STMICROELECTRONICS STPS20M60ST

STPS20M60S
Power Schottky rectifier
Features
■
A
K
High current capability
A
■
Avalanche rated
■
Low forward voltage drop
■
High frequency operation
K
K
A
Description
A
The STPS20M60S is a single Schottky diode,
suited for high frequency switch mode power
supply.
2
A
K
A
D2PAK
STPS20M60SG-TR
I2PAK
STPS20M60SR
K
2
Packaged in TO-220AB, I PAK and D PAK, this
device is intended to be used in notebook, game
station and desktop adapters, providing in these
aplications a good efficiency at both low and high
load.
Table 1.
A
A
K
TO-220AB
STPS20M60ST
Device summary
Symbol
Value
IF(AV)
20 A
VRRM
60 V
VF (typ)
0.365 V
Tj (max)
150 °C
Electrical characteristics(a)
Figure 1.
I
V
"Forward"
I
2 x IO
X
IF
VRRM
VR
VAR
IO
X
V
IR
VTo VF(Io) VF VF(2xIo)
"Reverse"
IAR
a. VARM and IARM must respect the reverse safe
operating area defined in Figure 12. VAR and IAR are
pulse measurements (tp < 1 µs). VR, IR, VRRM and VF,
are static characteristics
October 2011
Doc ID 019045 Rev 1
1/9
www.st.com
9
Characteristics
1
STPS20M60S
Characteristics
Table 2.
Absolute ratings (limiting values with terminals 1 and 3 short circuited at
Tamb = 25 °C, unless otherwise specified)
Symbol
Parameter
Value
Unit
VRRM
Repetitive peak reverse voltage
60
V
IF(RMS)
Forward rms current
90
A
IF(AV)
Average forward current, δ = 0.5
Tc = 135 °C Per package
20
A
IFSM
Surge non repetitive forward current
tp = 10 ms sine-wave
600
A
PARM(1)
Repetitive peak avalanche power
Tj = 25 °C, tp = 1 µs
26400
W
VARM(2)
Maximum repetitive peak
tp < 1 µs, Tj < 150 °C, IAR < 99 A
avalanche voltage
80
V
VASM(2)
Maximum single-pulse
peak avalanche voltage
80
V
-65 to +175
°C
150
°C
Tstg
Tj
tp < 1 µs, Tj < 150 °C, IAR < 99 A
Storage temperature range
Maximum operating junction
temperature(3)
1. For temperature or pulse time duration deratings, please refer to Figure 4 and 5. More details regarding the
avalanche energy measurements and diode validation in the avalanche are provided in the application
notes AN1768 and AN2025.
2. See Figure 12
3.
1
dPtot <
condition to avoid thermal runaway for a diode on its own heatsink
Rth(j-a)
dTj
Table 3.
Thermal resistance
Symbol
Rth(j-c)
Table 4.
Symbol
IR(1)
Parameter
Junction to case
Parameter
Reverse leakage
current
Test conditions
Tj = 25 °C
Tj = 125 °C
Forward voltage drop
Tj = 125 °C
Tj = 25 °C
Tj = 125 °C
1.0
°C/W
VR = VRRM
IF = 10 A
IF = 20 A
Min.
Typ.
Max.
Unit
-
30
125
µA
-
20
75
mA
-
0.465
0.500
-
0.365
0.405
-
0.520
0.565
-
0.450
0.505
1. Pulse test: tp = 5 ms, δ < 2 %
2. Pulse test: tp = 380 µs, δ < 2 %
To evaluate the conduction losses use the following equation:
P = 0.380 x IF(AV) + 0.0063 x IF2(RMS)
2/9
Unit
Static electrical characteristics (terminals 1 and 3 short circuited)
Tj = 25 °C
VF(2)
Value
Doc ID 019045 Rev 1
V
STPS20M60S
Figure 2.
Characteristics
Average forward power dissipation Figure 3.
versus average forward current
PF(AV)(W)
18
IF(AV)(A)
24
16
δ = 0.05
δ = 0.1
δ = 0.5
δ = 0.2
δ=1
Average forward current versus
ambient temperature (δ = 0.5)
Rth(j-a) = Rth(j-c)
20
14
16
12
10
12
8
8
6
4
T
4
2
δ = tp / T
tp
IF(AV)(A)
0
0
4
8
Figure 4.
1
12
16
20
24
0
28
Normalized avalanche power
derating versus pulse duration
Tamb(°C)
0
25
Figure 5.
PARM(tp)
PARM(1µs)
1.2
50
75
100
125
150
Normalized avalanche power
derating versus junction
temperature
PARM(Tj)
PARM(25 °C)
1
0.1
0.8
0.6
0.4
0.01
0.2
tp(µs)
0.001
0.01
0.1
Figure 6.
350
1
10
1000
100
Non repetitive surge peak forward
current versus overload duration
(maximum values)
IM(A)
Tj(°C)
0
25
50
Figure 7.
1.0
75
100
150
125
Relative variation of thermal
impedance junction to case versus
pulse duration
Zth(j-c)/Rth(j-c)
0.9
300
0.8
250
0.7
0.6
200
Tc = 25 °C
150
Tc = 75 °C
0.4
0.3
100
50
0.5
Tc = 125 °C
IM
t
δ = 0.5
Single pulse
0.1
t(s)
0
1.E-03
0.2
1.E-02
1.E-01
1.E+00
0.0
1.E-04
Doc ID 019045 Rev 1
tp(s)
1.E-03
1.E-02
1.E-01
1.E+00
3/9
Characteristics
Figure 8.
1.E+02
STPS20M60S
Reverse leakage current versus
reverse voltage applied
(typical values)
Figure 9.
