STPS1150-Y Automotive power Schottky rectifier Datasheet − production data Features ■ AEC-Q101 qualified ■ Negligible switching losses ■ Low forward voltage drop for higher efficiency and extended battery life ■ Low thermal resistance ■ Surface mount miniature package ■ Avalanche capability specified ■ ECOPACK®2 compliant component A K SMA STPS1150AY Table 1. Description These 150 V power Schottky rectifiers are suited for switch mode power supplies on up to 24 V rails and high frequency converters. Packaged in SMA, this device is intended for use in automotive applications where low drop forward voltage is required to reduce power dissipation. May 2012 This is information on a product in full production. Doc ID 018928 Rev 2 Device summary Symbol Values IF(AV) 1A VRRM 150 V Tj (max) 175 °C VF(max) 0.67 V 1/7 www.st.com 7 Characteristics STPS1150-Y 1 Characteristics Table 2. Absolute ratings (limiting values) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 150 V IF(RMS) Forward rms current 15 A IF(AV) Average forward current TL = 150 °C δ = 0.5 1 A IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 50 A PARM Repetitive peak avalanche power tp = 1µs Tj = 25 °C 1500 W -65 to +175 °C -40 to +175 °C Tstg Storage temperature range Operating junction temperature Tj dPtot --------------dTj 1. range(1) 1 - condition to avoid runaway for a diode on its own heatsink < ------------------------Rth ( j – a ) Table 3. Thermal resistance Symbol Rth(j-c) Table 4. Parameter Junction to case Parameter Reverse leakage current Tests conditions Tj = 25 °C Tj = 125 °C Tj = 25 °C VF (2) Forward voltage drop Tj = 125 °C Tj = 25 °C Tj = 125 °C Min. VR = VRRM IF = 1 A 20 °C/W Typ. Max. Unit 0.2 1.0 µA 0.2 1.0 mA 0.78 0.82 0.62 0.67 0.85 0.89 0.69 0.75 V IF = 2 A 1. tp = 5 ms, δ < 2% 2. tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.59 x IF(AV) + 0.08 IF2(RMS) 2/7 Unit Static electrical characteristics Symbol IR (1) Value Doc ID 018928 Rev 2 STPS1150-Y Figure 1. Characteristics Average forward power dissipation versus average forward current Figure 2. PF(AV)(W) IF(AV)(A) 1.2 0.9 δ = 0.1 0.8 δ = 0.2 Average forward current versus ambient temperature (δ = 0.5) δ = 0.5 Rth(j-a) = Rth(j-l) 1.0 δ = 0.05 0.7 0.8 δ=1 0.6 0.5 Rth(j-a) = 120 °C/W 0.6 0.4 0.4 0.3 T 0.2 T 0.2 0.1 IF(AV)(A) δ=tp/T δ = tp / T tp 0.0 tp 0.0 0.0 0.2 Figure 3. 0.4 0.6 0.8 1.0 1.2 Normalized avalanche power derating versus pulse duration 0 25 50 Figure 4. PARM(tp) PARM(1 µs) 75 100 125 150 175 Normalized avalanche power derating versus junction temperature PARM(Tj) PARM(25 °C) 1 1.2 0.1 0.8 1 0.6 0.4 0.01 0.2 Tj(°C) tp(µs) 0.001 0.01 0.1 Figure 5. 1 0 10 100 25 1000 Non repetitive surge peak forward current versus overload duration - maximum values IM(A) Figure 6. 1.0 8 50 75 100 125 150 Relative variation of thermal impedance junction to ambient versus pulse duration Zth(j-a)/Rth(j-a) SMA SMA 0.9 7 0.8 6 0.7 5 Ta=25°C Ta=75°C 0.4 3 Ta=125°C 2 t Single pulse 0.1 t(s) δ=0.5 0 1.E-03 0.3 0.2 IM 1 0.6 0.5 4 1.E-02 1.E-01 1.E+00 0.0 1.E-02 Doc ID 018928 Rev 2 tp(s) 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 3/7 Characteristics Figure 7. STPS1150-Y Reverse leakage current versus reverse voltage applied (typical values) Figure 8. IR(µA) Junction capacitance versus reverse voltage applied (typical values) C(pF) 1.E+04 100 1.E+03 F=1MHz VOSC=30mVRMS Tj=25°C Tj=150°C Tj=125°C 1.E+02 Tj=100°C 1.E+01 Tj=75°C 1.E+00 10 Tj=50°C 1.E-01 Tj=25°C 1.E-02 VR(V) VR(V) 1 1.E-03 0 25 Figure 9. 50 75 100 125 1 150 Forward voltage drop versus forward current (all packages) 10 100 1000 Figure 10. Thermal resistance junction to ambient versus copper surface under each lead (SMA) Rth(j-a)(°C/W) IFM(A) 130 3.0 Epoxy printed circuit board, copper thickness = 35 µm 120 110 2.5 Tj=125°C (maximum values) 100 90 2.0 80 1.5 70 60 Tj=125°C (typical values) 50 1.0 Tj=25°C (maximum values) 0.5 20 10 VFM(V) 0.0 0.0 4/7 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 40 30 0.9 1.0 0 0.0 SCu(cm²) 0.5 Doc ID 018928 Rev 2 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 STPS1150-Y 2 Package information Package information ● Band shows cathode. ● Epoxy meets UL94, V0 In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 5. SMA dimensions Dimensions Ref. Millimeters Inches E1 D Min. Max. Min. Max. A1 1.90 2.45 0.075 0.094 A2 0.05 0.20 0.002 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.006 0.016 D 2.25 2.90 0.089 0.114 E 4.80 5.35 0.189 0.211 E1 3.95 4.60 0.156 0.181 L 0.75 1.50 0.030 0.059 E A1 C A2 L b Figure 11. Footprint (dimensions in mm) 1.4 2.63 1.4 (0.055) (0.104) (0.055) 1.64 (0.064) 5.43 (0.214) Doc ID 018928 Rev 2 5/7 Ordering information 3 STPS1150-Y Ordering information Table 6. Ordering information Order code Marking Package Weight Base qty Delivery mode 1150Y SMA 0.068 g 5000 Tape and reel STPS1150AY 4 Revision history Table 7. 6/7 Document revision history Date Revision Changes 02-Nov-2011 1 Initial release. 02-May-2012 2 Updated Table 3. Doc ID 018928 Rev 2 STPS1150-Y Please Read Carefully: Information in this document is provided solely in connection with ST products. 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