ONSEMI SBRA8160T3G

SS16T3G,
SBRA8160T3G
Surface Mount
Schottky Power Rectifier
SMA Power Surface Mount Package
http://onsemi.com
These devices employ the Schottky Barrier principle in a large area
metal−to−silicon power diode. State of the art geometry features
epitaxial construction with oxide passivation and metal overlay
contact. Ideally suited for low voltage, high frequency rectification, or
as free wheeling and polarity diodes in surface mount applications
where compact size and weight are critical to the system.
SCHOTTKY BARRIER
RECTIFIER
1.0 AMPERES
60 VOLTS
Features








Small Compact Surface Mountable Package with J−Bent Leads
Rectangular Package for Automated Handling
Highly Stable Oxide Passivated Junction
Very Low Forward Voltage Drop
Guardring for Stress Protection
AEC−Q101 Qualified and PPAP Capable
SBRA8 Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements
All Packages are Pb-Free*
SMA
CASE 403D
PLASTIC
MARKING DIAGRAM
SS16
AYWWG
Mechanical Characteristics
 Case: Epoxy, Molded, Epoxy Meets UL 94 V−0
 Weight: 70 mg (approximately)
 Finish: All External Surfaces Corrosion Resistant and Terminal





Leads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes:
260C Max. for 10 Seconds
Shipped in 12 mm tape, 5000 units per 13 inch reel
Polarity: Cathode Lead Indicated by Polarity Band
ESD Ratings:
 Machine Model = C
 Human Body Model = 3B
Device Meets MSL 1 Requirements
SS16
A
Y
WW
G
= Specific Device Code
= Assembly Location
= Year
= Work Week
= Pb−Free Package
ORDERING INFORMATION
Package
Shipping†
SS16T3G
SMA
(Pb−Free)
5,000 /
Tape & Reel
SBRA8160T3G
SMA
(Pb−Free)
5,000 /
Tape & Reel
Device
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
 Semiconductor Components Industries, LLC, 2012
January, 2012 − Rev. 7
1
Publication Order Number:
SS16/D
SS16T3G, SBRA8160T3G
MAXIMUM RATINGS
Rating
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Average Rectified Forward Current
(At Rated VR, TC = 105C)
Symbol
Value
Unit
VRRM
VRWM
VR
60
V
IO
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)
1.0
IFSM
Storage/Operating Case Temperature
Operating Junction Temperature
Voltage Rate of Change
(Rated VR, TJ = 25C)
40
A
A
Tstg, TC
−55 to +150
C
TJ
−55 to +150
C
dv/dt
10,000
V/ms
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction−to−Lead (Note 1)
Thermal Resistance, Junction−to−Ambient (Note 1)
Symbol
Value
Unit
RqJL
RqJA
35
86
C/W
1. Mounted on 2 in Square PC Board with 1 in Square Total Pad Size, PC Board FR4.
ELECTRICAL CHARACTERISTICS
Characteristic
Maximum Instantaneous Forward Voltage (Note 2)
(IF = 0.1 A)
(IF = 1.0 A)
Symbol
Value
Unit
VF
TJ = 25C
V
0.51
0.72
IR
Maximum Instantaneous Reverse Current
(VR = 60 V)
2. Pulse Test: Pulse Width  250 ms, Duty Cycle  2.0%.
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2
TJ = 25C
TJ = 100C
0.2
5.0
mA
SS16T3G, SBRA8160T3G
10
10
TJ = 150C
5.0
TJ = 150C
100C
I R , REVERSE CURRENT (mA)
7.0
25C
5.0
3.0
1.0
100C
0.5
0.2
0.1
75C
0.05
0.02
0.01
25C
0.005
0.002
0.001
0.7
0
40
20
30
50
VR, REVERSE VOLTAGE (VOLTS)
10
0.5
70
60
Figure 2. Typical Reverse Current*
*The curves shown are typical for the highest voltage device in the
voltage grouping. Typical reverse current for lower voltage selections
can be estimated from these same curves if VR is sufficiently below rated
VR.
5.0
0.3
0.2
PF(AV) , AVERAGE FORWARD
POWER DISSIPATION (WATTS)
0.1
0.07
0.05
0.03
0.02
0
SQUARE
WAVE
4.0
3.0
dc
p
2.0
5
10
IPK/IAV = 20
1.0
0
0.2
0.4
0.6
0.8
1.2
1.0
1.4
0
1.6
1.0
2.0
3.0
4.0
vF, INSTANTANEOUS VOLTAGE (VOLTS)
IF(AV), AVERAGE FORWARD CURRENT (AMPS)
Figure 1. Typical Forward Voltage
Figure 3. Forward Power Dissipation
200
TJ = 25C
f = 1 MHz
C, CAPACITANCE (pF)
i F, INSTANTANEOUS FORWARD CURRENT (AMPS)
2.0
125C
2.0
1.0
100
80
70
60
50
40
30
20
0
10
20
30
40
50
60
70
80
VR, REVERSE VOLTAGE (VOLTS)
Figure 4. Typical Capacitance
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3
90
100
5.0
SS16T3G, SBRA8160T3G
PACKAGE DIMENSIONS
SMA
CASE 403D−02
ISSUE F
HE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 403D−01 OBSOLETE, NEW STANDARD IS 403D−02.
E
b
DIM
A
A1
b
c
D
E
HE
L
D
POLARITY INDICATOR
OPTIONAL AS NEEDED
(SEE STYLES)
MIN
1.97
0.05
1.27
0.15
2.29
4.06
4.83
0.76
MILLIMETERS
NOM
MAX
2.10
2.20
0.10
0.15
1.45
1.63
0.28
0.41
2.60
2.92
4.32
4.57
5.21
5.59
1.14
1.52
MIN
0.078
0.002
0.050
0.006
0.090
0.160
0.190
0.030
INCHES
NOM
0.083
0.004
0.057
0.011
0.103
0.170
0.205
0.045
MAX
0.087
0.006
0.064
0.016
0.115
0.180
0.220
0.060
STYLE 1:
PIN 1. CATHODE (POLARITY BAND)
2. ANODE
A
L
c
A1
SOLDERING FOOTPRINT*
4.0
0.157
2.0
0.0787
2.0
0.0787
SCALE 8:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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For additional information, please contact your local
Sales Representative
SS16/D