IR(mA)
10000
Tj = 150 °C
Junction capacitance versus
reverse voltage applied
(typical values)
C(pF)
F = 1 MHz
Vosc = 30 mVRMS
Tj = 25 °C
Tj = 125 °C
1.E+01
Tj = 100 °C
1.E+00
Tj = 75 °C
1.E-01
1000
Tj = 50 °C
Tj = 25 °C
1.E-02
VR(V)
1.E-03
0
10
20
30
40
50
1
60
Figure 10. Forward voltage drop versus
forward current
1000.0
VR(V)
100
10
100
Figure 11. Thermal resistance junction to
ambient versus copper surface
under tab
IFM(A)
80
Rth(j-a)(°C/W)
epoxy printed board copper thickness = 35 µm
Tj = 125 °C
(Maximum values)
100.0
70
2
60
Tj = 125 °C
(Typical values)
D PAK
50
10.0
40
Tj = 25 °C
(Maximum values)
30
1.0
20
10
0.1
0.0
2
VFM(V)
0.2
0.4
0.6
0.8
1.0
SCu(cm )
0
1.2
0
5
10
15
Figure 12. Reverse safe operating area (tp < 1 µs and Tj < 150 °C)
105.0
Iarm (A)
Iarm (Varm) 150 °C, 1µs
100.0
95.0
90.0
85.0
80.0
75.0
70.0
65.0
Varm (V)
60.0
80
4/9
85
90
95
100
105
110
Doc ID 019045 Rev 1
115
120
20
25
30
35
40
STPS20M60S
2
Package information
Package information
●
Epoxy meets UL94, V0
●
Cooling method: by conduction (C)
●
Recommended torque value: 0.4 to 0.6 N·m
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Table 5.
TO-220AB dimensions
Dimensions
Ref.
Dia
Min.
Max.
Min.
Max.
A
4.40
4.60
0.173
0.181
C
1.23
1.32
0.048
0.051
D
2.40
2.72
0.094
0.107
E
0.49
0.70
0.019
0.027
F
0.61
0.88
0.024
0.034
F1
1.14
1.70
0.044
0.066
F2
1.14
1.70
0.044
0.066
G
4.95
5.15
0.194
0.202
G1
2.40
2.70
0.094
0.106
H2
10
10.40
0.393
0.409
C
L5
L7
L6
L2
F2
D
L9
L4
L2
F
M
G1
Inches
A
H2
F1
Millimeters
16.4 Typ.
0.645 Typ.
L4
13
14
0.511
0.551
L5
2.65
2.95
0.104
0.116
L6
15.25
15.75
0.600
0.620
L7
6.20
6.60
0.244
0.259
L9
3.50
3.93
0.137
0.154
E
G
M
Dia.
Doc ID 019045 Rev 1
2.6 Typ.
3.75
3.85
0.102 Typ.
0.147
0.151
5/9
Package information
Table 6.
STPS20M60S
D2PAK dimensions
Dimensions
Ref.
Millimeters
Inches
Min.
Max.
Min.
Max.
A
4.40
4.60
0.173
0.181
A1
2.49
2.69
0.098
0.106
A2
0.03
0.23
0.001
0.009
B
0.70
0.93
0.027
0.037
B2
1.14
1.70
0.045
0.067
C
0.45
0.60
0.017
0.024
C2
1.23
1.36
0.048
0.054
D
8.95
9.35
0.352
0.368
E
10.00
10.40
0.393
0.409
G
4.88
5.28
0.192
0.208
L
15.00
15.85
0.590
0.624
L2
1.27
1.40
0.050
0.055
L3
1.40
1.75
0.055
0.069
M
2.40
3.20
0.094
0.126
A
E
C2
L2
D
L
L3
A1
B2
R
C
B
G
A2
M
*
V2
* FLAT ZONE NO LESS THAN 2mm
R
0.40 typ.
V2
0°
0.016 typ.
8°
Figure 13. D2PAK footprint (dimensions in mm)
16.90
10.30
5.08
1.30
8.90
6/9
Doc ID 019045 Rev 1
3.70
0°
8°
STPS20M60S
Package information
Table 7.
I2PAK dimensions
Dimensions
Ref.
Millimeters
Inches
Min.
Max.
Min.
Max.
A
4.40
4.60
0.173
0.181
A1
2.40
2.72
0.094
0.107
b
0.61
0.88
0.024
0.035
b1
1.14
1.70
0.044
0.067
c
0.49
0.70
0.019
0.028
c2
1.23
1.32
0.048
0.052
D
8.95
9.35
0.352
0.368
e
2.40
2.70
0.094
0.106
e1
4.95
5.15
0.195
0.203
E
10
10.40
0.394
0.409
L
13
14
0.512
0.551
L1
3.50
3.93
0.138
0.155
L2
1.27
1.40
0.050
0.055
A
E
c2
L2
D
L1
A1
b1
L
b
c
e
e1
Doc ID 019045 Rev 1
7/9
Ordering information
3
STPS20M60S
Ordering information
Table 8.
Ordering information
Order code
STPS20M60ST
STPS20M60SR
STPS20M60SG-TR
4
STPS20M60ST
STPS20M60SR
STPS20M60SG
Package
Weight
TO-220AB
Base qty Delivery mode
2.2 g
50
Tube
2
1.49 g
50
Tube
2
1.48 g
1000
Tape and reel
I PAK
D PAK
Revision history
Table 9.
8/9
Marking
Revision history
Date
Revision
11-Oct-2011
1
Changes
Initial release
Doc ID 019045 Rev 1
STPS20M60S
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY TWO AUTHORIZED ST REPRESENTATIVES, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2011 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
Doc ID 019045 Rev 1
9/9