transient overvoltage protection capability. It is intended for use in voltage and ESD sensitive equipment such as computers, printers, business machines, communication systems, medical equipment, and other applications. Its quad junction common anode design protects four separate lines using only one package. These devices are ideal for situations where board space is at a premium. http://onsemi.com SC−74 QUAD TRANSIENT VOLTAGE SUPPRESSOR 24 WATTS PEAK POWER 5.6 − 33 VOLTS SC−74 CASE 318F STYLE 1 Features • SC−74 Package Allows Four Separate Unidirectional Configurations • Peak Power − Min. 24 W @ 1.0 ms (Unidirectional), • • • • • • per Figure 5 Waveform Peak Power − Min. 150 W @ 20 ms (Unidirectional), per Figure 6 Waveform Maximum Clamping Voltage @ Peak Pulse Current Low Leakage < 2.0 mA ESD Rating of Class 3B (exceeding 16 kV) per the Human Body Model SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable Pb−Free Packages are Available* PIN ASSIGNMENT 1 6 2 5 3 4 PIN 1. 2. 3. 4. 5. 6. CATHODE ANODE CATHODE CATHODE ANODE CATHODE MARKING DIAGRAM xxxMG G xxx M G = Specific Device Code = Date Cade = Pb−Free Package (Note: Microdot may be in either location) DEVICE MARKING & ORDERING INFORMATION See specific marking and ordering information in the device marking and ordering information table on page 6 of this data sheet. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2012 February, 2012 − Rev. 10 1 Publication Order Number: MMQA/D MMQA, SZMMQA Quad Common Anode Series THERMAL CHARACTERISTICS (TA = 25°C Unless Otherwise Noted) Characteristic Symbol Value Unit Peak Power Dissipation @ 1.0 ms (Note 1) @ TA ≤ 25°C Ppk Peak Power Dissipation @ 20 ms (Note 2) @ TA ≤ 25°C Ppk Total Power Dissipation on FR-5 Board (Note 3) @ TA = 25°C PD 225 1.8 MW mW/°C Thermal Resistance from Junction−to−Ambient RqJA 556 °C/W 300 2.4 MW mW/°C RqJA 417 °C/W TJ, Tstg −55 to +150 °C TL 260 °C Total Power Dissipation on Alumina Substrate (Note 4) @ TA = 25°C Derate above 25°C Junction and Storage Temperature Range Lead Solder Temperature − Maximum (10 Second Duration) 1. 2. 3. 4. W 150 PD Thermal Resistance from Junction−to−Ambient W 24 Non-repetitive current pulse per Figure 5 and derate above TA = 25°C per Figure 4. Non-repetitive current pulse per Figure 6 and derate above TA = 25°C per Figure 4. FR-5 = 1.0 x 0.75 x 0.62 in. Alumina = 0.4 x 0.3 x 0.024 in., 99.5% alumina ELECTRICAL CHARACTERISTICS (TA = 25°C Unless Otherwise Noted) UNIDIRECTIONAL (Circuit tied to pins 1, 2, and 5; Pins 2, 3, and 5; Pins 2, 4, and 5; or Pins 2, 5, and 6) (VF = 0.9 V Max @ IF = 10 mA) Max Reverse Leakage Current Breakdown Voltage VZT (Note 5) (V) @ IZT IR VR Max Zener Impedance (Note 7) Max Reverse Surge Current Max Reverse Voltage @ IRSM (Note 6) (Clamping Voltage) IRSM (A) VRSM (V) (mV/°C) Min Max Maximum Temperature Coefficient of VZ Capacitance @ 0 Volt Bias, 1 MHz (pF) Device (Note 8) Min Nom Max (mA) (nA) (V) ZZT @ IZT (W) (mA) MMQA5V6T 5.32 5.6 5.88 1.0 2000 3.0 400 3.0 8.0 1.26 − − MMQA6V2T 5.89 6.2 6.51 1.0 700 4.0 300 2.66 9.0 10.6 − − MMQA6V8T 6.46 6.8 7.14 1.0 500 4.3 300 2.45 9.8 10.9 100 250 MMQA12VT 11.4 12 12.6 1.0 75 9.1 80 1.39 17.3 14 − − MMQA13VT 12.4 13 13.7 1.0 75 9.8 80 1.29 18.6 15 − − MMQA15VT 14.3 15 15.8 1.0 75 11 80 1.1 21.7 16 − − MMQA18VT 17.1 18 18.9 1.0 75 14 80 0.923 26 19 − − MMQA20VT 19 20 21 1.0 75 15 80 0.84 28.6 20.1 − − MMQA21VT 20 21 22.1 1.0 75 16 80 0.792 30.3 21 − − MMQA22VT 20.9 22 23.1 1.0 75 17 80 0.758 31.7 22 − − MMQA24VT 22.8 24 25.2 1.0 75 18 100 0.694 34.6 25 − − MMQA27VT 25.7 27 28.4 1.0 75 21 125 0.615 39 28 − − MMQA33VT 31.4 33 34.7 1.0 75 25 200 0.504 48.6 37 − − 5. VZ measured at pulse test current IT at an ambient temperature of 25°C. 6. Surge current waveform per Figure 5 and derate per Figure 4. 7. ZZT is measured by dividing the AC voltage drop across the device by the AC current supplied. The specified limits are IZ(AC) = 0.1 IZ(DC), with AC frequency = 1 kHz. 8. Include SZ-prefix devices where applicable. http://onsemi.com 2 MMQA, SZMMQA Quad Common Anode Series TYPICAL CHARACTERISTICS 300 10,000 BIASED AT 0 V BIASED AT 1 V BIASED AT 50% OF VZ NOM 200 1,000 I R , LEAKAGE (nA) C, CAPACITANCE (pF) 250 150 100 +150°C 100 +25°C 10 -40°C 50 0 0 5.6 6.8 12 20 27 VZ, NOMINAL ZENER VOLTAGE (V) 5.6 33 6.8 Figure 1. Typical Capacitance ALUMINA SUBSTRATE 200 150 100 FR‐5 BOARD 50 25 50 75 100 125 150 175 PEAK PULSE DERATING IN % OF PEAK POWER OR CURRENT @ TA = 25 ° C PD , POWER DISSIPATION (mW) 250 0 27 33 Figure 2. Typical Leakage Current 300 0 20 VZ, NOMINAL ZENER VOLTAGE (V) 100 90 80 70 60 50 40 30 20 10 0 0 25 50 75 100 125 150 TA, AMBIENT TEMPERATURE (°C) TA, AMBIENT TEMPERATURE (°C) Figure 3. Steady State Power Derating Curve Figure 4. Pulse Derating Curve http://onsemi.com 3 175 200 MMQA, SZMMQA Quad Common Anode Series TYPICAL CHARACTERISTICS PEAK VALUE—IRSM VALUE (%) 100 IRSM HALF VALUE— 2 50 tP PEAK VALUE IRSM @ 8 ms tr 90 % OF PEAK PULSE CURRENT tr 100 PULSE WIDTH (tP) IS DEFINED AS THAT POINT WHERE THE PEAK CURRENT DECAYS TO 50% OF IRSM. tr ≤ 10 ms PULSE WIDTH (tP) IS DEFINED AS THAT POINT WHERE THE PEAK CURRENT DECAY = 8 ms 80 70 60 HALF VALUE IRSM/2 @ 20 ms 50 40 30 tP 20 10 0 0 1 2 3 0 4 0 20 40 t, TIME (ms) 80 t, TIME (ms) Figure 5. 10 × 1000 ms Pulse Waveform Figure 6. 8 × 20 ms Pulse Waveform 200 100 RECTANGULAR WAVEFORM, TA = 25°C 180 PPK , PEAK SURGE POWER (W) Ppk PEAK SURGE POWER (W) 60 10 UNIDIRECTIONAL 160 8 × 20 WAVEFORM AS PER FIGURE NO TAG 140 120 100 80 10 × 100 WAVEFORM AS PER FIGURE NO TAG 60 40 20 1.0 0.1 1.0 10 100 1000 0 5.6 PW, PULSE WIDTH (ms) 6.8 12 20 27 NOMINAL VZ Figure 7. Maximum Non−Repetitive Surge Power, Ppk versus PW Figure 8. Typical Maximum Non−Repetitive Surge Power, Ppk versus VZ Power is defined as VRSM x IZ(pk) where VRSM