STPS160-Y Automotive power Schottky rectifier Datasheet − production data Features ■ Very small conduction losses ■ Negligible switching losses ■ Low forward voltage drop ■ Surface mount miniature packages ■ Avalanche capability specified ■ ECOPACK®2 compliant components ■ AEC-Q101 qualified K Description Single chip Schottky rectifiers suited to switched mode power supplies and high frequency DC to DC converters. Packaged in SMA and SMB, this device is especially intended for surface mounting and used in low voltage, high frequency inverters, free wheeling and polarity protection for automotive application. This is information on a product in full production. K SMA (JEDEC DO-214AC) STPS160AY Table 1. June 2012 A A Doc ID 023383 Rev 1 SMB (JEDEC DO-214AA) STPS160UY Device summary Symbol Value IF(AV) 1A VRRM 60 V Tj (max) 150 °C VF (max) 0.57 V 1/9 www.st.com 9 Characteristics 1 STPS160-Y Characteristics Table 2. Absolute ratings (limiting values) Symbol Unit 60 V Repetitive peak reverse voltage IF(AV) Average forward current TL = 130 °C, δ = 0.5 1 A IFSM Surge non repetitive forward current tp =10 ms sinusoidal 75 A IRRM Repetitive peak reverse current tp = 2 µs F = 1 kHz square 1 A IRSM Non repetitive peak reverse current tp = 100 µs square 1 A PARM Repetitive peak avalanche power tp = 1 µs Tj = 25 °C 2400 W Storage temperature range -65 to + 150 °C Operating junction temperature range(1) -40 to + 150 °C 10000 V/µs Value Unit Tj dV/dt Critical rate of rise of reverse voltage 1 dPtot < condition to avoid thermal runaway for a diode on its own heatsink Rth(j-a) dTj Table 3. Thermal resistance Symbol Rth(j-l) Table 4. Parameter 30 SMB 23 °C/W Static electrical characteristics Symbol Parameter IR(1) Reverse leakage current VF(2) SMA Junction to lead Test conditions Tj = 25 °C Tj = 125 °C Tj = 25 °C Tj = 125 °C Forward voltage drop Tj = 25 °C Tj = 125 °C Min. VR = VRRM Typ. 1.1 Max. Unit 4 µA 4 mA 0.67 IF = 1 A 0.49 0.57 V 0.8 IF = 2 A 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.49 x IF(AV) + 0.08 IF2(RMS) 2/9 Value VRRM Tstg 1. Parameter Doc ID 023383 Rev 1 0.58 0.65 STPS160-Y Figure 1. Characteristics Average forward power dissipation Figure 2. versus average forward current Average forward current versus ambient temperature (δ = 0.5) IF(AV)(A) PF(AV)(W) 0.7 δ = 0.1 δ = 0.05 0.6 1.2 δ = 0.5 δ = 0.2 Rth(j-a)=Rth(j-I) 1.0 δ=1 0.5 SMA Rth(j-a)=100°C/W S(CU)=1.5cm2 0.8 0.4 SMB Rth(j-a)=80°C/W S(CU)=1.5cm2 0.6 0.3 0.4 0.2 T T 0.2 0.1 IF(AV)(A) δ=tp/T 0.0 tp δ=tp/T 0.0 0.0 0.2 Figure 3. 0.4 0.6 0.8 1.0 1.2 Normalized avalanche power derating versus pulse duration 0 25 Figure 4. PARM(tp) PARM(1µs) Tamb(°C) tp 50 75 100 125 150 Normalized avalanche power derating versus junction temperature PARM(Tj) PARM(25 °C) 1 1.2 0.1 0.8 1 0.6 0.4 0.01 0.2 Tj(°C) tp(µs) 0.001 0.01 0.1 Figure 5. 1 0 10 100 25 1000 Non repetitive surge peak forward current versus overload duration (maximum values) (SMA) 50 Figure 6. 