STPS30H60-Y Automotive power Schottky rectifier Datasheet − production data Features ■ High junction temperature capability ■ Avalanche rated ■ Low leakage current ■ Good trade-off between leakage current and forward voltage drop ■ High frequency operation ■ AEC-Q 101 qualified A1 K A2 K Description A2 A1 Dual centre tab Schottky rectifier suited for high frequency switch mode power supply. D2PAK STPS30H60CGY-TR 2 Packaged in D PAK, this device is designed for use in automotive applications. In these applications this device provides a good margin between the remaining voltage applied on the diode and the voltage capability of the diode. March 2012 This is information on a product in full production. Table 1. Doc ID 022824 Rev 1 Device summary Symbol Value IF(AV) 2 X 15 A VRRM 60 V Tj 175 °C VF (typ) 0.535 V 1/7 www.st.com 7 Characteristics STPS30H60-Y 1 Characteristics Table 2. Absolute ratings (limiting values per diode) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 60 V IF(RMS) Forward rms current 30 A Per diode 15 Total package 30 IF(AV) Average forward current, δ = 0.5 Tc = 155 °C IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 230 A PARM Relative peak avalanche power Tj = 125 °C 715 W Tj Tstg Operating junction temperature tp = 10 µs range(1) Storage temperature range A -40 to + 175 °C -65 to + 175 °C Value Unit 1 dPtot < condition to avoid thermal runaway for a diode on its own heatsink Rth(j-a) dTj 1. Table 3. Thermal parameters Symbol Parameter Rth(j-c) Junction to case Rth(c) Coupling Table 4. Symbol IR(1) 1.5 Total 0.8 Static electrical characteristics Parameter Reverse leakage current Test conditions Tj = 25 °C Tj = 125 °C Tj = 125 °C Forward voltage drop Tj = 25 °C Tj = 125 °C Tj = 25 °C Tj = 125 °C Min. VR = VRRM IF = 7.5 A IF = 15 A IF = 30 A 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.45 x IF(AV) + 0.008 x IF2(RMS) 2/7 °C/W 0.1 Tj = 25 °C VF(2) Per diode Doc ID 022824 Rev 1 Typ. 8 Max. Unit 60 µA 25 mA 550 435 470 660 535 570 820 635 690 mV STPS30H60-Y Figure 1. Characteristics Conduction losses versus average forward current Figure 2. PF(AV)(W) 18 12 δ=0.1 δ=0.05 δ=0.5 δ=0.2 Average forward current versus ambient temperature (δ = 0.5, per diode) IF(AV)(A) δ=1 Rth(j-a)=Rth(j-c) 16 10 14 12 8 10 6 8 Rth(j-a)=15 °C/W 6 4 T 4 2 IF(AV)(A) 2 δ=tp/T Tamb(°C) tp 0 0 0 2 4 Figure 3. 6 8 10 12 14 16 18 Normalized avalanche power derating versus pulse duration PARM(tp) PARM(1 µs) 0 25 Figure 4. 1.0 50 75 100 125 150 175 Relative variation of thermal impedance junction to case versus pulse duration Zth(j-c)/Rth(j-c) 0.9 1 0.8 0.7 0.6 0.1 0.5 0.4 0.3 0.01 0.2 Single pulse 0.1 tp(µs) 0.001 0.01 0.1 Figure 5. 1 10 100 tp(s) 0.0 1.E-03 1.E-02 1.E-01 1.E+00 1000 Reverse leakage current versus reverse voltage applied (typical values, per diode) Figure 6. IR(mA) Junction capacitance versus reverse voltage applied (typical values, per diode) C(nF) 1.E+02 10.0 Tj=150°C 1.E+01 F=1MHz Vosc=30mVRMS Tj=25°C Tj=125°C Tj=100°C 1.E+00 1.0 Tj=75°C 1.E-01 Tj=50°C 1.E-02 Tj=25°C VR(V) VR(V) 1.E-03 0 5 10 15 20 25 30 35 40 45 0.1 50 55 60 1 Doc ID 022824 Rev 1 10 100 3/7 Characteristics Figure 7. 100 STPS30H60-Y Forward voltage drop versus forward current (per diode) IFM(A) Figure 8. 80 Thermal resistance junction to ambient versus copper surface under tab Rth(j-a)(°C/W) epoxy printed board FR4, copper thickness = 35 µm TJ=125 °C Maximum values 70 60 TJ=125 °C Typical values TJ=25 °C Maximum values 50 10 40 30 20 10 VFM(V) S(cm²) 1 0 0.0 0.1 4/7 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 0 Doc ID 022824 Rev 1 5 10 15 20 25 30 35 40 STPS30H60-Y 2 Package information Package information ● Epoxy meets UL94, V0 ● Cooling method: by conduction (C) In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 5. D2PAK dimensions Dimensions Ref. Millimeters Inches Min. Max Min. Max. A 4.40 4.60 0.173 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.70 0.93 0.027 0.037 B2 1.14 1.70 0.045 0.067 C 0.45 0.60 0.017 0.024 C2 1.23 1.36 0.048 0.054 D 8.95 9.35 0.352 0.368 E 10.00 10.40 0.393 0.409 G 4.88 5.28 0.192 0.208 L 15.00 15.85 0.590 0.624 L2 1.27 1.40 0.050 0.055 L3 1.40 1.75 0.055 0.069 M 2.40 3.20 0.094 0.126 A E C2 L2 D L L3 A1 B2 R C B G A2 M * V2 * FLAT ZONE NO LESS THAN 2mm R V2 Figure 9. 0.40 typ. 0° 8° 0.016 typ. 0° 8° Footprint (dimensions in millimeters) 16.90 10.30 5.08 1.30 8.90 Doc ID 022824 Rev 1 3.70 5/7 Ordering information 3 STPS30H60-Y Ordering information Table 6. Ordering information Order code Marking STPS30H60CGY-TR STPS30H60CGY-TR 4 Weight Base qty Delivery mode D2PAK 1.48 g 1000 Tape and reel Revision history Table 7. 6/7 Package Document revision history Date Revision 20-Mar-2012 1 Changes First issue. Doc ID 022824 Rev 1 STPS30H60-Y Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. 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