is the clamping voltage at IZ(pk). http://onsemi.com 4 33 MMQA, SZMMQA Quad Common Anode Series TYPICAL COMMON ANODE APPLICATIONS A quad junction common anode design in a SC-74 package protects four separate lines using only one package. This adds flexibility and creativity to PCB design especially when board space is at a premium. A simplified example of MMQA/SZMMQA Series Device applications is illustrated below. A KEYBOARD TERMINAL PRINTER ETC. B C I/O D FUNCTIONAL DECODER GND MMQA/SZMMQA SERIES DEVICE Figure 9. Computer Interface Protection VDD VGG ADDRESS BUS RAM ROM DATA BUS I/O CPU CLOCK CONTROL BUS GND MMQA/SZMMQA SERIES DEVICE Figure 10. Microprocessor Protection http://onsemi.com 5 MMQA, SZMMQA Quad Common Anode Series DEVICE MARKING AND ORDERING INFORMATION Device Marking Package Shipping MMQA5V6T1 Device* 5A6 SC−74 3,000/Tape & Reel MMQA6V2T1 6A2 SC−74 3,000/Tape & Reel MMQA6V2T3 6A2 SC−74 10,000/Tape & Reel MMQA6V8T1 6A8 SC−74 3,000/Tape & Reel MMQA12VT1 12A SC−74 3,000/Tape & Reel MMQA13VT1 13A SC−74 3,000/Tape & Reel MMQA15VT1 15A SC−74 3,000/Tape & Reel MMQA18VT1 18A SC−74 3,000/Tape & Reel MMQA20VT1 20A SC−74 3,000/Tape & Reel MMQA20VT3 20A SC−74 10,000/Tape & Reel MMQA21VT1 21A SC−74 3,000/Tape & Reel MMQA22VT1 22A SC−74 3,000/Tape & Reel MMQA24VT1 24A SC−74 3,000/Tape & Reel MMQA27VT1 27A SC−74 3,000/Tape & Reel MMQA27VT3 27A SC−74 10,000/Tape & Reel MMQA33VT1 33A SC−74 3,000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. *Include SZ-prefix devices where applicable. Mechanical Characteristics: CASE: Void−free, Transfer−molded, Thermosetting Plastic Case. FINISH: Corrosion resistant finish, easily solderable. Package designed for optimal automated board assembly. Small package size for high density applications. Available in 8 mm Tape and Reel. Use the Device Number to order the 7 inch/3,000 unit reel. Replace the “T1” with “T3” in the Device Number to order the 13 inch/10,000 unit reel. http://onsemi.com 6 MMQA, SZMMQA Quad Common Anode Series PACKAGE DIMENSIONS SC−74 CASE 318F−05 ISSUE M D 6 HE 1 5 4 2 3 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. 318F−01, −02, −03, −04 OBSOLETE. NEW STANDARD 318F−05. E DIM A A1 b c D E e L HE q b e 0.05 (0.002) q C A L A1 MIN 0.90 0.01 0.25 0.10 2.90 1.30 0.85 0.20 2.50 0° MILLIMETERS NOM MAX 1.00 1.10 0.06 0.10 0.37 0.50 0.18 0.26 3.00 3.10 1.50 1.70 0.95 1.05 0.40 0.60 2.75 3.00 10° − MIN 0.035 0.001 0.010 0.004 0.114 0.051 0.034 0.008 0.099 0° INCHES NOM 0.039 0.002 0.015 0.007 0.118 0.059 0.037 0.016 0.108 − MAX 0.043 0.004 0.020 0.010 0.122 0.067 0.041 0.024 0.118 10° STYLE 1: PIN 1. CATHODE 2. ANODE 3. CATHODE 4. CATHODE 5. ANODE 6. CATHODE SOLDERING FOOTPRINT* 2.4 0.094 0.95 0.037 1.9 0.074 0.95 0.037 0.7 0.028 1.0 0.039 SCALE 10:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 http://onsemi.com 7 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative MMQA/D