75 100 125 150 Non repetitive surge peak forward current versus overload duration (maximum values) (SMB) IM(A) IM(A) 8 8 7 7 6 6 Ta=25°C 5 Ta=25°C 5 4 4 Ta=50°C Ta=50°C 3 2 Ta=100°C IM 1 3 Ta=100°C 2 IM 1 t t(s) δ=0.5 t t(s) δ=0.5 0 0 1E-3 1E-2 1E-1 1E+0 1E-3 Doc ID 023383 Rev 1 1E-2 1E-1 1E+0 3/9 Characteristics Figure 7. STPS160-Y Relative variation of thermal impedance junction to ambient versus pulse duration (SMA) Figure 8. Zth(j-c)/Rth(j-c) Zth(j-c)/Rth(j-c) 1.0 1.0 epoxy printed circuit board, e(Cu) = 35 µm recommended pad layout 0.9 epoxy printed circuit board, e(Cu) = 35 µm recommended pad layout 0.9 0.8 0.8 0.7 0.7 0.6 Relative variation of thermal impedance junction to ambient versus pulse duration (SMB) 0.6 δ = 0.5 δ = 0.5 0.5 0.5 0.4 0.4 0.3 δ = 0.2 0.2 δ = 0.1 0.1 Single pulse T 1E-1 Figure 9. δ=tp/T tp(s) 0.0 1E-2 1E+0 tp 0.3 δ = 0.2 0.2 δ = 0.1 0.1 Single pulse T δ=tp/T tp(s) 0.0 1E+1 1E+2 Reverse leakage current versus reverse voltage applied (typical values) 1E-2 1E-1 1E+0 1E+1 tp 1E+2 1E+3 Figure 10. Junction capacitance versus reverse voltage applied (typical values) IR(µA) C(pF) 1E+3 200 F=1MHz Tj=25°C Tj=105°C 100 1E+2 Tj=75°C 50 1E+1 1E+0 20 Tj=25°C VR(V) VR(V) 1E-1 0 5 10 15 20 25 30 10 35 40 45 50 55 1 60 Figure 11. Forward voltage drop versus forward current (maximum values) 2 5 10 20 50 100 Figure 12. Thermal resistance junction to ambient versus copper surface under each lead (SMA) Rth(j-a)(°C/W) IFM(A) 140 1E+1 Epoxy printed circuit board Fr4 copper thickness: 35 µm 120 Tj=125°C 100 1E+0 Tj=25°C 80 60 1E-1 40 20 S(Cu)(cm²) VFM(V) 0 1E-2 0 4/9 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 0 Doc ID 023383 Rev 1 1 2 3 4 5 STPS160-Y Characteristics Figure 13. Thermal resistance junction to ambient versus copper surface under lead (Epoxy printed circuit board FR4, copper thickness: 35 µm) (SMB) Rth(j-a)(°C/W) 100 80 60 40 20 S(Cu)(cm²) 0 0 1 2 Doc ID 023383 Rev 1 3 4 5 5/9 Package information 2 STPS160-Y Package information ● Epoxy meets UL94, V0 ● Band indicates cathode In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 5. SMA dimensions Dimensions Ref. Millimeters Inches E1 D Min. Max. Min. Max. A1 1.90 2.45 0.075 0.094 A2 0.05 0.20 0.002 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.006 0.016 D 2.25 2.90 0.089 0.114 E 4.80 5.35 0.189 0.211 E1 3.95 4.60 0.156 0.181 L 0.75 1.50 0.030 0.059 E A1 A2 C L b Figure 14. Footprint, dimensions in mm (inches) 1.4 2.63 1.4 (0.055) (0.103) (0.055) 1.64 (0.064) 5.43 (0.214) 6/9 Doc ID 023383 Rev 1 STPS160-Y Package information Table 6. SMB dimensions Dimensions Ref. Millimeters Inches E1 D Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 D 3.30 3.95 0.130 0.156 E 5.10 5.60 0.201 0.220 E1 4.05 4.60 0.159 0.181 L 0.75 1.50 0.030 0.059 E A1 A2 C L b Figure 15. Footprint, dimensions in mm (inches) 1.62 2.60 (0.064) (0.102) 1.62 (0.064) 2.18 (0.086) 5.84 (0.300) Doc ID 023383 Rev 1 7/9 Ordering information 3 Ordering information Table 7. 4 Ordering information Order code Marking Package Weight Base qty Delivery mode STPS160AY GA6Y SMA 0.068 g 5000 Tape and reel STPS160UY E16Y SMB 0.107 g 2500 Tape and reel Revision history Table 8. 8/9 STPS160-Y Document revision history Date Revision 28-Jun-2012 1 Changes Initial release. Doc ID 023383 Rev 1 STPS160-Y Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. 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