HDMI05-CL01F3 5-line IPAD™, HDMI™ control line ESD protection Features ■ High efficiency in ESD protection ■ Lead-free package ■ Very thin package ■ High reliability offered by monolithic integration ■ High reduction of parasitic elements through integration and wafer level packaging Leed-free Flip-Chip package (8 bumps) Figure 1. Pin configuration (bump side) Complies with the standards: ■ ■ 3 2 IEC 61000-4-2 Level 4 – ± 15 kV (air discharge) – ± 8 kV (contact discharge) SCL CEC IEC 61000-4-2 Level 1 – ± 2 kV (air discharge) – ± 2 kV (contact discharge) SDA GND HPD GND Application Where ESD protection for HDMI control lines (CEC, HPD, SCL and SDA) is required: ■ Mobile phones and communication systems ■ Portable multimedia players ■ Camcorder, digital still cameras Figure 2. The HDMI05-CL01F3 chip is a low capacitance ESD protection for HDMI control pins. It also integrates a pull-up resistor for I²C bus and a pulldown resistor for hot plug detect. The ESD protection circuitry prevents damage to the protected device when subjected to ESD surges up to 15 kV. B C RPU A2 CEC SCL SDA HPD R3 Description A 5V Schematic A1 5V A3 B3 C3 1 GND C2 GND B2 R1 Low line capacitance R2 ■ C1 1. B2 and C2 bumps must be connected together in the PCB TM: IPAD is a trademark of STMicroelectronics. HDMI, the HDMI logo and High-Definition Multimedia Interface are trademarks or registered trademarks of HDMI Licensing LLC. April 2010 Doc ID 17458 Rev 1 1/8 www.st.com 8 Characteristics 1 HDMI05-CL01F3 Characteristics Table 1. Absolute maximum ratings (Tamb = 25 °C) Symbol VPP Parameter External pins (A1, A2, A3, B3 and C3): ESD IEC 61000-4-2, level 4 - air discharge ESD IEC 61000-4-2, level 4 - contact discharge Internal pin (C1): ESD IEC 61000-4-2, level 1 - air discharge ESD IEC 61000-4-2, level 1 - contact discharge Pd Line resistance power dissipation at 70 °C Top Tstg Figure 3. Value Unit 15 8 kV 2 2 60 mW Operating temperature range -30 to + 85 °C Storage temperature range -55 to + 150 °C Electrical characteristics - definitions I Symbol VBR = IRM = VRM = Cline = Table 2. VBR VRM IR IRM IRM IR V VRM VBR Electrical characteristics (Tamb = 25 °C) Symbol Test condition VBR IR = 1 mA IRM VRM = 3 V per line Min. Typ. Max. 14 Unit V 50 200 nA R1, R2 1575 1750 1925 Ω R3 80 100 120 kΩ 8 10 12 pF Cline 2/8 Parameter Breakdown voltage Leakage current @ VRM Stand-off voltage Line capacitance Vline = 0 V, Vosc = 30 mV, F = 1 MHz (measured under zero light conditions, B2 and C2 bumps connect together) Doc ID 17458 Rev 1 HDMI05-CL01F3 Figure 4. 0 Characteristics S21(dB) versus frequency on A1 Figure 5. S21 (dB) 0 Analog crosstalk measurements B3-A3 Crosstalk (dB) B3_A3_0V -2 -5 A1_0V A1_3.6V -4 -6 - 10 A1_2.5V A1_5.5V -8 B3_A3_3.6V B3_A3_2.5V B3_A3_5.5V - 15 - 10 - 20 - 12 - 25 - 14 - 16 - 30 - 18 - 35 - 20 F(Hz) - 22 100k Figure 6. 1M 10M 100M F(Hz) - 40 100k 1G Digital crosstalk measurement A3-B3 with 5 V applied on C1 Figure 7. 1 V/Div 1M 10M 100M 1G ESD response to IEC 61000-4-2 (+8 kV contact discharge) on CEC line (A2) 20 V/Div Output C2 20 ns/Div 50 mV/Div Input VCL C1 20 ns/Div Figure 8. C2 ESD response to IEC 61000-4-2 (-8 kV contact discharge) on CEC line (A2) 20 V/Div Figure 9. 10 VCL 20 ns/Div C2 Line capacitance versus reverse applied voltage on A2-B2 C(pF) 8.0 6.0 4.0 2.0 20 ns/Div VR(V) 0.0 0 Doc ID 17458 Rev 1 2 4 6 8 10 12 14 3/8 Typical application schematic 2 HDMI05-CL01F3 Typical application schematic HDMI DRIVER Figure 10. Implementation with HDMI type C connector TYPE C HDMI CONNECTOR 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 4 TMDS channel A1 A2 A3 B1 B3 C1 C2 C3 3V B2 2 x 1K75 100K ESDAULC6-8F3 5V CEC SCL SDA HPD HDMI05-CL01F3 4/8 Doc ID 17458 Rev 1 TMDS DATA2 SHIELD TMDS DATA2 + TMDS DATA2 TMDS DATA1 SHIELD TMDS DATA1 + TMDS DATA1 TMDS DATA0 SHIELD TMDS DATA0 + TMDS DATA0 TMDS CLK SHIELD TMDS CLK + TMDS CLK DDC/ EEC GROUND CEC SCL SDA RESERVED +5V POWER HOT PLUG DETECT HDMI05-CL01F3 3 Ordering information scheme Ordering information scheme Figure 11. Ordering information scheme HDMI 05 - CL 01 F3 Function HDMI = HDMI Protection Number of lines 05 = 5 lines Application CL = Control lines Version 01 = without CEC Pull-up integrated Package F3 = Flip-Chip 0.4 mm pitch Package information ● Epoxy meets UL94, V0 ● Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 12. Flip-Chip dimensions 400 µm ± 40 605 µm ± 55 1.14 mm ± 30 µm 400 µm ± 40 255 µm ± 40 170 µm 4 1.14 mm ± 30 µm Doc ID 17458 Rev 1 5/8 Package information HDMI05-CL01F3 Figure 13. Footprint Figure 14. Marking Copper pad Diameter: 220 µm recommended 260 µm maximum Dot, ST logo ECOPACK status xx = marking z = manufacturing location yww = datecode (y = year Solder mask opening: 300 µm minimum x x z y ww Solder stencil opening : 220 µm recommended Figure 15. Flip-Chip tape and reel specification 1.75 ± 0.1 3.5 ±- 0.1 1.24 xxz yww 1.24 ST E xxz yww ST E xxz yww ST E 8.0 ± 0.3 Ø 1.5 ± 0.1 4.0 ± 0.1 Dot identifyng Pin A1 location 4.0 ± 0.1 0.69 ± 0.05 All dimensions in mm 6/8 User direction of unreeling Doc ID 17458 Rev 1 HDMI05-CL01F3 5 Ordering information Ordering information Table 3. 6 Ordering information Order code Marking Package Weight Base qty Delivery mode HDMI05-CL01F3 JN Flip-Chip 1.9 mg 5000 Tape and reel (7”) Revision history Table 4. Document revision history Date Revision 30-Apr-2010 1 Changes Initial release. Doc ID 17458 Rev 1 7/8 HDMI05-CL01F3 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. 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