STPS1045HR Aerospace 2 x 10 A - 45 V Schottky rectifier Features ■ Forward current: 2 x 10 A ■ Repetitive peak voltage: 45 V ■ Low forward voltage drop: 0.75 V ■ Maximum junction temperature: 175 °C ■ Negligible switching losses ■ Low capacitance ■ High reverse avalanche surge capability ■ Hermetic package ■ Target radiation qualification: – 150 krad (Si) low dose rate – 1 Mrad high dose rate ■ ESCC qualified SMD.5 Description This power Schottky rectifier is designed and packaged to comply with the ESCC5000 specification for aerospace products. Housed in a hermetically sealed surface mount package, it is ideal for use in applications for aerospace and other harsh environments. The STPS1045HR is intended for use in medium voltage applications and in high frequency circuits where low switching losses and low noise are required. Table 1. Device summary Order code STPS1045CS1 STPS1045CSHRB June 2010 ESCC detailed specification Quality level - Engineering model 5106/017/02 Configuration Package Lead finish Double die common cathode SMD.5 Gold ESCC flight Doc ID 17640 Rev 1 EPPL - 1/8 www.st.com 8 Characteristics 1 STPS1045HR Characteristics Table 2. Absolute maximum ratings Symbol IFSM VRRM IRRM IO IF(RMS) TOP TJ TSTG Characteristic Forward surge current (per diode)(1) Value Unit 200 A (2) 45 V (3) 1 A Average output rectified current (50% duty cycle):(4) per diode per device 10 20 A Forward rms current (per diode) 15 A -65 to +175 °C +175 °C -65 to +175 °C +245 °C 10000 V/µs Repetitive peak reverse voltage Repetitive peak reverse current Operating temperature range (case temperature) Junction temperature Storage temperature range temperature(5) TSOL Soldering dV/dt Critical rate of rise of reverse voltage 1. Sinusoidal pulse of 10 ms duration 2. Pulsed, duration 5 ms, F = 50 Hz 3. Pulsed, duration 2 µs, F = 1 kHz 4. For Tcase > +140 °C, derate linearly to 0 A at +175 °C. 5. Duration 5 seconds maximum and the same package shall not be resoldered until 3 minutes have elapsed. Table 3. Symbol Rth(j-c)(1) Thermal resistance Characteristic Thermal resistance, junction to case per diode per device(2) 1. Package mounted on infinite heatsink 2. The per device ratings apply only when both anode terminals are tied togther. 2/8 Doc ID 17640 Rev 1 Value Unit 1.65 0.85 °C/W STPS1045HR Table 4. Symbol IR VF1 Characteristics s Electrical measurements at ambiant temperature (per diode), Tamb = 22 ±3 °C Characteristic Reverse Current MIL-STD-750 test method 4016 (1) VF2(1) VF3 Forward Voltage 4011 (1) C Zth(j-c)(2) Values Test conditions Units Min. Max. DC method, VR = 45V - 100 µA Pulse method, IF = 3 A - 620 mV Pulse method, IF = 20 A - 750 mV 880 mV 500 pF Pulse method, IF = 20 A Capacitance 4001 VR = 5 V, F = 1 MHz Relative thermal impedance, junction to case 3101 IH = 15 to 40 A, tH = 50 ms IM = 50 mA, tmd = 100 µs - Calculate ΔVF(3) °C/W 1. Pulse width ≤ 300 µs, Duty Cycle ≤ 2% 2. Performed only during screening tests parameter drift values (initial measurements), go-no-go 3. The limits for ΔVF shall be defined by the manufacturer on every lot in accordance with MIL-STD-750 Method 3101 and shall guarantee the Rth(j-c) limits specified in maximum ratings. Table 5. Symbol IR Electrical measurements at high and low temperatures (per diode) Characteristic Reverse Current MIL-STD-750 test method 4016 VF1(2) VF2 (2) VF3(2) Forward Voltage 4011 Values Test conditions(1) Units Min. Max. Tcase = +125 (+0, -5) °C DC method, VR = 45 V - 15 mA Tcase = +125 (+0, -5) °C pulse method, IF = 3 A - 570 mV Tcase = +125 (+0, -5) °C pulse method, IF = 10 A - 700 mV Tcase = -55 (+0, -5) °C pulse method, IF = 10 A - 850 mV Tcase = +125 (+0, -5) °C pulse method, IF = 20 A - 800 mV 1. Read and record measurements shall be performed on a sample of 5 components with 0 failures allowed. Alternatively a 100% inspection may be performed. 2. Performed only during screening tests parameter drift values (initial measurements for HTRB), go-no-go. Doc ID 17640 Rev 1 3/8 Configuration 2 STPS1045HR Configuration Figure 1. Available device configuration STPS1045CS STPS1045CSHRB 1 Terminal 1: Anode a Terminal 2: Common cathode Terminal 3: Anode b 2 3 The lid is not connected to any terminal 4/8 Doc ID 17640 Rev 1 STPS1045HR 3 Package Information Package Information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 2. Surface mount package (SMD.5), 3-terminal dimension definitions A e A1 b2 b3 1 2 E D1 D b1 3 b Table 6. Surface mount package (SMD.5), 3-terminal dimension values Dimension in millimetres Dimlension in inches Reference Min. Max. Min. Max. A 2.84 3.15 0.112 0.124 A1 0.25 0.51 0.010 0.20 b 7.13 7.39 0.281 0.291 b1 5.58 5.84 0.220 0.230 b2(1) 2.28 2.54 0.090 0.100 (1) 2.92 3.18 0.115 0.125 D 10.03 10.28 0.395 0.405 D1(1) 0.76 - 0.030 - E 7.39 7.64 0.291 0.301 b3 (1) e 1.91 BSC 0.075 1. 2 locations Doc ID 17640 Rev 1 5/8 Ordering Information STPS1045HR 4 Ordering Information Table 7. Ordering information Order code STPS1045CS1 ESCC detailed Package specification - Lead finish Marking EPPL Gold STPS1045CS1 - SMD.5 STPS1045CSHRB 6/8 5106/017/02 Gold Doc ID 17640 Rev 1 510601702 - Mass (g) Packing 2.0 Strip pack STPS1045HR 5 Revision history Revision history Table 8. Document revision history Date Revision 16-June-2010 1 Changes Initial release. Doc ID 17640 Rev 1 7/8 STPS1045HR Please Read Carefully: Information in this document is provided solely in connection with ST products. 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